Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor...

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ON Semiconductor 0 Reliability Audit Report 2000 Reliability Audit Report 2000 Life Test Data

Transcript of Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor...

Page 1: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

ON Semiconductor0Reliability Audit Report 2000

Reliability Audit Report2000

Life Test Data

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ON SemiconductoriReliability Audit Report 2000

Key Contacts:

Tom Grzybowski

Manager, ON Product Reliability

(602) 244−4331

Don Long

Reliability Data Management

(602) 244−6554

E ON Semiconductor L.L.C., 2000

The information in this book has been carefully checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies.

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ON SemiconductoriiReliability Audit Report 2000

Table of Contents

Reliability Data Analysis iii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Reliability Stress Tests vii. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Data Summary ix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Analog

Advance Bipolar Epi 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .CMOS 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .EG Bipolar Epi 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Other 2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VHVIC 3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Bipolar DiscreteAudio & Power Base 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Epi Base 4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .General Purpose 6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Glass Passivated (Rectifier) 7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .HF Transistor 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .HV Epi Collector 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .HV Planar 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .HV Transistor 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Junction FET 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Low Current (Thyristor) 9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .LV Planar 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Medium Current (Thyristor) 13. . . . . . . . . . . . . . . . . . . . . . . . . . . .Open Junction (Rectifier) 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Schottky Rectifier 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Switching Diode 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Ultrafast (Rectifier) 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Zener Diode 22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

LogicHSL CMOS 25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .LCX 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Metal Gate CMOS 29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MOSAIC 3 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .MOSAIC 5 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .VHC 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

MOS GatedHD TMOS III 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .HD TMOS 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IGBT 37. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TMOS II 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TMOS IV 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TMOS V 41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TMOS VII 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

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ON SemiconductoriiiReliability Audit Report 2000

RELIABILITY DATA ANALYSISReliability is the probability that a semiconductor device

will perform its specified function in agiven environment foraspecified period. In other words, reliability is quality overtime and environmental conditions. The most frequentlyused reliability measure for semiconductor devices is thefailure rate ( � ). The failure rate is obtained by dividing thenumber of failures observed by the product of the number ofdevices on test and the interval in hours, usually expressedas percent per thousand hours or failures per billion devicehours (FITS). This is called a point estimate because it isobtained from observations on a portion (sample) of thepopulation of devices.

To project from the sample to the population in general,one must establish confidence intervals. The application ofconfidence intervals is a statement of how “confident” one isthat the sample failure rate approximates that for thepopulation. To obtain failure rates at different confidencelevels, it is necessary to make use of specific probabilitydistributions. The chi-square (�2) distribution that relatesobserved andexpected frequencies of anevent is frequentlyused to establish confidence intervals. The relationshipbetween failure rate and the chi-square distribution is asfollows:

� ��2 ��, d. f.)

2twhere:

� = failure rate�2 = chi-square function� = (100 − confidence level) /100

d.f. = degrees of freedom = 2r + 2r = number of failurest = device hoursChi-square values for 60% and 90% confidence

intervals for up to 12 failures are shown in Table 1−1.

Table 1−1 Chi-Square Table

Chi-Square Distribution Function

60% Confidence Level 90% Confidence Level

No. Fails �2 Quantity No. Fails �2 Quantity

0 1.833 0 4.6051 4.045 1 7.7792 6.211 2 10.6453 8.351 3 13.3624 10.473 4 15.9875 12.584 5 18.5496 14.685 6 21.0647 16.780 7 23.5428 18.868 8 25.9899 20.951 9 28.41210 23.031 10 30.81311 25.106 11 33.19612 27.179 12 35.563

The failure rate of semiconductor devices is inherentlylow. As a result, the industry uses a technique calledaccelerated testing to assess the reliability ofsemiconductors. During accelerated tests, elevatedstresses are used to produce, in a short period, the samefailuremechanisms aswould beobserved undernormal useconditions. The objective of this testing is to identify thesefailure mechanisms and eliminate themas a cause of failureduring the useful life of the product.

Temperature, relative humidity, and voltage are themostfrequently used stresses during accelerated testing. Theirrelationship to failure rates has been shown to follow anEyring type of equation of the form:

� = A exp(�kT) � exp(B/RH) � exp(CE)

WhereA,B, C, � , and k are constants, more specificallyB,C, and�arenumbers representing theapparent energyatwhich various failure mechanisms occur. These are calledactivation energies. “T” is the temperature, “RH” is therelative humidity, and “E” is the electric field. The mostfamiliar form of this equation (shown on following page)deals with the first exponential term that shows anArrheniustype relationship of the failure rate versus the junctiontemperatureof semiconductors. The junction temperature isrelated to the ambient temperature through the thermalresistance andpower dissipation. Thus,wecan test devicesnear their maximum junction temperatures, analyze thefailures to assure that they are the types that areacceleratedby temperature and then by applying known accelerationfactors, estimate the failure rates for lower junctiontemperatures.

Figure 1-1 shows a curve that gives estimates of typicalfailure rates versus temperature for semiconductors.

(3.0)

Figure 1-1 − Typical Failure Rate versus Junction Temperature

90% CONFIDENCE LEVEL

% FAILURE1000 HOURS

1

0.1

0.01

0.001

0.0001

0.7 eV

1.0 eV

(3.5)(2.5)(2.0)

(1.5)

0

2565100

150200

250450 350400

500

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Arrhenius type of equation:

� ��

kTA exp

where:� = failure rateA = constant� = 2.72� = activation energyk = Boltzman’s constant, 8.62 x 10-5eV/KT = temperature in degrees Kelvin (Tj ���� C + 273.15)

Temperature acceleration factors for a particular failuremechanism can be expressed as the ratio of the failure ratesat two different levels of stress:

�Tr

Fa = exp� /k) � �

Tt

where:Fa = acceleration factor� = activation energyk = Boltzman’s constant, 8.62 x 10-5eV/KTr = junction temperature, K at the rated ambient

temperatureSincedevice junction temperatureandactivation energy

for observed failure mechanisms are “critical” parameters inestimating failure rate, the following additional informationon these two parameters is presented below.

Tt = junction temperature,K at the life test ambienttemperature

See Figure 1-2 as an example.

THERMAL RESISTANCE

Circuit performance and long-term circuit reliability areaffected by die temperature. Normally, both are improved bykeeping the junction temperatures low.

Electrical power dissipated in any semiconductor deviceis a source of heat. This heat source increases thetemperature of the die about some reference point, normallytheambient temperature of 25C in still air. The temperatureincrease, then, depends on the amount of power dissipatedin the circuit and on the net thermal resistance between theheat source and the reference point.

The temperature at the junction depends on thepackaging and mounting system’s ability to remove heatgenerated in the circuit from the junction region to theambient environment. The basic formula for convertingpower dissipation to estimated junction temperature is:

(1) TJ = TA + PD (�JC + �CA)

or:

(2) TJ = TA + PD (�JA)

where:TJ = maximum junction temperatureTA = maximum ambient temperaturePD = calculated maximum power dissipation, including

effects of externalloads when applicable

�JC = average thermal resistance, junction to case�CA = average thermal resistance, case to ambient�JA = average thermal resistance, junction to ambient

Figure 1-2 − Example of Temperature Acceleration Factor (0.7 eV Activation Energy)

70

60

50

40

30

20

100

70

60

50

4030

20

100

400 800 1200 1400TESTING TIME (HRS) @ 167.5C (TJ)

8.617

26

30

TIME (YEARS) @ 70C (TJ)

ACCELERATIONFACTOR

FR (FIT)

FR (FIT)

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This ON Semiconductor recommended formula hasbeen approved by RADC and DESC for calculating a“practical” maximum operating junction temperature forMIL-M-38510 devices.

Only two terms on the right side of equation (1) can bevaried by the user, the ambient temperature and the devicecase-to-ambient thermal resistance, �CA. (To some extentthe device power dissipation can also be controlled, butunder recommended use the supply voltage and loadingdictate a fixed power dissipation.) Both system air flow andthe package mounting technique affect the �CA thermalresistance term. �JC is essentially independent of air flowand external mounting method, but is sensitive to packagematerial, die bonding method, and die area.

For applications where the case is held at essentially afixed temperature by mounting on a large or temperaturecontrolled heat sink, the estimated junction temperature iscalculated by:

(3) TJ = TC + PD (�JC)

where TC = maximum case temperature and the otherparameters are as previously defined.

AIR FLOW

Air flow over the packages (due to a decrease in �CA)

reduces the thermal resistance of the package, thereforepermitting a corresponding increase in power dissipationwithout exceeding the maximum permissible operatingjunction temperature.

For thermal resistance values for specific packages, seethe ON Semiconductor Data Book or Design Manual for theappropriate device family or contact your local ONSemiconductor sales office.

ACTIVATION ENERGYDetermination of activation energies is accomplished by

testing randomly selected samples from the samepopulation at various stress levels and comparing failurerates due to the same failure mechanism. The activationenergy is represented by theslope of the curve relating to thenatural logarithm of the failure rate to the various stresslevels.

Incalculating failure rates, thecomprehensivemethod isto use the specific activation energy for each failuremechanism applicable to the technology and circuit underconsideration. A common alternative method is to use asingle activation energy value for the “expected” failuremechanism(s) with the lowest activation energy.

Table 1−2, on the following page, shows observedactivation energies with references.

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Table 1−2 − Time Dependent Failure Mechanisms in Semiconductor Devices(Applicable to Discrete and Integrated Circuits)

TypicalDevice Relevant Accelerating Activation

Association Process Factors Factors Energy in eV Model Reference

Silicon Oxide Surface Charges Mobile Ions T, V 1.0 Fitch, et al. 1ASilicon-Silicon Inversion, Accumulation E/V, T Peck 2Oxide Interface

Oxide Pinholes E/V, T E, T 0.7 - 1.0 (Bipolar) 1984 WRS 181.0 (Bipolar) Hokari, et al. 5

Dielectric Breakdown E/V, T E, T 0.3-0.4 (MOS) Domangue, et al. 3(TDDB) 0.3 (MOS) Crook, D.L. 4

Charge Loss E, T E, T 0.8 (MOS) Gear, G. 11EPROM

Metallization Electromigration T, J J, T 1.0 Nanda, et al. 6Large grain Al(glassivated)

Grain Size 0.5 Black, J.R. 7Small grain Al

Doping 0.7 Black, J.R. 12Cu-Al/Cu-Si-Al(sputtered)

Corrosion Contamination H, E/V, T 0.6-0.7 Lycoudes, N.E. 8Chemical (for electrolysis)Galvanic E/V may haveElectrolytic thresholds

Bond and Other Intermetallic T, Impurities T 1.0 (Au/Al) Fitch, W.T. 9Mechanical Interfaces Growth Bond Strength

Various Wafer Fab, Metal Scratches T, V T, V 0.5-0.7 eV Howes, et al. 10Assembly, and Mask Defects, etc.Silicon Defects Silicon Defects 0.5 eV MMPD 13

V = voltage; E = electric field; T = temperature; J = current density; H = humidity

NO. REFERENCE

1A 1.0 eV activation for leakage type failures.

Fitch, W.T.; Greer, P.; Lycoudes, N.; “Data to Support 0.001%/1000 Hoursfor Plastic I/C’s.” Case study on linear product shows 0.914 eV activationenergy which is within experimental error of 0.9 To 1.3 eV activationenergies for reversible leakage (inversion) failures reported in theliterature.

1B 0.7 To 1.0 eV for oxide defect failures for bipolar structures. This is under

investigation subsequent to information obtained from 1984 WaferReliability Symposium, especially for bipolar capacitors with silicon nitrideas dielectric.

2 1.0 eV activation for leakage type failures.

Peck, D.S.; “New Concerns About Integrated Circuit Reliability”’ 1978Reliability Physics Symposium.

3 0.36 eV for dielectric breakdown for MOS gate structures.

Domangue, E.; Rivera, R.; Shedard, C.; “Reliability Prediction Using LargeMOS Capacitors”, 1984 Reliability Physics Symposium.

4 0.3 eV for dielectric breakdown.

Crook, D.L.; “Method of Determining Reliability Screens for TimeDependent Dielectric Breakdown”, 1979 Reliability Physics Symposium.

5 1.0 eV for dielectric breakdown.

Hokari, Y.; et al.; IEDM Technical Digest, 1982.

6 1.0 eV for large grain Al-Si (compared to line width).

Nanda, Vangard, Gj-P; Black, J.R.; “Electromigration of Al-Si Alloy Films”,1978 Reliability Physics Symposium.

7 0.5 eV Al, 0.7 eV Cu-Al small grain (compared to line width).

Black, J.R.; “Current Limitation of Thin Film Conductor’’ 1982 ReliabilityPhysics Symposium.

8 0.65 eV for corrosion mechanism.

Lycoudes, N.E.; “The Reliability of Plastic Microcircuits in MoistEnvironments”, 1978 Solid State Technology.

9 1.0 eV for open wires or high resistance bonds at the pad bond due to Au-Alintermetallics.

Fitch, W.T.; “Operating Life vs Junction Temperatures for PlasticEncapsulated I/C (1.5 mil Au wire)’’, unpublished report.

10 0.7 eV for assembly related defects.

Howes, M.G.; Morgan, D.V.; “Reliability and Degradation, SemiconductorDevices and Circuits’’ John Wiley and Sons, 1981.

11 Gear, G.; “FAMOUS PROM Reliability Studies”, 1976 Reliability PhysicsSymposium

12 Black, J.R.: unpublished report.

13 ON Semiconductor Memory Products Division; unpublished report.

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ON SemiconductorviiReliability Audit Report 2000

RELIABILITY STRESS TESTSThe following are brief descriptions of the reliability testscommonly used in the reliability monitoring program. Not allof the tests listed are performed on each product. Othertests may be performed when appropriate. The informationherein is typical of the testing performed. Variations to thefollowing will be found throughout this document based onthe limitations of the specific device being tested.

AUTOCLAVEAutoclave is an environmental test which measures deviceresistance to moisture penetration and the resultant effectsof galvanic corrosion. Autoclave is a highly accelerated anddestructive test.

Typical TestConditions: TA = 121C, rh = 100%, p= 1 atmosphere (15 psig), t = 24 to 240 hoursCommon Failure Modes: Parametric shifts, highleakage and/or catastrophicCommon Failure Mechanisms: Die corrosion orcontaminants such as foreign material on or withinthe package materials. Poor package sealing

HIGHLY ACCELERATED STRESS TESTHighly Accelerated Stress Test uses a pressurizedenvironment to produce extremely severetemperature, humidity and bias conditions. HASTaccelerates the same failure mechanisms asHigh Humidity High Temperature Bias.

Typical Test Conditions: TA = 130C, rh = 85% to95%, p = 2 Atmospheres, Bias = 80% to 100% ofData Book max. rating, t = 96 to 240 hoursCommon Failure Modes: Parametric shifts, highleakage and/or catastrophicCommon Failure Mechanisms: Die corrosion orcontaminants such as foreign material on or withinthe package materials. Poor package sealing

HIGH HUMIDITY HIGH TEMPERATURE BIASThis is an environmental test designed to measure themoisture resistance of plastic encapsulated devices. A biasis applied to create an electrolytic cell necessary toaccelerate corrosion of the die metallization. With time, thisis a catastrophically destructive test.

Typical Test Conditions: TA = 85C to 95C, rh =85% to 95%,Bias = 80% to 100%ofData Bookmax.rating, t = 96 to 1008 hoursCommon Failure Modes: Parametric shifts, highleakage and/or catastrophicCommon Failure Mechanisms: Die corrosion orcontaminants such as foreign material on or withinthe package materials. Poor package sealing

HIGH TEMPERATURE FORWARD BIASThis test is designed to measure the stability of the devicesunder a forward bias condition at high temperature.

Typical TestConditions: TA = 85C to 100C,Bias= 100% of Data Book max. rating, t = 120 to 1008hours

Common Failure Modes: Parametric drifts inrepetitive peak off−state and reverse currents, gatetrigger current and voltageCommon Failure Mechanisms: Random oxidedefects and ionic contamination

HIGH TEMPERATURE GATE BIASThis test is designed to electrically stress the gate oxideunder a bias condition at high temperature.

Typical Test Conditions: TA = 150C, Bias = 80%of Data Book max. rating, t = 120 to 1008 hoursCommon Failure Modes: Parametric shifts in gateleakage and gate threshold voltageCommon Failure Mechanisms: Random oxidedefects and ionic contamination

HIGH TEMPERATURE REVERSE BIASThe purpose of this test is to align mobile ions by means oftemperature and voltage stress to form a high-currentleakage path between two or more junctions.

Typical Test Conditions: TA = 85C to 150C,Bias= 80% to 100% of Data Book max. rating, t = 120 to1008 hoursCommon Failure Modes: Parametric shifts inleakage and gainCommon Failure Mechanisms: Ioniccontamination on the surface or under themetallization of the die

HIGH TEMPERATURE STORAGE LIFEHigh temperature storage life testing is performed toaccelerate failure mechanisms which are thermallyactivated through the application of extreme temperatures.

Typical Test Conditions: TA = 125C to 200C, nobias, t = 24 to 1008 hoursCommon Failure Modes: Parametric shifts inleakage and gainCommon Failure Mechanisms: Bulk die anddiffusion defects

INTERMITTENT OPERATING LIFEThe purpose of this test is the same as Operating Life inaddition to checking the integrity of both wire and die bondsby means of thermal stressing.

Typical Test Conditions: TA = 25C, Pd = DataBook maximum rating, Ton = Toff = TJ of 125C to175C, t = 1000 to 15000 cyclesCommon Failure Modes: Parametric shifts andcatastrophicCommon Failure Mechanisms: Foreign material,crack andbulk diedefects,metallization, wire anddiebond defects

OPERATING LIFEThe purpose of this test is to evaluate the bulk stability of thedie and to generate defects resulting from manufacturingaberrations that are manifested as time andstress-dependent failures.

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ON SemiconductorviiiReliability Audit Report 2000

Typical Test Conditions: TA = 25C, PD = DataBook maximum rating, t = 45 to 1008 hoursCommon Failure Modes: Parametric shifts andcatastrophicCommon Failure Mechanisms: Foreign material,crack die, bulk die, metallization, wire and die bonddefects

SOLDERABILITYThe purpose of this test is to measure the ability of deviceleads/terminals to be soldered after an extended period ofstorage or shelf life.

Typical Test Conditions: Steam aging = 8 hoursCommon Failure Modes: Pin holes, dewetting,non-wettingCommon Failure Mechanisms: Poor plating,contaminated leads

SOLDER HEATThis test is used to measure the ability of a device towithstand the temperatures as may be seen in wavesoldering operations. Electrical testing is the endpointcriterion for this stress.

Typical Test Conditions: Solder Temperature =260 C, t = 10 secondsCommon Failure Modes: Parameter shifts,mechanical failure

TEMPERATURE CYCLING (AIR TO AIR)The purpose of this test is to evaluate the ability of the deviceto withstand both exposure to extreme temperatures andtransitions between temperature extremes. This testing willalso expose excessive thermal mismatch betweenmaterials.

Typical Test Conditions: TA = −65C to 150C,cycle = 100 to 1000Common Failure Modes: Parametric shifts andcatastrophicCommon Failure Mechanisms: Wire bond,cracked or lifted die and package failure

THERMAL SHOCK (LIQUID TO LIQUID)The purpose of this test is to evaluate the ability of the deviceto withstand both exposure to extreme temperatures andsudden transitions between temperature extremes. Thistesting will also expose excessive thermal mismatchbetween materials.

Typical Test Conditions: TA = −65C to 150C,cycle = 100 to 1000Common Failure Modes: Parametric shifts andcatastrophicCommon Failure Mechanisms: Wire bond,cracked or lifted die and package failure

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This is a Product Technology Summary Sheet. The Product Families are shaded gray and are followed immediately bythe appropriate Technologies. FIT rate summaries are calculated on the combined die related stress tests for that specificproduct family or technology. Specific test details follow this page.

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hours @ T1 MTBF 90%FIT 90%Rej.

2000Reliability Audit ReportLife Test Summary

728362231 1.258 7949125603640104 55Analog2000 3.161 3163555844639 0

150927041 6.072 164690382582232 55Advance Bipolar EPI2000 15.256 65547981966 0246297734 3.721 268744961950144 55EG Bipolar EPI2000 9.348 106974754943 0212955630 4.304 232342007821520 55Other2000 10.812 92489826815 099879878 9.176 1089799481286208 55VHVIC2000 23.053 433783021276 0

2208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

52694542 17.393 57494394203280 55Audio & Power Base2000 43.695 22885914510 0556600362 1.647 6071645422147200 55Epi Base2000 4.137 2417210544300 060968892 15.032 66524747235200 55General Purpose2000 37.765 264795452450 046659866 19.642 50911312180000 55Glass Passivated2000 49.346 202650671500 01244263 736.581 13576244800 55HF Transistor2000 1850.493 54039750 01555329 589.264 16970326000 55HV Epi Collector2000 1480.394 67549650 0

145060340 6.318 158277936559600 55HV Planar2000 15.873 63000063650 04977052 184.145 543050319200 55HV Transistors2000 462.623 2161587200 0

87795205 10.439 95794616338688 55Junction FET2000 26.226 38130100336 0144645586 6.336 157828283558000 55Low Current2000 15.918 628219635700 0239002205 3.835 260756193922000 55LV Planar2000 9.634 1037990451600 023332223 39.280 254582481178800 55Medium Current2000 98.683 101334588000 0

110926056 47.207 21183299427920 55Open Junction2000 72.062 138769391790 4299618555 3.059 3269042171155840 55Schottky Rectifier2000 7.685 1301236176294 0

8709842 105.226 950335533600 55Switching Diodes2000 264.356 3782778350 065012747 14.097 70937079250800 55Ultrafast2000 35.416 282358262450 0

302604787 3.029 3301419611167360 55Zener Diodes2000 7.609 1314233145820 03300569118 0.278 359712230212732622 55Logic2000 0.698 143266475632309 0

1015044955 0.903 11074197123915744 55HSL CMOS2000 2.268 4409171088512 030099761 30.449 32841801116116 55LCX2000 76.496 13072579308 0

1015044955 0.903 11074197123915744 55Metal Gate CMOS2000 2.268 4409171088512 0261295252 3.508 2850627141008000 55MOSAIC 32000 8.812 113481616720 062710860 14.615 68422853241920 55MOSAIC 52000 36.716 27236082160 0

916373335 1.000 10000000003535098 55VHC2000 2.513 3979307608491 03919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

619543485 1.479 6761325222390016 55HD TMOS2000 3.716 2691065662552 0619543485 1.479 6761325222390016 55HD TMOS III2000 3.716 2691065662552 0877650789 1.044 9578544061160256 55IGBT2000 2.623 3812428522032 0619543485 1.479 6761325222390016 55TMOS II2000 3.716 2691065662552 0151924525 6.033 165755014586080 55TMOS IV2000 15.156 65980470760 0990739886 0.925 10810810811309760 55TMOS V2000 2.324 4302925992520 0990739886 0.925 10810810811309760 55TMOS VII2000 2.324 4302925992520 0

ON SemiconductorReliability Audit Report ix2000

Page 11: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

Operating LifeTj = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Analog - Advance Bipolar EPI

Test Conditions:

77250PPEX0007OSPI TESLA OSPI 0LINS0124 LM324D SOIC-1477504PPEX0007OSPI TESLA OSPI 0LINS0124 LM324D SOIC-1477250PPCT0005OSPI BMC OSPI 0LINS3074 MC34074DR2 SOIC-1477504PPCT0005OSPI BMC OSPI 0LINS3074 MC34074DR2 SOIC-1477250PEF0008OSPI BMC OSPI 0LINS3074 MC34074DR2 SOIC-1477504PEF0008OSPI BMC OSPI 0LINS3074 MC34074DR2 SOIC-1477250PIK0020OSPI BMC OSPI 0LINS3074 MC34074DR2 SOIC-1477504PIK0020OSPI BMC OSPI 0LINS3074 MC34074DR2 SOIC-14

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

60199523 15.224 65685759232232 55Advance Bipolar EPI2000 38.248 26145158616728362231 1.258 7949125603640104 55Analog2000 3.161 3163555844639 0

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Analog - Advance Bipolar EPI

Test Conditions:

5010000002PSI - PSI 0RETT8M05 MC78M05BDT DPAK5010000037PSI - PSI 0RETT8M05 MC78M05BDT DPAK5010000001PSI - PSI 0RETT8M05 MC78M05BDTRK DPAK5010000003PSI - PSI 0RETT8M05 MC78M05BDTRK DPAK5010000005PSI - PSI 0RETT8M05 MC78M05CDT DPAK5010000004PSI - PSI 0RETT8M05 MC78M05CDTRK DPAK5010000009PSI - PSI 0RETT8M05 MC78M05CDTRK DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

90727518 10.102 98990299350000 55Advance Bipolar EPI2000 25.378 39404208350728362231 1.258 7949125603640104 55Analog2000 3.161 3163555844639 0

0Rej.

Operating LifeTj = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Analog - CMOS

Test Conditions:

8010080027SBN Mos-7 4” PHX 0LINN2001 NCS2001BSNT1 TSOP-5801008 -SBN Mos-7 4” PHX 0LINN1330 MC33330SN-1T1 TSOP-5801008n/aSBN Mos-7 4” PHX 0NCP305 NCP305SQ30T1 SC-82AB791008n/aSBN Mos-7 4” PHX 0NCP305 NCP305SQ30T1 SC-82AB801008n/aSBN Mos-7 4” PHX 0NCP305 NCP305SQ30T1 SC-82AB801008 -Sbn Aap1

(A i)PHX 0NCP305 NCP305LSQ30T1 SC-82AB

801008 -Sbn Aap1(A i)

PHX 0NCP305 NCP305LSQ30T1 SC-82AB801008 -Sbn Aap1

(A i)PHX 0NCP305 NCP305LSQ30T1 SC-82AB

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

1015044955 0.903 11074197123915744 55CMOS2000 2.268 4409171088512728362231 1.258 7949125603640104 55Analog2000 3.161 3163555844639 0

0Rej.

ON SemiconductorReliability Audit Report 12000

Page 12: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

Operating LifeTj = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Analog - EG Bipolar EPI

Test Conditions:

801008 -- BMC PHX 0REGP063A MC33063AP1 PDIP-8801008 -- BMC PHX 0REGP063A MC33063AP1 PDIP-8801008 -Amt

(A t )TESLA PHX 0REGS3064 MC34064D-005 SOIC-8

801008 -Amt(A t )

TESLA PHX 0REGS3064 MC34064D-005 SOIC-8801008 -- - PHX 0REGS3064 MC33064D-005 SOIC-8781008 -SBN BP4 PHX 0REDM5150 LP2951CDM-5.0R2 Micro-8781008 -SBN BP4 PHX 0REDM5150 LP2951CDM-5.0R2 Micro-8781008 -SBN BP4 PHX 0REDM5150 LP2951CDM-5.0R2 Micro-8191008 -Carsem

(M)BP4 PHX 0REDM5150 LP2951CDM-5.0R2 Micro-8

801008 -TESLA TESLA PHX 0REGT3166 MC34166T TO-220-5801008 -TESLA TESLA PHX 0REGTV167 MC34167TV TO-220-5801008 -Amt

(A t )TESLA PHX 0REGS3064 MC34064D-005 SOIC-8

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

233336660 3.928 254582485900144 55EG Bipolar EPI2000 9.868 101337657893728362231 1.258 7949125603640104 55Analog2000 3.161 3163555844639 0

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Analog - EG Bipolar EPI

Test Conditions:

5010000031PSI - PSI 0REGT3269 MC33269DTRK DPAKMTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

12961074 70.712 1414187150000 55EG Bipolar EPI2000 177.647 562914150728362231 1.258 7949125603640104 55Analog2000 3.161 3163555844639 0

0Rej.

Operating LifeTj = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Analog - Other

Test Conditions:

1751008 -SBN BMC PHX 0INTS2105 SC902105SNT1 TSOP-6801008 -Sbn II Sbn II PHX 0XT2950L SDC3712T1 TSOP-6801008 -Sbn II Sbn II PHX 0XT2950L SDC3712T1 TSOP-6801008 -Sbn II Sbn II PHX 0XT2950L SDC3712T1 TSOP-6801008 -SBN BMC PHX 0INTS2105 SC902105SNT1 TSOP-6801008 -SBN BMC PHX 0INTS2105 SC902105SNT1 TSOP-6

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

150244770 6.100 163934426579600 55Other2000 15.325 65252855575728362231 1.258 7949125603640104 55Analog2000 3.161 3163555844639 0

0Rej.

ON SemiconductorReliability Audit Report 22000

Page 13: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Analog - Other

Test Conditions:

801008 -Sbn II Sbn II PHX 0XT2950L SDC3712T1 TSOP-6801008 -Sbn II Sbn II PHX 0XT2950L SDC3712T1 TSOP-6801008 -Sbn II Sbn II PHX 0XT2950L SDC3712T1 TSOP-6

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

62710860 14.615 68422853241920 55Other2000 36.716 27236082240728362231 1.258 7949125603640104 55Analog2000 3.161 3163555844639 0

0Rej.

High Temperature Blocking BiasTa = +125°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Analog - VHVIC

Test Conditions:

801008 -Amt(A t )

Mos-7 4” PHX 0REGP3365 MC33365P PDIP-16801008 -Amt

(A t )Mos-7 4” PHX 0REGP3365 MC33365P PDIP-16

801008 -Amt(A t )

Mos-7 4” PHX 0REGP3365 MC33365P PDIP-16801008 -Amt

(A t )Mos-7 4” PHX 0REGP3365 MC33365P PDIP-16

801008CPCC0007Amt(A t )

Mos-7 4” PHX 0REGP3333 MC33363P PDIP-16801008CPCD0007Amt

(A t )Mos-7 4” PHX 0REGP3333 MC33363P PDIP-16

801008CPCE0007Amt(A t )

Mos-7 4” PHX 0REGP3333 MC33363P PDIP-16801008CPBP0003Amt

(A t )BMC PHX 0REGP3333 MC33363P PDIP-16

801008 -Ase (M) Mos-7 4” PHX 0REGP608A MC44608P75 PDIP-8801008 -Ase (M) Mos-7 4” PHX 0REGP608A MC44608P75 PDIP-8801008 -Ase (M) Mos-7 4” PHX 0REGP608A MC44608P75 PDIP-8

1001008 -Ase (M) Mos-7 4” PHX 0REGP4608 MC44608P40 PDIP-8801008 -Amt

(A t )Mos-7 4” PHX 0REGS3368 MC33368D SOIC-16

801008 -Amt(A t )

Mos-7 4” PHX 0REGS1336 MC33364D2 SOIC-8361008 -- - PHX 0REGP608A MC44608P75 PDIP-8

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

92052301 9.956 1004419451185408 55VHVIC2000 25.013 399792111176728362231 1.258 7949125603640104 55Analog2000 3.161 3163555844639 0

0Rej.

High Temperature Blocking BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Analog - VHVIC

Test Conditions:

501008 -Ase (M) Mos-7 4” PHX 0REGP4608 MC44608P40 PDIP-8501008 -Ase (M) Mos-7 4” PHX 0REGP608A MC44608P75 PDIP-8

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

26129525 35.075 28510335100800 55VHVIC2000 88.119 11348290100728362231 1.258 7949125603640104 55Analog2000 3.161 3163555844639 0

0Rej.

ON SemiconductorReliability Audit Report 32000

Page 14: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - Audio & Power Base

Test Conditions:

801008 -PSI BP6 PHX 0PLR1193 MJL21193 TO-264801008 -TEAM

PACIFIBP6 PHX 0PLR1193 MJL21193 TO-264

501200024GDL PHX GDL 0PL432 MJ15003 TO-204501200018GDL PHX GDL 0PL435 MJ15004 TO-204501200013GDL PHX GDL 0PL1193 MJ15023 TO-204501200016GDL PHX GDL 0PL1193 MJ15023 TO-204501200010GDL PHX GDL 0PL1193 MJ21193 TO-204501200017GDL PHX GDL 0PL1194 MJ21194 TO-204501200026GDL PHX GDL 0PL1694 SJ7148 TO-204

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

52694542 17.393 57494394203280 55Audio & Power Base2000 43.695 228859145102208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - Epi Base

Test Conditions:

501200020GDL PHX GDL 0PL002 2N3055 TO-204501200014GDL PHX GDL 0PL034 2N3772 TO-204501200020GDL PHX GDL 0PL034 2N3773 TO-204501200020GDL PHX GDL 0PL034 2N3773 TO-204501200022GDL GDL GDL 0PL034 2N3773 TO-2045010000013PSI - PSI 0PLA508 2N6043 TO-220501200025GDL PHX GDL 0PL010 2N6056 TO-2045010000005PSI - PSI 0PLA527 2N6491 TO-2205010000035PSI - PSI 0PLA502 BD243B TO-220501200019GDL PHX GDL 0PL458 MJ15015 TO-204501200015GDL PHX GDL 0PL004 MJ802 TO-2045010000025PSI - PSI 0PLC3052 MJD31C DPAK5010000005PSI - PSI 0PLC3052 MJD31CT4 DPAK5010000012PSI - PSI 0PLC3052 MJD31CT4 DPAK5010000013PSI - PSI 0PLC3052 MJD31CT4 DPAK5010000019PSI - PSI 0PLC3052 MJD31CT4 DPAK5010000022PSI - PSI 0PLC3052 MJD31CT4 DPAK5010000027PSI - PSI 0PLC3052 MJD31CT4 DPAK5010000030PSI - PSI 0PLC3052 MJD31CT4 DPAK5010000015PSI - PSI 0PLC3052 MJD31T4 DPAK5010000016PSI - PSI 0PLC3052 MJD31T4 DPAK5010000017PSI - PSI 0PLC3052 MJD31T4 DPAK5010000007PSI - PSI 0PLC3037 MJD32C DPAK5010000026PSI - PSI 0PLC3037 MJD32CT4 DPAK5010000032PSI - PSI 0PLC3037 MJD32CT4 DPAK5010000033PSI - PSI 0PLC3037 MJD32CT4 DPAK

ON SemiconductorReliability Audit Report 42000

Page 15: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

5010000035PSI - PSI 0PLC3037 MJD32T4 DPAK501200026GDL PHX GDL 0PLB4558 MJF3055 TO-220-ISO501200011GDL PHX GDL 0PL1847 SJ41042 TO-204501200025GDL PHX GDL 0PLA1588 SJE5818 TO-220501200024GDL PHX GDL 0PLA1580 SJE7030LFDE TO-220501200025GDL PHX GDL 0PLB4569 SJF2008LFRB TO-220-ISO5010000032PSI - PSI 0PLA501 TE02509 TO-2205010000037PSI - PSI 0PLA568 TIP100 TO-220501200026GDL PHX GDL 0PLA569 TIP107 TO-2205010000028PSI - PSI 0PLA569 TIP107 TO-2205010000006PSI - PSI 0PLA508 TIP112 TO-2205010000016PSI - PSI 0PLA508 TIP112 TO-2205010000023PSI - PSI 0PLA507 TIP117 TO-2205010000027PSI - PSI 0PLA508 TIP120 TO-2205010000030PSI - PSI 0PLA508 TIP122 TO-2205010000018PSI - PSI 0PLA545 TIP127 TO-2205010000004PSI - PSI 0PLA550 TIP29C TO-2205010000011PSI - PSI 0PLA552 TIP31C TO-2205010000024PSI - PSI 0PLA552 TIP31C TO-2205010000025PSI - PSI 0PLA552 TIP31C TO-2205010000034PSI - PSI 0PLA552 TIP31C TO-2205010000003PSI - PSI 0PLA560 TIP41C TO-2205010000031PSI - PSI 0PLA560 TIP41C TO-2205010000008PSI - PSI 0PLA557 TIP42C TO-2205010000012PSI - PSI 0PLA557 TIP42C TO-2205010000015PSI - PSI 0PLA557 TIP42C TO-22050960017SBN PHX SBN 0PLC3007 SJD1038T4 DPAK50960022SBN PHX SBN 0PLC3008 MJD112T4 DPAK50960026SBN PHX SBN 0PLC3008 MJD112T4 DPAK50960018SBN PHX SBN 0PLC3008 MJD122T4 DPAK50960023SBN PHX SBN 0PLC3017 MJD127T4 DPAK50960024SBN PHX SBN 0PLC3017 MJD127T4 DPAK50960021SBN PHX SBN 0PLC3017 MJD127T4 DPAK50960009SBN PHX SBN 0PLC3020 MJD41CT4 DPAK50960004SBN PHX SBN 0PLC3021 SJD1008LFKBT4 DPAK50960006SBN PHX SBN 0PLC3021 MJD42CT4 DPAK50960007SBN PHX SBN 0PLC3052 MJD31C1 DPAK50960025SBN PHX SBN 0PLC3052 SJD1015-001 DPAK50960003SBN PHX SBN 0PLE007P BD682 TO-22550960004SBN PHX SBN 0PLE007P BD682 TO-22550960006SBN PHX SBN 0PLE007P BD680 TO-22550960011SBN PHX SBN 0PLE007P BD678 TO-22550960025SBN PHX SBN 0PLE007P BD678 TO-22550960026SBN PHX SBN 0PLE007P BD680A TO-22550960016SBN PHX SBN 0PLE007P BD678A TO-22550960021SBN PHX SBN 0PLE007P BD680 TO-22550960001SBN PHX SBN 0PLE008P BD679 TO-225

ON SemiconductorReliability Audit Report 52000

Page 16: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

50960005SBN PHX SBN 0PLE008P 2N6038 TO-22550960007SBN PHX SBN 0PLE008P BD681 TO-22550960008SBN PHX SBN 0PLE008P BD675 TO-22550960010SBN PHX SBN 0PLE008P BD679A TO-22550960012SBN PHX SBN 0PLE008P BD677 TO-22550960013SBN PHX SBN 0PLE008P BD675 TO-22550960024SBN PHX SBN 0PLE008P BD677 TO-22550960023SBN PHX SBN 0PLE008P BD681 TO-22550960017SBN PHX SBN 0PLE008P BD675 TO-22550960019SBN PHX SBN 0PLE008P BD677 TO-22550960014SBN PHX SBN 0PLE045P BD436 TO-22550960015SBN PHX SBN 0PLE052P BD237 TO-22550960005SBN PHX SBN 0PLC3037 SJD1003T4 DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

556600362 1.647 6071645422147200 55Epi Base2000 4.137 24172105443002208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - General Purpose

Test Conditions:

50960007SBN SBN SBN 0MCF035 MMBT2222ALT1 SOT-2350960003SBN SBN SBN 0MCF035 MMBT2222ALT1 SOT-2350960020SBN SBN SBN 0MCF0E6 BC848BLT1 SOT-2350960025SBN SBN SBN 0MCF003 BC847ALT1 SOT-2350960023SBN SBN SBN 0MCF003 BC847ALT1 SOT-2350960006SBN SBN SBN 0MCF035 MMBT2222ALT1 SOT-2350960011SBN SBN SBN 0MCF035 MMBT2222ALT1 SOT-2350960012SBN SBN SBN 0MCF035 MMBT2222ALT1 SOT-2350960002SBN SBN SBN 0MCF036 MMBT4401LT1 SOT-2350960010SBN SBN SBN 0MCF055 BC856BLT1 SOT-2350960024SBN SBN SBN 0MCF055 BC856BLT1 SOT-2350960017SBN SBN SBN 0MCF055 BC856BLT1 SOT-2350960009SBN SBN SBN 0MCF085 MMBT2907ALT1 SOT-2350960008SBN SBN SBN 0MCF085 MMBT2907ALT1 SOT-2350960021SBN SBN SBN 0MCF085 MMBT2907ALT1 SOT-2350960019SBN SBN SBN 0MCF08R MMBT3906LT1 SOT-2350960015SBN SBN SBN 0MCF08R MMBT3906LT1 SOT-2350960014SBN SBN SBN 0MCF0E6 BC847BLT1 SOT-2350960022SBN SBN SBN 0MCF0E6 BC847BLT1 SOT-2350960020SBN SBN SBN 0MT133 PZT2222AT1 SOT-22350960014SBN SBN SBN 0MT19J PZT751T1 SOT-22350960021SBN SBN SBN 0MT12C PZT651T1 SOT-22350960015SBN SBN SBN 0MT62C SZT651T1 SOT-22350960026SBN SBN SBN 0MT62C SZT651T1 SOT-22350960010SBN SBN SBN 0MT133 PZT2222AT1 SOT-22350960004SBN SBN SBN 0MT14V BCP56-10T1 SOT-223

ON SemiconductorReliability Audit Report 62000

Page 17: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

50960017SBN SBN SBN 0MT14V BCP56-10T1 SOT-22350960024SBN SBN SBN 0MT14V BCP56-10T1 SOT-22350960001SBN SBN SBN 0MT183P PZT2907AT1 SOT-22350960011SBN SBN SBN 0MT183P PZT2907AT1 SOT-22350960007SBN SBN SBN 0MT19B BCP53T1 SOT-22350960013SBN SBN SBN 0MT19B BCP53T1 SOT-22350960015SBN SBN SBN 0MT19D BCP69T1 SOT-22350960022SBN SBN SBN 0MT19F BCP53-16T1 SOT-22350960001SBN SBN SBN 0MT19J PZT751T1 SOT-22350960004SBN SBN SBN 0MT19J PZT751T1 SOT-22350960005SBN SBN SBN 0MT19J PZT751T1 SOT-22350960010SBN SBN SBN 0MT19J PZT751T1 SOT-22350960011SBN SBN SBN 0MT19J PZT751T1 SOT-22350960012SBN SBN SBN 0MT19J PZT751T1 SOT-22350960008SBN SBN SBN 0MT1R4 PZTA96ST1 SOT-22350960016SBN SBN SBN 0MT19J PZT751T1 SOT-22350960016SBN SBN SBN 0MT1R1 PZTA92T1 SOT-22350960013SBN SBN SBN 0XT13SJ MMBT3904LT1 SOT-2350960004SBN SBN SBN 0MCF035 MMBT2222ALT1 SOT-2350960001SBN SBN SBN 0MCF035 MMBT2222ALT1 SOT-2350960005SBN SBN SBN 0MCF035 MMBT2222ALT1 SOT-2350960026SBN SBN SBN 0MCF0E6 BC847BLT1 SOT-2350960018SBN SBN SBN 0XT13SJ MMBT3904LT1 SOT-23

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

60968892 15.032 66524747235200 55General Purpose2000 37.765 2647954524502208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - Glass Passivated

Test Conditions:

501200001GDL PHX GDL 0RL631G MR2535L Case-194501200004GDL PHX GDL 0RL631G MR2535L Case-194501200021GDL PHX GDL 0RL631G MR2535L Case-194501200026GDL PHX GDL 0RL631G MR2535L Case-194501200007GDL PHX GDL 0RL631G MR2535LRL Case-194501200024GDL PHX GDL 0RL631G MR2535LRL Case-194501200016GDL PHX GDL 0RL631G MR2535LRL Case-194501200025GDL PHX GDL 0RL631G MRJ2535-2LF Case-194501200006GDL PHX GDL 0RL631G SR4115LO Case-194501200019GDL PHX GDL 0RL631G SR4115LO Case-194501200010GDL PHX GDL 0RL631G SR4183 Case-194501200022GDL PHX GDL 0RL631G SR4183 Case-194501200008GDL PHX GDL 0RL631G SR4410LRL Case-194501200009GDL PHX GDL 0RL631G SR4410LRL Case-194501200015GDL PHX GDL 0RL631G SR4413LC Case-194501200002GDL PHX GDL 0RL631G SR4415-2LF Case-194

ON SemiconductorReliability Audit Report 72000

Page 18: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

501200005GDL PHX GDL 0RL632 SR4416LF Case-194501200002GDL GDL GDL 0RL874G SR4445 Case-193501200018GDL GDL GDL 0RL874G SR4445 Case-193501200020GDL GDL GDL 0RL874G SR4445 Case-193501200023GDL GDL GDL 0RL874G SR4445 Case-193501200026GDL GDL GDL 0RL874G SR4461 Case-193501200011GDL PHX GDL 0RL631G SRJ4413LF Case-194501200012GDL PHX GDL 0RL631G SRJ4413LF Case-194501200008GDL PHX GDL 0RL631G SRJ4415-2LF Case-194501200017GDL PHX GDL 0RL632 SRJ4416LF Case-194501200018GDL PHX GDL 0RL631G SRJ4434LF Case-194501200021GDL GDL GDL 0RL886 TR00305 Case-193501200021GDL GDL GDL 0RL886 TR00305 Case-193501200017GDL GDL GDL 0RL887G TR00305G Case-193

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

46659866 19.642 50911312180000 55Glass Passivated2000 49.346 2026506715002208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - HF Transistor

Test Conditions:

50960016SBN SBN SBN 0XT2030L MMBT2369LT1 SOT-23MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

1244263 736.581 13576244800 55HF Transistor2000 1850.493 540397502208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - HV Epi Collector

Test Conditions:

501200024GDL PHX GDL 0PLB5556 MJF18204 TO-220-ISOMTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

1555329 589.264 16970326000 55HV Epi Collector2000 1480.394 675496502208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - HV Planar

Test Conditions:

5010000020PSI - PSI 0PLA5546 BUH50 TO-2205010000038PSI - PSI 0PLA5538 BUL146 TO-2205010000001PSI - PSI 0PLA5466 BUL45 TO-2205010000026PSI - PSI 0PLA5466 BUL45 TO-2205010000010PSI - PSI 0PLA5434 MJE13005 TO-2205010000019PSI - PSI 0PLA5434 MJE13005 TO-2205010000022PSI - PSI 0PLA5430 MJE13007 TO-2205010000014PSI - PSI 0PLA5472 TIP47 TO-220

ON SemiconductorReliability Audit Report 82000

Page 19: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

5010000002PSI - PSI 0PLA5472 TIP50 TO-2205010000007PSI - PSI 0PLA5472 TIP50 TO-2205010000033PSI - PSI 0PLA5472 TIP50 TO-22050960010SBN PHX SBN 0PLC3500 BUD42D DPAK50960003SBN PHX SBN 0PLC3032 TE02548T4 DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

145060340 6.318 158277936559600 55HV Planar2000 15.873 630000636502208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - HV Transistors

Test Conditions:

50960003SBN SBN SBN 0MT2330 PZTA42T1 SOT-22350960009SBN SBN SBN 0MT2330 PZTA42T1 SOT-22350960012SBN SBN SBN 0MT2330 PZTA42T1 SOT-22350960019SBN SBN SBN 0MT2330P2 BF720T1 SOT-223

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

4977052 184.145 543050319200 55HV Transistors2000 462.623 21615872002208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - Junction FET

Test Conditions:

841008 -Sbn II LANSDALE

PHX 0MB544L1 MMBFJ177LT1 SOT-23841008 -Sbn II LANSDA

LEPHX 0MB525L1 MMBF5460LT1 SOT-23

841008 -Sbn II LANSDALE

PHX 0MB525L1 MMBF5460LT1 SOT-23841008 -Sbn II LANSDA

LEPHX 0MB525L1 MMBF5460LT1 SOT-23

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

87795205 10.439 95794616338688 55Junction FET2000 26.226 381301003362208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Forward BiasTa = +100°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - Low Current

Test Conditions:

50960007SBN GDL SBN 0TL220 2N6073B TO-22550960003SBN GDL SBN 0TL220 SAC895LFVP TO-22550960002SBN GDL SBN 0TL220 2N6075A TO-22550960004SBN GDL SBN 0TL220 2N6075A TO-22550960006SBN GDL SBN 0TL220 2N6075A TO-22550960005SBN GDL SBN 0TL220 2N6075A TO-22550960008SBN GDL SBN 0TL220 2N6075A TO-22550960009SBN GDL SBN 0TL220 2N6075A TO-22550960010SBN GDL SBN 0TL220 2N6073B TO-22550960011SBN GDL SBN 0TL220 2N6075A TO-22550960012SBN GDL SBN 0TL220 2N6073A TO-225

ON SemiconductorReliability Audit Report 92000

Page 20: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

50960013SBN GDL SBN 0TL220 2N6073B TO-22550960001SBN GDL SBN 0TL220 2N6071A TO-22550960022SBN GDL SBN 0TL220 2N6073B TO-22550960023SBN GDL SBN 0TL220 2N6075A TO-22550960024SBN GDL SBN 0TL220 2N6075A TO-22550960025SBN GDL SBN 0TL220 2N6075A TO-22550960026SBN GDL SBN 0TL220 2N6075A TO-22550960019SBN GDL SBN 0TL220 2N6073A TO-22550960014SBN GDL SBN 0TL220 2N6075A TO-22550960017SBN GDL SBN 0TL220 2N6075A TO-22550960018SBN GDL SBN 0TL220 2N6075A TO-22550960020SBN GDL SBN 0TL220 2N6075A TO-22550960021SBN GDL SBN 0TL220 2N6075A TO-22550960016SBN GDL SBN 0TL220 2N6075B TO-22550960002SBN GDL SBN 0TL236 C106D TO-22550960003SBN GDL SBN 0TL236 C106D TO-22550960004SBN GDL SBN 0TL236 C106D TO-22550960005SBN GDL SBN 0TL236 C106D1 TO-22550960006SBN GDL SBN 0TL236 C106D TO-22550960007SBN GDL SBN 0TL236 C106D TO-22550960008SBN GDL SBN 0TL236 C106M1 TO-22550960009SBN GDL SBN 0TL236 C106D TO-22550960010SBN GDL SBN 0TL236 C106D TO-22550960011SBN GDL SBN 0TL236 C106D1 TO-22550960012SBN GDL SBN 0TL236 C106M TO-22550960001SBN GDL SBN 0TL236 C106D1 TO-22550960013SBN GDL SBN 0TL236 C106D TO-22550960025SBN GDL SBN 0TL236 C106B TO-22550960023SBN GDL SBN 0TL236 C106D1 TO-22550960022SBN GDL SBN 0TL236 C106M1 TO-22550960026SBN GDL SBN 0TL236 C106M1 TO-22550960018SBN GDL SBN 0TL236 C106D1 TO-22550960020SBN GDL SBN 0TL236 C106D1 TO-22550960021SBN GDL SBN 0TL236 C106D1 TO-22550960016SBN GDL SBN 0TL236 C106M1 TO-22550960019SBN GDL SBN 0TL236 C106M1 TO-22550960017SBN GDL SBN 0TL238 mcr106-006 TO-22550960015SBN GDL SBN 0TL220 2N6071A TO-225

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

4655360 196.870 5079494235200 55Low Current2000 494.591 202187324502208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - Low Current

Test Conditions:

501200015GDL PHX GDL 0TL186 MKP1V130RL Surmetic-30

ON SemiconductorReliability Audit Report 102000

Page 21: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

501200005GDL PHX GDL 0TL197 MKP3V120 Case-267501200013GDL GDL GDL 0TL160 MKP9V160RL Surmetic-30501200023GDL PHX GDL 0TL160 MKP9V160RL Surmetic-30501200008GDL GDL GDL 0TL196 SK2P102RL Surmetic-30501200012GDL GDL GDL 0TL1401 SK2V1401 SSOVP501200013GDL GDL GDL 0TL1401 SK2V1401 SSOVP501200011GDL GDL GDL 0TL1401 SK2V1401-001 SSOVP501200023GDL GDL GDL 0TL1401 SK2V1401-001 SSOVP50960006SBN SBN SBN 0TL367 MCR08BT1 SOT-22350960007SBN GDL SBN 0TL220 2N6073B TO-22550960003SBN GDL SBN 0TL220 SAC895LFVP TO-22550960002SBN GDL SBN 0TL220 2N6075A TO-22550960004SBN GDL SBN 0TL220 2N6075A TO-22550960006SBN GDL SBN 0TL220 2N6075A TO-22550960005SBN GDL SBN 0TL220 2N6075A TO-22550960008SBN GDL SBN 0TL220 2N6075A TO-22550960009SBN GDL SBN 0TL220 2N6075A TO-22550960010SBN GDL SBN 0TL220 2N6073B TO-22550960011SBN GDL SBN 0TL220 2N6075A TO-22550960012SBN GDL SBN 0TL220 2N6073A TO-22550960013SBN GDL SBN 0TL220 2N6073B TO-22550960001SBN GDL SBN 0TL220 2N6071A TO-22550960022SBN GDL SBN 0TL220 2N6073B TO-22550960023SBN GDL SBN 0TL220 2N6075A TO-22550960024SBN GDL SBN 0TL220 2N6075A TO-22550960025SBN GDL SBN 0TL220 2N6075A TO-22550960026SBN GDL SBN 0TL220 2N6075A TO-22550960019SBN GDL SBN 0TL220 2N6073A TO-22550960014SBN GDL SBN 0TL220 2N6075A TO-22550960017SBN GDL SBN 0TL220 2N6075A TO-22550960018SBN GDL SBN 0TL220 2N6075A TO-22550960020SBN GDL SBN 0TL220 2N6075A TO-22550960021SBN GDL SBN 0TL220 2N6075A TO-22550960016SBN GDL SBN 0TL220 2N6075B TO-22550960002SBN GDL SBN 0TL236 C106D TO-22550960003SBN GDL SBN 0TL236 C106D TO-22550960004SBN GDL SBN 0TL236 C106D TO-22550960005SBN GDL SBN 0TL236 C106D1 TO-22550960006SBN GDL SBN 0TL236 C106D TO-22550960007SBN GDL SBN 0TL236 C106D TO-22550960008SBN GDL SBN 0TL236 C106M1 TO-22550960009SBN GDL SBN 0TL236 C106D TO-22550960010SBN GDL SBN 0TL236 C106D TO-22550960011SBN GDL SBN 0TL236 C106D1 TO-22550960012SBN GDL SBN 0TL236 C106M TO-22550960001SBN GDL SBN 0TL236 C106D1 TO-22550960013SBN GDL SBN 0TL236 C106D TO-225

ON SemiconductorReliability Audit Report 112000

Page 22: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

50960025SBN GDL SBN 0TL236 C106B TO-22550960023SBN GDL SBN 0TL236 C106D1 TO-22550960022SBN GDL SBN 0TL236 C106M1 TO-22550960026SBN GDL SBN 0TL236 C106M1 TO-22550960018SBN GDL SBN 0TL236 C106D1 TO-22550960020SBN GDL SBN 0TL236 C106D1 TO-22550960021SBN GDL SBN 0TL236 C106D1 TO-22550960016SBN GDL SBN 0TL236 C106M1 TO-22550960019SBN GDL SBN 0TL236 C106M1 TO-22550960017SBN GDL SBN 0TL238 mcr106-006 TO-22550960019SBN PHX SBN 0TL278A MCR708AT4 DPAK50960025SBN PHX SBN 0TL381 MAC08MT1 SOT-22350960012SBN GDL SBN 0TLL1311 SMT10B310T3 SMB50960005SBN GDL SBN 0TLL1330 SMT05B330NT3 SMB50960010SBN GDL SBN 0TLL1330 SMT10002T3 SMB50960022SBN GDL SBN 0TLL1330 SMT05B330NT3 SMB50960015SBN GDL SBN 0TL220 2N6071A TO-225

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

83676694 10.953 91299187322800 55Low Current2000 27.517 3634117132502208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - LV Planar

Test Conditions:

5010000008PSI - PSI 0PLC3520 MJD200T4 DPAK5010000037PSI - PSI 0PLC3520 MJD200T4 DPAK5010000029PSI - PSI 0PLC3521 MJD210RL DPAK5010000009PSI - PSI 0PLC3521 MJD210T4 DPAK5010000014PSI - PSI 0PLC3521 MJD210T4 DPAK5010000020PSI - PSI 0PLC3521 MJD210T4 DPAK5010000028PSI - PSI 0PLC3521 MJD210T4 DPAK5010000004PSI - PSI 0PLC3524 MJD243T4 DPAK5010000021PSI - PSI 0PLC3524 MJD243T4 DPAK5010000006PSI - PSI 0PLC3536 MJD340T4 DPAK5010000024PSI - PSI 0PLC3536 MJD340T4 DPAK5010000003PSI - PSI 0PLC3535 MJD350T4 DPAK5010000031PSI - PSI 0PLC3535 MJD350T4 DPAK5010000036PSI - PSI 0PLC3535 MJD350T4 DPAK5010000038PSI - PSI 0PLC3535 MJD350T4 DPAK5010000011PSI - PSI 0PLC3070 MJD44H11T4 DPAK5010000018PSI - PSI 0PLC3535 SJD1033T4 DPAK50960005SBN SBN SBN 0PLJ6521 MMJT9435T3 SOT-22350960023SBN SBN SBN 0PLJ6521 MMJT9435T3 SOT-22350960014SBN SBN SBN 0PLJ6521 MMJT9435T3 SOT-22350960021SBN SBN SBN 0PLJ6521 MMJT9435T3 SOT-22350960011SBN PHX SBN 0PLC3016 SJD1041T4 DPAK

ON SemiconductorReliability Audit Report 122000

Page 23: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

50960016SBN PHX SBN 0PLC3070 MJD44H11T4 DPAK50960019SBN PHX SBN 0PLC3070 SJD1031T4 DPAK50960014SBN PHX SBN 0PLC3070 SJD1031T4 DPAK50960001SBN PHX SBN 0PLC3071 SJD1035T4 DPAK50960020SBN PHX SBN 0PLC3521 MJD210RL DPAK50960012SBN PHX SBN 0PLC3536 MJD340T4 DPAK50960018SBN PHX SBN 0PLE021P MJE210 TO-22550960002SBN PHX SBN 0PLE022P MJE182 TO-22550960009SBN PHX SBN 0PLE036P MJE340 TO-22550960020SBN PHX SBN 0PLE036P MJE340 TO-225

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

239002205 3.835 260756193922000 55LV Planar2000 9.634 10379904516002208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Forward BiasTa = +100°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - Medium Current

Test Conditions:

501200011GDL GDL GDL 0TL672 2N6405 TO-220501200013GDL GDL GDL 0TL672 2N6405 TO-220501200006GDL GDL GDL 0TL672 2N6509 TO-220501200015GDL GDL GDL 0TL672 2N6509 TO-220501200007GDL GDL GDL 0TL807 MAC12D TO-220501200002GDL GDL GDL 0TL807 MAC12M TO-220501200004GDL GDL GDL 0TL807 MAC12M TO-220501200005GDL GDL GDL 0TL807 MAC12M TO-220501200006GDL GDL GDL 0TL807 MAC12M TO-220501200009GDL GDL GDL 0TL807 MAC12M TO-220501200012GDL GDL GDL 0TL807 MAC12M TO-220501200014GDL GDL GDL 0TL807 MAC12M TO-220501200015GDL GDL GDL 0TL807 MAC12M TO-220501200017GDL GDL GDL 0TL807 MAC12M TO-220501200025GDL GDL GDL 0TL807 MAC12M TO-220501200023GDL GDL GDL 0TL807 MAC12N TO-220501200017GDL GDL GDL 0TL781 MAC15A6FP TO-220-ISO501200008GDL GDL GDL 0TL981 MAC15A8 TO-220501200009GDL GDL GDL 0TL781 MAC15A8FP TO-220-ISO501200016GDL GDL GDL 0TL816 MAC15M TO-220501200020GDL GDL GDL 0TL816 MAC15M TO-220501200024GDL GDL GDL 0TL816 MAC15M TO-220501200011GDL GDL GDL 0TL817 MAC16N TO-220501200002GDL GDL GDL 0TL985 MAC223A10 TO-220501200025GDL GDL GDL 0TL785 MAC223A10FP TO-220-ISO501200006GDL GDL GDL 0TL785 MAC223A6FP TO-220-ISO501200002GDL GDL GDL 0TL785 MAC223A8FP TO-220-ISO501200013GDL GDL GDL 0TL785 MAC223A8FP TO-220-ISO501200007GDL GDL GDL 0TL990 MAC224A8 TO-220

ON SemiconductorReliability Audit Report 132000

Page 24: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

501200014GDL GDL GDL 0TL990 MAC224A8 TO-220501200016GDL GDL GDL 0TL990 MAC224A8 TO-220501200010GDL GDL GDL 0TL809 MAC9D TO-220501200003GDL GDL GDL 0TL617 MCR12LD TO-220501200013GDL GDL GDL 0TL617 MCR12LD TO-220501200023GDL GDL GDL 0TL470 MCR218-6FP TO-220-ISO501200015GDL GDL GDL 0TL472 MCR225-8FP TO-220-ISO501200018GDL GDL GDL 0TL625 MCR25D TO-220501200009GDL GDL GDL 0TL685 MCR264-006 TO-220501200003GDL GDL GDL 0TL690 MCR265-010 TO-220501200005GDL GDL GDL 0TL690 MCR265-010 TO-220501200023GDL GDL GDL 0TL690 MCR265-010 TO-220501200021GDL GDL GDL 0TL675 MCR72-008 TO-220501200021GDL GDL GDL 0TL675 MCR72-008 TO-220501200025GDL GDL GDL 0TL675 MCR72-008 TO-220501200001GDL GDL GDL 0TL606 MCR8SD TO-220501200018GDL GDL GDL 0TL981L SAC319M TO-220501200019GDL GDL GDL 0TL672S SCR1989 TO-220501200002GDL GDL GDL 0TL673A SCR2146A TO-220501200003GDL GDL GDL 0TL673A SCR2146A TO-220501200004GDL GDL GDL 0TL673A SCR2146A TO-220501200005GDL GDL GDL 0TL673A SCR2146A TO-220501200006GDL GDL GDL 0TL673A SCR2146A TO-220501200007GDL GDL GDL 0TL673A SCR2146A TO-220501200008GDL GDL GDL 0TL673A SCR2146A TO-220501200010GDL GDL GDL 0TL673A SCR2146A TO-220501200011GDL GDL GDL 0TL673A SCR2146A TO-220501200013GDL GDL GDL 0TL673A SCR2146A TO-220501200014GDL GDL GDL 0TL673A SCR2146A TO-220501200015GDL GDL GDL 0TL673A SCR2146A TO-220501200016GDL GDL GDL 0TL673A SCR2146A TO-220501200017GDL GDL GDL 0TL673A SCR2146A TO-220501200019GDL GDL GDL 0TL673A SCR2146A TO-220501200020GDL GDL GDL 0TL673A SCR2146A TO-220501200021GDL GDL GDL 0TL673A SCR2146A TO-220501200023GDL GDL GDL 0TL673A SCR2146A TO-220501200023GDL GDL GDL 0TL673A SCR2146A TO-220501200025GDL GDL GDL 0TL673A SCR2146A TO-220501200014GDL GDL GDL 0TL672A SCR2149ALFCG TO-220501200015GDL GDL GDL 0TL672A SCR2149ALFCG TO-220501200017GDL GDL GDL 0TL672A SCR2149ALFCG TO-220501200018GDL GDL GDL 0TL672A SCR2149ALFCG TO-220501200019GDL GDL GDL 0TL672A SCR2149ALFCG TO-220501200020GDL GDL GDL 0TL672A SCR2149ALFCG TO-220501200012GDL GDL GDL 0TL472S SCR2159 TO-220-ISO501200019GDL GDL GDL 0TL472S SCR2159 TO-220-ISO501200024GDL GDL GDL 0TL986S T2500D TO-220

ON SemiconductorReliability Audit Report 142000

Page 25: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

501200008GDL GDL GDL 0TL816 TP00256 TO-220MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

9144458 100.225 9977551462000 55Medium Current2000 251.792 397153238502208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - Medium Current

Test Conditions:

501200011GDL GDL GDL 0TL672 2N6405 TO-220501200013GDL GDL GDL 0TL672 2N6405 TO-220501200006GDL GDL GDL 0TL672 2N6509 TO-220501200015GDL GDL GDL 0TL672 2N6509 TO-220501200007GDL GDL GDL 0TL807 MAC12D TO-220501200002GDL GDL GDL 0TL807 MAC12M TO-220501200004GDL GDL GDL 0TL807 MAC12M TO-220501200005GDL GDL GDL 0TL807 MAC12M TO-220501200006GDL GDL GDL 0TL807 MAC12M TO-220501200009GDL GDL GDL 0TL807 MAC12M TO-220501200012GDL GDL GDL 0TL807 MAC12M TO-220501200014GDL GDL GDL 0TL807 MAC12M TO-220501200015GDL GDL GDL 0TL807 MAC12M TO-220501200017GDL GDL GDL 0TL807 MAC12M TO-220501200025GDL GDL GDL 0TL807 MAC12M TO-2205010000021PSI - PSI 0TL807 MAC12M TO-2205010000029PSI - PSI 0TL807 MAC12M TO-220501200023GDL GDL GDL 0TL807 MAC12N TO-220501200017GDL GDL GDL 0TL781 MAC15A6FP TO-220-ISO501200008GDL GDL GDL 0TL981 MAC15A8 TO-220501200009GDL GDL GDL 0TL781 MAC15A8FP TO-220-ISO501200016GDL GDL GDL 0TL816 MAC15M TO-220501200020GDL GDL GDL 0TL816 MAC15M TO-220501200024GDL GDL GDL 0TL816 MAC15M TO-220501200021GDL GDL GDL 0TL817 MAC16M TO-220501200011GDL GDL GDL 0TL817 MAC16N TO-220501200002GDL GDL GDL 0TL985 MAC223A10 TO-220501200025GDL GDL GDL 0TL785 MAC223A10FP TO-220-ISO501200006GDL GDL GDL 0TL785 MAC223A6FP TO-220-ISO501200002GDL GDL GDL 0TL785 MAC223A8FP TO-220-ISO501200013GDL GDL GDL 0TL785 MAC223A8FP TO-220-ISO501200007GDL GDL GDL 0TL990 MAC224A8 TO-220501200014GDL GDL GDL 0TL990 MAC224A8 TO-220501200016GDL GDL GDL 0TL990 MAC224A8 TO-2205010000009PSI - PSI 0TL808 MAC8D TO-2205010000037PSI - PSI 0TL808 MAC8M TO-2205010000017PSI - PSI 0TL808 MAC8N TO-220501200010GDL GDL GDL 0TL809 MAC9D TO-220

ON SemiconductorReliability Audit Report 152000

Page 26: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

501200003GDL GDL GDL 0TL617 MCR12LD TO-220501200013GDL GDL GDL 0TL617 MCR12LD TO-220501200023GDL GDL GDL 0TL470 MCR218-6FP TO-220-ISO501200015GDL GDL GDL 0TL472 MCR225-8FP TO-220-ISO501200018GDL GDL GDL 0TL625 MCR25D TO-220501200009GDL GDL GDL 0TL685 MCR264-006 TO-220501200003GDL GDL GDL 0TL690 MCR265-010 TO-220501200005GDL GDL GDL 0TL690 MCR265-010 TO-220501200023GDL GDL GDL 0TL690 MCR265-010 TO-220501200021GDL GDL GDL 0TL675 MCR72-008 TO-220501200021GDL GDL GDL 0TL675 MCR72-008 TO-220501200025GDL GDL GDL 0TL675 MCR72-008 TO-220501200018GDL GDL GDL 0TL981L SAC319M TO-220501200019GDL GDL GDL 0TL672S SCR1989 TO-220501200002GDL GDL GDL 0TL673A SCR2146A TO-220501200003GDL GDL GDL 0TL673A SCR2146A TO-220501200004GDL GDL GDL 0TL673A SCR2146A TO-220501200005GDL GDL GDL 0TL673A SCR2146A TO-220501200006GDL GDL GDL 0TL673A SCR2146A TO-220501200007GDL GDL GDL 0TL673A SCR2146A TO-220501200008GDL GDL GDL 0TL673A SCR2146A TO-220501200010GDL GDL GDL 0TL673A SCR2146A TO-220501200011GDL GDL GDL 0TL673A SCR2146A TO-220501200013GDL GDL GDL 0TL673A SCR2146A TO-220501200014GDL GDL GDL 0TL673A SCR2146A TO-220501200015GDL GDL GDL 0TL673A SCR2146A TO-220501200016GDL GDL GDL 0TL673A SCR2146A TO-220501200017GDL GDL GDL 0TL673A SCR2146A TO-220501200019GDL GDL GDL 0TL673A SCR2146A TO-220501200020GDL GDL GDL 0TL673A SCR2146A TO-220501200021GDL GDL GDL 0TL673A SCR2146A TO-220501200023GDL GDL GDL 0TL673A SCR2146A TO-220501200023GDL GDL GDL 0TL673A SCR2146A TO-220501200025GDL GDL GDL 0TL673A SCR2146A TO-220501200014GDL GDL GDL 0TL672A SCR2149ALFCG TO-220501200015GDL GDL GDL 0TL672A SCR2149ALFCG TO-220501200017GDL GDL GDL 0TL672A SCR2149ALFCG TO-220501200018GDL GDL GDL 0TL672A SCR2149ALFCG TO-220501200019GDL GDL GDL 0TL672A SCR2149ALFCG TO-220501200020GDL GDL GDL 0TL672A SCR2149ALFCG TO-220501200012GDL GDL GDL 0TL472S SCR2159 TO-220-ISO501200019GDL GDL GDL 0TL472S SCR2159 TO-220-ISO501200024GDL GDL GDL 0TL986S T2500D TO-220501200008GDL GDL GDL 0TL816 TP00256 TO-22050960016SBN PHX SBN 0TL606D MCR8DSMT4 DPAK

ON SemiconductorReliability Audit Report 162000

Page 27: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

185809957 4.932 202757502716800 55Medium Current2000 12.392 8069722441502208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - Open Junction

Test Conditions:

801008 -Lite-OnS f l

Vishay(K)

PHX 0RLLA4007 MRA4007T3 SMA801008 -Lite-On

S f lVishay

(K)PHX 0RLLA4007 MRA4007T3 SMA

801008 -Lite-OnS f l

Vishay(K)

PHX 0RLLA4007 MRA4007T3 SMA501200001GDL TLS GDL 0RL840 MR2504 Case-193501200002GDL TLS GDL 0RL840 MR2504 Case-193501200003GDL TLS GDL 0RL840 MR2504 Case-193501200004GDL TLS GDL 0RL840 MR2504 Case-193501200006GDL TLS GDL 0RL840 MR2504 Case-193501200015GDL TLS GDL 0RL840 MR2504 Case-193501200016GDL TLS GDL 0RL840 MR2504 Case-193501200025GDL PHX GDL 0RL601M MR750 Case-194501200017GDL PHX GDL 0RL601M MR751 Case-194501200018GDL PHX GDL 0RL601M MR751 Case-194501200020GDL PHX GDL 0RL601M MR751 Case-194501200026GDL PHX GDL 2RL601M MR751RL Case-194501200005GDL PHX GDL 0RL601M MR752RL Case-194501200007GDL PHX GDL 0RL601M MR754 Case-194501200014GDL PHX GDL 1RL601M MR754 Case-194501200023GDL PHX GDL 0RL601M MR754 Case-194501200024GDL PHX GDL 0RL601M MR754 Case-194501200002GDL PHX GDL 0RL602M MR760 Case-194501200003GDL PHX GDL 1RL602M MR760 Case-194501200005GDL PHX GDL 0RL602M MR760 Case-194501200006GDL PHX GDL 0RL602M MR760 Case-194501200009GDL PHX GDL 0RL602M MR760 Case-194501200011GDL PHX GDL 0RL602M MR760 Case-194501200013GDL PHX GDL 0RL602M MR760RL Case-194501200019GDL TLS GDL 0RL689 SR3980 Case-193501200017GDL TLS GDL 0RL689 SR4389 Case-193501200024GDL TLS GDL 0RL689 SR4389 Case-193501200025GDL TLS GDL 0RL689 SR4389 Case-193501200009GDL PHX GDL 0RL604C SR4480 Case-339501200011GDL PHX GDL 0RL605C SR4491 Case-339501200004GDL PHX GDL 0RL600M SR751B Case-194

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

110926056 47.207 21183299427920 55Open Junction2000 72.062 1387693917902208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

4Rej.

ON SemiconductorReliability Audit Report 172000

Page 28: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

High Temperature Reverse BiasTa = +125°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - Schottky Rectifier

Test Conditions:

451680001Liteon - Liteon 0RLL754S MBRS140T3 SMB485000001Liteon - Liteon 0RLL754S MBRS140T3 SMB451680005Liteon - Liteon 0RLL754S MBRS140T3 SMB451680008Liteon - Liteon 0RLL754S MBRS140T3 SMB451680013Liteon - Liteon 0RLL754S MBRS140T3 SMB4510000013Liteon - Liteon 0RLL754S MBRS140T3 SMB465000013Liteon - Liteon 0RLL754S MBRS140T3 SMB451680017Liteon - Liteon 0RLL754S MBRS140T3 SMB451680021Liteon - Liteon 0RLL754S MBRS140T3 SMB451680026Liteon - Liteon 0RLL754S MBRS140T3 SMB451680030Liteon - Liteon 0RLL754S MBRS140T3 SMB451680034Liteon - Liteon 0RLL754S MBRS140T3 SMB451680001Liteon - Liteon 0RLLA140 SBRA140T3 SMA485000001Liteon - Liteon 0RLLA140 SBRA140T3 SMA451680005Liteon - Liteon 0RLLA140 SBRA140T3 SMA451680008Liteon - Liteon 0RLLA140 SBRA140T3 SMA451680013Liteon - Liteon 0RLLA140 SBRA140T3 SMA4510000013Liteon - Liteon 0RLLA140 SBRA140T3 SMA465000013Liteon - Liteon 0RLLA140 SBRA140T3 SMA451680017Liteon - Liteon 0RLLA140 SBRA140T3 SMA451680021Liteon - Liteon 0RLLA140 SBRA140T3 SMA451680026Liteon - Liteon 0RLLA140 SBRA140T3 SMA451680030Liteon - Liteon 0RLLA140 SBRA140T3 SMA451680034Liteon - Liteon 0RLLA140 SBRA140T3 SMA

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

24855662 36.873 27120115320080 55Schottky Rectifier2000 92.635 1079505610882208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - Schottky Rectifier

Test Conditions:

8010089936PSI Z/R PHX 0T0977W MBR7030WT TO-2478010089936Stm (S) Z/R PHX 0T0977W MBR7030WT TO-247501200024GDL PHX GDL 0RL956 1N5817 Surmetic-30501200024GDL PHX GDL 0RL754A 1N5819RL Surmetic-30501200025GDL PHX GDL 0RL935E MBR1045 TO-220501200025GDL PHX GDL 0RL973E MBR20100CT TO-220501200024GDL PHX GDL 0RL946 MBR2045CT TO-220501200026GDL PHX GDL 0RL946 MBR2045CT TO-220501200015GDL PHX GDL 0RL786 MBRP60035CTL Case-357C501200026GDL PHX GDL 0RL8755 SBR5442RLC Case-26750960024SBN PHX SBN 0RLD735A MBRD330RL DPAK

ON SemiconductorReliability Audit Report 182000

Page 29: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

50960014SBN PHX SBN 0RLD735A MBRD350RL DPAK50960013SBN PHX SBN 0RLD745 MBRD650CTT4 DPAK50960025SBN PHX SBN 0RLD8745 SBRD111T4 DPAK50960002SBN PHX SBN 0RLD924 MBRD835L DPAK50960011SBN PHX SBN 0RLD924 MBRD835L DPAK50960026SBN PHX SBN 0RLD924 MBRD835L DPAK50960016SBN GDL SBN 0RLL765S MBRS360T3 SMC50960001SBN PHX SBN 0RLL708S MBRS2040LT3 SMB50960002SBN PHX SBN 0RLL8754S SBRS5598T3 SMB50960005SBN PHX SBN 0RLL8754S SBRS5641T3 SMB50960008SBN PHX SBN 0RLL8754S SBRS5641T3 SMB50960020SBN GDL SBN 0RLL754S MBRS140T3 SMB50960001SBN PHX SBN 0RLL755S MBRS340T3 SMC50960006SBN PHX SBN 0RLL755S MBRS340T3 SMC50960008SBN PHX SBN 0RLL755S MBRS340T3 SMC50960009SBN PHX SBN 0RLL755S MBRS340T3 SMC50960012SBN PHX SBN 0RLL755S MBRS340T3 SMC50960014SBN GDL SBN 0RLL755S MBRS340T3 SMC50960018SBN GDL SBN 0RLL755S MBRS340T3 SMC50960021SBN GDL SBN 0RLL755S MBRS340T3 SMC50960024SBN GDL SBN 0RLL755S MBRS340T3 SMC50960026SBN GDL SBN 0RLL755S MBRS340T3 SMC50960005SBN PHX SBN 0RLL765S MBRS360T3 SMC50960013SBN PHX SBN 0RLL765S MBRS360T3 SMC50960020SBN GDL SBN 0RLL765S MBRS360T3 SMC50960010SBN PHX SBN 0RLL766S MBRS1100T3 SMB50960021SBN GDL SBN 0RLL766S SBRS5636-7T3 SMB50960011SBN PHX SBN 0RLL8754S SBRS5641T3 SMB50960015SBN GDL SBN 0RLL8754S SBRS5598T3 SMB50960023SBN GDL SBN 0RLL8754S SBRS5598T3 SMB50960025SBN GDL SBN 0RLL8755S SBRS5652T3 SMC50960019SBN GDL SBN 0RLL8755S SBRS8340T3 SMC50960026SBN GDL SBN 0RLL8756L SBRS8130LT3 SMB50960025SBN GDL SBN 0RLL8756S SBRS5654T3 SMB50960018SBN GDL SBN 0RLL8766S SBRS81100T3 SMB50960009SBN PHX SBN 0RLL955S MBRS240LT3 SMB50960012SBN PHX SBN 0RLL955S MBRS240LT3 SMB50960021SBN GDL SBN 0RLM712 MBRM120ET3 Case-45750960018SBN GDL SBN 0RLM756S MBRM120LT3 Case-45750960020SBN GDL SBN 0RLM756S SBRM120LT3 Case-45750960001SBN PHX SBN 0RLM712 MBRM120ET3 Case-45750960002SBN PHX SBN 0RLM712 MBRM120ET3 Case-45750960005SBN PHX SBN 0RLM712 MBRM120ET3 Case-45750960009SBN PHX SBN 0RLM712 MBRM120ET3 Case-45750960012SBN PHX SBN 0RLM712 MBRM120ET3 Case-45750960022SBN GDL SBN 0RLM712 MBRM120ET3 Case-45750960023SBN GDL SBN 0RLM712 MBRM120ET3 Case-457

ON SemiconductorReliability Audit Report 192000

Page 30: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

50960003SBN PHX SBN 0RLM754S MBRM140T3 Case-45750960013SBN PHX SBN 0RLM754S MBRM140T3 Case-45750960015SBN GDL SBN 0RLM754S MBRM140T3 Case-45750960007SBN PHX SBN 0RLM756S MBRM120LT3 Case-45750960004SBN PHX SBN 0RLM756S SBRM120LT3 Case-45750960006SBN PHX SBN 0RLM756S SBRM120LT3 Case-45750960008SBN PHX SBN 0RLM756S SBRM120LT3 Case-45750960010SBN PHX SBN 0RLM756S SBRM120LT3 Case-45750960011SBN PHX SBN 0RLM756S SBRM120LT3 Case-45750960016SBN GDL SBN 0RLM756S MBRM120LT3 Case-45750960019SBN GDL SBN 0RLM756S MBRM120LT3 Case-45750960024SBN GDL SBN 0RLM756S MBRM120LT3 Case-45750960025SBN GDL SBN 0RLM756S MBRM120LT3 Case-45750960014SBN GDL SBN 0RLM756S SBRM120LT3 Case-45750960017SBN GDL SBN 0RLM756S SBRM120LT3 Case-45750960026SBN GDL SBN 0RLM756S SBRM120LT3 Case-45750960016SBN GDL SBN 0RLS951 MBR0520LT3 SOD-12350960007SBN PHX SBN 0RLS951 MBR0520LT1 SOD-12350960004SBN PHX SBN 0RLS951 MBR0520LT3 SOD-12350960019SBN GDL SBN 0RLS951 MBR0520LT3 SOD-12350960025SBN GDL SBN 0RLS951 MBR0520LT3 SOD-12350960003SBN PHX SBN 0RLS967 MBR0530T1 SOD-12350960010SBN PHX SBN 0RLS967 MBR0530T1 SOD-12350960013SBN PHX SBN 0RLS967 MBR0530T1 SOD-12350960022SBN GDL SBN 0RLS967 MBR0530T1 SOD-123

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

145081078 6.317 158302992559680 55Schottky Rectifier2000 15.870 6301197242102208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

Steady State Operating LifeTa = +25°C, Tj = 150°C, Pd = 100%

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - Schottky Rectifier

Test Conditions:

451680001Liteon - Liteon 0RLL754S MBRS140T3 SMB465000001Liteon - Liteon 0RLL754S MBRS140T3 SMB4710000001Liteon - Liteon 0RLL754S MBRS140T3 SMB451680005Liteon - Liteon 0RLL754S MBRS140T3 SMB451680008Liteon - Liteon 0RLL754S MBRS140T3 SMB451680013Liteon - Liteon 0RLL754S MBRS140T3 SMB451680017Liteon - Liteon 0RLL754S MBRS140T3 SMB451680021Liteon - Liteon 0RLL754S MBRS140T3 SMB451680026Liteon - Liteon 0RLL754S MBRS140T3 SMB451680030Liteon - Liteon 0RLL754S MBRS140T3 SMB451680034Liteon - Liteon 0RLL754S MBRS140T3 SMB451680001Liteon - Liteon 0RLLA140 SBRA140T3 SMA465000001Liteon - Liteon 0RLLA140 SBRA140T3 SMA4710000001Liteon - Liteon 0RLLA140 SBRA140T3 SMA

ON SemiconductorReliability Audit Report 202000

Page 31: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

451680005Liteon - Liteon 0RLLA140 SBRA140T3 SMA451680008Liteon - Liteon 0RLLA140 SBRA140T3 SMA451680013Liteon - Liteon 0RLLA140 SBRA140T3 SMA451680017Liteon - Liteon 0RLLA140 SBRA140T3 SMA451680021Liteon - Liteon 0RLLA140 SBRA140T3 SMA451680026Liteon - Liteon 0RLLA140 SBRA140T3 SMA451680030Liteon - Liteon 0RLLA140 SBRA140T3 SMA451680034Liteon - Liteon 0RLLA140 SBRA140T3 SMA

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

71565866 12.806 78088396276080 55Schottky Rectifier2000 32.173 310819639962208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - Switching Diodes

Test Conditions:

50960006SBN SBN SBN 0XD289 MMSD4148T1 SOD-12350960009SBN SBN SBN 0XD289 MMSD4148T1 SOD-12350960012SBN SBN SBN 0XD289 MMSD914T1 SOD-12350960015SBN PHX SBN 0XD289 MMSD4148T1 SOD-12350960021SBN PHX SBN 0XD289 MMSD4148T1 SOD-12350960024SBN PHX SBN 0XD289 MMSD4148T1 SOD-12350960018SBN GDL SBN 0XD289 MMSD4148T1 SOD-123

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

8709842 105.226 950335533600 55Switching Diodes2000 264.356 37827783502208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - Ultrafast

Test Conditions:

501200025GDL PHX GDL 0RL517 MUR110 Surmetic-30501200026GDL PHX GDL 0RL644E MUR1100E Surmetic-30501200022GDL GDL GDL 0RL644E MUR1100ERL Surmetic-30501200024GDL PHX GDL 0RL517 MUR115RL Surmetic-30501200025GDL PHX GDL 0RL518 MUR160RL Surmetic-30501200026GDL PHX GDL 0RL518 MUR160RL Surmetic-30501200026GDL PHX GDL 0RL537 MUR420 Case-267501200025GDL PHX GDL 0RL538 MUR460RL Case-267501200024GDL PHX GDL 0RL310E MUR820 TO-220501200026GDL PHX GDL 0RL310E MUR820 TO-220501200011GDL PHX GDL 0RLP452 MURP20020CT Case-357C501200009GDL PHX GDL 0RLP454 MURP20040CT Case-357C501200024GDL PHX GDL 0RL8538 SUR259RL Case-26750960006SBN PHX SBN 0RLD410 MURD310T4 DPAK50960012SBN PHX SBN 0RLD410 MURD320T4 DPAK50960021SBN PHX SBN 0RLD410 MURD310T4 DPAK50960017SBN PHX SBN 0RLD410 MURD320T4 DPAK

ON SemiconductorReliability Audit Report 212000

Page 32: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

50960020SBN PHX SBN 0RLD410 MURD320T4 DPAK50960001SBN PHX SBN 0RLD417 MURD620CTT4 DPAK50960003SBN PHX SBN 0RLD417 MURD620CTT4 DPAK50960004SBN PHX SBN 0RLD417 MURD620CTT4 DPAK50960007SBN PHX SBN 0RLD417 MURD620CTT4 DPAK50960008SBN PHX SBN 0RLD417 MURD620CT DPAK50960009SBN PHX SBN 0RLD417 SURD109-4T4 DPAK50960023SBN PHX SBN 0RLD417 MURD620CTT4 DPAK50960018SBN PHX SBN 0RLD417 MURD620CT DPAK50960007SBN PHX SBN 0RLL8517S SURS283T3-001 SMB50960003SBN PHX SBN 0RLL8517S SURS5644T3 SMB50960014SBN GDL SBN 0RLL517S MURS120T3 SMB50960025SBN GDL SBN 0RLL517S MURS120T3 SMB50960025SBN GDL SBN 0RLL517S MURS120T3 SMB50960006SBN PHX SBN 0RLL518S MURS160T3 SMB50960004SBN PHX SBN 0RLL518S MURS160T3 SMB50960013SBN PHX SBN 0RLL518S SURS5630-2T3 SMB50960016SBN GDL SBN 0RLL518S MURS140T3 SMB50960019SBN GDL SBN 0RLL518S MURS160T3 SMB50960024SBN GDL SBN 0RLL518S MURS160T3 SMB50960010SBN PHX SBN 0RLL537S MURS320T3 SMC50960011SBN PHX SBN 0RLL537S MURS320T3 SMC50960002SBN PHX SBN 0RLL8537S SURS5648T3 SMC50960004SBN PHX SBN 0RLL8537S SURS5648T3 SMC50960022SBN GDL SBN 0RLL537S MURS320T3 SMC50960015SBN GDL SBN 0RLL537S MURS320T3 SMC50960017SBN GDL SBN 0RLL8537S SURS5648T3 SMC50960007SBN PHX SBN 0RLL538S MURS340T3 SMC50960003SBN PHX SBN 0RLL8538S SURS5668T3 SMC50960017SBN GDL SBN 0RLL8517S SURS239T3 SMB50960022SBN GDL SBN 0RLL8517S SURS5644T3 SMB50960023SBN GDL SBN 0RLL8537S SURS5648T3 SMC

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

65012747 14.097 70937079250800 55Ultrafast2000 35.416 2823582624502208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Bipolar Discrete - Zener Diodes

Test Conditions:

841008 -Leshan(LPS)

Z/R PHX 0MB6V2AL2 MMBZ6V2ALT1 SOT-23841008 -Leshan

(LPS)Z/R PHX 0MB6V2AL2 MMBZ6V2ALT1 SOT-23

841008 -Leshan(LPS)

Z/R PHX 0MB6V2AL2 MMBZ6V2ALT1 SOT-23841008CONTROLLeshan

(LPS)Z/R PHX 0MB6V2AL2 MMBZ6V2ALT1 SOT-23

781008n/aSmp Z/R PHX 0ZK6V1QA MSQA6V1W5T2 SC-88A781008n/aSmp Z/R PHX 0ZK6V1QA MSQA6V1W5T2 SC-88A781008n/aSmp Z/R PHX 0ZK6V1QA MSQA6V1W5T2 SC-88A

ON SemiconductorReliability Audit Report 222000

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Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

501200010GDL PHX GDL 0ZL18435 1.5KE150CA Case-41501200023GDL PHX GDL 0ZL18215 1.5KE18CA Case-41501200018GDL PHX GDL 0ZL18250 1.5KE27A Case-41501200020GDL PHX GDL 0ZL18250 1.5KE27A Case-41501200022GDL PHX GDL 0ZL18250 1.5KE27A Case-41501200013GDL PHX GDL 0ZL18275 1.5KE33CA Case-41501200019GDL PHX GDL 0ZL18275 1.5KE33CARL4 Case-41501200006GDL PHX GDL 0ZL18335 1.5KE56CA Case-41501200008GDL PHX GDL 0ZL18375 1.5KE82CA Case-41501200014GDL PHX GDL 0ZL18385 1.5KE91CA Case-41501200010GDL PHX GDL 0ZL3190 1N5339B Surmetic-40501200022GDL PHX GDL 0ZL3190 1N5339B Surmetic-40501200021GDL PHX GDL 0ZL3200 1N5340B Surmetic-40501200017GDL PHX GDL 0ZL3245 1N5346B Surmetic-40501200003GDL PHX GDL 0ZL3245 1N5346BRL Surmetic-40501200014GDL PHX GDL 0ZL3270 1N5349B Surmetic-40501200025GDL PHX GDL 0ZL3270 1N5349B Surmetic-40501200023GDL PHX GDL 0ZL3270 1N5349BRL Surmetic-40501200004GDL PHX GDL 0ZL3355 1N5362B Surmetic-40501200009GDL PHX GDL 0ZL3420 1N5369B Surmetic-40501200005GDL PHX GDL 0ZL3440 1N5371BRL Surmetic-40501200011GDL PHX GDL 0ZL3520 1N5381B Surmetic-40501200012GDL PHX GDL 0ZL3520 1N5381BRL Surmetic-40501200013GDL PHX GDL 0ZL3580 1N5388BRL Surmetic-40501200025GDL PHX GDL 0ZL18100A 1N5908 Case-41501200022GDL PHX GDL 0ZL2210B 1N5921BRL Surmetic-30501200022GDL PHX GDL 0ZL2420B 1N5942BRL Surmetic-30501200009GDL PHX GDL 0ZL2480B 1N5948B Surmetic-30501200005GDL PHX GDL 0ZL2540B 1N5953BRL Surmetic-30501200004GDL PHX GDL 0ZL2560B 1N5955BRL Surmetic-30501200006GDL PHX GDL 0ZL2560B 1N5955BRL Surmetic-30501200021GDL PHX GDL 0ZL18290 1N6285A Case-41501200019GDL PHX GDL 0ZL2140 MZP4729ARL Surmetic-30501200023GDL PHX GDL 0ZL2340 MZP4749ATA Surmetic-30501200004GDL PHX GDL 0ZL3580C P6KE200CA Surmetic-40501200019GDL PHX GDL 0ZL3390 P6KE39ARL Surmetic-40501200003GDL PHX GDL 0ZL3390C P6KE39CA Surmetic-40501200016GDL PHX GDL 0ZL3400C P6KE43CARL Surmetic-40501200010GDL PHX GDL 0ZL3410C P6KE47CA Surmetic-40501200013GDL PHX GDL 0ZL3410C P6KE47CA Surmetic-40501200013GDL PHX GDL 0ZL3410C P6KE47CA Surmetic-40501200011GDL PHX GDL 0ZL3445C P6KE62CA Surmetic-40501200009GDL PHX GDL 0ZL3230PC P6KE8.2CA Surmetic-40501200020GDL PHX GDL 0ZL32240 SA15A Surmetic-30501200007GDL PHX GDL 0ZL32245 SA15CA Surmetic-30501200010GDL PHX GDL 0ZL32245 SA15CA Surmetic-30501200021GDL PHX GDL 0ZL32305 SA24CARL Surmetic-30

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Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

501200011GDL PHX GDL 0ZL32380 SA45ARL Surmetic-30501200024GDL PHX GDL 0ZL2180A SZ14095RL Surmetic-30501200016GDL PHX GDL 0ZL3370A SZ2189RL Surmetic-40501200006GDL PHX GDL 0ZL3370A SZ2189RL Surmetic-40501200007GDL PHX GDL 0ZL3370A SZ2189RL Surmetic-40501200008GDL PHX GDL 0ZL3370A SZ2189RL Surmetic-40501200015GDL PHX GDL 0ZL3370A SZ2189RL Surmetic-40501200018GDL PHX GDL 0ZL3370A SZ2189RL Surmetic-40501200020GDL PHX GDL 0ZL3370A SZ2189RL Surmetic-40501200024GDL PHX GDL 0ZL3370A SZ2189RL Surmetic-40501200015GDL PHX GDL 0ZL2364A SZ2229RL Surmetic-30501200013GDL PHX GDL 0ZL2180A SZ14095RL Surmetic-30501200024GDL PHX GDL 0ZL18330 SZ2498RL4 Case-41501200021GDL PHX GDL 0ZL2185B SZ2564RL Surmetic-30501200006GDL PHX GDL 0ZL32300 SZP30274RL Surmetic-30501200002GDL PHX GDL 0ZL2290A SZP30082RL Surmetic-30501200017GDL PHX GDL 0ZL2360A SZP30253RL Surmetic-30501200018GDL PHX GDL 0ZL2360A SZP30253RL Surmetic-30501200019GDL PHX GDL 0ZL2360A SZP30253RL Surmetic-30501200019GDL PHX GDL 0ZL2360A SZP30253RL Surmetic-30501200009GDL PHX GDL 0ZL32300 SZP30274RL Surmetic-30501200003GDL PHX GDL 0ZL2310A SZP30339RL Surmetic-30501200014GDL PHX GDL 0ZL2340 SZP30343RR2 Surmetic-30501200025GDL PHX GDL 0ZL2231A SZP35104RL Surmetic-30501200016GDL PHX GDL 0ZL2300 SZP35126-67RL Surmetic-30501200011GDL PHX GDL 0ZL2351A SZP35144TA Surmetic-30501200010GDL PHX GDL 0ZL2320ZA SZ2527RL Surmetic-3050960020SBN GDL SBN 0ZL5V1F2 MMSZ5V1T1 SOD-12350960014SBN GDL SBN 0ZL5V6F1 MMSZ5232BT1 SOD-12350960005SBN PHX SBN 0ZL12VF1 MMSZ5242BT1 SOD-12350960001SBN PHX SBN 0ZL15VF3 MMSZ4702T1 SOD-12350960023SBN GDL SBN 0ZL18VF2 MMSZ18T1 SOD-12350960026SBN GDL SBN 0ZL24VF2 MMSZ24T1 SOD-12350960011SBN PHX SBN 0ZL27VF1 MMSZ5254BT1 SOD-12350960001SBN PHX SBN 0ZL42340 1SMB5934BT3 SMB50960007SBN PHX SBN 0ZL43210 P6SMB6.8AT3 SMB50960024SBN GDL SBN 0ZL43350 SZP6SMB27AT3 SMB50960003SBN PHX SBN 0ZL43360A SZ1SMB26AT3 SMB50960018SBN GDL SBN 0ZL43360D 1SMB26CAT3 SMB50960014SBN GDL SBN 0ZL43370 P6SMB33AT3 SMB50960026SBN GDL SBN 0ZL43380D 1SMB30CAT3 SMB50960016SBN GDL SBN 0ZL43455A 1SMB60AT3 SMB50960020SBN GDL SBN 0ZL43360D 1SMB26CAT3 SMB50960023SBN GDL SBN 0ZL44210 1.5SMC6.8AT3 SMC50960025SBN GDL SBN 0ZL44310 1.5SMC18AT3 SMC50960002SBN PHX SBN 0ZL44340 1.5SMC24AT3 SMC50960011SBN PHX SBN 0ZL44340A 1SMC20AT3 SMC

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Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

50960019SBN GDL SBN 0ZL44360A 1SMC26AT3 SMC50960021SBN GDL SBN 0ZL44360A 1SMC26AT3 SMC50960008SBN PHX SBN 0ZL44380A 1SMC30AT3 SMC50960013SBN PHX SBN 0ZL44390 1.5SMC39AT3 SMC50960009SBN PHX SBN 0ZL44435A 1SMC51AT3 SMC50960004SBN PHX SBN 0ZL44440 1.5SMC62AT3 SMC50960015SBN GDL SBN 0ZL44450 1.5SMC68AT3 SMC50960017SBN GDL SBN 0ZL44480 1.5SMC91AT3 SMC50960017SBN GDL SBN 0ZL4V7F2 MMSZ4V7T1 SOD-12350960008SBN PHX SBN 0ZL6V2F2 MMSZ6V2T1 SOD-12350960006SBN PHX SBN 0ZL44370A 1SMC28AT3 SMC

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

302604787 3.029 3301419611167360 55Zener Diodes2000 7.609 13142331458202208600563 2.371 4217629699388288 55Bipolar Discrete2000 3.619 27631942542050 4

0Rej.

Operating LifeTj = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Logic - HSL CMOS

Test Conditions:

801008 -Carmon PHENITEC

PHX 0CMD774 MC74HC74AD SOIC-14801008 -Carmon PHENIT

ECPHX 0CMD7595 MC74HC595AD SOIC-16

801008 -- - PHX 0CMD7595 MC74HC595AD SOIC-16801008 -Carmon PHENIT

ECPHX 0CMD7595 MC74HC595AD SOIC-16

801008 -Carmon PHENITEC

PHX 0CMD74060 MC74HC4060AD SOIC-16801008PHJ022Carmon PHENIT

ECPHX 0CMD7595 MC74HC595AD SOIC-16

801008PHL022Carmon PHENITEC

PHX 0CMD7595 MC74HC595AD SOIC-16801008PHN022Carmon PHENIT

ECPHX 0CMD7595 MC74HC595AD SOIC-16

801008PHO022Carmon PHENITEC

PHX 0CMD7595 MC74HC595AD SOIC-1677250PBN9951OSPI Phenetic OSPI 0CMCT708 MC74HC08ADTEL TSSOP-1477504PBN9951OSPI Phenetic OSPI 0CMCT708 MC74HC08ADTEL TSSOP-14772509927MPC Phenitec MPC 0CMD732 MC74HC32AD SOIC-14775049927MPC Phenitec MPC 0CMD732 MC74HC32AD SOIC-1477250PHJ952OSPI MOS1 OSPI 0CMCT4051 MC74HC4051DTEL TSSOP-1677504PHJ952OSPI MOS1 OSPI 0CMCT4051 MC74HC4051DTEL TSSOP-1677250PAQ0011OSPI CSM OSPI 0CMCT700 MC74HC00ADTEL TSSOP-1477504PAQ0011OSPI CSM OSPI 0CMCT700 MC74HC00ADTEL TSSOP-1477250PPCG0007OSPI Phenetic OSPI 0CMCT704 MC74HC04ADTEL TSSOP-1477504PPCG0007OSPI Phenetic OSPI 0CMCT704 MC74HC04ADTEL TSSOP-14772509905MPC PHENET

ICMPC 0CMD708 MC74HC08AD SOIC-14

775049905MPC PHENETIC

MPC 0CMD708 MC74HC08AD SOIC-14772509909MPC PHENET

ICMPC 0CMD708 MC74HC08AD SOIC-14

775049909MPC PHENETIC

MPC 0CMD708 MC74HC08AD SOIC-14772509930OSPI Phenitec OSPI 0CMCT708 MC74HC08ADT TSSOP-14775049930OSPI Phenitec OSPI 0CMCT708 MC74HC08ADT TSSOP-14772509944OSPI Thinko OSPI 0CMCT708 MC74HC08ADTEL TSSOP-14775049944OSPI Thinko OSPI 0CMCT708 MC74HC08ADTEL TSSOP-14772509948OSPI BP2 OSPI 0CMD710 MC74HC10D SOIC-14

ON SemiconductorReliability Audit Report 252000

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Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

775049948OSPI BP2 OSPI 0CMD710 MC74HC10D SOIC-14772509940OSPI Thinko OSPI 0CMD7125 MC74HC125AD SOIC-14775049940OSPI Thinko OSPI 0CMD7125 MC74HC125AD SOIC-14772509931OSPI Phenitec OSPI 0CMD7125 MC74HC125AD SOIC-14775049931OSPI Phenitec OSPI 0CMD7125 MC74HC125AD SOIC-1477250PBD0014OSPI PHENET

ICOSPI 0CMD7125 MC74HC125ADR2 SOIC-14

77504PBD0014OSPI PHENETIC

OSPI 0CMD7125 MC74HC125ADR2 SOIC-1477250PBR0023OSPI PHENET

ICOSPI 0CMCT7125 MC74HC125ADTEL TSSOP-14

77504PBR0023OSPI PHENETIC

OSPI 0CMCT7125 MC74HC125ADTEL TSSOP-1477250PBW0027OSPI PHENET

ICOSPI 0CMD7126 MC74HC126ADR2 SOIC-14

77504PBW0027OSPI PHENETIC

OSPI 0CMD7126 MC74HC126ADR2 SOIC-1477250PBK0020OSPI PHENET

ICOSPI 0CMCT7126 MC74HC126ADTEL TSSOP-14

77504PBK0020OSPI PHENETIC

OSPI 0CMCT7126 MC74HC126ADTEL TSSOP-1477250PCK0019OSPI PHENET

ICOSPI 0CMD7132 MC74HC132AD SOIC-14

77504PCK0019OSPI PHENETIC

OSPI 0CMD7132 MC74HC132AD SOIC-1477250PPBL0006OSPI Phenetic OSPI 0CMD7132 MC74HC132AD SOIC-1477504PPBL0006OSPI Phenetic OSPI 0CMD7132 MC74HC132AD SOIC-14772509905MPC BP2 MPC 0CMD7139 MC74HC139AD SOIC-16775049905MPC BP2 MPC 0CMD7139 MC74HC139AD SOIC-16772509841MPC - MPC 0CMD714 MC74HC14AD SOIC-14775049841MPC - MPC 0CMD714 MC74HC14AD SOIC-14772509849MPC BP2 MPC 0CMD714 MC74HC14AD SOIC-14775049849MPC BP2 MPC 0CMD714 MC74HC14AD SOIC-14772509918MPC PHENET

ICMPC 0CMD714 MC74HC14AD SOIC-14

775049918MPC PHENETIC

MPC 0CMD714 MC74HC14AD SOIC-14772509925MPC THINK-

OMPC 0CMD714 MC74HC14AD SOIC-14

775049925MPC THINK-O

MPC 0CMD714 MC74HC14AD SOIC-14772509841MPC BP2 MPC 0CMCT714 MC74HC14ADT TSSOP-14775049841MPC BP2 MPC 0CMCT714 MC74HC14ADT TSSOP-14772509841MPC - MPC 0CMD714 MC74HC14AD SOIC-14775049841MPC - MPC 0CMD714 MC74HC14AD SOIC-14772509934OSPI BMC OSPI 0CMD7153 MC74HC153D SOIC-16775049934OSPI BMC OSPI 0CMD7153 MC74HC153D SOIC-16772509909MPC BP2 MPC 0CMD7157 MC74HC157AD SOIC-16775049909MPC BP2 MPC 0CMD7157 MC74HC157AD SOIC-16772509932OSPI BP2 OSPI 0CMD7165 MC74HC165D SOIC-16775049932OSPI BP2 OSPI 0CMD7165 MC74HC165D SOIC-1677250PAT0002OSPI BMC OSPI 0CMD7175 MC74HC175D SOIC-1677504PAT0002OSPI BMC OSPI 0CMD7175 MC74HC175D SOIC-16772509947OSPI Phenetic OSPI 0CMCT7244 MC74HC244ADT TSSOP-20775049947OSPI Phenetic OSPI 0CMCT7244 MC74HC244ADT TSSOP-20772509945OSPI Phenetic OSPI 0CMCT7244 MC74HC244ADTEL TSSOP-20775049945OSPI Phenetic OSPI 0CMCT7244 MC74HC244ADTEL TSSOP-2077250PAG0012OSPI CSM OSPI 0CMCT7244 MC74HC244ADTEL TSSOP-2077504PAG0012OSPI CSM OSPI 0CMCT7244 MC74HC244ADTEL TSSOP-20772509940OSPI BP2 OSPI 0CMCT7245 MC74HC245ADTEL TSSOP-20775049940OSPI BP2 OSPI 0CMCT7245 MC74HC245ADTEL TSSOP-20

ON SemiconductorReliability Audit Report 262000

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Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

77250PAVIOSPI BP2 OSPI 0CMCT7245 MC74HC245ADTEL TSSOP-2077504PAVIOSPI BP2 OSPI 0CMCT7245 MC74HC245ADTEL TSSOP-2077250PUVIOSPI Phenitec OSPI 0CMCT732 MC74HC32ADTEL TSSOP-1477504PUVIOSPI Phenitec OSPI 0CMCT732 MC74HC32ADTEL TSSOP-1477250PCR0015OSPI PHENET

ICOSPI 0CMCT732 MC74HC32ADTR2 TSSOP-14

77504PCR0015OSPI PHENETIC

OSPI 0CMCT732 MC74HC32ADTR2 TSSOP-1477250PBVKOSPI BP2 OSPI 0CMCT7365 MC74HC365ADTEL TSSOP-1677504PBVKOSPI BP2 OSPI 0CMCT7365 MC74HC365ADTEL TSSOP-1677250PPAO0005OSPI Phenetic OSPI 0CMD7390 MC74HC390ADR2 SOIC-1677504PPAO0005OSPI Phenetic OSPI 0CMD7390 MC74HC390ADR2 SOIC-16772509945OSPI - OSPI 0CMD7393 MC74HC393AD SOIC-14775049945OSPI - OSPI 0CMD7393 MC74HC393AD SOIC-14772509901MPC BP2 MPC 0CMD7393 MC74HC393D SOIC-14775049901MPC BP2 MPC 0CMD7393 MC74HC393D SOIC-1477250PAQ0011OSPI CSM OSPI 0CMT74051 MC74HC4051ADTEL TSSOP-1677504PAQ0011OSPI CSM OSPI 0CMT74051 MC74HC4051ADTEL TSSOP-16772509911MPC - MPC 0CMCT4051 MC74HC4051DT TSSOP-16775049911MPC - MPC 0CMCT4051 MC74HC4051DT TSSOP-1677250PJP0013OSPI CSM OSPI 0CMCT4051 MC74HC4051DT TSSOP-1677504PJP0013OSPI CSM OSPI 0CMCT4051 MC74HC4051DT TSSOP-16772509945OSPI Mos 7 OSPI 0CMCT4051 MC74HC4051DTEL TSSOP-16775049945OSPI Mos 7 OSPI 0CMCT4051 MC74HC4051DTEL TSSOP-16772509945OSPI BP2 OSPI 0CMS74053 MC74HC4053AD SOIC-16775049945OSPI BP2 OSPI 0CMS74053 MC74HC4053AD SOIC-1677250PBQ0013OSPI BMC OSPI 0CMS74053 MC74HC4053ADR2 SOIC-1677504PBQ0013OSPI BMC OSPI 0CMS74053 MC74HC4053ADR2 SOIC-16772509927MPC BP2 MPC 0CMS74053 MC74HC4053D SOIC-16775049927MPC BP2 MPC 0CMS74053 MC74HC4053D SOIC-16772509918MPC BP2 MPC 0CMCT4053 MC74HC4053DT TSSOP-16775049918MPC BP2 MPC 0CMCT4053 MC74HC4053DT TSSOP-16772509928MPC BP2 MPC 0CMCT4053 MC74HC4053DT TSSOP-16775049928MPC BP2 MPC 0CMCT4053 MC74HC4053DT TSSOP-16772509925MPC BP2 MPC 0CMCT4053 MC74HC4053DT TSSOP-16775049925MPC BP2 MPC 0CMCT4053 MC74HC4053DT TSSOP-1677250PAC007OSPI Phenitec OSPI 0CMD74060 MC74HC4060AD SOIC-1677504PAC007OSPI Phenitec OSPI 0CMD74060 MC74HC4060AD SOIC-1677250PAC007OSPI Phenitec OSPI 0CMD74060 MC74HC4060AD SOIC-1677504PAC007OSPI Phenitec OSPI 0CMD74060 MC74HC4060AD SOIC-1677250PAK0019OSPI PHENET

ICOSPI 0CMD74060 MC74HC4060ADR2 SOIC-16

77504PAK0019OSPI PHENETIC

OSPI 0CMD74060 MC74HC4060ADR2 SOIC-1677250PDT0009OSPI BMC OSPI 0CMD4066 MC74HC4066D SOIC-1477504PDT0009OSPI BMC OSPI 0CMD4066 MC74HC4066D SOIC-1477250PDJ0023OSPI CSM OSPI 0CMD4066 MC74HC4066DR2 SOIC-1477504PDJ0023OSPI CSM OSPI 0CMD4066 MC74HC4066DR2 SOIC-14772509906MPC BP2 MPC 0CMCT4066 MC74HC4066DT TSSOP-14775049906MPC BP2 MPC 0CMCT4066 MC74HC4066DT TSSOP-14772509911MPC BP2 MPC 0CMCT4066 MC74HC4066DT TSSOP-14

ON SemiconductorReliability Audit Report 272000

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Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

775049911MPC BP2 MPC 0CMCT4066 MC74HC4066DT TSSOP-14772509914MPC BP2 MPC 0CMCT4066 MC74HC4066DT TSSOP-14775049914MPC BP2 MPC 0CMCT4066 MC74HC4066DT TSSOP-14772509923MPC BP2 MPC 0CMCT4066 MC74HC4066DT TSSOP-14775049923MPC BP2 MPC 0CMCT4066 MC74HC4066DT TSSOP-1477250PDF0027OSPI BMC OSPI 0CMD74316 MC74HC4316D SOIC-1677504PDF0027OSPI BMC OSPI 0CMD74316 MC74HC4316D SOIC-16772509932OSPI BP2 OSPI 0CMD74316 MC74HC4316D SOIC-16775049932OSPI BP2 OSPI 0CMD74316 MC74HC4316D SOIC-1677250PPBS0005OSPI BMC OSPI 0CMD74316 MC74HC4316DR2 SOIC-1677504PPBS0005OSPI BMC OSPI 0CMD74316 MC74HC4316DR2 SOIC-16772509901MPC BP2 MPC 0CMD74851 MC74HC4851AD SOIC-16775049901MPC BP2 MPC 0CMD74851 MC74HC4851AD SOIC-16772509928MPC Phenitec MPC 0CMCT7541 MC74HC541ADT TSSOP-20775049928MPC Phenitec MPC 0CMCT7541 MC74HC541ADT TSSOP-20772509915MPC PHENET

ICMPC 0CMD7595 MC74HC595AD SOIC-16

775049915MPC PHENETIC

MPC 0CMD7595 MC74HC595AD SOIC-16772509924MPC THINK-

OMPC 0CMD7595 MC74HC595AD SOIC-16

775049924MPC THINK-O

MPC 0CMD7595 MC74HC595AD SOIC-16772509940OSPI Thinko OSPI 0CMD7595 MC74HC595AD SOIC-16775049940OSPI Thinko OSPI 0CMD7595 MC74HC595AD SOIC-1677250PFQ007OSPI Phenitec OSPI 0CMD7595 MC74HC595AD SOIC-1677504PFQ007OSPI Phenitec OSPI 0CMD7595 MC74HC595AD SOIC-1677250PCJ007OSPI Phenitec OSPI 0CMD774 MC74HC74AD SOIC-1477504PCJ007OSPI Phenitec OSPI 0CMD774 MC74HC74AD SOIC-14772509936OSPI Phenitec OSPI 0CMD774 MC74HC74AD SOIC-14775049936OSPI Phenitec OSPI 0CMD774 MC74HC74AD SOIC-1477250PFVNOSPI phenetic OSPI 0CMCT7086 MC74HC86ADT TSSOP-1477504PFVNOSPI phenetic OSPI 0CMCT7086 MC74HC86ADT TSSOP-14772509949OSPI Phenetic OSPI 0CMTT714 MC74HCT14ADT TSSOP-14775049949OSPI Phenetic OSPI 0CMTT714 MC74HCT14ADT TSSOP-14772509932OSPI BP2 OSPI 0JHS7T244 MC74HCT244ADTEL TSSOP-20775049932OSPI BP2 OSPI 0JHS7T244 MC74HCT244ADTEL TSSOP-20772509918MPC BP2 MPC 0CMTT732 MC74HCT32ADT TSSOP-14775049918MPC BP2 MPC 0CMTT732 MC74HCT32ADT TSSOP-14772509927MPC BP2 MPC 0CMTT732 MC74HCT32ADT TSSOP-14775049927MPC BP2 MPC 0CMTT732 MC74HCT32ADT TSSOP-14772509915MPC BP2 MPC 0CTD074 MC74HCT74AD SOIC-14775049915MPC BP2 MPC 0CTD074 MC74HCT74AD SOIC-14772509923MPC BP2 MPC 0CMUT704 MC74HCU04ADT TSSOP-14775049923MPC BP2 MPC 0CMUT704 MC74HCU04ADT TSSOP-14772509914MPC BMC MPC 0VHCD4051 MC74VHC4051D SOIC-16775049914MPC BMC MPC 0VHCD4051 MC74VHC4051D SOIC-16772509914MPC - MPC 0VHCT4051 MC74VHC4051DT TSSOP-16775049914MPC - MPC 0VHCT4051 MC74VHC4051DT TSSOP-1677250PAJ0017OSPI PHENET

ICOSPI 0VHCT4052 MC74VHC4052DT TSSOP-16

77504PAJ0017OSPI PHENETIC

OSPI 0VHCT4052 MC74VHC4052DT TSSOP-16

ON SemiconductorReliability Audit Report 282000

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Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

772509914MPC BMC MPC 0VHCD4053 MC74VHC4053D SOIC-16775049914MPC BMC MPC 0VHCD4053 MC74VHC4053D SOIC-16772509914MPC BMC MPC 0VHCT4053 MC74VHC4053DT TSSOP-16775049914MPC BMC MPC 0VHCT4053 MC74VHC4053DT TSSOP-16772509911MPC BMC MPC 0VHCD4066 MC74VHC4066D SOIC-14775049911MPC BMC MPC 0VHCD4066 MC74VHC4066D SOIC-14772509911MPC BMC MPC 0VHCT4066 MC74VHC4066DT TSSOP-14775049911MPC BMC MPC 0VHCT4066 MC74VHC4066DT TSSOP-14772509911MPC BMC MPC 0VHCT4066 MC74VHC4066DT TSSOP-14775049911MPC BMC MPC 0VHCT4066 MC74VHC4066DT TSSOP-14772509911MPC BMC MPC 0VHCD4066 MC74VHC4066D SOIC-14775049911MPC BMC MPC 0VHCD4066 MC74VHC4066D SOIC-14772509911MPC BMC MPC 0VHCT4066 MC74VHC4066DT TSSOP-14775049911MPC BMC MPC 0VHCT4066 MC74VHC4066DT TSSOP-14

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

1015044955 0.903 11074197123915744 55HSL CMOS2000 2.268 44091710885123300569118 0.278 359712230212732622 55Logic2000 0.698 143266475632309 0

0Rej.

Operating LifeTj = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Logic - LCX

Test Conditions:

77250PAN0002OSPI CSM OSPI 0LCXT0086 MC74LCX86DTR2 TSSOP-1477504PAN0002OSPI CSM OSPI 0LCXT0086 MC74LCX86DTR2 TSSOP-1477250PPBD0005OSPI TESLA OSPI 0LCXT0373 MC74LCX373DT TSSOP-2077504PPBD0005OSPI TESLA OSPI 0LCXT0373 MC74LCX373DT TSSOP-20

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

30099761 30.449 32841801116116 55LCX2000 76.496 130725793083300569118 0.278 359712230212732622 55Logic2000 0.698 143266475632309 0

0Rej.

Operating LifeTj = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Logic - Metal Gate CMOS

Test Conditions:

801008 -Carmon Slovakia PHX 0CMD14013 MC14013BD SOIC-14801008 -Carmon Mos-1 PHX 0CMD14013 MC14013BD SOIC-14801008 -Amt

(A t )Slovakia PHX 0CMP14014 MC14014BCP PDIP-16

801008 -Amt(A t )

Slovakia PHX 0CMP14014 MC14014BCP PDIP-16801008 -Amt

(A t )Slovakia PHX 0CMP14014 MC14014BCP PDIP-16

801008 -Amt(A t )

Slovakia PHX 0CMP14014 MC14014BCP PDIP-16801008 -Carmon MITEL PHX 0CMD14052 MC14052BD SOIC-16801008 -Carmon MITEL PHX 0CMD14052 MC14052BD SOIC-16801008 -Carmon MITEL PHX 0CMD14052 MC14052BD SOIC-16801008 -Carmon MITEL PHX 0CMD14052 MC14052BD SOIC-16801008 -Amt

(A t )Slovakia PHX 0CMP14051 MC14051BCP PDIP-16

801008 -Amt(A t )

Slovakia PHX 0CMP14051 MC14051BCP PDIP-16801008 -Amt

(A t )Slovakia PHX 0CMP14051 MC14051BCP PDIP-16

801008 -Amt(A t )

Slovakia PHX 0CMP14051 MC14051BCP PDIP-16

ON SemiconductorReliability Audit Report 292000

Page 40: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

77250PVZ9952/OSPI MOS1 OSPI 0BMD14011 MC14011BD SOIC-1477504PVZ9952/OSPI MOS1 OSPI 0BMD14011 MC14011BD SOIC-14

154250PAA952/PAB952

OSPI SEI OSPI 0BMD14011 MC14011BD SOIC-14154504PAA952/PA

B952OSPI SEI OSPI 0BMD14011 MC14011BD SOIC-14

77250PAV0019OSPI MITEL OSPI 0BMD14011 MC14011BDR2 SOIC-1477504PAV0019OSPI MITEL OSPI 0BMD14011 MC14011BDR2 SOIC-1477250PAG952OSPI MOS1 OSPI 0CMD14013 MC14013BDR2 SOIC-1477504PAG952OSPI MOS1 OSPI 0CMD14013 MC14013BDR2 SOIC-1477250PAI0013OSPI MITEL OSPI 0CMD14013 MC14013BDR2 SOIC-1477504PAI0013OSPI MITEL OSPI 0CMD14013 MC14013BDR2 SOIC-14772509901MPC MOS1 MPC 0CMD14015 MC14015BD SOIC-16775049901MPC MOS1 MPC 0CMD14015 MC14015BD SOIC-16772509949OSPI MOS1 OSPI 0CMD14017 MC14017BD SOIC-16775049949OSPI MOS1 OSPI 0CMD14017 MC14017BD SOIC-1677250PAQ0027OSPI SEI OSPI 0CMD14017 MC14017BD SOIC-1677504PAQ0027OSPI SEI OSPI 0CMD14017 MC14017BD SOIC-1677250PAJ0019OSPI SEI OSPI 0CMD14017 MC14017BDR2 SOIC-1677504PAJ0019OSPI SEI OSPI 0CMD14017 MC14017BDR2 SOIC-16772509923MPC MOS1 MPC 0CMD14018 MC14018BD SOIC-16775049923MPC MOS1 MPC 0CMD14018 MC14018BD SOIC-16772509909MPC MOS1 MPC 0CMD14020 MC14020BD SOIC-16775049909MPC MOS1 MPC 0CMD14020 MC14020BD SOIC-16772509934OSPI MOS1 OSPI 0CMD14020 MC14020BD SOIC-16775049934OSPI MOS1 OSPI 0CMD14020 MC14020BD SOIC-1677250PAW0022OSPI MITEL OSPI 0CMD14020 MC14020BDR2 SOIC-1677504PAW0022OSPI MITEL OSPI 0CMD14020 MC14020BDR2 SOIC-16772509850MPC MOS1 MPC 0CMD14027 MC14027BD SOIC-16775049850MPC MOS1 MPC 0CMD14027 MC14027BD SOIC-1677250PAW0001OSPI MOS1 OSPI 0CMD14027 MC14027BD SOIC-1677504PAW0001OSPI MOS1 OSPI 0CMD14027 MC14027BD SOIC-16772509939OSPI MOS1 OSPI 0CMD14028 MC14028BD SOIC-16775049939OSPI MOS1 OSPI 0CMD14028 MC14028BD SOIC-16772509932OSPI MOS1 OSPI 0CMD14028 MC14028BD SOIC-16775049932OSPI MOS1 OSPI 0CMD14028 MC14028BD SOIC-1677250PVZ952OSPI MOS1 OSPI 0CMD14051 MC14051BD SOIC-1677504PVZ952OSPI MOS1 OSPI 0CMD14051 MC14051BD SOIC-16

154250PAE/PAF952

OSPI SEI OSPI 0CMD14051 MC14051BD SOIC-16154504PAE/PAF95

2OSPI SEI OSPI 0CMD14051 MC14051BD SOIC-16

154250PAH/PAG952

OSPI SEI OSPI 0CMD14051 MC14051BD SOIC-16154504PAH/PAG95

2OSPI SEI OSPI 0CMD14051 MC14051BD SOIC-16

154250PAJ/PAI952OSPI SEI OSPI 0CMD14051 MC14051BD SOIC-16154504PAJ/PAI952OSPI SEI OSPI 0CMD14051 MC14051BD SOIC-16772509927MPC MOS1 MPC 0CMD14052 MC14052BD SOIC-16775049927MPC MOS1 MPC 0CMD14052 MC14052BD SOIC-16772509945OSPI MITEL OSPI 0CMD14052 MC14052BD SOIC-16775049945OSPI MITEL OSPI 0CMD14052 MC14052BD SOIC-1677250PDT0006OSPI MITEL OSPI 0CMD14053 MC14053BDR2 SOIC-16

ON SemiconductorReliability Audit Report 302000

Page 41: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

77504PDT0006OSPI MITEL OSPI 0CMD14053 MC14053BDR2 SOIC-16772509945OSPI MITEL OSPI 0CMD14066 MC14066BD SOIC-14775049945OSPI MITEL OSPI 0CMD14066 MC14066BD SOIC-14772509948OSPI MITEL OSPI 0CMD14066 MC14066BD SOIC-14775049948OSPI MITEL OSPI 0CMD14066 MC14066BD SOIC-1477250PEV0010OSPI MITEL OSPI 0CMD14066 MC14066BD SOIC-1477504PEV0010OSPI MITEL OSPI 0CMD14066 MC14066BD SOIC-14772509930OSPI MOS1 OSPI 0BMT14066 MC14066BDT TSSOP-14775049930OSPI MOS1 OSPI 0BMT14066 MC14066BDT TSSOP-1477250PBQ0029OSPI PHENET

ICOSPI 0BMT14066 MC14066BDTR2 TSSOP-14

77504PBQ0029OSPI PHENETIC

OSPI 0BMT14066 MC14066BDTR2 TSSOP-1477250PAB0015OSPI SEI OSPI 0CMD14069 MC14069UBD SOIC-1477504PAB0015OSPI SEI OSPI 0CMD14069 MC14069UBD SOIC-1477250PBD0027OSPI MITEL OSPI 0CMD14081 MC14081BDR2 SOIC-1477504PBD0027OSPI MITEL OSPI 0CMD14081 MC14081BDR2 SOIC-14772509840MPC - MPC 0CMD14094 MC14094BD SOIC-16775049840MPC - MPC 0CMD14094 MC14094BD SOIC-16772509915MPC MOS1 MPC 0CMD14094 MC14094BD SOIC-16775049915MPC MOS1 MPC 0CMD14094 MC14094BD SOIC-1677250PDC0013OSPI MITEL OSPI 0CMD14094 MC14094BD SOIC-1677504PDC0013OSPI MITEL OSPI 0CMD14094 MC14094BD SOIC-16772509905MPC BP2 MPC 0CMD14504 MC14504BD SOIC-16775049905MPC BP2 MPC 0CMD14504 MC14504BD SOIC-1677250PAB0010OSPI SEI OSPI 0CMD14504 MC14504BD SOIC-1677504PAB0010OSPI SEI OSPI 0CMD14504 MC14504BD SOIC-1677250PAA0010OSPI SEI OSPI 0CMD14504 MC14504BD SOIC-1677504PAA0010OSPI SEI OSPI 0CMD14504 MC14504BD SOIC-1677250PCR0009OSPI MOS1 OSPI 0CMD14504 MC14504BD SOIC-1677504PCR0009OSPI MOS1 OSPI 0CMD14504 MC14504BD SOIC-1677250PAA0018OSPI SEI OSPI 0CMD14512 MC14512BD SOIC-1677504PAA0018OSPI SEI OSPI 0CMD14512 MC14512BD SOIC-1677250PPBA0005OSPI MITEL OSPI 0CMD14541 MC14541BD SOIC-1477504PPBA0005OSPI MITEL OSPI 0CMD14541 MC14541BD SOIC-1477250PDN0025OSPI MITEL OSPI 0CMD14541 MC14541BDR2 SOIC-1477504PDN0025OSPI MITEL OSPI 0CMD14541 MC14541BDR2 SOIC-14772509935OSPI MOS1 OSPI 0CMD14543 MC14543BD SOIC-16775049935OSPI MOS1 OSPI 0CMD14543 MC14543BD SOIC-16772509918MPC MOS1 MPC 0CMD14551 MC14551BD SOIC-16775049918MPC MOS1 MPC 0CMD14551 MC14551BD SOIC-16772509939OSPI MOS1 OSPI 0CMD14584 MC14584BD SOIC-14775049939OSPI MOS1 OSPI 0CMD14584 MC14584BD SOIC-14

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

1015044955 0.903 11074197123915744 55Metal Gate CMOS2000 2.268 44091710885123300569118 0.278 359712230212732622 55Logic2000 0.698 143266475632309 0

0Rej.

ON SemiconductorReliability Audit Report 312000

Page 42: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

Operating LifeTj = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Logic - MOSAIC 3

Test Conditions:

801008 -Carmon Mesa PHX 0PSXQ1016 MC10E016FN PLCC-28801008 -Carmon Mesa PHX 0PSXQ1016 MC10E016FN PLCC-28801512 -- - PHX 0PSXQ1016 MC10E016FN PLCC-28801512 -Carmon Mesa PHX 0PSXQ1116 MC10E116FN PLCC-28801512 -Carmon Mesa PHX 0PSXQ1116 MC10E116FN PLCC-28801512 -Carmon Mesa PHX 0PSXQ1116 MC10E116FN PLCC-28801512 -Ase

(METL)Mesa PHX 0PSXS1L16 MC10EL16D SOIC-8

801512 -Ase(METL)

Mesa PHX 0PSXS1L16 MC10EL16D SOIC-8801512 -Ase

(METL)Mesa PHX 0PSXS1L16 MC10EL16D SOIC-8

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

261295252 3.508 2850627141008000 55MOSAIC 32000 8.812 1134816167203300569118 0.278 359712230212732622 55Logic2000 0.698 143266475632309 0

0Rej.

Operating LifeTj = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Logic - MOSAIC 5

Test Conditions:

801512 -Aap1(A i)

MOS6 PHX 0EPLTHP08 MC10EP08DT TSSOP-8801512 -Aap1

(A i)MOS6 PHX 0EPLTHP16 MC10EP16DT TSSOP-8

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

62710860 14.615 68422853241920 55MOSAIC 52000 36.716 272360821603300569118 0.278 359712230212732622 55Logic2000 0.698 143266475632309 0

0Rej.

Operating LifeTj = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

Logic - VHC

Test Conditions:

841512 -SMP Chartered

PHX 0V1GC02 MC74VHC1G02DFT1 SC-88841512 -SMP Chartere

dPHX 0V1GC00 MC74VHC1G00DFT1 SC-88

841512 -SMP Chartered

PHX 0V1GC08 MC74VHC1G08DFT1 SC-8877250PAG0002OSPI - OSPI 0CMVD7126 MC74VHC126D SOIC-1477504PAG0002OSPI - OSPI 0CMVD7126 MC74VHC126D SOIC-1477250PCL0001OSPI BMC OSPI 0CMVT714 MC74VHC14DTR2 TSSOP-1477504PCL0001OSPI BMC OSPI 0CMVT714 MC74VHC14DTR2 TSSOP-1477250PCD952OSPI BMC OSPI 0CMVT7245 MC74VHC245DT TSSOP-2077504PCD952OSPI BMC OSPI 0CMVT7245 MC74VHC245DT TSSOP-20772509915MPC BMC MPC 0CMVT700 MC74VHC00DT TSSOP-14775049915MPC BMC MPC 0CMVT700 MC74VHC00DT TSSOP-14772509926MPC BMC MPC 0CMVT700 MC74VHC00DT TSSOP-14775049926MPC BMC MPC 0CMVT700 MC74VHC00DT TSSOP-1477250PCK0011OSPI MOS7 OSPI 0CMVT702 MC74VHC02DTR2 TSSOP-1477504PCK0011OSPI MOS7 OSPI 0CMVT702 MC74VHC02DTR2 TSSOP-14772509944OSPI - OSPI 0CMVD704 MC74VHC04D SOIC-14

ON SemiconductorReliability Audit Report 322000

Page 43: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

775049944OSPI - OSPI 0CMVD704 MC74VHC04D SOIC-14772509910MPC - MPC 0CMVT708 MC74VHC08DT TSSOP-14775049910MPC - MPC 0CMVT708 MC74VHC08DT TSSOP-14772509923MPC - MPC 0CMVT708 MC74VHC08DT TSSOP-14775049923MPC - MPC 0CMVT708 MC74VHC08DT TSSOP-14772509932OSPI BMC OSPI 0CMVT708 MC74VHC08DT TSSOP-14775049932OSPI BMC OSPI 0CMVT708 MC74VHC08DT TSSOP-147710009846MPC - MPC 0CMVT7125 MC74VHC125DT TSSOP-14772509850MPC - MPC 0CMVT7132 MC74VHC132DT TSSOP-14775049850MPC - MPC 0CMVT7132 MC74VHC132DT TSSOP-14772509909MPC BMC MPC 0CMVT7132 MC74VHC132DT TSSOP-14775049909MPC BMC MPC 0CMVT7132 MC74VHC132DT TSSOP-14772509902MPC - MPC 0CMVD7138 MC74VHC138D SOIC-16775049902MPC - MPC 0CMVD7138 MC74VHC138D SOIC-16772509923MPC - MPC 0CMVT7139 MC74VHC139DT TSSOP-16775049923MPC - MPC 0CMVT7139 MC74VHC139DT TSSOP-16772509949OSPI - OSPI 0CMVT7139 MC74VHC139DT TSSOP-16775049949OSPI - OSPI 0CMVT7139 MC74VHC139DT TSSOP-16772509907MPC - MPC 0CMVT714 MC74VHC14DT TSSOP-14775049907MPC - MPC 0CMVT714 MC74VHC14DT TSSOP-1477250PKVNOSPI - OSPI 0CMVT714 MC74VHC14DT TSSOP-1477504PKVNOSPI - OSPI 0CMVT714 MC74VHC14DT TSSOP-1477250PPC0005OSPI TESLA OSPI 0CMVT714 MC74VHC14DT TSSOP-1477504PPC0005OSPI TESLA OSPI 0CMVT714 MC74VHC14DT TSSOP-1477250PCA0018OSPI MOS7 OSPI 0CMVD7157 MC74VHC157DR2 SOIC-1677504PCA0018OSPI MOS7 OSPI 0CMVD7157 MC74VHC157DR2 SOIC-1677250PCW0028OSPI TESLA OSPI 0CMVD7157 MC74VHC157DR2 SOIC-1677504PCW0028OSPI TESLA OSPI 0CMVD7157 MC74VHC157DR2 SOIC-1677250PBI0010OSPI MOS7 OSPI 0CMVT7244 MC74VHC244DT TSSOP-2077504PBI0010OSPI MOS7 OSPI 0CMVT7244 MC74VHC244DT TSSOP-20772509909MPC - MPC 0CMVT7245 MC74VHC245DT TSSOP-20775049909MPC - MPC 0CMVT7245 MC74VHC245DT TSSOP-20772509948OSPI - OSPI 0CMVT732 MC74VHC32DT TSSOP-14775049948OSPI - OSPI 0CMVT732 MC74VHC32DT TSSOP-1477250PAK004OSPI TESLA OSPI 0CMVT7540 MC74VHC540DT TSSOP-2077504PAK004OSPI TESLA OSPI 0CMVT7540 MC74VHC540DT TSSOP-20772509840MPC - MPC 0CMVT7573 MC74VHC573DT TSSOP-20775049840MPC - MPC 0CMVT7573 MC74VHC573DT TSSOP-2077250PLVIOSPI - OSPI 0CMVT7573 MC74VHC573DT TSSOP-2077504PLVIOSPI - OSPI 0CMVT7573 MC74VHC573DT TSSOP-20772509850MPC - MPC 0CMVT7574 MC74VHC574DT TSSOP-20775049850MPC - MPC 0CMVT7574 MC74VHC574DT TSSOP-20772509902MPC - MPC 0CMVT7574 MC74VHC574DT TSSOP-20775049902MPC - MPC 0CMVT7574 MC74VHC574DT TSSOP-20772509919MPC - MPC 0CMVT7574 MC74VHC574DT TSSOP-20775049919MPC - MPC 0CMVT7574 MC74VHC574DT TSSOP-20772509904MPC - MPC 0CMVD7595 MC74VHC595D SOIC-16

ON SemiconductorReliability Audit Report 332000

Page 44: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

775049904MPC - MPC 0CMVD7595 MC74VHC595D SOIC-16772509939OSPI - OSPI 0CMVD7074 MC74VHC74D SOIC-14775049939OSPI - OSPI 0CMVD7074 MC74VHC74D SOIC-14772509944OSPI - OSPI 0CMVT7074 MC74VHC74DT TSSOP-14775049944OSPI - OSPI 0CMVT7074 MC74VHC74DT TSSOP-1477250PPVIOSPI - OSPI 0CMVT7074 MC74VHC74DT TSSOP-1477504PPVIOSPI - OSPI 0CMVT7074 MC74VHC74DT TSSOP-1477250PAM0016OSPI CSM OSPI 0CMVT7074 MC74VHC74DTR2 TSSOP-1477504PAM0016OSPI CSM OSPI 0CMVT7074 MC74VHC74DTR2 TSSOP-1477250PAW0025OSPI CSM OSPI 0CMVT7074 MC74VHC74DTR2 TSSOP-1477504PAW0025OSPI CSM OSPI 0CMVT7074 MC74VHC74DTR2 TSSOP-14772509933OSPI BMC OSPI 0VHCD7086 MC74VHC86D SOIC-14775049933OSPI BMC OSPI 0VHCD7086 MC74VHC86D SOIC-14772509902MPC - MPC 0VHCT7086 MC74VHC86DT TSSOP-14775049902MPC - MPC 0VHCT7086 MC74VHC86DT TSSOP-14772509931OSPI BMC OSPI 0HVTD704 MC74VHCT04AD SOIC-14775049931OSPI BMC OSPI 0HVTD704 MC74VHCT04AD SOIC-1477250PAT0015OSPI MOS7 OSPI 0HVTT704 MC74VHCT04ADTR2 TSSOP-1477504PAT0015OSPI MOS7 OSPI 0HVTT704 MC74VHCT04ADTR2 TSSOP-14772509923MPC - MPC 0HVTT7244 MC74VHCT244ADT TSSOP-20775049923MPC - MPC 0HVTT7244 MC74VHCT244ADT TSSOP-20772509905MPC - MPC 0HVTT7245 MC74VHCT245ADT TSSOP-20775049905MPC - MPC 0HVTT7245 MC74VHCT245ADT TSSOP-20772509927MPC BMC MPC 0HVTT7245 MC74VHCT245ADT TSSOP-20775049927MPC BMC MPC 0HVTT7245 MC74VHCT245ADT TSSOP-20772509946OSPI - OSPI 0HVTT7245 MC74VHCT245ADT TSSOP-20775049946OSPI - OSPI 0HVTT7245 MC74VHCT245ADT TSSOP-20772509914MPC - MPC 0VCTD4051 MC74VHCT4051D SOIC-16775049914MPC - MPC 0VCTD4051 MC74VHCT4051D SOIC-16772509914MPC - MPC 0VCTT4051 MC74VHCT4051DT TSSOP-16775049914MPC - MPC 0VCTT4051 MC74VHCT4051DT TSSOP-16772509914MPC - MPC 0VCTD4053 MC74VHCT4053D SOIC-16775049914MPC - MPC 0VCTD4053 MC74VHCT4053D SOIC-16772509914MPC - MPC 0VCTT4053 MC74VHCT4053DT TSSOP-16775049914MPC - MPC 0VCTT4053 MC74VHCT4053DT TSSOP-1677250PAU0016OSPI MOS7 OSPI 0HVTT7541 MC74VHCT541ADT TSSOP-2077504PAU0016OSPI MOS7 OSPI 0HVTT7541 MC74VHCT541ADT TSSOP-20772509947OSPI TESLA OSPI 0HVTT7574 MC74VHCT574ADT TSSOP-20775049947OSPI TESLA OSPI 0HVTT7574 MC74VHCT574ADT TSSOP-2077250PAD0020OSPI CSM OSPI 0HVTT7574 MC74VHCT574ADT TSSOP-2077504PAD0020OSPI CSM OSPI 0HVTT7574 MC74VHCT574ADT TSSOP-20772509915MPC BMC MPC 0HVTT7574 MC74VHCT574ADT TSSOP-20775049915MPC BMC MPC 0HVTT7574 MC74VHCT574ADT TSSOP-2077250PBA0027OSPI TESLA OSPI 0HVUD704 MC74VHCU04D SOIC-1477504PBA0027OSPI TESLA OSPI 0HVUD704 MC74VHCU04D SOIC-1477250PAQ0027OSPI CSM OSPI 0HVTT7574 MC74VHCT574ADTR2 TSSOP-2077504PAQ0027OSPI CSM OSPI 0HVTT7574 MC74VHCT574ADTR2 TSSOP-20

ON SemiconductorReliability Audit Report 342000

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Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

916373335 1.000 10000000003535098 55VHC2000 2.513 39793076084913300569118 0.278 359712230212732622 55Logic2000 0.698 143266475632309 0

0Rej.

High Temperature Gate BiasTa = +125°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - HD TMOS III

Test Conditions:

801008 -Sbn Newport PHX 0XE4209W NTGS3443T1 TSOP-6801008 -Sbn CDMC PHX 0XE4209W NTGS3443T1 TSOP-6801008 -Sbn CDMC PHX 0XE4209W NTGS3443T1 TSOP-6801008 -Sbn Siliconix PHX 0XE5531L MGSF3441XT1 TSOP-6

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

25048245 36.589 27330618322560 55HD TMOS III2000 91.923 108786703203919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Gate BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - HD TMOS III

Test Conditions:

841008 -SBN CDMC PHX 0XE4241L MGSF3441VT1 TSOP-6841008 -SBN CDMC PHX 0XE4241L MGSF3441VT1 TSOP-6841008 -SBN CDMC PHX 0XE4241L MGSF3441VT1 TSOP-6841008 -SBN CDMC PHX 0XE4241L MGSF3441VT1 TSOP-6801008 -Amt

(A t )Newport PHX 0SOD4205 MMSF4205R2 SOIC-8

801008 -Amt(A t )

Newport PHX 0SOD4205 MMSF4205R2 SOIC-8801008 -Aap1

(A i)Newport PHX 0SOP4210W NTQD6866 TSSOP-8

801008 -Aap1(A i)

Newport PHX 0SOP4210W NTQD6866 TSSOP-850960011SBN PHX SBN 0PFC3302 MTD3302T4 DPAK50960007SBN PHX SBN 0PFC3302 MTD3302T4 DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

173898211 5.270 189753321670848 55HD TMOS III2000 13.241 755229977563919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Reverse BiasTa = +125°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - HD TMOS III

Test Conditions:

801008 -Sbn CDMC PHX 0XE4209W NTGS3443T1 TSOP-6801008 -Sbn Newport PHX 0XE4241L MGSF3441VT1 TSOP-6801008 -Sbn Siliconix PHX 0XE5531L MGSF3441XT1 TSOP-6

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

18786184 48.786 20497684241920 55HD TMOS III2000 122.563 81590692403919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

ON SemiconductorReliability Audit Report 352000

Page 46: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - HD TMOS III

Test Conditions:

841008 -SBN CDMC PHX 0XE4241L MGSF3441VT1 TSOP-6841008 -SBN CDMC PHX 0XE4241L MGSF3441VT1 TSOP-6841008 -SBN CDMC PHX 0XE4241L MGSF3441VT1 TSOP-6841008 -SBN CDMC PHX 0XE4241L MGSF3441VT1 TSOP-6801008 -Amt

(A t )Newport PHX 0SOD4205 MMSF4205R2 SOIC-8

801008 -Amt(A t )

Newport PHX 0SOD4205 MMSF4205R2 SOIC-8801008 -Amt

(A t )Newport PHX 0SOD4205 MMSF4205R2 SOIC-8

801008 -Amt(A t )

Newport PHX 0SOD4205 MMSF4205R2 SOIC-8801008 -Amt

(A t )Newport PHX 0SOD4205 MMSF4205R2 SOIC-8

801008 -Amt(A t )

Newport PHX 0SOD4205 MMSF4205R2 SOIC-8801008 -Aap1

(A i)Newport PHX 0SOP4210W NTQD6866 TSSOP-8

801008 -Sbn Newport PHX 0XE4209W NTGS3443T1 TSOP-6801008 -Sbn CDMC PHX 0XE4209W NTGS3443T1 TSOP-6801008 -Sbn Siliconix PHX 0XE5531L MGSF3441XT1 TSOP-650960011SBN PHX SBN 0PFC3302 MTD3302T4 DPAK50960007SBN PHX SBN 0PFC3302 MTD3302T4 DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

299319932 3.062 3265839321154688 55HD TMOS III2000 7.692 13000520012363919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Gate BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - HD TMOS

Test Conditions:

801008 -Amt(A t )

Aizu-6 PHX 0SOD9524 MMDF6N02HDR2 SOIC-8801008 -Amt

(A t )Aizu-6 PHX 0SOD9524 MMDF6N02HDR2 SOIC-8

801008 -Amt(A t )

Aizu-6 PHX 0SOD9524 MMDF6N02HDR2 SOIC-88010080013Amt

(A t )Aizu-4 PHX 0SOD9524 MMDF6N02HDR2 SOIC-8

801008 -Amt(A t )

Newport PHX 0SOD9524 MMDF6N02HDR2 SOIC-8801008 -Aap1

(A i)Mos-7 4” PHX 0SOD9524 MMDF6N02HDR2 SOIC-8

801008 -Amt(A t )

Newport PHX 0SOD9510 MMDF4N01HDR2 SOIC-850960003SBN PHX SBN 0PFC4310 MTD20N03HDLT4 DPAK50960018SBN PHX SBN 0PFC4310 MTD20N03HDLT4 DPAK50960001SBN PHX SBN 0PFC9610 MTD20N06HDT4 DPAK50960005SBN PHX SBN 0PFC9610 MTD20N06HDT4 DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

151302393 6.057 165098233583680 55HD TMOS2000 15.218 657116577603919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

ON SemiconductorReliability Audit Report 362000

Page 47: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - HD TMOS

Test Conditions:

801008 -Amt(A t )

Aizu-6 PHX 0SOD9524 MMDF6N02HDR2 SOIC-8801008 -Amt

(A t )Aizu-6 PHX 0SOD9524 MMDF6N02HDR2 SOIC-8

801008 -Amt(A t )

Aizu-6 PHX 0SOD9524 MMDF6N02HDR2 SOIC-88010080013Amt

(A t )Aizu-4 PHX 0SOD9524 MMDF6N02HDR2 SOIC-8

801008 -Amt(A t )

Newport PHX 0SOD9524 MMDF6N02HDR2 SOIC-8801008 -Amt

(A t )Newport PHX 0SOD9524 MMDF6N02HDR2 SOIC-8

801008 -Amt(A t )

Newport PHX 0SOD9524 MMDF6N02HDR2 SOIC-8801008 -Amt

(A t )Newport PHX 0SOD9524 MMDF6N02HDR2 SOIC-8

801008 -Aap1(A i)

Mos-7 4” PHX 0SOD9524 MMDF6N02HDR2 SOIC-8801008 -Aap1

(A i)Mos-7 4” PHX 0SOD9524 MMDF6N02HDR2 SOIC-8

801008 -Amt(A t )

Newport PHX 0SOD9510 MMDF4N01HDR2 SOIC-8801008 -Amt

(A t )Newport PHX 0SOD9510 MMDF4N01HDR2 SOIC-8

50960003SBN PHX SBN 0PFC4310 MTD20N03HDLT4 DPAK50960018SBN PHX SBN 0PFC4310 MTD20N03HDLT4 DPAK50960001SBN PHX SBN 0PFC9610 MTD20N06HDT4 DPAK50960005SBN PHX SBN 0PFC9610 MTD20N06HDT4 DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

255820494 3.583 279095730986880 55HD TMOS2000 9.000 11111111111603919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Forward BiasTa = +100°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - IGBT

Test Conditions:

501200013GDL PHX GDL 0PFF3794 STP8039LFBL TO-220MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

118759 7717.310 1295796000 55IGBT2000 19388.004

51578503919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Gate BiasTa = +175°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - IGBT

Test Conditions:

1291008 -Gdl Mos-7A6”

PHX 0PFF3996 MGP15N43CL TO-2201291008 -Gdl Mos-7A

6”PHX 0PFF3996 MGP15N43CL TO-220

1291008 -Gdl Mos-7A6”

PHX 0PFF3996 MGP15N43CL TO-220MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

295079760 3.106 321957502390096 55IGBT2000 7.803 1281558373873919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

ON SemiconductorReliability Audit Report 372000

Page 48: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - IGBT

Test Conditions:

501200004GDL PHX GDL 0PFF3792 MGP20N35CL TO-220501200011GDL PHX GDL 0PFF3794 MGP20N40CL TO-220501200012GDL PHX GDL 0PFF3794 MGP20N40CL TO-220501200020GDL PHX GDL 0PFF3990 STP1060 TO-220501200021GDL PHX GDL 0PFF3990 STP1060 TO-220501200003GDL PHX GDL 0PFF3792 STP8022 TO-220501200010GDL PHX GDL 0PFF3792 STP8022 TO-220501200015GDL PHX GDL 0PFF3792 STP8022 TO-220501200016GDL PHX GDL 0PFF3792 STP8022 TO-220501200002GDL PHX GDL 0PFF3794 STP8038 TO-220501200005GDL PHX GDL 0PFF3794 STP8039LFBL TO-220501200007GDL PHX GDL 0PFF3794 STP8039LFBL TO-220501200008GDL PHX GDL 0PFF3794 STP8039LFBL TO-220501200009GDL PHX GDL 0PFF3794 STP8039LFBL TO-220501200013GDL PHX GDL 0PFF3794 STP8039LFBL TO-220501200017GDL PHX GDL 0PFF3794 STP8039LFBL TO-220501200023GDL PHX GDL 0PFF3794 STP8039LFBL TO-220501200024GDL PHX GDL 0PFF3794 STP8039LFBL TO-220501200018GDL PHX GDL 0PFF3792 STP8053 TO-220

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

29551249 31.014 32243503114000 55IGBT2000 77.915 128344999503919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Reverse BiasTa = +175°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - IGBT

Test Conditions:

1291008 -Gdl Mos-7A6”

PHX 0PFF3996 MGP15N43CL TO-2201291008 -Gdl Mos-7A

6”PHX 0PFF3996 MGP15N43CL TO-220

1291008 -Gdl Mos-7A6”

PHX 0PFF3996 MGP15N43CL TO-220MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

295079760 3.106 321957502390096 55IGBT2000 7.803 1281558373873919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Reverse Bias-AvalancheTj = +175°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - IGBT

Test Conditions:

1291008 -Gdl Mos-7A6”

PHX 0PFF3996 MGP15N43CL TO-2201291008 -Gdl Mos-7A

6”PHX 0PFF3996 MGP15N43CL TO-220

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

196719840 4.659 214638334260064 55IGBT2000 11.704 854408752583919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

ON SemiconductorReliability Audit Report 382000

Page 49: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

High Temperature Gate BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - TMOS II

Test Conditions:

801008 -PSI Mos-4 PHX 0PFN6578 MTW10N100E TO-247451008 -PSI Mos-4 PHX 0PFN6578 MTW10N100E TO-247801008 -PSI Mos-4 PHX 0PFN6578 MTW10N100E TO-247801008 -Stm (S) Mos-4 PHX 0PFN6578 MTW10N100E TO-247801008 -PSI Mos-4 PHX 0PFR6550 MTY25N60E TO-264801008 -PSI Mos-4 PHX 0PFR6550 MTY25N60E TO-264801008 -Team

P ifiMos-4 PHX 0PFR6550 MTY25N60E TO-264

801008N/APSI Mos-4 PHX 0PFN7156 STW1019 TO-247801008N/APSI Mos-4 PHX 0PFN7156 STW1019 TO-247801008N/APSI Mos-4 PHX 0PFN7156 STW1019 TO-247801008N/AStm (S) Mos-4 PHX 0PFN7156 STW1019 TO-247801008 -Tesla Mos-7 4” PHX 0PFA6580 MTP3N120E TO-220801008 -Tesla Mos-7 4” PHX 0PFA6580 MTP3N120E TO-220801008 -Tesla Mos-7 4” PHX 0PFA6580 MTP3N120E TO-22050960019SBN PHX SBN 0PFC2394 MTD6N15T4 DPAK50960022SBN PHX SBN 0PFC3144 MTD10N10ELT4 DPAK50960023SBN PHX SBN 0PFC6144 MTD9N10ET4 DPAK50960009SBN PHX SBN 0PFC6240 MTD1N50ET4 DPAK50960024SBN PHX SBN 0PFC6410 MTD6N20ET4 DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

289726664 3.163 3161555491117680 55TMOS II2000 7.947 12583364813353919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Gate BiasTa = +175°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - TMOS II

Test Conditions:

811008 -PSI Mos-7A6”

PHX 0PLM6404X PTB6404-5L D2PAK-5811008 -PSI Mos-7A

6”PHX 0PLM6404X PTB6404-5L D2PAK-5

811008 -PSI Mos-7A6”

PHX 0PLM6404X PTB6404-5L D2PAK-5MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

185282640 4.946 202183583244944 55TMOS II2000 12.427 804699442433919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - TMOS II

Test Conditions:

801008 -PSI Mos-4 PHX 0PFN6578 MTW10N100E TO-247451008 -PSI Mos-4 PHX 0PFN6578 MTW10N100E TO-247801008 -PSI Mos-4 PHX 0PFN6578 MTW10N100E TO-247801008 -Stm (S) Mos-4 PHX 0PFN6578 MTW10N100E TO-247801008 -PSI Mos-4 PHX 0PFR6550 MTY25N60E TO-264

ON SemiconductorReliability Audit Report 392000

Page 50: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

801008 -PSI Mos-4 PHX 0PFR6550 MTY25N60E TO-264801008N/APSI Mos-4 PHX 0PFN7156 STW1019 TO-247801008N/APSI Mos-4 PHX 0PFN7156 STW1019 TO-247801008N/AStm (S) Mos-4 PHX 0PFN7156 STW1019 TO-247801008 -Tesla Mos-7 4” PHX 0PFA6580 MTP3N120E TO-220801008 -Tesla Mos-7 4” PHX 0PFA6580 MTP3N120E TO-220801008 -Tesla Mos-7 4” PHX 0PFA6580 MTP3N120E TO-2205010000001PSI - PSI 0PFC6144P STD9N10ET4 DPAK5010000010PSI - PSI 0PFC6144P STD9N10ET4 DPAK5010000023PSI - PSI 0PFC6144P STD9N10ET4 DPAK5010000034PSI - PSI 0PFC6144P STD9N10ET4 DPAK50960019SBN PHX SBN 0PFC2394 MTD6N15T4 DPAK50960022SBN PHX SBN 0PFC3144 MTD10N10ELT4 DPAK50960023SBN PHX SBN 0PFC6144 MTD9N10ET4 DPAK50960009SBN PHX SBN 0PFC6240 MTD1N50ET4 DPAK50960024SBN PHX SBN 0PFC6410 MTD6N20ET4 DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

299763719 3.057 3271180901156400 55TMOS II2000 7.681 13019138113753919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Gate BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - TMOS IV

Test Conditions:

801008 -- - PHX 0PFF3748 SLP1004 TO-220801008 -Gdl PHENIT

ECPHX 0PFF3748 SLP1004 TO-220

801008 -Gdl PHENITEC

PHX 0PFF3748 SLP1004 TO-220501200002GDL PHX GDL 0PFA3744 MLP2N06CL TO-22050960026SBN PHX SBN 0PFC3748 SLD1004T4 DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

65510452 13.990 71479628252720 55TMOS IV2000 35.147 284519303403919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Blocking BiasTa = +125°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - TMOS IV

Test Conditions:

801008010Gdl PHENITEC

PHX 0PFF3748 SLP1004 TO-220MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

6262061 146.358 683256180640 55TMOS IV2000 367.690 2719682803919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - TMOS IV

Test Conditions:

801008 -- - PHX 0PFF3748 SLP1004 TO-220801008 -Gdl PHENIT

ECPHX 0PFF3748 SLP1004 TO-220

ON SemiconductorReliability Audit Report 402000

Page 51: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

801008 -Gdl PHENITEC

PHX 0PFF3748 SLP1004 TO-220501200002GDL PHX GDL 0PFA3744 MLP2N06CL TO-22050960026SBN PHX SBN 0PFC3748 SLD1004T4 DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

65510452 13.990 71479628252720 55TMOS IV2000 35.147 284519303403919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Gate BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - TMOS V

Test Conditions:

50960014SBN PHX SBN 0PFC10421 MTD5P06V DPAK50960017SBN PHX SBN 0PFC10421 MTD5P06VT4 DPAK50960006SBN PHX SBN 0PFC10426 MTD20N06VT4 DPAK50960016SBN PHX SBN 0PFC10426 MTD20N06VT4 DPAK50960008SBN PHX SBN 0PFC12420 STD1009VT4 DPAK50960012SBN PHX SBN 0PFC12420 STD1066-001 DPAK50960025SBN PHX SBN 0PFC12420 NTD3055AVLT4 DPAK50960020SBN PHX SBN 0PFC12420 STD1009V-001 DPAK50960021SBN PHX SBN 0PFC12420 STD1066-001 DPAK50960010SBN PHX SBN 0PFC12426 MTD15N06VL1 DPAK50960004SBN PHX SBN 0PFC14420 MTD3055VT4 DPAK50960002SBN PHX SBN 0PFC3458 MTD3055ELT4 DPAK50960013SBN PHX SBN 0PFC3700 STD1056T4 DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

16175420 56.660 1764913562400 55TMOS V2000 142.346 70251366503919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Gate BiasTa = +175°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - TMOS V

Test Conditions:

801008 -SBN Mos-7 4” PHX 0PFC10422 MTD15N06V1 DPAK801008 -SBN Mos-7 4” PHX 0PFC10422 MTD15N06V1 DPAK801008 -SBN Mos-7 4” PHX 0PFC10422 MTD15N06V1 DPAK801008 -SBN Mos-7 4” PHX 0PFC10422 MTD15N06V1 DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

243993600 3.756 266240682322560 55TMOS V2000 9.437 1059658793203919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Reverse BiasTa = +150°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - TMOS V

Test Conditions:

5010000002PSI - PSI 0PFC8611 MTD2955ET4 DPAK501200026GDL PHX GDL 0PFA10427 MTP2955V TO-22050960014SBN PHX SBN 0PFC10421 MTD5P06V DPAK50960017SBN PHX SBN 0PFC10421 MTD5P06VT4 DPAK

ON SemiconductorReliability Audit Report 412000

Page 52: Reliability Audit Report 2000 Life Test Data Audit Report 2000 Life Test Data ON Semiconductor Reliability Audit Report 2000 i Key Contacts: Tom Grzybowski Manager, ON Product Reliability

Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

50960006SBN PHX SBN 0PFC10426 MTD20N06VT4 DPAK50960016SBN PHX SBN 0PFC10426 MTD20N06VT4 DPAK50960008SBN PHX SBN 0PFC12420 STD1009VT4 DPAK50960012SBN PHX SBN 0PFC12420 STD1066-001 DPAK50960025SBN PHX SBN 0PFC12420 NTD3055AVLT4 DPAK50960020SBN PHX SBN 0PFC12420 STD1009V-001 DPAK50960021SBN PHX SBN 0PFC12420 STD1066-001 DPAK50960010SBN PHX SBN 0PFC12426 MTD15N06VL1 DPAK50960004SBN PHX SBN 0PFC14420 MTD3055VT4 DPAK50960002SBN PHX SBN 0PFC3458 MTD3055ELT4 DPAK50960013SBN PHX SBN 0PFC3700 STD1056T4 DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

30691823 29.861 33488497118400 55TMOS V2000 75.020 133297797503919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Reverse BiasTa = +175°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - TMOS V

Test Conditions:

801008 -SBN Mos-7 4” PHX 0PFC10422 MTD15N06V1 DPAK801008 -SBN Mos-7 4” PHX 0PFC10422 MTD15N06V1 DPAK801008 -SBN Mos-7 4” PHX 0PFC10422 MTD15N06V1 DPAK801008 -SBN Mos-7 4” PHX 0PFC10422 MTD15N06V1 DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

243993600 3.756 266240682322560 55TMOS V2000 9.437 1059658793203919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

Steady State Operating LifeTa = +25°C, Tj = 175°C, Pd = 100%

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - TMOS V

Test Conditions:

801008009SBN PHENITEC

PHX 0PFC12420 MTD3055VL1 DPAK801008009SBN PHENIT

ECPHX 0PFC12420 MTD3055VL1 DPAK

801008009SBN PHENITEC

PHX 0PFC12420 MTD3055VL1 DPAK801008009SBN PHENIT

ECPHX 0PFC12420 MTD3055VL1 DPAK

801008010SBN PHENITEC

PHX 0PFC10422 MTD15N06V1 DPAK801008010SBN PHENIT

ECPHX 0PFC10422 MTD15N06V1 DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

365990400 2.504 399361022483840 55TMOS V2000 6.291 1589572414803919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Gate BiasTa = +175°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - TMOS VII

Test Conditions:

801008 -Sbn Aizu-4 PHX 0PFC21912 NTD32N06L DPAK801008 -Sbn Aizu-4 PHX 0PFC21912 NTD32N06L DPAK801008 -Sbn Aizu-4 PHX 0PFC21912 NTD32N06L DPAK

ON SemiconductorReliability Audit Report 422000

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Reliability Audit Report 2000Life Test Detail Report

The Reject Summary is at the end of this report

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

182995200 5.008 199680511241920 55TMOS VII2000 12.582 794786202403919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

High Temperature Reverse BiasTa = +175°C, Various Bias Conditions

SampleHrs/CycDateCodeMfg Site Waf Site Test Site ResultsLine Device Package

MOS Gated - TMOS VII

Test Conditions:

801008 -Sbn Aizu-4 PHX 0PFC21912 NTD32N06L DPAK801008 -Sbn Aizu-4 PHX 0PFC21912 NTD32N06L DPAK801008 -Sbn Aizu-4 PHX 0PFC21912 NTD32N06L DPAK

MTBF 60%FIT 60%T1Units Cum. HoursSummary Product/Technology EQ Hrs @ T1 MTBF 90%FIT 90%

182995200 5.008 199680511241920 55TMOS VII2000 12.582 794786202403919616058 0.234 427350427410019536 55MOS Gated2000 0.587 170357751313217 0

0Rej.

ON SemiconductorReliability Audit Report 432000

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2000Reliability Audit ReportLife Test Reject Summary

TechnologyDateCodeMfg Site Waf Site Test Site CommentsLine Device Package

High Temperature Reverse Bias

Open Junction0026GDL PHX GDL MoistureRL601M MR751RL Case-194Open Junction0014GDL PHX GDL Ionic ContamRL601M MR754 Case-194Open Junction0003GDL PHX GDL Chipped DieRL602M MR760 Case-194

ON SemiconductorReliability Audit Report 442000

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