IEEC Database for Electronic Packaging Materials Wayne E. Jones Jr.a, Peter Borgesenb, Junghyun Choc

Sam Mahin-Shirazib, Linyue Tonga a) Department of Chemistry and Materials Science Program, Binghamton University, Binghamton, NY 13902

b) Department of Systems Science and Industrial Engineering, Binghamton University, Binghamton, NY 13902

c) Department of Mechanical Engineering, Binghamton University, Binghamton, NY 13902

The database of properties of industrial electronic

packaging materials (EPMs) has been maintained

and expanded in order to provide a wide range of

information for various electronic packaging

materials by utilizing chemical, mechanical,

physical and thermal testing methods. The

obtained information from the tests can provide a

basis for decision making on new products as well

as a foundation on which new materials can be

evaluated.

Introduction

Test Descriptions for Tools

By reviewing the description, the members will be

able to have a general idea about the capabilities of

the tools and their general application. The purpose

of the tools description is to address the following:

• What are the tool and its application

• One/two picture(s) of the tool

• An example of the result that can be obtained from the

tool

• A link to the tool for more details if there is any online

information for further information, staff members that

are responsible for that specific tool and some other

technical specifications.

Contact Information

If you want to add new materials to the database please contact:

Sam Mahin-Shirazi at smahins1@binghamton.edu

To discuss materials and data feel free to email:

Sam Mahin-Shirazi at smahins1@binghamton.edu

Linyue Tong at ltong1@binghamton.edu

Dr. Peter Borgesen at pborgese@binghamton.edu

1) IEEC Materials Submission Form

The online form is now available for members with

both secured access to the website and through a

link which has been sent to all the members.

Comparison of the measured and predicted plots for the

creep compliance of Hysol QMI519.

Continues lines are the predicted and dashed lines are the real data

Where 𝐷 𝑡 = 𝜀(𝑡)𝜎0

𝐷 𝑡 is the creep compliance function which is a material

property that characterizes creep behavior

𝜀(𝑡) is the time-varying strain at a constant load 𝜎0

is the mean retardation time. The smaller this value the

more rapid is the creep

Some of the tests have been reorganized and

some of them are recently added to the list

.

Available Tests

Chemical Structure

and Composition

Analysis

Mechanical Testing

• Universal Testing Machine

• Nanoindentation Testing

• Transmission electron microscopy (TEM)

• Scanning Electron Microscopy (SEM)

• X-ray Diffraction (XRD)

• Optical Microscopy (OM)

• Atomic Force Microscopy (AFM)

• Small-angle X-ray scattering (SAXS)

• IR Microscope

• Sample Preparation tools

Argon Ion Cross Section Polisher

Multiprep Tools

• Spectroscopic Ellipsometry

• Moisture analysis in Polymer

Weight Gain

Moisture Swelling

Coefficient Hygroscopic Swelling (CHS)

Microstructure Analysis

and Characterization

• Flash Diffusivity

• Thermal Conductivity

• Differential Scanning Calorimetry (DSC)

• TGA-MS

• Thermo-Mechanical Analyzer (TMA)

• Dynamic Mechanical Analyzer (DMA)

• Rheological Characterization

Thermal Analysis

Electrical Properties

• Electrical Conductivity

• Electrical Resistivity • X-Ray Imaging

• Scanning Acoustic Microscopy (C-SAM)

Non-destructive Structural

Characterization

• Fourier Transform Infrared Spectroscopy

• Energy/Wavelength-Dispersive

X-ray Spectroscopy

• X-Ray Photoelectron spectroscopy (XPS)

IEEC Website

Please enter the following information

If Other

Choose class

o Encapsulants

o Adhesives

o Thermal Interface Materials

o Polymer Underfill Materials

o Polymer Composites w / CNT's

o Solders

o Barrier Layers

• Other

Name

Company Name

Please enter your email id

Name of Material

Submit

Property/Data Available Value TDS Value

MSDS

TDS

Tg (CTE Data)

Coefficient of Thermal

Expansion (CTE)

Storage Modulus

Stress Relaxation / TTS Data

Elastic Region Stress-Strain

Curve

Moisture Uptake

Outgassing

Coefficient of Hygroscopic

Swelling (CHS)

0.0021 %ε/%C

1.03% @ 100 0C

90 0C

63.63 ppm/0C (<Tg),

177.26 ppm/0C (>Tg)

3.3 wt.%, @ 85°C/85°RH

90 0C

54 ppm/0C (<Tg),

206 ppm/0C (>Tg)

516,912 psi

EPO-TEK 353 ND

Optical Adhesives

2) New Standard Template

We designed Template to include TDS values for easy

access to further information on the materials.

- Included values where necessary for different types of

preparation of the materials

- Included links to PDF copies of both the TDS/MSDS

Differential scanning calorimetry (DSC)

DSC is the most popular thermal analysis technique, which measures the sample

compared to a reference material, usually air, to determine heat flow as a function of

temperature through exo or endothermic reactions. It can be used to characterize

polymers, pharmaceuticals, food; biologicals, organic chemicals and inorganics, and

yield thermal stability data or heat capacity depending on how the experiment is set

up. The information of glass transition, melting, crystallization, curing and cure

kinetics, onset of oxidation and heat capacity can be analyzed from the DSC result.

DSC Q200 from TA Instruments

As shown in the Figure 1 A) and B) we see no glass transition (Tg) since these

epoxies start in a psudo liquid state, however the first exothermic process would

indicate the melt point (Tm) which relates the thermal cure point. Figure 1 C) and D)

are calibrated to measure heat Cp for the underfill materials.

• For detailed tool information from the ADL click here

Figure 1. DSC (a) and MDSC (b) of underfill epoxy Hysol QMSI519. DSC under different

curing conditions (c and d).

A)

C) D)

B) A)

C)

B)

A New Section for Online Modeling tools

We are creating a new section of the packaging

materials database that we post modeling tools that

are available online. One example is the creep model.

We can predict the creep behavior of epoxy adhesives

such as die attach adhesive, Hysol QM1519 in a wide

range of stresses by using the provided equations.

Sumitomo G700E (Mold Compounds)

Sumitomo G700Y (Mold Compounds)

Sumitomo G600 (Mold Compounds)

Sumitomo G700l-Y (Mold Compounds)

Hysol CE3103 (Optical Adhesive)

Hysol CE3920 (Optical Adhesive)

Ablecoat 8006NS (Die Attach Adhesive)

New Materials

IEEC Integrated Electronics Engineering Center