Package outline 5 x 6

Space for via hole (optional)

Solder resist covering vias andsegmenting thermal pad (optional)

4.2

1.27 0.4

0.8

4.9

3.4

P/PG-VQFN-8-1, -2, -4

Package Information Published by Infineon Technologies AG

Package Outline

Foot PrintSoldering Type: Reflow Soldering

±0.15A

6±0

.1

BIndex Marking

5 8

14

1.27

3 x 1.27 = 3.81

Index Marking

0.18x

BAM C

±0.0

50.

5

±0.050.4

±0.14.20

±0.1

3.40

0.9

MA

X.

0.05

MA

X.

C8x

0.05SEATING

(0.2

5)

PLANE

126.3

5.3

8Index Marking

0.3

1.2

Manufacturer

G = Green Product

Lot code

Type code

Date code (YYWW)

12345678

XXX

12345678G

P/PG-VQFN-8-1, -2, -4

Package Information Published by Infineon Technologies AG

Marking Layout

Tape and ReelReel ø330 mm: 3.000 Pieces/Reel