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PRODUCT SPECIFICATION

Part Number

PLBT2016 White Series

Details • High Power 2016 SMD LED • 2.0 x 1.6 x 0.70mm • 1,000 piece reels • Emitting Color: White • InGaN based phosphor-converted LED

Features • Typical viewing angle 50% Iv: 120° • Binning based on ANSI C78.377 • ROHS and REACH-compliant • MSL 3 qualified according to J-STD 020 • ESD 2KV (HBM : MIL-STD-883 Class 2)

Mechanical Dimensions

Notes:

1. Dimension in millimeter [inch], and tolerance is ±0.13mm unless otherwise noted. 2. Specifications subject to change.

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Device Selection Guide

Model Number Material Typical CCT °K

Emitting Color

Luminous Flux (lm)

Wattage Basic Order Code

Group Min

PLBT2016.2-YDCW

InGaN

4746-7040 Cool White

B30 75

0.2 B31 80 B32 90 B33 100

PLBT2016.5-YDCW 4746-6530 Cool White

B18 24

0.5 B19 26 B20 28 B21 30

PLBT20161W-YDCW 4746-7040 Cool White

B22 35

1.0 B23 40 B24 45 B25 50

Absolute Maximum Ratings at Ta=25°C PLBT2016.2-YDCW

Parameter Symbol Rating Unit Power Dissipation PD 0.2 W

Continuous Forward Current IAF 60 mA Pulsed Forward Current IFP 500 (Note1) mA

Reverse Voltage Vr -5 V Dice Temperature Tj 115° °C

Operating Temperature Topr -40~+85 °C Storage Temperature Tstg -40~+100 °C

Soldering Temperature Tsol 240°for5sec °C PLBT2016.5-YDCW

Parameter Symbol Rating Unit Power Dissipation PD 0.5 W

Continuous Forward Current IAF 100 mA Pulsed Forward Current IFP 500 (Note1) mA

Reverse Voltage Vr -5 V Dice Temperature Tj 115° °C

Operating Temperature Topr -40~+85 °C Storage Temperature Tstg -40~+100 °C

Soldering Temperature Tsol 240°for5sec °C

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PLBT20161W-YDCW

Parameter Symbol Rating Unit Power Dissipation PD 1.0 W

Continuous Forward Current IAF 350 mA Pulsed Forward Current IFP 1000 (Note1) mA

Reverse Voltage Vr -5 V Dice Temperature Tj 115° °C

Operating Temperature Topr -40~+85 °C Storage Temperature Tstg -40~+100 °C

Soldering Temperature Tsol 240°for5sec °C Notes:

1. Duty 1/10 Pulse Width 0.1ms 2. For other ambient, limited setting of current will depend on de-rating curves. 3. When drive on maximum current, TJ must be kept below 115°C

Electrical and Optical Characteristics at Ta=25°C

PLBT2016.2-YDCW Parameter Symbol Min. Typ. Max. Unit Condition

Forward Voltage VF 3.0 -- 3.6 V IF=60mA Reverse Current Ir -- -- 10 µA Vr=5V Viewing Angle 2Ø1/2 -- 120±10° -- Deg IF=60mA

PLBT2016.5-YDCW Parameter Symbol Min. Typ. Max. Unit Condition

Forward Voltage VF 3.0 -- 3.6 V IF=100mA Reverse Current Ir -- -- 10 µA Vr=5V Viewing Angle 2Ø1/2 -- 120±10° -- Deg IF=100mA

PLBT20161W-YDCW Parameter Symbol Min. Typ. Max. Unit Condition

Forward Voltage VF 3.0 -- 3.6 V IF=350mA Reverse Current Ir -- -- 10 µA Vr=5V Viewing Angle 2Ø1/2 -- 120±10° -- Deg IF=350mA

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Intensity Binning

Bin Code Min. Фv (lm) Max. Фv (lm) B18 24 26 B19 26 28 B20 28 30 B21 30 35 B22 35 40 B23 40 45 B24 45 50 B25 50 55 B30 75 80 B31 80 90 B32 90 100 B33 100 110

Forward Voltage Binning

Bin Code Min. Vf Max. Vf V2830 2.8 3.0 V3032 3.0 3.2 V3234 3.2 3.4 V3236 3.4 3.6

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Color Coordinate Binning

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Typical Electrical / Optical Characteristic Curves PLBT2016.2-YDCW

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PLBT2016.5-YDCW

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PLBT20161W-YDCW

Typical Spatial Distribution

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Relative Spectral Power Distribution

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Thermal Design for Derating 60mA

100mA

350mA

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Recommended Solder Pad

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Packing

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Notes: 1. Reeled products (minimum number of pieces is 100 and maximum is 1000) packed in sealed moisture-proof bags along with a desiccant; a maximum of five moisture-proof bags packed inside the box (size: 240mm x 195mm x 100mm ±5mm) and a maximum of four inside boxes are put in the outside box 2. (size: 410mm x 255mm x 240mm ±5mm) together with buffer material packed. 3. (Part No., Lot No., quantity should appear on the label of the moisture-proof bag and the cardboard box.)

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Reflow Temperature / Time

Notes:

1. We recommend reflow temp of 240°C (±5°C). The maximum soldering temperature should b limited to 260°C 2. Do not cause stress to the epoxy resin while it is exposed to high temperature 3. Number of reflow process should not exceed 3 times.

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Precautions

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Reliability

Notes: 1. USL: Upper specification level 2. LSL: Lower specification level

Test Item Test Conditions Duration/ Cycle

Number of Damage Reference

Thermal Shock –40℃ 30min

↑↓5min 125℃ 30min

100 cycles 0/22 AEC-Q101

High Temperature Storage Ta=100℃ 1000 hrs 0/22 EIAJ ED-4701

200 201

Humidity Heat Storage Ta=85℃ RH=85%

1000 hrs 0/22 EIAJ ED-4701 100 103

Low Temperature Storage Ta=-40℃ 1000 hrs 0/22 EIAJ ED-4701

200 202

Life Test Ta=25℃ If=350mA

1000 hrs 0/22 Tested with factory standard

High Humidity Heat Life Test

85℃ RH=85% If=350mA

1000 hrs 0/22 Tested with factory standard

High Temperature Life Test Ta=85℃ 1000 hrs 0/22 Tested with factory

standard

ESD(HBM) 2KV at 1.5kΩ;100pf 3 Times 0/22 MIL-STD-883

Criteria for Judging the Damage

Item Symbol Condition Criteria for Judgment Min Max

Forward Voltage VF If=350mA _ USL 1×1.1 Reverse Current IR VR =5V _ 100μA

Luminous Intensity Iv If=350mA LSL 2×0.7 _