Performance Characterization of a 450mm Wafer …...2013/01/23 · Particle Contribution...

Performance Characterization of a

450mm Wafer handling System:

Test Methods & Analysis Ghulam Mustafa

January 23, 2013

Measurement Conditions

© 2011 Crossing Automation - CONFIDENTIAL 2

Today’ Agenda

System Description

Modular Approach for Characterization

Summary of Module Test Results

System Summary

General Approach for System Test

Measurement Conditions


Fan Filter Unit

Mini

Environment

Pre

Aligner Robot

Load Ports

450mm Wafer Handling System

Control System + Electronics

450mm Performance / Reliability

The Modular Approach


450mm System

Performance

FFU

Characteristics Mini

Environment

Wafer

Handling

Robot

Load

Port

Pre

Aligner

Vibration / Resonance

Noise / Acoustics

Air Flow Velocity Distribution

Static Pressure / Fan Speed

Airborne Particles

Recovery Time

Tuning

Vibration / Dynamics

Repeatability

Particle Contribution

Reliability

Reliability

Motion Time

Vibration


Tuning

Vibration / Dynamics

Repeatability


Reliability

System

Frame Vibration

PWP

Wafer Placement

Throughput

Reliability

Completed

Preliminary/ Need More Data

Planned

Example


Acoustics & Vibes

(Comparison, PWM=8)

Befo

re

Aft

er

FF

U

Ch

ara

cte

ris

tic

s

6

Befo

re

Aft

er

Fan Speed Vibration

Fan Speed

FF

U

Ch

ara

cte

ris

tic

s


Before After

Small Peaks at Higher RPM

Vibration Spectrum F

FU

Ch

ara

cte

ris

tic

s Resonant

Peaks


Acoustics v RPM *

* Data collected at inlet of the fan 50mm above inlet

Nominal

Operating

Range

(61-66dB)

Low Speed (61dB)

High Speed (68dB)

max

max

FF

U

Ch

ara

cte

ris

tic

s

Velocity Distribution

Top Plane*


Overall

Mean=81.2 ft/m

Std=13.9

Uniformity=82.9%

* Measurement done @ p=0.0128’’ H2O

Min

i

En

vir

on

me

nt

450 Spartan Mini Environment Pressure v Velocity


80

858585

85

85 85

85

85

8585

909090

9595

95

100100

100

90 90

105105

105

90

90

95

80

100

110

10 20 30 40 50 60

20

40

60

80

100

120

140

160

0.0182

0.0182

0.01820.0182

0.0184

0.0

18

4

0.01840.0184

0.0

18

4

0.0184

0.0184

0.0184

0.0184 0.01860.0186

0.0186

0.0186

0.01880.0188 0.0190.0192

10 20 30 40 50 60

20

40

60

80

100

120

140

160

Pressure (inch H2O) Velocity (ft/m)

Pressure Probe

Velocity Probe

Pressure versus Velocity M

ini

En

vir

on

me

nt

Particle Measurements


Initial Reading

(Wipe Down)

FFU On

(w/o Robot Cycling)

FFU On

(Robot Cycling)

(Opened port 1 time)

FFU On

(Stopped Cycling)

FFU On

(Robot Cycling)

Airborne Particles

Recovery

Min

i

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on

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nt

Aligner

Robot

Tool Station

Location 1 Location 2

Airborne Particles

Recovery


Test#1

Clean System

Turn Probe on

Turn FFU @ full speed

Collect for 30min

Test#2

Stop FFU

Turn Probe on

Start FFU @ full speed

Collect for 15min

Test#3

Stop FFU

Turn Probe on

Turn FFU @ full speed

Start 25 Cycles (A,B,D,WE,Aligner)

Collect Data

Test#4

Repeat Test #3

Recovery Time

Min

i

En

vir

on

me

nt

Airborne ISO Class 1 Testing

Probe Locations


D C B A

1

2

34 5

6

7

9 10

8C1

C2

C3

C4

D C B A

1

2

34 5

6

7

9 10

8C1

C2

C3

C4

Front

Back

Locations 1, 2, 3, 4, 5, 8, 9, 10, C1, C3,C4 positioned 5 inches below the

bottom edge of the FOUP doors (when closed).

Locations 6 ,7 positioned ¼ inch below the top cover of the pre-aligner.

Location C2 positioned 1 inch below the top cover of the pre-aligner.

1

7Min

i

En

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on

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nt



100nm

0.0

0.1

0.2

0.3

0.4

0.5

0 1 2 3 4 5 6 7 8 9 10

Pa

rtic

les ≥

100

nm

pe

r C

ub

ic M

ete

r of

Air

0.0

3.5

7.1

10.6

14.1

17.7

10.0 0.283

Pa

rtic

les ≥

100

nm

pe

r C

ub

ic F

oo

t of

Air

ISO 14644 Class 1 (at 100 nm) Limit

Measurement Location (See Section V.A.)

Figure 1. Particles ≥ 100 nm per Unit Volume Versus Measurement Location, Compared to the

ISO 14644 Class 1 Limit.

Robot movement is shown

in Section V.D.

Plotted points are means

taken from Table 1

= main test at 0.012 inches of water. Sample

volumes met the minimum sampling volume

requirement of ISO 14644. See Appendix A.

= confirming test. Sample volumes were

either 3 or 6 cubic feet.

0.0

0.1

0.2

0.3

0.4

0.5

0 1 2 3 4 5 6 7 8 9 10

Pa

rtic

les ≥

100

nm

pe

r C

ub

ic M

ete

r of

Air

0.0

3.5

7.1

10.6

14.1

17.7

10.0 0.2830.283

Pa

rtic

les ≥

100

nm

pe

r C

ub

ic F

oo

t of

Air

Pa

rtic

les ≥

100

nm

pe

r C

ub

ic F

oo

t of

Air

ISO 14644 Class 1 (at 100 nm) LimitISO 14644 Class 1 (at 100 nm) Limit



ISO 14644 Class 1 Limit.


in Section V.D.


taken from Table 1


taken from Table 1











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10nm (Extended)

0

5

10

15

20

25

30

35

40

C1 C2 C3 C4

0

177

353

530

707

883

1060

1236

1413

Pa

rtic

les

≥10

nm

pe

r C

ub

ic M

ete

r of

Air

Pa

rtic

les

≥10

nm

pe

r C

ub

ic F

oo

t of

Air Extended ISO Class 1 (at 10 nm) limit1200 34


in Section V.D.


Extended ISO Class 1 Limit (at 10 nm).


taken from Table 2


= pressure at +0.012 inches of water


0

5

10

15

20

25

30

35

40

C1 C2 C3 C4

0

177

353

530

707

883

1060

1236

1413

Pa

rtic

les

≥10

nm

pe

r C

ub

ic M

ete

r of

Air

Pa

rtic

les

≥10

nm

pe

r C

ub

ic F

oo

t of

Air

Pa

rtic

les

≥10

nm

pe

r C

ub

ic F

oo

t of

Air Extended ISO Class 1 (at 10 nm) limitExtended ISO Class 1 (at 10 nm) limit1200 3434


in Section V.D.


Extended ISO Class 1 Limit (at 10 nm).


taken from Table 2


taken from Table 2




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Robot Tuning


Tuned all axes of the 450 Wafer Engine with Elmo Controller

Upper End Effector Lower End Effector Wa

fer

Ha

nd

lin

g R

ob

ot

End Effector Modal Test (Impact Test)


Bending

Mode

The Other

Two Modes

Wa

fer

Ha

nd

lin

g R

ob

ot

End Effector Vibration Test (Cycle Test)


Wa

fer

Ha

nd

lin

g R

ob

ot

Definition of Repeatability

Repeatability is calculated by measuring the robot position

error when returning to a taught point. This error is the radial

distance from the previous point to the current point at which

the end effector settles

Taught Position

Good Bad

0

1

2

3

4

5

0 5 10 15 20 25 30

N

R

0

1

2

3

4

5

0 5 10 15 20 25 30

N

R


Wa

fer

Ha

nd

lin

g R

ob

ot

Measurement and Analysis

Image Recognition/ Data Display / Storage

Robot Target

Camera

XY Coordinates Repeatability Histogram

Mean

Std Dev

Std Err Mean

upper 95% Mean

lower 95% Mean

N

9.9449441

7.2752085

0.3905537

10.713102

9.176786

347

Moments


6s=+/- 21.8 m

(99.99966%)

Wa

fer

Ha

nd

lin

g R

ob

ot

Axis Repeatability (EE1 / EE2)


6s=+/- 25 m 6s=+/- 16 m

EE

1

EE

2

Wa

fer

Ha

nd

lin

g R

ob

ot

Axis Repeatability (Z / Theta)


6s=+/- 21 m 6s=+/- 22 m

Z

Th

eta

Wa

fer

Ha

nd

lin

g R

ob

ot

450mm Load Port System

450 Load Port

500,000 MCBF

Horizontal

Drive

3.57M

Vertical

Drive

2.50M

FOUP

Advance

3.57M

APHD

2.27M

Latch

Keys

5.55M

PCB

Assembly

25M

Control

System

8.33M

Flex Cable

Motor

PCBA

Cam Followers

Lead Screw

Linear Bearing

Flex Cable

Motor

Belt

Brake

PCBA

Linear Bearing

Protrusion

Sensors

FOUP

Placement

Switch

Motor Rack

Drive

Presence

Receiver

Brake

Flex Cable

PCB (K-Plate)

Motor

Sensors

Cam

Cam Bearing

Spring

Motors

Sensors

PCB Door

Node

Arm Alignment

Motor

Sensors

PCB Door Node

Twist and Pull

Latch Key

Alignment

Wafer

Mapper

3.84M

LEDs

Protrusion

Sensor

PCB LED

Presence

Sensor/Emitter

CPU

Link Manager

Home Sensors

Protrusion

Sensor

RFID

SEN Board

Lo

ad

Po

rt

450mm Load Port System – Simulated

Population Statistics*

450 Load Port

500,000 MCBF

Horizontal

Drive

3.57M Vertical

Drive

2.50M FOUP

Advance

3.57M

APHD

2.27M

Latch

Keys

5.55M

PCB

Assembly

25M

Control

System

8.33M

Wafer

Mapper

3.84M

MCBF>500k

MCBF<500k

MCBF=500k

* Based on exponentially distributed time to failure

Lo

ad

Po

rt

System Reliability Demonstration Plan*

476k-606k

3 units 2+ units

• Based on exponentially distributed time to failure

• 2,500 cycles / day / unit +/- 10% variability

• Zero failures

831k-976k Lo

ad

Po

rt

450 Load Port Reliability Test Update L

oa

d P

ort

Wafer Placement Repeatability


Total Repeatability (um)

XY-Coordinates 100um

Sys

tem

x

y

Wafer Placement Repeatability

Statistics


Sys

tem

6s=+/- 62 m

Wafer Placement: Patterns in Data

100um

Ext

PRE Theta

-4

-3

-2

-1

0

1

2

3

Pri

n 2

1

23

4

5

6

xy

-10 -8 -6 -4 -2 0 2 4

Prin 1

25

35

45

55

65

75

Mean o

f r

33 66 99 132 165 198 231 264 297 330 363 396 429 462

Sample

Extension

Pre-aligner

Theta

Theta

Wafer Placement

“Potential” of the System

40 50 60



Frame Vibration

RMS=0.0007g Load Port D

RMS=0.0006g On Frame

(near ground)

Sys

tem

Throughput Measurement Test Setup


Tool

Station

Aligner

Load Port

A

Load Port

B

Load Port

C

Load Port

D

Wafer Cycle

Definition

25

20

15

10

5

1

Wafer Slot Allocation

Wafer Cycle

1) Each wafer was cycled 100 times

2) Each wafer was picked / placed at the same slot

3) Time for each wafer was recorded from pick from the FOUP

to put in the same FOUP (this resulted in a time distribution for each slot)

4) Single Wafer Pick and Place

Sys

tem

Wafer cycle Time : Slot v Load Port (A/B)


Time distribution

for each slot

Sys

tem

Wafer cycle Time : Slot v Load Port (C\D)


Sys

tem

Load Port Time Distribution : Load Port A


Seconds

Sys

tem

Cycle Time v Throughput: Port A v B


Sys

tem

Cycle Time v Throughput: Port C v D


Sys

tem

System Throughput / Statistics*


Wafer Cycle

D

C Throughput=125+/-8 wph

FOUP D

FOUP C

FOUP D

FOUP C

Sys

tem

* Data collected during marathon

Throughput v Cycle Time


Sys

tem

Particle / Wafer Pass - PWP


1 cycle = 3 minutes and 31 seconds

(300mm wafer will not be aligned or placed on the 450mm aligner)

Send “Open” Command 300mm Falcon Load Port (This will remain open until cycle is test is

complete)

Cy

cle

1. Open 450mm Load Port D

2. Wafer Engine Transfers All 300mm Wafers in Falcon LP to aligner then to

450mm Spartan Load port D. Wafer is not aligned.

3. Closes 450mm Spartan Load port D

4. Open 450mm Spartan Load port D

5. Wafer Engine Transfers All 300mm Wafers in 450mm Load port D to

aligner then to Falcon LP. Repeat steps one through five until ready to scan

wafers

Send “Close” Command 300mm Falcon Load Port. This will complete cycling and will be taken

to SP1 for particle analysis.

Setup

Cycle Definition Scan

Sys

tem

Summary of Data

Test 1 Test 2 Test 3 Test 4 Test 5

Cumulative

0 Cycles 1 Cycles 239 cycles 406 cycles 1515 cycles

Total

Particles

Particles

Added

Total

Particles

Particles

Added

Total

Particles

Particles

Added

Total

Particles

Particles

Added

Total

Particles

Particles

Added Total Particles PWP

Wafer 1 3 0 3 0 4 1 6 2 19 13 16 0.01056

Wafer 2 12 0 12 0 14 2 19 5 26 7 14 0.00924

Wafer 3 11 0 11 0 13 2 14 1 16 2 5 0.0033

Wafer 4 8 0 9 1 9 0 9 0 82 73 74 0.04884

Total

Particles 34 0 35 1 40 5 48 8 143 95 109 0.07195

Min 3 0 3 0 4 0 6 0 16 2 5 0.0033

Max 12 0 12 1 14 2 19 5 82 73 74 0.04884

Average 432.8 0 8.75 0.25 10 1.25 12 2 35.75 23.75 27.25 0.01799


Particle / Wafer Pass – PWP Result S

ys

tem

Wafer Engine Repeatability E1/E1 +/-25um (6 sigma)

Z +/-21um (6 sigma)

Theta +/-22um (6 sigma)

Wafer Placement +/-62um (6 sigma)

Mini Environment ISO Class 1 Met

Extended Class 1 Met

Recovery Time <5min

Air Velocity 82fpm @ 0.012”H2O

FFU Noise <68dB (full speed)

Static Pressure 0.018”H2O @ 85% full speed

Load Port Reliability 500k MCBF @ 80% CL

System Frame Vibration <0.0007g RMS

PWP <0.02 @ 0.12um

[Throughput]* 128 wph (EFEM Single Wafer Transfer)

Performance Summary


System Performance Characterization

General Approach


System

Performance

Functional

Module #1

System

Completed

Preliminary/ Need More Data

Planned

Functional

Module #2

Functional

Module #n

Module

Characteristics

Vibration

Dynamics

Tuning

Repeatability

Cycle Time


Reliability

Status

Module Test Plan

Measurement / Analysis

Summary of Results

System

Characteristics

Wafer Placement

PWP

Throughput

Reliability

System Test Plan

Measurement / Analysis

System Spec Validation

Module

DVT Plan /

Results

System EDS

Performance Characterization of a 450mm Wafer …...2013/01/23 · Particle Contribution...

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Transcript of Performance Characterization of a 450mm Wafer …...2013/01/23 · Particle Contribution...