Power module packaging: material market...for 2017-2023 will be 8.2%, coming close to a $2B business...
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Power module packaging: material market and technology trends Report FromTechnologies to Market
Transcript of Power module packaging: material market...for 2017-2023 will be 8.2%, coming close to a $2B business...
Power module packaging:
material market and technology
trends
Report
From Technologies to Market
2
Biographies & contacts
Alejandra Fuentes Suarez is a Technology & Market Analyst, Power Electronics, within the Power and Wireless Team at Yole Développement (Yole). She isinvolved in the development of custom studies and reports covering the power electronics industry: Alejandra daily researches the latest developments in powerconverter topologies, passive components, power modules packaging and EV/HEV. Previously Alejandra acquired extensive expertise in the design of powerconverters for solar, wind, hydro and motor drive applications at Semikron (France). Alejandra graduated from UJF (Grenoble, FR) and INP (Grenoble, FR) as anelectrical engineer, specializing in design of power electronics system. She also holds an advanced master’s in the field of Marketing and Management of Energy fromthe Grenoble Business School (Grenoble, FR).
E-mail: [email protected]
ABOUT THE AUTHORS
Dr. Milan Rosina
Dr. Milan Rosina is Senior Analyst, Power Electronics & Batteries, at Yole Développement (Yole), within the Power & Wireless division. Milan has 20 years ofscientific, industrial and managerial experience in equipment and process development. He has experience in due diligence, technology, and market surveys in thefields of renewable energies, EV/HEV, energy storage, batteries, power electronics, thermal management, and innovative materials and devices. Dr Rosina receivedhis Ph.D. degree from National Polytechnical Institute (Grenoble, France). He previously worked for the Institute of Electrical Engineering in Slovakia, Centrothermin Germany, Fraunhofer IWS in Germany, CEA LETI in France, and utility company ENGIE in France.
E-mail: [email protected]
Mattin GraoTxapartegi
Mattin Grao Txapartegi is a Power Electronics Analyst at Yole Développement. He is engaged in many custom studies and reports on the development of inverterarchitecture and passive components, and recently he has been in charge of power packaging topics. Mattin drives technology and market scouting, roadmapdefinition, identification of disruptive technologies and market opportunities, and competitive landscape analysis. He acquired comprehensive expertise in the designof power converters for electric vehicles at the car manufacturer Renault. He graduated from Grenoble INP with an engineering degree in electrical systems. Hethen earned an advanced master’s degree in aeronautic engineering from Arts et Métiers ParisTech. During this time, he oversaw managerial, financial andmarketing fields within the aeronautics industry.
Email: [email protected]
Alejandra Fuentes
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
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TABLE OF CONTENTS
• Objectives of the report 4
• What is in this report? 5
• Companies cited in the report 6
• List of abbreviations 7
• Executive summary 8
• Overall power electronics market 37
• Power module market 42
• Global trends for power module packaging 48
• Thermomechanical issues in power modules 63
• Power module packaging 71
• Composition of a conventional power module 73
• Power module materials and process choice 77
• Interconnections 82
• Die and substrate attach 97
• Encapsulation 121
• Substrates 139
• Baseplates 156
• Thermal Interface Materials (TIMs) 172
• Power modules - Case studies 193
• Raw materials market for power packaging 208
• Yole’s methodology for market metrics 209
• Specific market analysis of each part of the module:
• Interconnections in power modules 211
• Die attach for power modules 215
• Substrate attach for power modules 220
• Encapsulation for power modules 225
• Substrates for power modules 230
• Baseplates for power modules 235
• TIM for power modules 240
• Business model and supply chain analysis 245
• Wide-band gap packaging 286
• General conclusions 305
• Yole Développement presentation 310
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
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OBJECTIVES OF THE REPORT
To provide market analysis and forecasts for power module packaging.
To provide a deep insight into state-of-the-art package designs and materials.
To identify the key technology trends that will shape the power packaging market in the future.
To understand the main challenges and proposed innovations for power packaging.
To provide analysis and trends for the power packaging supply chain.
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
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WHAT IS IN THIS REPORT?
• The main challenge for the power electronics industry is to reduce energy consumption in order to meet targets for reducing CO2
emissions.
• To meet this objective conversion efficiency must be increased:
• Technology breakthroughs such as wide band gap (WBG) semiconductors are needed.
• The whole power electronics device must be optimized, including the packaging.
• Improved thermal management helps to reduce the cooling needs and related energy consumption.
• To preserve device characteristics, package developments are imperative:
• WBG semiconductor progress requires dedicated developments.
• Design-to-cost solutions are required to drive down costs.
• Volume constraints and related high-power density challenges require development of new solutions.
• In this report we provide an insight into the packaging market for power electronics:
• The standard module is described, with detailed analysis of each part of the package and the associated markets.
• Case studies are developed to illustrate different technologies.
• Technology trends
• A description of the power packaging landscape is also provided, along with main development trends.
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
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COMPANIES CITED IN THE REPORT
ABB, ACC, Alpha, AM2T, Amkor, AOS, APE, aPSI3D, Avator, AT&S, BlueStar Silicones, Bosch, BYD, CeramTec, Comelec, Continental, CPS Technologis, CRRC, Danfoss, Delphi, Denso, Dow Corning, Dowa, Dupont, Dynex, Electrolube, Fairchild, Fuji
Electric, GaN Systems, GE, General Electric, Hala, Henkel, Heraeus, Hitachi, Hitachi Chemical, Honda, Indium Corporation, Infineon, Intel, International Rectifier, IXYS, KCC, Kisco Conformal Coating, Kyocera, LS, Macmic, Microsemi, Mitsubishi Electric,
Mitsubishi Materials, Momentive, Müller-Ahlhorn, Nusil Technology, Plansee, Powerex, Powerstax, On Semiconductor, RavelinMaterials, RHP Technology, RUISIL, Schneider Electric, Semikron, ShinEtsu, Specialty Coating Systems (SCS), Shanghai Hua Hong
NEC, Shin Etsu, Siemens, Starpower, STATS ChipPAC, STMicroelectronics, Tesla, Texas Instruments, Toshiba, Toyota, TSMC, Valeo, Vincotech, Vishay, Wacker, and more.
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
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POWER MODULE MARKET
Power modules, discretes or embedded ?
Inverter power
Functionality integration
More
Less
IPMSmall device, small power.All-in-one: IGBT, diodes, drivers and control.
Discrete packagingSmall device, medium power.All in one: MOSFET, IGBT, or co-pack IGBT and diode.
6-in-1 power moduleLarge device, medium power.
Six IGBTs and diodes.IGBT driver is external.
Single power moduleLarge device, large power.One IGBT and diode. Several chips to handle the current.IGBT driver is external.
MW range100s kW range10s kW rangeWatt to kW range
IPM: Intelligent Power Module
Embedded PackageSmall device.Small heat dissipationSemiconductor embedded in PCB.
2-in-1 & 1-in-1 power modulesMedium power.2 or 1 IGBT packagedtogether with the diode.Trend in EV/HEV
New packaging trendsPackaging type by power inverter
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
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POWER MODULE MARKET
Power module market revenue, split by application
The power module market will experience a CAGR2017-2023
of 7.8%.
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
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GLOBAL TRENDS FOR POWER MODULE PACKAGING
Technology trends
about packaging
materials
Yole Développement’s
vision about the
coming years
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
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GLOBAL TRENDS FOR POWER MODULE PACKAGING
Impact of double-sided cooling designs on choice of packaging materials
Double-side cooling will have a strong impact on the choice of packaging materials.
• Impact of double-sided cooling:
• Wire bond-free interconnections will be significantly reduced.
• Baseplates are no longer used.
• Epoxy will be better adapted for use than silicone gel.
• New requirements will arise such as spacers, top-die attach and topside substrates.
Interconnections
Wire bonds
Wire bond-free
Encapsulation
Epoxy
Silicone gel
Substrate
Ceramics
Lead frame
Other
Baseplate
+ Top-die attach
+ Spacers
Double-side power
module cooling design
Impact of power module design on the choice of packaging materials: an example of a double-side cooling design.
Yole Développement
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
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LAST TECHNOLOGY INNOVATIONS
In…
Interconnections
Die-attachSubstrate-
attach
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DIE AND SUBSTRATE ATTACH
Yole’s vision of the soldering-to-sintering transition
The eagerness of different
power module manufacturers to make the transition to
sintering technology depends on
their technology and
market positioning.
Newcomers will
build new manufacturing
lines with a free choice
of die attach technology.
Source: Yole Développement
Still in
development
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
13
LAST TECHNOLOGY INNOVATIONS
In…
Encapsulation
Substrates
Baseplates
TIM
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
14
ADVANCED PACKAGING TECHNOLOGIES FOR POWER
At what level does advanced packaging inspire power packaging?
In recent years, synergies
between advance packaging
technologies and power packaging have popped-up.
Microelectronics
Power Electronics
Low power
Medium power
High power
Devices
Po
wer
Packaging
Advanced Packaging
Power Packaging
Synergies
sought
here!
Some advanced packaging solutions can be adapted for packaging of low-power
power electronic devices.
Yole Développement
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MARKET & FORECASTS
2017 - 2023
Forecasts for
2018-2023
Markets per
technology &
per
application in
cm2 or cm3
and in million
USD
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
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CASE STUDY
ST Microelectronics’ SiC Modules in TESLA’s Model S3 2017
Tesla’s Model S3 2017 is equipped with ST’ SiCMOSFET power modules
Source: System Plus Consulting
Source: System Plus Consulting
Latest case studies
of innovative
module packaging
in commercial
modules
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
17
BUSINESS MODEL AND SUPPLY CHAIN ANALYSIS
Yole Développement
analysis on business
models and supply-chain
evolution
Power module
manufacturers
positioning
M&A
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
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FOCUS ON SiC & GaN PACKAGING
Special chapter for SiC & GaN packaging challenges,
developments and solutions
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
19
RELATED REPORTS
Power Module Packaging: Material Market and Technology Trends | Sample | www.yole.fr | ©2018
2017 was an impressive year for the IGBT power module market, as it grew 18.1% compared to 2016. And so far, the perspectives for 2018 are even better, with over 20% growth in the first half of the year. The main explanation of this drastic market explosion is the boost from the electrical and hybrid electric vehicle (EV/HEV) sector, especially in China. It has also been an exceptional year for industrial motor drives in Asia.
Other device modules, like those based on MOSFETs and bipolar transistors, show a slight decrease. Consequently the overall power module market value ended at $3.54B, growing 11.3% year-on-year. By 2023 the market is expected to be over $5.5B. This promising market is beneficial for the packaging material business that Yole Développement (Yole) covers in this report, “Power Module Packaging 2018”.
The power module packaging material business is worth $1.2B, a little more than a third of the total power module market. It is a very dynamic market, where continuous innovations and material enhancements and a lot of R&D investment are needed. This power module packaging material market’s compound annual growth rate (CAGR) for 2017-2023 will be 8.2%, coming close to a $2B business opportunity by 2023.
In terms of technology, the report takes a deep look into substrates, baseplates, die-attach,
substrate-attach, encapsulation, interconnections and thermal interface material (TIM) markets. Almost 50% of the current $1.2B market value is substrates and baseplates. Another 25% of that market is exclusively from die-attach and substrate attach materials. Major technological choice trends in these segments can therefore rapidly impact the power module packaging overall market.
For instance, the penetration of silver sintering as a die-attach technology is increasing among the industry, and even arriving in some EV/HEV power modules. As this technology is more expensive, the CAGR2017-2023 for the die-attach market is 11%, much higher than for the other market segments.
The second highest CAGR2017-2023 is for interconnections, at 9.5%. This is because new interconnection technologies, like flexible interconnection foils, are more costly compared to more cost-effective but less reliable aluminum wire-bonding. The other major technological change that will impact the global market will be an increasing use of silicon nitride (Si3N4) active metal brazing (AMB), which will capture 37% of the power module substrate market by 2023. As the demand for Si3N4 increases, its high cost is expected to decrease faster than the other ceramic materials.
POWER MODULE PACKAGING 2018: MATERIAL MARKET AND TECHNOLOGY TRENDSMarket & Technology report - July 2018
THE IGBT POWER MODULE MARKET GREW 18.1% IN 2017, DRIVING THE POWER MODULE PACKAGING MATERIALS BUSINESS
Power packaging is continuously adapting to power application market trends.
KEY FEATURES• Presentation of detailed analysis of
thermal interface materials (TIMs), thermomechanical issues in power modules and case studies and technological innovations
• 2017-2023 market value for the power electronics field and especially for power modules
• Complete analysis of power module packaging design
• Deep insight into each part of a standard power module package: substrate, baseplate, die attach, substrate attach, encapsulation and interconnections
• Technology trends and roadmaps• 2017-2023 market metrics
and forecasts for each type of packaging component (substrate, baseplate, die attach, substrate attach, encapsulation, interconnections and TIMs)
• Evolution of different business models
• Supply chain analysis and evolution trends
• Complete presentation of Wide Band Gap device packaging
• Packaging trends for the coming years
WHAT’S NEW• Focus on packaging for Wide Band
Gap devices• Analysis of the newest power
module designs, including the Tesla Model 3 power module, Mitsubishi J1-series and Infineon’s HybridPack Drive
• Insight into emerging business models within the supply chain
• 2017-2023 market metrics and forecasts for thermal interface materials (TIMs)
(Yole Développement, July 2018)
Power module packaging: 2017 -2023 raw material marketsize per packaging part
US$ 1.2B
US$ 1.9B2023
2017
Substrate
Baseplate
Substrate attach
Casing
Interconnections
Dieattach
Encapsulation
Baseplate
Substrate attach
Casing
Interconnections
Substrate
Dieattach
Encapsulation
US$ 111 M
US$148 M
US$201 M
US$271 M
US$66 M
US$85 M US$
75 M
US$147 M US$
155 M
US$277 M
US$349 M
US$390 M
US$518 M
US$307 M CAGR 8.2%
US$ 147 M
POWER MODULE PACKAGING 2018: MATERIAL MARKET AND TECHNOLOGY TRENDS
NEW CHAPTERS: A WBG PACKAGING - TESLA’S MODEL 3 POWER MODULES - MITSUBISHI ELECTRIC’S J1 SERIES INNOVATIVE INTEGRATED SUBSTRATES
The Power Module Packaging 2018 report has several new features, including an entire chapter which focuses
on WBG module packaging challenges, innovations and future trends. Yole has also introduced the TIM market and its forecasts as part of the power module packaging market, building on the 2017 report, where just the different TIM technologies were described. Yole’s analysts have also now analyzed the Transient Liquid Phase Soldering (TLPS) technology as a future alternative to die-attach.
An exciting, fresh, case study explores Tesla’s Model 3 power module, which has been manufactured by STMicroelectonics and reverse engineered by System Plus Consulting. Similarly, photos and an explanation of Mitsubishi Electric’s J1-series power module, with its very innovative integrated ceramic and baseplate pin-fin substrate design secrets. The Power Module Packaging 2018 report will bring you all these latest innovations and much more.
Technical trends in power module packaging are mainly driven by the entrance of the Wide Band Gap (WBG) materials and the challenging system requirements of the booming EV/HEV industry. Indeed, the introduction of the WBG semiconductors SiC and GaN is pushing the development of new power packaging solutions, as these devices can work at higher junction temperatures and higher switching frequencies with smaller die sizes.
In order to take advantages of SiC’s properties, reliable and robust die attach technologies that work at 200 °C are required. Silver sintering is today the big star for SiC power modules, due to its high melting temperature point, exceeding 900°C. In term of substrates, high thermal conductivity materials will be chosen such as AlN and Si3N4, as dies need to dissipate the losses from a smaller surface. In addition, the interconnection technology is a key factor for the good performance of SiC devices. Many companies are therefore developing their own low-stray inductance interconnections such as GE’s Power Over Lay (POL) or Semikron’s SKiN technology. In contrast, GaN devices are not yet packaged in power modules, and are using advanced packaging technologies. GaN Systems’ printed circuit board-embedded GaN packages are the best example.
The EV/HEV industry’s demanding requirements for high power density and mechatronics integration are driving many of the other power packaging innovations. Today, there are two clear trends: over-molded double-side cooled modules for hybrid cars and single-side cooled modules with pin-fin baseplates for battery-only electric cars.
This report summarizes other tendencies such as the use of organic insulator foils in insulated metal substrates (IMS) and the “integrated substrates” that merge a ceramic substrate and a pin-fin baseplate. With all these new technologies, the EV/HEV power packaging landscape is fast-evolving and dynamic. That is why Yole follows the leading packaging material suppliers like DOWA, Denka, Rogers and Alpha, and the module manufacturers like Bosch, Mitsubishi Electric and Semikron, very closely to quickly understand their future technology innovations.
SiC module packaging: Main technologies that will need to evolve
(Yole Développement, July 2018)
Substrate
High thermal conductivity ceramics
such as AlN and Si3N4.
Encapsulation
High-temperature epoxy or silicone gel.
Die attach
Silver sintering is expected to become the preferred choice.
Interconnections
Low-inductance interconnections.
SiC chips: High Tj and
high frequency
New designs and new materials are needed
Example of STMicroelectronics’ SiC MOSFETs modules in Tesla’s Model 3*
(Yole Développement, July 2018)
Example of STMicroelectronics’ SiC MOSFETsmodules in Tesla’s Model 3
reverse engineered by System Plus Consulting
* Extracted from System Plus Consulting report : Tesla Model 3 Inverter with SiC Power Module from STMicroelectronics, June 2018
SILVER SINTERING, NEW SUBSTRATES AND INTERCONNECTION TECHNOLOGIES ARE THE LATEST INNOVATIONS DRIVEN BY EV/HEV AND THE ARRIVAL OF WBG
MARKET & TECHNOLOGY REPORT
COMPANIES CITED IN THE REPORT (non exhaustive list)ABB, ACC, Alpha, AM2T, Amkor, AOS, APE, aPSI3D, Avator, AT&S, BlueStar, Silicones Bosch, BYD, CeramTec, Comelec, Continental, CPS Technologis, Danfoss, Delphi, Denso, Dow Corning, Dowa, Dupont, Dynex, Electrolube, Fuji Electric, GaN Systems, GE, General Electric, Hala, Henkel, Heraeus, Hitachi, Hitachi Chemical, Honda, Indium Corporation, Infineon, Intel, International Rectifier, KCC, Kisco Conformal Coating, Kyocera, LS, Mersen, Mitsubishi Electric, Mitsubishi Materials, Momentive, Müller-Ahlhorn, Nusil Technology, Plansee, Powerex, Powerstax, Ravelin Materials, RHP Technology, RUISIL, Schneider Electric, Semikron, Shin-Etsu, Specialty Coating Systems (SCS), Shanghai Hua Hong NEC, Shin Etsu, Siemens, Starpower, STATS ChipPAC, STMicroelectronics, Texas Instruments, Toshiba, Toyota, TSMC, Valeo, Vincotech, Wacker, and more.
Objectives of the report 4Executive summary 8Overall power electronics market 37Power module market 42Global trends for power module packaging 48Thermomechanical issues in power modules 63Power module packaging 71Composition of a conventional power module 73Power module materials and process choice 77Interconnections 82Die and substrate attach 97Encapsulation 121Substrates 139
Baseplates 156Thermal Interface Materials (TIMs) 172Power modules - case studies 193Raw materials market for power packaging 208
Specific market analysis of each part of the module: Interconnections in power modules 211Die attach for power modules 215Substrate attach for power modules 220Encapsulation for power modules 225Substrates for power modules 230Baseplates for power modules 235TIM for power modules 240Business model and supply chain analysis 245Wide-band gap packaging 286General conclusions 305
TABLE OF CONTENTS (complete content on i-Micronews.com)
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OBJECTIVES OF THE REPORT• Highlight power module packaging
market analysis and forecasts• Provide a deep insight into state-
of-the-art package designs and materials
• Describe the current packaging challenges for SiC and GaN Wide Band Gap devices
• Identify the key technology trends that will shape the market in the future
• Understand the main challenges and proposed innovations
• Deliver supply chain analysis and trends
Mattin Grao Txapartegi investigates power packaging solutions to analyze the latest technical challenges, market growth and competi t ive landscape . Get t ing a deep understanding of the technology evolution, the market trends and the strategies of each player are part of his mission at Yole. Previously he acquired a comprehensive expertise in the design of power converters for EV at Renault (France). As an engineer, Mattin graduated from Grenoble INP (FR) with specialization in embedded systems for transportation. He has also an advanced master in aeronautics from the Arts & Métiers ParisTech (FR).
Dr. Milan Rosina has 20 years of scientif ic, industrial and managerial experience involving equipment and process development, due diligence, technology, and market surveys in the f ields of renewable energies, EV/HEV, energy storage, batteries, power electronics, thermal management, and innovative materials. He previously worked for the Institute of Electrical Engineering in Slovakia, Centrotherm (Germany), Fraunhofer IWS (Germany), CEA LETI in France, and utility company ENGIE in France.Dr. Rosina received his Ph.D. degree from National Polytechnical Institute (Grenoble, France).
Alejandra Fuentes Suarez daily researches the latest developments in power conver ter topologies , pass ive components, power modules packaging and EV/HEV. Previously Alejandra acquired extensive expertise in the design of power converters for solar, wind, hydro and motor drive applications at Semikron (France). Alejandra graduated from UJF (Grenoble, FR) and INP (Grenoble, FR) as an electrical engineer, specializing in design of power electronics system. She also holds an advanced master’s in the field of Marketing and Management of Energy from the Grenoble Business School (Grenoble, FR).
As analysts within the Power & Wireless division at Yole Développement (Yole) Alejandra Fuentes Suarez, Dr. Milan Rosina and Mattin Grao Txapartegi co-authored the Power module packaging 2018: Material market and technology trends report:
AUTHORS
ASSOCIATED REPORTAutomotive Power Module PackagingComparison 2018 - Structural, Process and Cost Report by SystemPlus ConsultingA cost-oriented review of power module packaging technologies for the automotive market.
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• @Micronews e-newsletter
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services
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www.i-Micronews.com
4©2018 | www.yole.fr | About Yole Développement
6 COMPANIES TO SERVE YOUR BUSINESS
Due diligence
www.yole.fr
Manufacturing costs analysis
Teardown and reverse engineering
Cost simulation tools
www.systemplus.fr
Market, technology and strategy
consulting
www.yole.fr
IP analysis
Patent assessment
www.knowmade.fr
Innovation and business maker
www.bmorpho.com
Design and characterization of
innovative optical systems
www.piseo.fr
Yole Group of Companies
5©2018 | www.yole.fr | About Yole Développement
OUR GLOBAL ACTIVITY
30%of our business
40%of our business 30%
of our business
Greater
China office
Yole Japan
HQ in Lyon
Nantes
Paris
Nice
Vénissieux
Europe office
Frankfurt
Hsinchu
Tokyo
Yole Inc.
Phoenix
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Seoul
Palo Alto
6©2018 | www.yole.fr | About Yole Développement
ANALYSIS SERVICES - CONTENT COMPARISON
Technology
and Market
Report
Leadership
Meeting
Q&A
Service
Depth of the analysis
Bre
adth
of th
e a
nal
ysis
Meet the
Analyst
Custom
Analysis
High
High
Low
7©2018 | www.yole.fr | About Yole Développement
SERVING THE ENTIRE SUPPLY CHAIN
Our analysts provide market analysis,
technology evaluation,
and business plans along the entire
supply chain
Integrators, end-
users and software
developpers
Device manufacturers
Suppliers: material, equipment,
OSAT, foundries…
Financial investors, R&D centers
8©2018 | www.yole.fr | About Yole Développement
SERVING MULTIPLE INDUSTRIAL FIELDS
We workacross
multiples industries to understand
the impact of More-than-
Moore technologies from deviceto system
From A to Z…
Transportation
makers
Mobile phone
and
consumer
electronics
Automotive
Medical
systems
Industrial
and defense
Energy
management
9©2018 | www.yole.fr | About Yole Développement
o Yole Développement, System Plus Consulting, KnowMade and PISEO, all part of Yole Group of Companies, keep on increasing their collaboration to offer, in 2018, a
collection of 150+ reports. Combining respective expertise and methodologies from the 4 companies, the reports aim to provide market & technology analysis, patent
investigation and patent infringement risk analysis, teardowns & reverse costing analysis.They cover:
o You are looking for:
• An analysis of your product market
• A review of your competitors evolution
• An understanding of your manufacturing and production costs
• An understanding of your industry technology roadmap and related IPs
• A clear view on the evolution of the supply chain…
Our reports are for you!
The combined team of 60+ experts (PhDs, MBAs, industry veterans…) from Yole Développement, System Plus Consulting, KnowMade and PISEO, collect information,identify the trends, the challenges, the emerging markets, the competitive environments and turn it into results to give you a complete picture of your industrylandscape.
In the past 20 years, we worked on more than 1 700 projects, interacting with technology professionals and high level opinion makers from the main players of theindustry.
o In 2018, Yole Group of Companies plan to publish +150 reports.Gain full benefit from our Bundled Offer and receive at least a 36% discount.
REPORTS COLLECTION
www.i-Micronews.com
• MEMS & Sensors
• RF devices & technologies
• Imaging
• Medical technologies (MedTech)
• Photonics
• Advanced packaging
• Manufacturing
• Advanced substrates
• Power electronics
• Batteries and energy management
• Compound semiconductors
• Solid state lighting
• Displays
• Software
• Memory
10©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (1/4)
MEMS & SENSORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the MEMS Industry 2018 – Update
− Silicon Photonics 2018 – Update
− Consumer Biometrics: Hardware & Software 2018 – Update
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Fingerprint Sensor Applications and Technologies – Consumer Market Focus 2017
− Sensors and Sensing Modules for Smart Homes and Buildings 2017
− Acoustic MEMS and Audio Solutions 2017
− MEMS & Sensors for Automotive Market & Technology Trends 2017
− High End Inertial Sensors 2017
− Magnetic Sensor 2017
o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT– by System Plus Consulting
− Piezo MEMS 2018 *
o PATENT ANALYSES – by KnowMade
− MEMS Microphone – Patent Landscape Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus – Patent-to-Product
Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− MEMS Pressure Sensor 2018 – Market & Technology Report
− MEMS Pressure Sensor Comparison 2018 – Structure, Process & Cost Report
− Gas & Particles 2018 – Market & Technology Report
− Gas & Particles Comparison 2018 – Structure, Process & Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market & Technology Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
− MEMS Packaging 2017 – Market & Technology Report
− MEMS Packaging Comparison 2017 – Structure, Process & Cost Report
RF DEVICES AND TECHNOLOGIES
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Wireless technologies (Radar, V2X) for Automotive 2018
− RF Standards and Technologies for Connected Objects 2018
− RF & Photonic Components & Technologies for 5G Infrastructure 2018
o REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT– by System Plus Consulting
− Automotive Radar Comparison 2018
o PATENT ANALYSES – by KnowMade
− RF Acoustic Wave Filters 2017 – Patent Landscape Analysis
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− 5G impact on RF Front End Modules and Connectivity for Cellphones 2018 – Market
& Technology Report – Update
− RF Front-End Module Comparison 2018 – Structure, Process & Cost Report
− RF Front End Modules for Cellphones 2018 – Patent Landscape Analysis
− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology Report – Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
& Cost Report
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023 Market & Technology Report – Update
− RF GaN Comparison 2018* – Structure, Process & Cost Report
− RF GaN 2018 – Patent Landscape Analysis
SOFTWAREo MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Consumer Biometrics: Sensors & Software 2018 – Update
− Processing Hardware and Software for AI 2018 - Vol. 1 & 2
− From Image Processing to Deep Learning, Introduction to Hardware and Software
Update : 2017 version still available / *To be confirmed
11©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (2/4)
IMAGING & OPTOELECTRONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of the Compact Camera Module and Wafer Level Optics
− Industry 2018 – Update
− 3D Imaging and Sensing 2018 – Update
− Sensors for Robotic Vehicles 2018
− Machine Vision for Industry and Automation 2018
− Imagers and Detectors for Security and Smart Buildings 2018
− Uncooled Infrared Imagers 2017
o PATENT ANALYSES – by KnowMade
− iPhone X Dot Projector – Patent-to-Product Mapping
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Status of the CMOS Image Sensor Industry 2018 – Market & Technology Report -Update
− CMOS Image Sensor Comparison 2018 – Structure, Process & Cost Report
− CMOS Image Sensors Monitor 2018* – Quaterly Update**
− Camera Module 2017 – Market & Technology Report
− Compact Camera Module Comparison 2018 – Structure, Process & Cost Report
− LiDARs for Automotive and Industrial Applications 2018 – Market & Technology
Report
− LiDAR for Automotive 2018 – Patent Landscape Analysis
ADVANCED PACKAGING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Advanced Packaging Industry 2018 – Update
− Status of Advanced Substrates 2018: Embedded Die and Interconnects, Substrate Like PCB Trends
− 3D TSV and Monolithic Business Update 2018 – Update
− Power Modules Packaging 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Status of Panel Level Packaging 2018
− Trends in Automotive Packaging 2018
− Hardware and Software for AI 2018 - Vol. 1 & 2
− Integrated Passive Devices (IPD) 2018
− Thin-Film Integrated Passive Devices 2018
− Memory Packaging Market and Technology Report 2018 – Update*
o PATENT ANALYSES – by KnowMade
− Hybrid Bonding for 3D Stack – Patent Landscape Analysis
o LINKED REPORTS– by Yole Développement and System Plus Consulting
− Advanced RF System-in-Package for Cellphones 2018 – Market & Technology Report -Update*
− Advanced RF SiPs for Cell Phones Comparison 2017 – Structure, Process
& Cost Report
− Fan-Out Packaging 2018 – Market & Technology Report – Update*
− Fan-Out Packaging Comparison 2018* – Structure, Process & Cost Report
MANUFACTURING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Wafer Starts for More Than Moore Applications 2018
− Equipment for More than Moore: Technology & Market Trends for Lithography & Bonding/Debonding 2018
− Polymeric Materials for wafer-level Advanced Packaging 2018
− Laser Technologies for Semiconductor Manufacturing 2017
− Glass Substrate Manufacturing in the Semiconductor Field 2017
− Equipment and Materials for Fan-Out Packaging 2017
− Equipment and Materials for 3D TSV Applications 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− Equipment for More than Moore: Technology & Market Trends for
Lithography & Bonding/Debonding 2018 – Market & Technology Report
− Wafer Bonding Comparison 2018 – Structure, Process & Cost Report
Update : 2017 version still available / *To be confirmed
12©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (3/4)MEMORY
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Emerging Non Volatile Memory 2018 – Update
− Memory Packaging Market and Technology Report 2018 – Update*
o QUARTERLY UPDATE – by Yole Développement**
− Memory Market Monitor 2018 (NAND & DRAM)
o MONTHLY UPDATE – by Yole Développement**
− Memory Pricing Monitor 2018 (NAND & DRAM)
o REVERSE ENGINEERING & COSTING REVIEW – by System Plus Consulting
− DRAM Technology & Cost Review 2018
− NAND Memory Technology & Cost Review 2018
o PATENT ANALYSES – by KnowMade
− 3D Non-Volatile Memories – Patent Landscape
COMPOUND SEMICONDUCTORS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Compound Semiconductor Industry 2018*
− GaAs Materials, Devices and Applications 2018
− InP Materials, Devices and Applications 2018
− Bulk GaN Substrate Market 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Power SiC 2018: Materials, Devices, and Applications – Market & Technology
Report – Update
− SiC Transistor Comparison 2018 – Structure, Process & Cost Report
− Power SiC 2018 – Patent Landscape Analysis
− Power GaN 2018: Materials, Devices, and Applications – Market & Technology Report – Update
− GaN-on-Silicon Transistor Comparison 2018 – Structure, Process & Cost Report
− Status of the GaN IP – Patent Watch 2018 & Patent Activity 2017
− RF GaN Market: Applications, Players, Technology, and Substrates 2018-2023
– Market & Technology Report – Update
− RF GaN – Patent Landscape Analysis
POWER ELECTRONICS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Status of Power Electronics Industry 2018 – Update
− Discrete Power Packaging 2018 – Update*
− Power Electronics for Electric Vehicles 2018 – Update
− Integrated Passive Devices (IPD) 2018
− Wireless Charging Market Expectations and Technology Trends 2018
− Thermal Management Technology and Market Perspectives in Power
− Electronics and LEDs 2017
− Gate Driver 2017
− Power MOSFET 2017
− IGBT 2017
− Market Opportunities for Thermal Management Components in Smartphones 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting
and KnowMade
− Power Modules Packaging 2018 – Market & Technology Report – Update
− Automotive Power Module Packaging Comparison 2018 – Structure, Process & Cost Report
− Power ICs Market Monitor 2018 – Quaterly Update**
− Power ICs Market Comparison 2018* – Structure, Process & Cost Report
BATTERY AND ENERGY MANAGEMENTo MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Li-ion Battery Packs for Automotive and Stationary Storage Applications 2018 –Update
o PATENT ANALYSES – by KnowMade
− Status of the Battery Patents – Patent Watch 2018 & Patent Activity 2017
o LINKED REPORTS – by Yole Développement and KnowMade
− Solid State Electrolyte Battery 2018 – Market & Technology Report
− Solid-State Batteries 2018 – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed / ** Can not be selected within an Annual Subscription offer
13©2018 | www.yole.fr | About Yole Développement
OUR 2018 REPORTS COLLECTION (4/4)
SOLID STATE LIGHTING
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− IR LEDs and Lasers 2018: Technology, Industry and Market Trends – Update
− Automotive Lighting 2018: Technology, Industry and Market Trends – Update
− UV LEDs 2018: Technology, Industry and Market Trends – Update
− LiFi: Technology, Industry and Market Trends
− LED Lighting Module Technology, Industry and Market Trends 2017
− CSP LED Lighting Modules
− Phosphors & Quantum Dots 2017 - LED Downconverters for Lighting & Displays
− Horticultural Lighting 2017
o LINKED REPORTS – by Yole Développement and System Plus Consulting
− VCSELs 2018: Technology, Industry and Market Trends – Market & Technology Report
− VCSELs Comparison 2018 – Structure, Process & Cost Report
DISPLAYS
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− Quantum Dots and Wide Color Gamut Display Technologies 2018 – Update
− Displays and Optical Vision Systems for VR/AR/MR 2018
− MicroLED Displays 2018 – Market & Technology Report – Update
o PATENT ANALYSES – by KnowMade
− MicroLED Display – Patent Landscape Analysis
MEDTECH
o MARKET AND TECHNOLOGY REPORT – by Yole Développement
− BioMEMS & Non Invasive Emerging Biosensors: Microsystems for Medical
− Applications 2018 – Update
− Point-of-Need Testing Application of Microfluidic Technologies 2018 – Update
− Neurotechnologies and Brain Computer Interface 2018
− CRISPR-Cas9 Technology: From Lab to Industries 2018
− Ultrasound technologies for Medical, Industrial and Consumer 2018
− Inkjet Functional and Additive Manufacturing for Electronics 2018
− Liquid Biopsy: from Isolation to Downstream Applications 2018
− Chinese Microfluidics Industry 2018
− Scientific Cameras for the Life Sciences & Analytical Instrumentation
Laboratory Markets 2018*
− Artificial Organ Technology and Market 2017
− Connected Medical Devices Market and Business Models 2017
− Status of the Microfluidics Industry 2017
− Organs-On-Chips 2017
− Solid-State Medical Imaging 2017
− Medical Robotics Market & Technology Analysis 2017
o PATENT ANALYSES – by KnowMade
− Microfluidic IC Cooling – Patent Landscape
− Circulating Tumor Cell Isolation – Patent Landscape
− OCT Medical Imaging – Patent Landscape
− Pumps for Microfluidic Devices – Patent Landscape 2017
− Microfluidic Technologies for Diagnostic Applications – Patent Landscape 2017
− FLUIDIGM – Patent Portfolio Analysis 2017
− Consumer Physics SCiO Molecular Sensor – Patent-to-Product Mapping 2017
o LINKED REPORTS – by Yole Développement, System Plus Consulting and KnowMade
− Organs-On-Chips 2017 – Market & Technology Report
− Organ-on-a-Chip – Patent Landscape Analysis
Update : 2017 version still available / *To be confirmed
14©2018 | www.yole.fr | About Yole Développement
OUR 2017 PUBLISHED REPORTS LIST (3/3)
OUR PARTNERS’ REPORTS
PATENT ANALYSES – by KnowMade
− Wireless Charging Patent Landscape Analysis
− RF Acoustic Wave Filters Patent Landscape Analysis
− NMC Lithium-Ion Batteries Patent Landscape Analysis
− Pumps for Microfluidic Devices Patent Landscape
− III-N Patent Watch
− FLUIDIGM Patent Portfolio Analysis
− Knowles MEMS Microphones in Apple iPhone 7 Plus Patent-to-Product Mapping 2017
− Consumer Physics SCiO Molecular Sensor Patent-to-Product Mapping
− Patent Licensing Companies in the Semiconductor Market - Patent Litigation Risk and Potential Targets
− Microfluidic Technologies for Diagnostic Applications Patent Landscape
TEARDOWN & REVERSE COSTING – by System Plus Consulting
More than 60 teardowns and reverse costing analysis and cost simulation tools published in 2017
MORE INFORMATION
o All the published reports from theYole Group of Companies are available on our website www.i-Micronews.com.
o Ask for our Bundle Subscription offers: With our bundle offer, you choose the number of reports you are interested in and select the related offer. You then haveup
to 12 months to select the required reports from the Yole Développement, System Plus Consulting and KnowMade offering. Pay once and receive the reports
automatically (multi-user format). Contact your sales team according to your location (see the last slide).
15©2018 | www.yole.fr | About Yole Développement
MICRONEWS MEDIA
o About Micronews Media
To meet the growing demand for market,
technological and business information,
Micronews Media integrates several tools able
to reach each individual contact within its
network.We will ensure you benefit from this.
ON L I N E ON S I T E I N PE R S ON
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campaigns are great strategies
for improving your
product/brand visibility. They
are also an efficient way to
adapt with the demands of the
times and to evolve an effective
marketing plan and strategy.
Brand visibility, networking
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Today's technology makes it
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Targeted audience
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Webcasts are a smart,
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absentees, thanks to the
recording technology.
Benefit from the i-Micronews.com
traffic generated by the 11,200+
monthly unique visitors, the
10,500+ weekly readers of
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Several key events planned for
2018 on different topics to
attract 120 attendees on average
Gain new leads for your business
from an average of 340
registrants per webcast
Contact: Camille Veyrier ([email protected]), Marketing & Communication Project Manager
16©2018 | www.yole.fr | About Yole Développement
CONTACT INFORMATION
o CONSULTING AND SPECIFIC ANALYSIS, REPORT
BUSINESS
• North America:
• Steve LaFerriere, Senior Sales Director for Western US &
Canada
Email: [email protected] – + 1 310 600-8267
• Troy Blanchette, Senior Sales Director for Eastern US &
Canada
Email: [email protected] – +1 704 859-0453
• Japan & Rest of Asia:
• Takashi Onozawa, General Manager, Asia Business
Development (Korea, Singapore, India & ROA)
Email: [email protected] - +81 34405-9204
• Miho Othake, Account Manager (Japan)
Email: [email protected] - +81 3 4405 9204
• Itsuyo Oshiba, Account Manager (Japan)
Email: [email protected] - +81-80-3577-3042
• Greater China: Mavis Wang, Director of Greater China Business
Development
Email: [email protected] - +886 979 336 809
• Europe: Lizzie Levenez, EMEA Business Development Manager
Email: [email protected] - +49 15 123 544 182
• RoW: Jean-Christophe Eloy, CEO & President, Yole Développement
Email [email protected] - +33 4 72 83 01 80
o FINANCIAL SERVICES (in partnershipwith Woodside
Capital Partners)
• Jean-Christophe Eloy, CEO & President
Email: [email protected] - +33 4 72 83 01 80
• Ivan Donaldson, VP of Financial Market Development
Email: [email protected] - +1 208 850 3914
o GENERAL
• Public Relations: [email protected] - +33 4 72 83 01 89
• Email: [email protected] - +33 4 72 83 01 80
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