Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness...

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Peter Jansweijer MROD Production Readiness Review: November 2, 2005 Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details

Transcript of Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness...

Page 1: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1

Production Readiness Reviewof the MDT ROD

Electronic Design Details

Page 2: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 2

MROD-X Design, Changes with respect to the MROD-1 design

MROD-1 MROD-X

3x

+

SHARC links usedfor data transport

RocketIO links usedfor data transport

Page 3: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 3

MROD-Out FPGA

RocketIO

RocketIObetween MROD-In and MOD-Out FPGAs

MROD-In FPGA

RocketIO

FIFO8191 1.6 Gb/s

(160 MB/s)FIFO511

FIFO511

FIFO511

Regis-ters

FIFO511

HF

HF

Extended ReturnData

EventData

EventLength(+ID)

EventData

EventLength

(+ID)

ReturnData

FIFO511

RdRq

RdRq

Regis-ters

Extended ReturnData

ReturnData

High Priority Path

Low Priority PathConnections from other7 MROD-In FPGAs

•Backpressure•8B/10B•Extended Data•Length Look-ahead•TDC Limit

Page 4: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 4

D5

D4

TDC Limit Register

D1

D2

D3

Dn

BOT

EOT}

12 bit, programmable 1 to 4096 data words

TDC Word Count bits [11:0]

Example when limit is set to 4:

D1

D2

D3

BOT

n

EOT6

D4

D1

D2

D3

BOT

EOT7

Register default = 0x60Maximum Event Fragmentfor 18 TDCs:18 x (BOT + 96 + 1 EOT) =1782 words

D4

D1

D2

D3

BOT

EOT6

D4

D1

D2

D3

BOT

EOT7

MROD-Out, Event Builder:Maximum Event Fragment8 x (1782 + 4 envelope words) =14288 words

No shutdown as with “Maximum Event Length”(Default 1K words)

Page 5: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 5

Backpressure and ROD-BusyMROD-In

Buffer MemoryPartition

CSM link

RocketIOFIFOs

S-LinkFIFO

Link FIFOFull

HalfFull

AlmostFull

X

ROD-Busy•Backplane P3 -> TIM•Front panel NIM•Front panel Led

18x8k

8x8K

1x511

Whenone of 18 partitions Half Full

OrI2O-FIFO Half Full

thenCSM Link Busy

Front panel Led “B”

I2OFIFO512

HalfFull

MROD-In Buffer Memory Partition = 8K wordsConsider the situation where a lot of small events are received. Buffer Memory Partition does not get Half Full while I2O-FIFO rapidly fills.

I2O FIFO Half Full signals ROD-Busy.

Up Busy Error

I2O-FIFO:event fragment complete -> start MROD-In Output Controller

Page 6: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 6

MROD-Out FPGA

TTC FIFOs

Event/Bunch-IDFIFO511

Trigger-TypeFIFO511

MROD-OutSHARCD

MA

Event/Bunch-IDFIFO511

Trigger-TypeFIFO511

EventBuilder

ROD-Busy•Backplane P3 -> TIM•Front panel NIM•Front panel Led

HF

HF

TTC1ECR

TTC4Event/Bunch-ID

TTC5TriggerType

DeSerialize

DeSerialize

ExtendedEvent-ID

Inc

Load

P3

back

plan

e dr

iven

by

TIM

•Debug•Test•Monitor

Other busy sources

Page 7: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 7

Event Builder (1)

EventData

EventLength

EventData

EventLength

8 x

TTC FIFOsnot empty

RocketIO1A

RocketIO4B

1A Busy

4B Busy

Cha

nnel

Ena

ble

Reg

iste

r

ROD-Busy

EventBuilder

TestMode

Test Count Event-ID

12

3

5

Event Fragment

Trailer

Event FragmentHeader

4

1. Wait for TTC info2. Send Header3. Repeat

If a channel is enabled (wait for / read) event length entry

then read event data and insert Link Word Count

4. Until all channels read5. Send Trailer

Page 8: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 8

Event Builder (2)Event Fragment Header•BOF (S-Link Control Word) 0xB0F00000•Header Marker 0xEE1234EE•Header Size 0x00000009•Format Version Number (VME register) 0x03000000•Module ID (VME Register) 0x00610080•Run number (VME Register) 0x00000000•Event –ID 0xEEeeeeee•Bunch-ID 0x00000bbb•Trigger-Type 0x000000tt•Detector Event Type (VME Register) 0x00000000•MROD BOB 0x80eeeeee

Test ModeNormal Running

eeeeee = from TTCTest Mode (run without TTC)

eeeeee = from Test Counter

Event Fragment Trailer •MROD EOB 0xF000wwww•MROD Status word (MSE1)•Number of Status Elements (NSE) 0x00000001•Number of Data Elements (NDE) 0x0000wwww•Status Block Position 0x00000001•EOF (S-Link Control Word) 0xE0F00000

2031-21 19181716 15-4 3 2 1 0

GOL Parity Error

TDC Parity Error

TDC Bunch-IDMiss Match

TDC Event-IDMiss Match

Page 9: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 9

Spy (MROD-In)

SHARC

•Debug•Test•Monitor

Event DataFIFO512

Event LengthFIFO

16

MROD-In FPGA

RocketIO

Event DataFIFO8191

Event LengthFIFO511

MROD-InOutput

Controller

1. MROD-X Mode2. MROD-1 Mode3. MROD-X Debug

Spy Pre-scale registera. Nob. Allc. One in ‘n’ [1..65536]

AF

AF

AF

AF

By Default: Main data stream is not halted by Spy Channel

Page 10: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 10

Spy (MROD-Out)

SHARC

•Debug•Test•Monitor

Event DataFIFO16K

Event LengthFIFO

4

MROD-Out FPGA

EventBuilder

1. MROD-X Mode2. MROD-1 Mode3. MROD-X Debug

Spy Pre-scale registera. Nob. Allc. One in ‘n’ [1..65536]

S-LinkFIFO511

AF

AF

AF

By Default: Main data stream is not halted by Spy Channel

Page 11: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 11

Test GeneratorMROD-In

SFP

SHARCFPGA

TestFIFO

(Pre-scaled)Data and Event-Length

MROD_InFunctionality

ExternalLoop back

RocketIO

SHARCLinks

TTC L1A•CSM links unidirectional•Test generator•Transparent / Circular mode•Free running / Triggered •Internal test mode

SFP

FPGA

TestFIFO

(Pre-scaled)Data and Event-Length

MROD_InFunctionality RocketIO

Page 12: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 12

XCF08P

XCF08P

XilinxXC2VP20

ASP

FPGA_TDOMROD-Out

MROD-In FPGAs

J26

SelSharcF for 3 or 4

MROD-Ins

TDI TDO

FPGA_TDI

MRO_XCF08P_TDI

FP

GA

_TD

O3

FP

GA

_TD

O4

XilinxXC2VP7/20

XilinxXC2VP7/20

XilinxXC2VP7/20

XilinxXC2VP7/20

XilinxXC2VP7/20

XilinxXC2VP7/20

XilinxXC2VP7/20

XilinxXC2VP7/20

ConfigurationBus

Configuration Bus

Remote Configuration (1)FPGA JTAG Chain

MTMbus

GeographicalAddress

Page 13: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 13

Remote Configuration (2)

buffers

P2

P1

P3

buffers

rear frontVME bus

to all MRODmodules

MTMbus

USB-JTAG(= Xilinx

DownloadCable)

Page 14: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 14

Other Extras

31-24Year

23-16Month

15-8Date

7-0Revision

FPGA firmware Date and Revision RegisterAutomatically determined during synthesis of VHDL code (TCL script)

OS Date Rev. File

31-24ID[31-0]

23-16 15-8 7-0

Unique Identifier Registers (DS2401)

Family-ID CRC ID[47-32]ID1ID2

S-Link Flush Mode

Temperature Readout for each FPGA (MAX 1618)

Zero Suppress Overridechoose to override zero suppression:

–Never–Once every ‘n’ [1..65536] events (first event of a run always non zero suppressed)

Page 15: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 15

Production Readiness Reviewof the MDT ROD

Prototype issues

Page 16: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 16

Design issues found in prototypes• Parallel termination for MROD-In FPGA configuration bus• Pull-up resistor on FPGA TDO• Wrong polarity for two capacitors• Small errors in silkscreen (Dip switch SW9, Ref. IC511, Pin 1 marking)

• Footprint for inductors too small• Short pin 1-2 for SMD LEDs (2 = Anode, 3 = Cathode)

• Power On Reset circuit: TPS3838SOT231 2

3SOT232 1

3

Rst_n pin 4

MR pin 3

VDD pin 1,5

Critical Ramp-Rate ~ 125 mV/msHappens to be exactly VME crate power supply Ramp-Rate!

Okay Fail

Page 17: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 17

Minor Assembly issues found in prototypes

• One capacitor misplaced (module 1)

• Software Test Procedure found 2 open address pins on a Temperature Sensor (module 1)

• One wrong component placed. IC511 = NC7SZ125 instead of NC7SZ126 (module 3)

• One IC557 missing (NC7SZ08) (module 5)

• One wrong component placed. IC564 = NC7SZ08 instead of NC7SZ126 (module 5)

• Open output pin on buffer, SHARC JTAG chain (module 6)

Keep in mind that we asked for assembly of 6 modules (4 different production runs):2 eight-channel, 1 eight-channel, 1 eight-channel without SHARC-B, 2 six-channel

Assembly house did a great job. Some issues:

Automatic Optical Inspection would track many, if not all of these failures.

Page 18: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 18

Changes to be made in PCBNeeded:• Parallel termination for MROD-In FPGA configuration bus (add 18 resistors)• Add Pull-up resistor to FPGA TDO• Change the polarity for two capacitors• Connect pin 1 and 2 for SOT23 SMD LEDs• Increase Footprint for inductors• Power On Reset (still under investigation… Use MAX 6863?)

Needed for MROD-Out @ 50 MHz:• Review Clock circuit on MROD-Out:

– Remove automatic Clock switch for selection of LHC-Clock or crystal– Re-route one LHC-Clock signal– MROD-Out FPGA prepared, system operation still to be demonstrated

Desirable:• Inverter for GA[4..0] connected to ASP• Review silkscreen (SW9 and IC511, Pin 1 marking)

Page 19: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 19

Thank you

Page 20: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 20

MROD_In

SFPSHARC

LHC_Clk1

MROD_In LHC_CLk2

MROD_In LHC_Clk3

MROD_In LHC_Clk4

MROD_Out

SHARCB

SHARCA

MROD-X Clocks

SFPXilinx

XC2VP7/20

XilinxXC2VP7/20

50/80 80

GO

L_X

Clk

AG

OL_

XC

lkB

Roc

ket

XC

lkB

Roc

ket

XC

lkA

40

RoboClock

ChA

_Clk

ChA

_Clk

x2

Sha

rcC

lk

ChB

_Clk

ChB

_Clk

x2Xilinx

XC2VP20

40

80RocketXClk

Clk

Sha

rcC

lk

Clk

x2

LHC

_Clk

S-Link

ZBT

ZBT

RoboClock

RoboClock

LHC_Clk(From TIM)

Page 21: Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 1 Production Readiness Review of the MDT ROD Electronic Design Details.

Peter JansweijerMROD Production Readiness Review: November 2, 2005Slide 21

MROD_In

SFPSHARC

MROD_In

MROD_In

MROD_In

MROD_Out

MROD-X Clocks (MROD-Out @ 50 MHz)

SFPXilinx

XC2VP7/20

XilinxXC2VP7/20

50/80 100

40

RoboClock

XilinxXC2VP20

LHC_Clk(From TIM)

50

100ZBT

ZBT

RoboClock

RoboClock

X

LHC_Clk1

LHC_CLk2

LHC_Clk3

LHC_Clk4

GO

L_X

Clk

AG

OL_

XC

lkB

Roc

ket

XC

lkB

Roc

ket

XC

lkA

ChA

_Clk

ChA

_Clk

x2

Sha

rcC

lk

ChB

_Clk

ChB

_Clk

x2RocketXClk

Clk

Clk

x2

LHC

_Clk

SHARCB

SHARCA

Sha

rcC

lkS-Link