Post Show Reportsemiexpos.org/.../files/SCWest15-PSR_web_final.pdf · 2016-03-21 · July 14–16,...
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www.semiconwest.org JULY 14–16, 2015 MOSCONE CENTER SAN FRANCISCO, CA 2015 Highlights: • 40% of visitors represented engineering and product management functions. 79% of those surveyed had a high influence in the buying decision. 180 hours of technical programs attracted attendees from the engineering community. • 17% of verified SEMICON visitors were international, an increase of 2% over the previous year. The new International Buyer Program brought over 100 buyers from six countries seeking products from the USA. • Supplier Search program, an exclusive buyer / seller program designed for device manufacturers, OSATs, and OEMs, providing exclusive customer access for SEMICON West Exhibitors. • Innovation Village, showcased 20 start-up companies seeking investor capital and strategic partners, and 12 research groups showcasing breakthrough research capabilities. Featured Keynotes and Industry Panel: • Doug Davis, Sr. Vice President and General Manager, Internet of Things Group, Intel • Stephen Forest, Ph. D., Department of EE, MSE & Physics, University of Michigan • Panel featuring ASE, GLOBALFOUNDRIES, imec, Stanford University and Qualcomm Post Show Report Total Attendance (Visitors and Exhibitors)* 26,435 Total Verified Visitors* 17,835 * SEMICON West and Intersolar North America Attendance Total SEMICON Exhibiting Companies 690 Total Net Exhibit Area 122,036 sq. ft. Exhibitor Information Total Intl.Verified SEMICON Visitors: (17% of verified unique SEMICON Visitors) 1,568 Major Countries Represented (Percent of International Visitors) International Attendance Japan 21% South Korea 19% Germany 6% Taiwan 6% Mainland China 5% Singapore 5% Canada 4% United Kingdom 3% France 2% Israel 2% Netherlands 2% Premier Sponsors
Transcript of Post Show Reportsemiexpos.org/.../files/SCWest15-PSR_web_final.pdf · 2016-03-21 · July 14–16,...
www.semiconwest.org
July 14–16, 2015Moscone cenTeR san FRancisco, ca
2015 Highlights:• 40%ofvisitorsrepresentedengineeringandproductmanagementfunctions.
79%ofthosesurveyedhadahighinfluenceinthebuyingdecision.180hours oftechnicalprogramsattractedattendeesfromtheengineeringcommunity.
• 17%ofverifiedSEMICONvisitorswereinternational,anincreaseof2%overthepreviousyear.ThenewInternationalBuyerProgrambroughtover100buyersfrom sixcountriesseekingproductsfromtheUSA.
• SupplierSearchprogram,anexclusivebuyer /sellerprogramdesignedfor devicemanufacturers,OSATs,andOEMs,providingexclusivecustomeraccess forSEMICONWestExhibitors.
• InnovationVillage,showcased20start-upcompaniesseekinginvestorcapital andstrategicpartners,and12researchgroupsshowcasingbreakthrough researchcapabilities.
FeaturedKeynotesandIndustryPanel:• DougDavis,Sr.VicePresidentandGeneralManager,InternetofThingsGroup,Intel
• StephenForest,Ph.D.,DepartmentofEE,MSE&Physics,UniversityofMichigan
• PanelfeaturingASE,GLOBALFOUNDRIES,imec,StanfordUniversityandQualcomm
Post Show Report
TotalAttendance(VisitorsandExhibitors)* 26,435
TotalVerifiedVisitors* 17,835
*SEMICONWestandIntersolarNorthAmerica
Attendance
TotalSEMICONExhibitingCompanies 690
TotalNetExhibitArea 122,036sq.ft.
ExhibitorInformation
TotalIntl.VerifiedSEMICONVisitors: (17% of verified unique SEMICON Visitors) 1,568
MajorCountriesRepresented(PercentofInternationalVisitors)
InternationalAttendance
Japan 21%SouthKorea 19%Germany 6%Taiwan 6%MainlandChina 5%Singapore 5%
Canada 4%UnitedKingdom 3%France 2%Israel 2%Netherlands 2%
Premier Sponsors
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VisitorProfileSEMICONWestattractsahighlyinfluentialaudiencefromeverysegmentandsector oftheglobalmicroelectronicsindustries,includingsemiconductors,solar/PV,LEDs,MEMS,Display,Fabless/Design,SystemOEMs,printed/flexibleelectronics,and otheradjacentmarkets.
FocusonEngineering PrimaryJobFunctions
ResearchandDevelopmentEngineering 10%
DesignEngineering(incl.Software,Systems,Test,Hardware) 8%
Mfg.Engineering/OperationsManagement 7%
ProductManagement /Engineering 7%
FabricationandProcessEngineering 3%
FacilitiesEngineering/EngineeringSupport 2%
QualityAssuranceandTestEngineering 1%
Assembly /PackagingEngineering 1%
ChemicalEngineering 1%
Marketing/Sales /BusinessDevelopment 27%
ExecutiveManagement /BoardMember 17%
Purchasing/Procurement 4%
Financial / IndustryAnalyst 3%
ManufacturingandProduction 3%
Training/Educator 1%
HumanResourcesManagement 1%
Other 4%
InfluentialBuyers
33% FinalDecisionMaker 41% Recommend/Evaluate/Consult 5% Specify 21% NoRole /Other
33%
21% 5%
41%
20% ExecutiveManagement22% SeniorManagement25% OtherManagement31% Non-management 2% Other
20%
31%
22%
2%
25%
PurchasingAuthority
JobLevels
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TechnologyInterestsSEMICONWestattractsadiverserange ofvisitorsfromacrossthemicroelectronics industrywithmultipleindustryand technologyinterests.
MicroelectronicDeviceInterestsIntegratedCircuit(IC)Logic 13%MEMS/SensorComponents 11%IntegratedCircuit(IC)Memory 10%Analog/PowerSemiconductors 8%ASICs 8%LEDComponents 7%Batteries 7%Flexible /PlasticElectronics 6%Displays 6%IntegratedSystems 6%
SystemsInterestsPC/Computer /Tablet /Storage 3%ConsumerElectronics/Wearables 11%Sensing 11%Industrial 11%Energy/Power 11%Automotive 10%Communications 9%Healthcare/Biotechnology/Wellness 8%Imaging 8%Security 5%
AreasofInterestSEMICONWestvisitorsareinterestedinabroadrangeofindustries,technologies, andproductsfromacrossthesupplychain,fromdesigntofinalmanufacturing.
MANUFACTURINGEQUIPMENT
WaferProcessing/Front-end 38% ManufacturingEquipment
TestEquipment(Device) 21%
InspectionandMeasurement/ 18% MetrologyProducts
AssemblyandPackagingEquipment 15%
MEMSManufacturingEquipment 15%
ThinFilmManufacturingEquipment 14%
FactoryAutomation/Robotics 13%
Cleanroom/LabEquipment 12%
MaterialHandlingEquipment 11%
LEDManufacturingEquipment 10%
DisplayManufacturingEquipment 10%
TestEquipment(Environmental) 9%
Printing,Coating,Roll-to-RollEquipment 7%
SecondaryEquipmentandServices 5%
MaTeRials
WafersandRelatedSubstrates 24%
ProcessChemicals 15%
AssemblyandPackagingMaterials 12%
DepositionMaterials 12%
GasesandLiquidChemicals 11%
PhotolithographyMaterials 11%
Consumables(TestandProcess) 9%
MEMSMaterialsSupplier 9%
LEDMaterials 9%
CleanroomSupplies 7%
PV/SolarCellsandModules 7%
Inks,Pastes,andPrintingMaterials 4%
COMPONENTS/SUB-SYSTEMS/SOFTWARE
FactoryControlAutomation/Facilities 9%
Software—Manufacturing/ 7% FactoryAutomation
Sub-systems 6%
Software—ElectronicDesign(EDA)/ 6% SiliconIntellectualProperty(IP)
SupportProducts(includesconsumables)4%
ManufacturingServicesor 7% ManufacturingConsulting
GeneralBusinessServices/Consulting 5%
Other 7%
SERVICES/SUPPORTPRODUCTS
MANUFACTURINGANDDESIGN
SemiconductorDeviceManufacturing 42% (IDM,foundry)
Packaging,Assembly,andTestServices 23%
ElectronicManufacturingServices(EMS)22%
MEMSManufacturing 20%
LEDManufacturing 16%
FablessSemiconductorManufacturer / 15% DesignServices
PVManufacturing 13%
Numbers reflect percentages of unique SEMICON visitors
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KeyVisitingCompaniesandOrganizationsSEMICONWestattractsvisitorsfromaroundtheworldandfromeverymajor microelectronicscompany,includingbuyingteamsfromtheworld’stopcapital spendingIDMs,foundries,fabless,OSATs,andOEMs.
IDMS/FOUNDRIES
•Cypress•GLOBALFOUNDRIES•IBM•IDT•IMFlash•Infineon
•Intel•Micron•Panasonic•Samsung•SKHynix•Spansion
•STMicroelectronics•TexasInstruments•Toshiba•TSMC•X-Fab
FABLESS/SYSTEMOEMS
•3M•Agilent•Altera•AMD•AnalogDevices•Apple•Avago•BloomEnergy•Bridgelux•Broadcom•Cisco•Cree•CSR•Fairchild•Flextronics•Freescale
•Google•Hewlett-Packard•HGST•Huawei•InternationalRectifier•Intersil•Jabil•JDSU•LatticeSemiconductor•LG•LockheedMartin•LSI•Magnachip•Marvell•Maxim•Micrel
•Microsoft•NorthropGrumman•nVidia•O2Micro•ONSemiconductor•Oracle•Qualcomm•Raytheon•SanDisk•Sanmina•SeagateTechnology•Sony•Tyco•VishaySiliconix•WesternDigital•Xilinx
osaTs
•AmkorTechnology•AmTechMicroelectronics•ASEGroup•Carsem•ChipMOSTaiwan•CorwilTechnology•FlipChipInternational•HanaMicroelectronicsGroup•HanaMicron
•InfinitiSolutions•KyoceraAmerica•LingsenPrecisionIndustries•MicrochipTechnology•NANIUM•NantongFujitsu
Microelectronics•NEPESCorporation•PromexIndustries
•Quik-Pak•Semi-Pac•ShinkoElectricIndustries•SiliconTurkeySolutions•StarsMicroelectronics•STATSChipPAC•TeledyneMicroelectronic
Technologies
UNIVERSITIES/RESEARCH
•CalPoly—Pomonaand SanLuisObispo
•CarnegieMellonUniversity•cea-Leti•CornellUniversity•DartmouthCollege•DukeUniversity•FraunhoferInstitute•GeorgeWashingtonUniversity•GeorgiaInstituteofTechnology•IMEC•Intermolecular•InternationalTechnological
University•JohnsHopkinsUniversity
•LawrenceBerkeley•LawrenceLivermore•MichiganStateUniversity•MIT,Colombia•NationalInstituteofStandards
(NIST)•NationalLab•NorthwesternUniversity•Novati•OregonStateUniversity•PortlandStateUniversity•PrincetonUniversity•PurdueUniversity•SanJoseStateUniversity•SandiaNationalLab
•SantaClaraUniversity•StanfordUniversity /SLAC•StateUniversityofNewYork
(SUNY)•SUNYPOLY-SEMATECH•TexasA&MUniversity•UC—Berkeley;Davis;Irvine;
SanDiego;SanFrancisco•UCLA•UniversityofCentralFlorida•UniversityofMichigan•UniversityofTexas,Austin•UniversityofWashington•and many more
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MediaPartnersandAttendeesMorethan50internationaltradeandbusinesspublicationsandmorethan 100journalistsandindustryanalystspartneredwithSEMItobringextensive globalcoverageofnewsandinformationaboutandfromSEMICONWestandour participatingcompanies.
2015MEDIAPARTNERSANDATTENDEES
•3DInCites•AdvantageBusiness
Media•AmicaResearch/
McGraw-Hill•AngelBusiness
Communications•AspenCore•B.Riley&Co.•BlackRock•Bloomberg•CapitalWorldInvestors•ChemicalWeek•ChipScaleReview•CircuitnetLLC•ClearBridge
Investments•CoughlinAssociates•CowenandCompany•CryoGasInternational•DeutscheBank•DigitalFirstMedia
•DisplayPlus•ee Times•EE-Evaluation
engineering•EpochTimes&NTDTV•EpochTimes•ExtensionMedia•ExtensionMedia/
ChipDesign•FirsthandCapital
Management•FirsthandFunds•FortWashington
InvestmentAdvisors•FortunaPublishing•Frost&Sullivan•Gartner•GlobalSMT&
Packaging•GoldmanSachs&Co.•HaleyPublishing•iconnect007.com
•IDC•iHs•InstitutionalCapital•JIJIPRESS•JPMorgan•LaPlumedeMaTante
PublishingCo.•LitchfieldHills
Research•M&ETech•Mergermarket•NomuraSecurities•Pennwell•phase4research•PhocasFinancial
Corporation•PiperJaffray•Pund-IT•Semiconductor
engineering•SemiconductorPortal
•Semiwiki.com•SiliconRun
Productions•SituationPublishing•SperlingMediaGroup•TecHceT•TechfocusMedia•TechSearch
International•TheWallStreetJournal•Topeka•TrustCompanyof
theWest•VacuumTechnology&
Coatingmagazine•VLSIresearch•Voya•WedbushSecurities•WTWHMedia•YoleDéveloppment•ZiffBrothers
Investments
INVESTORSANDANALYSTS
•AlixPartners
•AOASSETMGMT
•AppliedVentures
•AshfieldCapital
•BandofAngels
•B.Riley
•Berenberg
•BISResearch
•BrandesInvestmentPartners
•BreanCapital,LLC
•CapitolForum
•ChardanCapitalMarkets
•ColumbiaManagement
•CoughlinAssociates
•Craig-Hallum CapitalGroup
•CrosslinkCapital
•DCM
•DeutscheBank
•DowVentures
•eda2asic Consulting,Inc.
•FortunaPublishingLtd.(UK)
•Gartner
•GoldmanSachs&Co.
•HSBC
•IDC
•IHS
•IntelCapital
•ISIGroup
•ITRI
•Jefferies
•JefferiesLLC
•JETROSanFrancisco
•JPMorgan
•LinleyGroup
•LitchfieldHillsResearch,LLC
•MergermarketGroup
•MerrimanCapital
•Needham& Company,LLC
•Nomura
•phase4research
•PiperJaffray
•Pund-IT,Inc.
•RBCCAPITALMARKETS
•RobertWBaird&Co.
•SamsungVenturesInvestmentCorp.
•SemiAccurate
•SemiconductorAdvisors,LLC
•SEMICOResearch
•SequoiaCapital GlobalEquities
•SNSSecurities
•SterneAgee
•SummitResearchPartners
•TallwoodVentures
•TechcetGroup
•TheLinleyGroup
•TiriasResearch
•TIRIASResearch
•TopekaCapitalMarkets
•UBS
•VLSIresearch
•Westwood Marketing,LLC
•WoodsideResearch
•ZiffBrothersInvestments
