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FINAL PROGRAM

November 4 - 6, 2019

www.SEMI-THERM.org

SEMI-THERM® Thermal Technologies Workshop 2019Microsoft Corporation Conference Center

Redmond, Washington USA

All Workshop Technical Sessions, Exhibits, and Dining: Microsoft Corporate Campus, Bldg. 33, Rainier Room

16070 NE 36th Way, Redmond WA 98052

Premier Sponsor:Microsoft Corporation

Supporting Sponsors:Future Facilities

Indium Corporation

Student Stipend Sponsor:Hewlett Packard Enterprise

2 www.semi-therm.orgSEMI-THERM Thermal Technologies Workshop

Monday November 4, 2019

1:30PM Introduction and Program Overview General Chair: Dave Saums, DS&A LLC

2:00PM Keynote: Large-Scale Integrated Photonics for Accelerated Communication and Computing Ray Beausoleil, Sr. Vice President, HPE/Hewlett Packard Laboratories Developments in Thermal Management Materials for Power Semiconductors Dave Saums, DS&A LLC

3:30PM Coffee Break and Exhibits Continued

SEMI-THERM Thermal Technologies Workshop Organizing Committee

Dave SaumsPrincipal, DS&A LLC

General Chair

Vadim Gektin,Member Technical Staff, Blueman Inc.

Program Chair

Vadim Gektin, Member Technical Staff, Blueman Inc.Bill Maltz, President, Electronic Cooling Solutions, Inc.

Nader Nikfar, Principal Thermal Engineer, Qualcomm Technologies, Inc.John Peeples, Professor and Chair, Electrical and Computer Engineering, The Citadel

Emil Rahim, Senior Thermal Engineer, Google Inc.Adriana Rangel, Mechanical Engineer, Cisco Systems Inc.

Dave Saums, Principal, DS&A LLCTejas Shah, Senior Thermal Engineer, nVidia CorporationGuy Wagner, Director, Electronic Cooling Solutions, Inc.

Ross Wilcoxon, Associate Director, Mechanical Engineering, Mission Systems, Collins


Ray Beausoleil is a Senior Fellow and a Senior Vice President at Hewlett Packard Enterprise (HPE), and an Adjunct Professor of Applied Physics at Stanford University. At HPE, he leads the Large-Scale Integrated Photonics research group, and is responsible for research on the applications of optics at the micro/nanoscale to high-performance information processing. Ray received the Bachelor of Science with Honors in Physics from the California Institute of Technology in 1980, and his Ph.D. in Physics from Stanford in 1986. He has published over 300 papers and conference proceedings and five book chapters, and has over 150 issued patents. He is a Fellow of both the American Physical Society and the Optical Society of America, and the recipient of the 2016 APS Distinguished Lectureship on the Applications of Physics.

Keynote


The massive explosion in data acquisition, processing, and archiving, hindered by the end of Moore’s Law, creates an opportunity for a complete redesign of the information technology stack, including hardware system architectures, devices, networks, and software to enable future computing systems with multi-exascale performance—and beyond. Key to success in this challenging endeavor will be the paradigm shift of moving from a processor-centric to a memory-centric approach. Architectural changes are necessary to overcome the limitations of the traditional compute-centric model, and will require new network layouts (e.g., Hyper-X) and new high-performance memory-addressing protocols (e.g., Gen-Z) that rely on a high-bandwidth and energy-efficient photonic interconnect. We will describe the state-of-the-art in datacom photonics and present the advances that will be necessary—and are already appearing in R&D laboratories—to enable memory-centric computing at scale. Inevitably, high-bandwidth interconnects will require many of the same approaches used in telecommunications today, including dense-wavelength-division multiplexing. We will discuss the thermal challenges faced by DWDM systems in harsh HPC environments, and outline potential solutions.

Thank you to our Premier Sponsor

Large-Scale Integrated Photonics for Accelerated Communication and Computing


5:30PM Dinner, Networking, and Exhibits Dinner Sponsor: Microsoft


7:30PM Session 2: Systems Modeling Session Chair: Bill Maltz, Electronic Cooling Solutions, Inc.

Heat Pipe Orientation Angle: Modeling and Testing Salar Effati, San Jose State University Thermal Simulation of a Smart Pole Housing Active Electronics Mark Hendrix, SRC Design Solutions

4:00PM Session 1: Thermal Interface Materials Program Chair: Vadim Gektin, Blueman Inc. Adhesive Bonding in Critical Performance Applications Thomas F. Marinis, Jeffrey B. Delisio, Nina S. Dytiuk, Gardy K. Ligonde, Juan C. Rodriguez, Gregory B. Stankiewicz, Nicole J. Levasseur, Katherine L. Graham, Draper Laboratories

Thermally Conductive Gap Fillers: 10W/mK Miguel Hermosillo, Momentive Performance Materials Liquid Metal TIMs: Material and Process Innovations Tim Jensen, Miloš Lazić, Indium Corporation

Student Stipend Sponsor

Wi-Fi Connection Instructions:

• Make sure your wireless adapter is set to dynamically obtain an IP address

• Connect to the wireless network MSFTGUEST

• Open a browser and navigate to a web site to be redirected to the Captive Portal

• Click on Event Attendee Code and enter the access code: msevent895yp


11:00AM Session 4: Two-Phase Liquid Cooling Technologies Session Chair: Ross Wilcoxon Collins Aerospace, Inc. Vaporizable Dielectric Fluid Cooling of IGBT Power Semiconductors and EV Vehicle Powertrain Inverters David L. Saums, DS&A LLC

Thermal and Hydraulic Performance of Refrigerant-based Two-Phase Cold Plates: Experimental Characterization and System Performance Prof. Al Ortega, Villanova University Proper Use of Boiling Enhancement in Two-Phase Immersion Cooling of Computers Phillip Tuma, 3M Company

12:30PM Lunch, Networking, and Exhibits Luncheon Sponsor: Microsoft

2:00PM Session 5: CFD Modeling Session Chair: Nader Nikfar, Qualcomm, Inc. Leveraging Boundary Condition Independent Reduced Order Models John Wilson, Mentor, A Siemens Business Thermo-Mechanical Analysis of a Printed Circuit Board Mehdi Abarham, ANSYS, Inc. A Holistic Approach to Improve Mission Critical Facility Performance Kourosh Nemati, Future Facilities

Tuesday November 5, 2019

9:00AM Session 3: Two-Phase Liquid Cooling Technologies Session Chair: Dave Saums, DS&A LLC

Advances in Single Phase and Two-Phase Liquid Cooling Research at NSF Center ES2 Prof. Al Ortega, Villanova University Reliable Operation of a Supercritical CO2 Cold Plate for Electronics Cooling Applications Alec Nordlund, Oregon State University

Relative Performance of Two-Phase Versus Solid Anisotropic Conductive Heat Spreaders Joe Boswell, ThermAvant Technologies

10:30AM Coffee Break and Exhibits Coffee Sponsor: Future Facilities

Continued

8:00AM Continental Breakfast and Exhibits

Thank you to our Media Sponsor


5:30PM Dinner, Networking, and Exhibits Dinner Sponsor: Microsoft

7:30PM Session 7: Technology Development Session Chair: Guy WagnerElectronic Cooling Solutions, Inc.

Lessons Learned in the Development of a Printed Liquid Cold Plate Ross Wilcoxon, Collins Aerospace, Inc.

Micro-Encapsulated Phase-Change Materials as Heat Transfer Media in Electronics John Rasberry, Keysight Technologies

Tuesday November 5, 2019

Thank you to our Supporting Sponsor

Thank you to our Supporting Sponsor

3:30PM Coffee Break and Exhibits Coffee Break Sponsor: Indium

4:00PM Session 6: Liquid Cooling Session Chair: Adriana Rangel, Cisco, Inc. Points of Connection: Critical Considerations in Liquid Cooling Dennis Downs, CPC, Colder Products Company Recent Developments in Computer Immersion Cooling with Fluorochemical Heat Transfer Fluids Phillip Tuma, 3M Company

Liquid Cooling of a 17 kW Artificial Intelligence Module Guy R. Wagner, Electronic Cooling Solutions Inc.


8:00AM Continental Breakfast and Exhibits

9:00AM Keynote: Developments in Quantum Computing at Microsoft Presenter: Dave Wecker, Microsoft Quantum Computing Group Session Chair: Bill Maltz, Electronic Cooling Solutions, Inc.

Thermal Design of the Microsoft Surface Hub Andy Delano, Microsoft

Wednesday November 6, 2019

10:00AM Coffee Break and Exhibits

10:30AM Session 8: System Thermal Modeling Session Chair: Vadim Gektin, Blueman Inc.

The Design of Actively-Cooled Headphones Guy R. Wagner, Electronic Cooling Solutions Inc. Precise Electrical Methods for Characterizing Thermoelectric Microcoolers Brandon Noska, Uttam Ghoshal, Sheetak Solder Joint Integrity Evaluation of QFN Components with Voiding Ross Wilcoxon, Tim Pearson, Dave Hillman, Collins Aerospace Inc.,

12:30PM Closing Remarks: Dave Saums, Vadim Gektin

12:45PM Workshop Close

The 36th Annual Thermal Measurement, Modeling and Management SymposiumMarch 16th - 20th, 2020

Thermal Innovations that Make the World’s Technology CoolSan Jose, California at the Doubletree by Hilton

For program details, registration, exhibition and hotel informationvisit WWW.SEMI-THERM.ORG today!

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www.semi-therm.org

EXHIBITOR LISTINGS

8SEMI-THERM Thermal Technologies Workshop

Boyd CorporationBoyd Corporation has over 90 years of customer-focused performance success and is a global leader in advanced sealing, thermal management and protection solutions. Aavid, Thermal Division of Boyd Corporation has a long history of developing, designing, testing, optimizing, and fabricating reliable high-performance cooling systems across all industries. By choosing, integrating, or developing the right technology, Boyd delivers solutions that can increase power, improve functionality and reliability, and reduce the cost and size of our customers’ applications.

CPCCPC thinks beyond the point of connection to help protect valuable electronics. Designed specifically for liquid cooling applications, rugged couplings withstand long periods of connection yet disconnect reliably without drips.

AOS Thermal Compounds LLCAOS Thermal Compounds LLC developed the FIRST non-silicone thermal grease. Our roots trace back to Newark, New Jersey in 1895 and the founding of American Oil & Supply Co. AOS was a major supplier of lubricant products to the military in both World Wars and a pioneer in the development of turbine and hydraulic lubricants based on synthetic esters for aircraft, naval vessels and NASA.Our focus is thermal grease and making it user-friendly. Our mission is to be the leading innovator in solving thermal interface challenges —today and tomorrow. We are successful, profitable and constantly growing. Our people are focused, enthusiastic and committed contributors to a business driven by clients and product innovation.We focus our efforts not only to improve thermal properties but can demonstrate superior shelf-life stability, long-term performance and optimal rheological properties. We are constantly striving to bring better solutions to the individual customer's thermal management needs in today's demanding environment.

DS&A LLCDS&A LLC has provided business strategy, product development strategy, and market analyses for electronics industry thermal management systems, thermal materials, and thermal material test and characterization. Acquisitions strategy, candidate analysis, and due diligence and electronics market assessments are also conducted for client companies. All work is undertaken in strict confidence and utilizing forty years of global electronics thermal management industry experience.Primary focus areas are two-phase pumped dielectric liquid cooling, CTE-matched thermal materials and substrates, thermal interface materials, and advanced thermal management components, primarily for vehicle electrification, power semiconductors, and computing/telcom hardware.

CPS TechnologiesCPS Technologies is the World’s leader In MMC technologies providing thermal management solutions in our AlSiC for heat sinks and heat spreaders, base plates, optical mounts and benches. With CPS’s unique processing and manufacturing capabilities we can provide near net shaped parts as well provide features such as inserts and tubes. CPS has a variety of plating schemes for our AlSiC materials and have complete in house machining capabilities. CPS is an industry leader for Hermetic packaging providing glass to metal seals including ceramic feedthrus in ASTM Kovar ,Cold Roll Steel, Stainless Steel, Copper, Aluminum,48 Alloy and our unique AlSiC package for the high reliability space and defense contractors, meeting Mil Std 883,202, DFAR compliant and Certified to ISO 9001 http://www.alsic.com

Electronics CoolingElectronics Cooling magazine has been providing a technical data column since 1997 with the intent of providing you, the readers, with pertinent material properties for use in thermal analyses. We have largely covered the most common materials and their associated thermal properties used in electronics packaging. https://www.electronics-cooling.com

www.semi-therm.org

EXHIBITOR LISTINGS


Indium CorporationIndium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.For more information about Indium Corporation, visit www.indium.com or email [email protected]. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.

Future Facilities IncorporatedWe set Future Facilities up to deliver the power of engineering simulation into the hands of an emerging data center industry. We created a tool optimized for data centers, designed to be used by the DC professional, and made it powerful, intelligent, automated and connected. Five years later, we tuned our technology to deliver the same benefits to the thermal management of electronics and provide an integrated toolset for these two converging industries. We develop engineering simulation software that allows our customers to quantify and qualify business decisions balancing risk against cost. Our offering covers the full spectrum starting from electronics design to data center design and operations. Our software provides a safe, offline environment in which to create virtual prototypes, troubleshoot existing designs and run what-if scenarios for future configurations.

Hermetic Solutions GroupHermetic Solutions Group is the premier global supplier of hermetic packaging, components and services to leading manufacturers in the defense, aerospace, medical, energy and telecommunication markets. Comprised of highly respected microelectronic packaging brands - Hi-Rel Group, Litron, PA&E and Sinclair Manufacturing, we offer a single source of supply for hermetic packages, connectors, headers, lids, windows, thermal management materials, vacuum products, preforms and laser solutions. We make our customers lives easier by providing a comprehensive solution to enable and protect sensitive electronics in harsh environments.

Long WinLong Win specializes in research, design, manufacture and service of scientific instruments for thermal managing, material & fluid mechanic and educational fields. Long Win holds a leading position on research, measurement and inspection apparatus for the electronic cooling market. Some of their product lines include thermal-related measurement apparatus for fan performance, TIMs, cooler modules, heat pipes, vapor chambers, IC packages, LEDs, liquid cooling, thermal and flow test for servers, racks and data center, and natural-convection simulation. They have more than 100 types of apparatus in their 18,000 sq. ft. lab which is located in Taiwan and a lab based in Livermore, California.

Energy Smart Electronic Systems (ES2) CenterThe Center for Energy-Smart Electronic Systems (ES2) is an NSF-sponsored Industry/University Cooperative Research Center (I/UCRC). ES2 is a collaboration of government, industry and academia, researching ways to make electronic systems, including data centers, more energy-efficient. The Center has published over 200 papers and graduated more than 50 students, most with master’s or doctorate degrees. Members work closely with students to address real world challenges using the extensive research facilities available at each university site. Additional information may be found at the ES2 website: www.binghamton.edu/es2

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EXHIBITOR LISTINGS


Schlegel EMEI GroupSchlegel Electronic Materials (SEM) invented highly conductive fabric over foam shielding gaskets in 1987, marking a major breakthrough for the electromagnetic interference shielding of electronic enclosures and has become the pre-eminent manufacturer of electromagnetic interference (EMI) shielding products.SEM offers a full range of EMI shielding products including gaskets, Thermal Interface Materials, I/O backplane shielding gaskets, BeCu Fingerstock, and conductive tapes. laminates, and a newly developed line of absorbers. These products enable the computer, telecommunications, military, medical and electronics industries to meet global requirements for electromagnetic compatibility (EMC).From concept to production, SEM's complete portfolio of shielding products combines highly conductive materials with flexible foams and coatings to provide the latest EMI containment solutions.

Siemens Digital IndustriesThe Simcenter™ portfolio is a range of simulation software and test solutions that support development of a product digital twin to aid improved design from early stages, through to manufacture and lifecycle management.In electronics and semiconductor sector, Simcenter portfolio includes accurate electronics cooling, CFD, multi-physics simulation software and design exploration tools to meet different application thermal modeling requirements and to suit the wide engineering user demographic variances. These proven solutions provide workflow advantages to enable faster, confident development of reliable products. 3D Simulation software incl.: Simcenter Flotherm, Simcenter Flotherm XT, Simcenter STAR-CCM+, Simcenter FLOEFD, and Simcenter 3D, Simcenter NASTRAN …Accurate, repeatable thermal characterization testing is achievable using Simcenter T3STER thermal transient test technology. Test applications include packaged ICs, LEDs, TIM materials, and for power semiconductor thermal reliability assessment (Simcenter POWERTESTER). A unique test and simulation capability is in automatic package thermal model calibration for highest accuracy simulation.https://www.siemens.com/simcenter

Sekisui PolymatechSekisui Polymatech is a global supplier of electronic components. We specialize in solving heat, moisture, vibration, water, and other custom challenges for our consumer electronics customers.

ThermAvant Technologies, LLCThermAvant Technologies, LLC designs, develops and delivers custom thermal solutions to improve size, weight, performance and/or costs of advanced energy and technology platforms. The leading provider of Oscillating Heat Pipe products, ThermAvant also offers custom Cold Plates, Ejector Refrigerators, and Design & Engineering services.

Momentive Performance MaterialsFrom potting and encapsulation products to adhesives, and packaging, Momentive has been leading the way in providing long-term, reliable protection for sensitive electronic components for decades. And as systems continue to get smaller, circuit densities higher, and operating temperatures hotter, our deep technical knowledge and extensive thermal management experience help meet industry needs for silicone solutions for heat dissipation in electronics.Designers confronting thermal challenges will find a range of solutions from Momentive Performance Materials. Our SilCool* family of silicone adhesives, compounds, potting materials and gap fillers deliver the high thermal conductivity, thin bond lines, and low thermal resistance required for high-performance components.

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