PCN15880- Burn-In Site Expansion to TTTJ S9S08AW16A/AW60 ...
Transcript of PCN15880- Burn-In Site Expansion to TTTJ S9S08AW16A/AW60 ...
PCN15880- Burn-In Site Expansion to TTTJS9S08AW16A/AW60/DZ60/DZ128/QD4
Product Page
Number
S9S08AW16A (0M62J/1M62J) 1
S9S08AW60 (5M75B/7M75B) 18
S9S08DZ60_AUTO (1M74K/2M74K) 35
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S9S08DZ128_AUTO (2M78G) 52
S9S08QD4_AUTO (1M15D/2M15D) 69
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Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service
names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are
the property of their respective owners. © Freescale Semiconductor, Inc. 2006.
TM
24/09/13, Mu Kuan
KES-China Burn-In to Trio Tech-Tianjin Burn-In Expansion0M62J/1M62J - 9S08AW16A Correlation
0. Introduction – Reason for Burn-In Expansion
� Logistical Expansion
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owners. © Freescale Semiconductor, Inc. 2006.
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1. Objective and Considerations
1.1 Objective
� Objective is to qualify Trio Tech-Tianjin(TTTJ) Burn-In facility as joint Burn-In site
for 0M62J/1M62J. Complete list of affected parts is outlined in PCN15880.
� This report details the correlation result of below FSL part# to demonstrate that
KES-China(KESC) Burn-In facility correlates with the TTTJ Burn-In facility.
� No impact of customer deliveries
� Completed on Sep/20/2013
1.2 Considerations
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owners. © Freescale Semiconductor, Inc. 2006.
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� Burn-In Platform Hardware in TTTJ is identical platform used in KESC, and
verified by dual site correlation analysis.
� Identical Burn-In board design used in both sites
� Burn-In drivers are the same in both sites.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.1 Introduction:
This report details the burn-in correlation plan and result of S9S08AW16A QFN48 & LQFP44 with correlation vehicle, so that the TrioTech-
Tianjin(TTTJ) site can burn-in the same production line as in the KES-China(KESC) site. These correlation units were first processed at the KESC BI site
and then processed in TTTJ, with the ambient burn-in temperature at 125°C.
S9S08AW16A ( LPN:AC16_Auto)
Mask set: 0M62J/1M62J
Production Line: G9FZAW6A / G9ZZAW6A
Package code: 8256/6152
• TTTJ
Hardware:
Burn-in System : IBE
Burn-in Pattern Generator : Flash Memory
Burn-in Driver : CC3
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Slide 4
Burn-in Driver : CC3
Burn-in Program Software: : MBI
Environment Plan : 125C
Burn-in Program(s) : AC16_QFP44
AC16_QFN48
• KESC
Hardware:
Burn-in System : IBE
Burn-in Pattern Generator : Flash Memory
Burn-in Driver : CC3
Burn-in Program Software: : MBI
Environment Plan : 125C
Burn-in Program(s) : AC16_QFP44
AC16_QFN48
Conclusion: Same hardware and software environment were used in both TTTJ and KESC
Correlation Results (CHD - TJN)2. Burn In Qualification Results
• Correlation Lot Information:
BI Site Wafer Lot # Final Test Lot # Device Part ID Package Mask/Rev Qty.
TTTJ T1TH532031 YZMEA1GK5P02 S9S08AW16AE0MLDR LQFP44 0M62J 500
TTTJ T1TH532071 YZMEA1GK5Q02 S9S08AW16AE0MLDR LQFP44 0M62J 500
TTTJ T1TH529141 YZMEA1GM8Q02 S9S08AW16AE0MLDR LQFP44 0M62J 500
TTTJ T1TH385111 YZMEA1B64P02 S9S08AW16AE0VLD QFN48 0M62J 500
TTTJ T1TH385091 YZMEA1B9J302 S9S08AW16AE0VLD QFN48 0M62J 500
TTTJ T1TH384751 YZMEA1BKZN02 S9S08AW16AE0VLD QFN48 0M62J 500
KESC T1TH532031 YZMEA1GK5P01 S9S08AW16AE0MLDR LQFP44 0M62J 500
KESC T1TH532071 YZMEA1GK5Q01 S9S08AW16AE0MLDR LQFP44 0M62J 500
KESC T1TH529141 YZMEA1GM8Q01 S9S08AW16AE0MLDR LQFP44 0M62J 500
KESC T1TH385111 YZMEA1B64P01 S9S08AW16AE0VLD QFN48 0M62J 500
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Slide 5
KESC T1TH385111 YZMEA1B64P01 S9S08AW16AE0VLD QFN48 0M62J 500
KESC T1TH385091 YZMEA1B9J301 S9S08AW16AE0VLD QFN48 0M62J 500
KESC T1TH384751 YZMEA1BKZN01 S9S08AW16AE0VLD QFN48 0M62J 500
2.2 Engineering Qualification Plan
2.2.1 Requirements:
The requirements and acceptance criteria based on agreements between AMPG Reliability and AMPG Product Engineering. If a
specification exists for this transfer/change, then the specification overrides these requirements.
2. Burn In Qualification Results
NameDetail Description
Req’d per
Correlation
Plan,
(Y / N?)
Acceptance Criteria Comment
Pattern Verify
Goal: Correlate and verify correct functionality of burn-in
patterns, cycling, etc
Lot quantity: 1
Units per lot: 5
Temperature: 25C, or as possible
BI Duration: N/A
Y
Correct pattern written
to array or other
product module(s)
This capability may be dependent upon
type of product.
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owners. © Freescale Semiconductor, Inc. 2006.
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BI Duration: N/A
Type of units: good
Site: TTTJ
Equipment
Release
Goal: Calibration and verification of entire system
according to site standard equipment release procedure
(May include performing voltage calibration on all drivers
including debug station, meet GR&R requirements, etc.)
Lot quantity / Units per lot: 0
Temperature: BI Ta
BI Duration: N/A
Type of units: N/A
Site: TTTJ
YApproval by
manufacturing CAB.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
Burn-in Board
Voltages
Goal: Verify that the parts on the burn-in board are
receiving the correct voltage
Lot quantity: 1
Units per lot: Empty and Full Board
Temperature: BI Ta
BI Duration: N/A
Type of units: good
Site: TTTJ and KESC
Y
Voltage within range of
target to be agreed by
PE/TE and R&QA.
Measure at front & back of empty and full
burn-in board.
Package Case
Temperature
Goal: Compare temperature at surface of mold compound
or on-chip temperature monitor
Lot quantity: 1
Units per lot: Full Board
Temperature: BI Ta
BI Duration: N/A
Type of units: good
Y
Less than 15%
variation or to be
agreed by PE/TE and
R&QA.
Thermocouples on five units with full burn-
in board running stress pattern. For high
power devices, also verify with single part
on nearly-empty board to ensure no
overheating.
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Slide 7
Type of units: good
Site: TTTJ and KESC
overheating.
Ambient
Temperature (Ta)
Goal: Compare temperature of air inside chamber
Lot quantity: 1
Units per lot: Full Board
Temperature: BI Ta
Type of units: good
BI Duration: N/A
Site: TTTJ and KESC
Y
Less than 10%
variation or to be
agreed by PE/TE and
R&QA.
One thermocouple. Can be performed
along with Package Case Temperature.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
Burn-in Board
Current
Goal: Compare burn-in board current
Lot quantity: 1
Units per lot: Full board
Temperature: BI Ta
BI Duration: N/A
Type of units: good
Site: TTTJ and KESC
Y
Less than 15% variation
or to be agreed by PE/TE
and R&QA.
Best measured on individual devices. Or
measure entire full board current minus
empty board current divided by # of devices
on full board.
Three Lot Burn-in
Check
Goal: Verify that burn-in system does not cause abnormal non-
burn-in failures
Lot quantity: 3
Units per lot: 500
Temperature: BI Ta
BI Duration: Typical BI Duration
Type of units: good
Site: TTTJ
Y
Address manufactur-
ability / over-stress
issues.
Run through standard test flow.
Burn-in Yield
Goal: Verify that burn-in system does not cause unusually low
yield
Lot quantity: 1
Units per lot: 500Optional
Post BI yield within PDA
limit or agreed up by May set a target here based on typical yields.
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Slide 8
Burn-in YieldUnits per lot: 500
Temperature: BI Ta
BI Duration: Typical BI Duration
Type of units: good
Site: TTTJ and KESC
Optional limit or agreed up by
PE/TE and R&QA.
May set a target here based on typical yields.
Visual
Inspection
Goal: Check for visual mechanicalLot quantity: 1
Units per lot: 500 Temperature: 25C BI Duration: N/A Type of units: goodSite: TTTJ and KESC
Y
Less than 2%
variation or agreed
upon by PE/TE and
R&QA.
Use the same units from Burn-in
Yield check in BI correlation.
Solderability
Test
Goal: Check for solderability on the leads Lotquantity: 1 lot for each packageUnits per lot: 20Type of units: goodSite: TTTJ
YAs per
12MRM27364A
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.3 Correlation/Qualification Results:
2.3.1Pattern Verify:
Table 1 summarizes the pattern comparison results.
Table 1.
LQFP 44: Burn-in Board
Unit # Maskset BI Program BI Pattern Description KESC TTTJ
Unit 1 0M62J AC16_QFP44 Bin2 Check Pass Pass
Unit 2 0M62J AC16_QFP44 Bin2 Check Pass Pass
Unit 3 0M62J AC16_QFP44 Bin2 Check Pass Pass
Unit 4 0M62J AC16_QFP44 Bin2 Check Pass Pass
Unit 5 0M62J AC16_QFP44 Bin2 Check Pass Pass
QFN 48: Burn-in Board
Unit # Maskset BI Program BI Pattern Description KESC TTTJ
Unit 1 0M62J AC16_QFN48 Bin2 Check Pass Pass
Unit 2 0M62J AC16_QFN48 Bin2 Check Pass Pass
Unit 3 0M62J AC16_QFN48 Bin2 Check Pass Pass
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Slide 9
Unit 3 0M62J AC16_QFN48 Bin2 Check Pass Pass
Unit 4 0M62J AC16_QFN48 Bin2 Check Pass Pass
Unit 5 0M62J AC16_QFN48 Bin2 Check Pass Pass
Conclusion: pattern verify pass.
2.3.2 Equipment Release: (TTTJ equipment Buy-off and release stuff, TTTJ CAB#120121220001)
2.3.3 Burn-in Board Voltage Measurements:
Tables 2 summarize the voltage measurements taken from an empty and full burn-in board.
Table 2. Burn-in Board Voltage Measurements at 125C
1) LQFP44
BIB Condition Driver Location Target
(V) KESC
(V) Delta from
Target (mV)
TTTJ(V) Delta from
Target (mV) Empty VDUT1 5.75 5.75 0 5.75 0
VDUT3 5.75 5.75 0 5.74 10
Full VDUT1 5.75 5.74 10 5.75 0
VDUT3 5.75 5.74 10 5.75 0
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2) QFN48
BIB Condition Driver Location Target
(V)
KESC
(V)
Delta from
Target (mV)
TTTJ(V)
Delta from
Target (mV)
Empty VDUT1 5.75 5.74 10 5.75 0
VDUT3 5.75 5.75 0 5.74 10
Full VDUT1 5.75 5.74 10 5.75 0
VDUT3 5.75 5.74 10 5.74 10
Conclusion: Passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.4 Package Case Temperature:
Table 3 shows the temperature of five chip packages run in a full burn-in board under normal burn-in conditions. At the time of
the measurement, the oven temperature had stabilized for 30 minutes and pattern was being executed. The thermocouples were
located in all four corner sockets and one socket at the center of the burn-in board (see Figure 1). The thermocouples were
epoxied to the top of the device.
Figure 1. Location of Thermocouples
51
3 Feedthrough
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Slide 11
4 2
Feedthrough
Connector
(Driver-side)
Correlation Results (CHD - TJN)2. Burn In Qualification Results
Table 3. Case Temperatures
1) LQFP44
Thermocouple # Thermocouple Location KESC (C) TTTJ (C) % Delta
1 Upper Left Corner 125.00 125.10 0.08% 2 Lower Left Corner 125.20 125.10 0.08% 3 Center of BIB 125.10 125.00 0.08% 4 Lower Right Corner 125.00 125.00 0.00% 5 Upper Right Corner 125.20 125.20 0.00%
2) QFN48
Thermocouple # Thermocouple Location KESC (C) TTTJ (C) % Delta
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Slide 12
1 Upper Left Corner 125.10 125.00 0.08% 2 Lower Left Corner 125.00 125.10 0.08% 3 Center of BIB 125.10 125.10 0.00% 4 Lower Right Corner 125.00 125.20 0.16% 5 Upper Right Corner 125.00 125.10 0.08%
Conclusion: Passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.5 Ambient Temperature:
Table 4 shows the ambient air temperature in the chamber while the burn-in system is running under normal operating conditions at BI Ta.
Table 4. Chamber Air Temperature
Thermocouple Location KESC (C) TTTJ (C) % Delta
Open Area in Chamber 125.10 125.00 0.08%
Conclusion: Passed requirement.
2.6 Burn-in Board Current:
Table5 shows the current reading on a full burn-in board running various patterns at BI Ta(125C).
Table 5. Burn-in Board Current
BI Program BI Pattern # Units on BIB KESC (A) TTTJ (A) % Delta
AC16_QFP44 AC16_QFP44 Full 0.6 0.6 0
AC16_QFN48 AC16_QFN48 Full 0.6 0.6 0
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Slide 13
AC16_QFN48 AC16_QFN48 Full 0.6 0.6 0
Conclusion: Passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.7 3-Lot Burn-in Check:
Table 6 shows the result of the burn-in check.
Table 6. 3-Lot Burn-in Check
Lot Package Burn-
in Site
Lot Size Burn-in
Result
YZMEA1GK5P02 10x10 LQFP44 TTJ 500 Pass
YZMEA1GK5Q02 10x10 LQFP44 TTJ 500 Pass
YZMEA1GM8Q02 10x10 LQFP44 TTJ 500 Pass
YZMEA1B64P02 7x7 QFN48 TTJ 500 Pass
YZMEA1B9J302 7x7 QFN48 TTJ 500 Pass
YZMEA1BKZN02 7x7 QFN48 TTJ 500 Pass
Conclusion: Passed requirement.
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Slide 14
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.8 Burn-in Yield:
Table 7 shows the result of the post burn-in yield.
Table 7. Burn-in Yield
Lot Package Burn-in Site Burn-in
Yield
YZMEA1GK5P02 10x10 LQFP44 TTTJ Pass
YZMEA1GK5Q02 10x10 LQFP44 TTTJ Pass
YZMEA1GM8Q02 10x10 LQFP44 TTTJ Pass
YZMEA1B64P02 7x7 QFN48 TTTJ Pass
YZMEA1B9J302 7x7 QFN48 TTTJ Pass
YZMEA1BKZN02 7x7 QFN48 TTTJ Pass
YZMEA1GK5P01 10x10 LQFP44 KESC Pass
YZMEA1GK5Q01 10x10 LQFP44 KESC Pass
YZMEA1GM8Q01 10x10 LQFP44 KESC Pass
YZMEA1B64P01 7x7 QFN48 KESC Pass
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Slide 15
YZMEA1B64P01 7x7 QFN48 KESC Pass
YZMEA1B9J301 7x7 QFN48 KESC Pass
YZMEA1BKZN01 7x7 QFN48 KESC Pass
Conclusion: No abnormal non-Burn-in failures found, all correlation lots BI yield variation less than criteria, passed requirement.
2.9 Visual inspection
Table 8 shows the result of the visual inspection post burn-in.
Table 8.Visual Inspection
BI Site Final Test Lot # Package Inspection Qty Visual Yield
TTTJ YZMEA1GK5P02 10x10 LQFP44 500 Pass
TTTJ YZMEA1B64P02 7x7 QFN48 500 Pass
KESC YZMEA1GK5P01 10x10 LQFP44 500 Pass
KESC YZMEA1B64P01 7x7 QFN48 500 Pass
Conclusion: All correlation lots VM yield variation less than criteria, passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.10 Solderability Test Table 11 shoes the result of solderability test post burn-in. Note: Test were done using 20 sample parts per package type
Table 11.Solderability Test
BI Site Final Test Lot # Package Test Qty Result
TTTJ YZMEA1GK5P02 10x10 LQFP44 20 Passed
TTTJ YZMEA1B64P02 7x7 QFN48 20 Passed
LQFP sample photos QFN sample photos
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Slide 16
Conclusion: All result showed passed
3. Conclusion and Recommendation
3.1 Conclusion
� Based on this report, 0M62J/1M62J passed all correlation requirements without any issues.
� TTTJ is capable to implement burn-in for S9S08AW16A QFN48 & LQFP44 package
3.2 Recommendation
� Burn-In for 0M62J/1M62J, QFN48 & LQFP44(6152/8256) can be released in TTTJ Burn-In.
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owners. © Freescale Semiconductor, Inc. 2006.
17
Freescale Semiconductor Confidential and Proprietary Information. Freescale™ and the
Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service
names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are
the property of their respective owners. © Freescale Semiconductor, Inc. 2006.
TM
24/09/13, Zhang Tao
KES-China Burn-In to Trio Tech-Tianjin Burn-In Expansion5M75B/7M75B- S9S08AW60 Correlation
0. Introduction – Reason for Burn-In Expansion
� Logistical Expansion
TMFreescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective
owners. © Freescale Semiconductor, Inc. 2006.
19
1. Objective and Considerations
1.1 Objective
� Objective is to qualify Trio Tech-Tianjin(TTTJ) Burn-In facility as joint Burn-In site
for 5M75B/7M75B. Complete list of affected parts is outlined in PCN15880.
� This report details the correlation result of below FSL part# to demonstrate that
KES-China(KESC) Burn-In facility correlates with the TTTJ Burn-In facility.
� No impact of customer deliveries
� Completed on Sep/20/2013
1.2 Considerations
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owners. © Freescale Semiconductor, Inc. 2006.
20
� Burn-In Platform Hardware in TTTJ is identical platform used in KESC, and
verified by dual site correlation analysis.
� Identical Burn-In board design used in both sites
� Burn-In drivers are the same in both sites.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.1 Introduction:
This report details the burn-in correlation plan and result of S9S08AW60 QFN48 & QFP44 with correlation vehicle, so that the TrioTech-Tianjin(TTTJ) site
can burn-in the same production line as in the KES-China(KESC) site. These correlation units were first processed at the KESC BI site and then processed in
TTTJ, with the ambient burn-in temperature at 125°C.
S9S08AW60
Mask set: 5M75B/7M75B
Production Line: G9FA8AW6/ G9ZA8AW6
Package code: 8256/6152
• TTTJ
Hardware:
Burn-in System : IBE
Burn-in Pattern Generator : Flash Memory
Burn-in Driver : CC3
Burn-in Program Software: : MBI
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owners. © Freescale Semiconductor, Inc. 2006.
Slide 21
Burn-in Program Software: : MBI
Environment Plan : 125C
Burn-in Program(s) : AW_44LQFP
AW_48QFN
• KESC
Hardware:
Burn-in System : IBE
Burn-in Pattern Generator : Flash Memory
Burn-in Driver : CC3
Burn-in Program Software: : MBI
Environment Plan : 125C
Burn-in Program(s) : AW_44LQFP
AW_48QFN
• Conclusion: Same hardware and software environment were used in both TTTJ and KESC
Correlation Results (CHD - TJN)2. Burn In Qualification Results
• Correlation Lot Information:
BI Site Wafer Lot # Final Test Lot # Device Part ID Package Mask/Rev Qty.
TTTJ T1TH147121 YZMEA15X2Q03 S9S08AW16E5MFGE LQFP44 5M75B 500
TTTJ T1TH527221 YZMEA1G9RM02 S9S08AW16E5MFGE LQFP44 5M75B 500
TTTJ T1TH533921 YZMEA1GEJQ02 S9S08AW16E5MFGE LQFP44 5M75B 500
TTTJ T1TH409111 YZMEA1BPDK02 S9S08AW32E5CFDE QFN48 5M75B 500
TTTJ T1TH390731 YZMEA1B0PW02 S9S08AW32E5CFDE QFN48 5M75B 500
TTTJ T1TH429561 YZMEA1D1MU02 S9S08AW32E5CFDE QFN48 5M75B 500
KESC T1TH147121 YZMEA15X2Q00 S9S08AW16E5MFGE LQFP44 5M75B 500
KESC T1TH527221 YZMEA1G9RM01 S9S08AW16E5MFGE LQFP44 5M75B 500
KESC T1TH533921 YZMEA1GEJQ01 S9S08AW16E5MFGE LQFP44 5M75B 500
KESC T1TH409111 YZMEA1BPDK01 S9S08AW32E5CFDE QFN48 5M75B 500
KESC T1TH390731 YZMEA1B0PW01 S9S08AW32E5CFDE QFN48 5M75B 500
KESC T1TH429561 YZMEA1D1MU01 S9S08AW32E5CFDE QFN48 5M75B 500
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Slide 22
2.2 Engineering Qualification Plan
2.2.1 Requirements:
The requirements and acceptance criteria based on agreements between AMPG Reliability and AMPG Product Engineering. If a
specification exists for this transfer/change, then the specification overrides these requirements.
2. Burn In Qualification Results
NameDetail Description
Req’d per
Correlation
Plan,
(Y / N?)
Acceptance Criteria Comment
Pattern Verify
Goal: Correlate and verify correct functionality of burn-in
patterns, cycling, etc
Lot quantity: 1
Units per lot: 5
Temperature: 25C, or as possible
BI Duration: N/A
Y
Correct pattern written
to array or other
product module(s)
This capability may be dependent upon
type of product.
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owners. © Freescale Semiconductor, Inc. 2006.
23
BI Duration: N/A
Type of units: good
Site: TTTJ
Equipment
Release
Goal: Calibration and verification of entire system
according to site standard equipment release procedure
(May include performing voltage calibration on all drivers
including debug station, meet GR&R requirements, etc.)
Lot quantity / Units per lot: 0
Temperature: BI Ta
BI Duration: N/A
Type of units: N/A
Site: TTTJ
YApproval by
manufacturing CAB.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
Burn-in Board
Voltages
Goal: Verify that the parts on the burn-in board are
receiving the correct voltage
Lot quantity: 1
Units per lot: Empty and Full Board
Temperature: BI Ta
BI Duration: N/A
Type of units: good
Site: TTTJ and KESC
Y
Voltage within range of
target to be agreed by
PE/TE and R&QA.
Measure at front & back of empty and full
burn-in board.
Package Case
Temperature
Goal: Compare temperature at surface of mold compound
or on-chip temperature monitor
Lot quantity: 1
Units per lot: Full Board
Temperature: BI Ta
BI Duration: N/A
Type of units: good
Y
Less than 15%
variation or to be
agreed by PE/TE and
R&QA.
Thermocouples on five units with full burn-
in board running stress pattern. For high
power devices, also verify with single part
on nearly-empty board to ensure no
overheating.
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Type of units: good
Site: TTTJ and KESC
overheating.
Ambient
Temperature (Ta)
Goal: Compare temperature of air inside chamber
Lot quantity: 1
Units per lot: Full Board
Temperature: BI Ta
Type of units: good
BI Duration: N/A
Site: TTTJ and KESC
Y
Less than 10%
variation or to be
agreed by PE/TE and
R&QA.
One thermocouple. Can be performed
along with Package Case Temperature.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
Burn-in Board
Current
Goal: Compare burn-in board current
Lot quantity: 1
Units per lot: Full board
Temperature: BI Ta
BI Duration: N/A
Type of units: good
Site: TTTJ and KESC
Y
Less than 15% variation
or to be agreed by PE/TE
and R&QA.
Best measured on individual devices. Or
measure entire full board current minus
empty board current divided by # of devices
on full board.
Three Lot Burn-in
Check
Goal: Verify that burn-in system does not cause abnormal non-
burn-in failures
Lot quantity: 3
Units per lot: 500
Temperature: BI Ta
BI Duration: Typical BI Duration
Type of units: good
Site: TTTJ
Y
Address manufactur-
ability / over-stress
issues.
Run through standard test flow.
Burn-in Yield
Goal: Verify that burn-in system does not cause unusually low
yield
Lot quantity: 1
Units per lot: 500Optional
Post BI yield within PDA
limit or agreed up by May set a target here based on typical yields.
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Burn-in YieldUnits per lot: 500
Temperature: BI Ta
BI Duration: Typical BI Duration
Type of units: good
Site: TTTJ and KESC
Optional limit or agreed up by
PE/TE and R&QA.
May set a target here based on typical yields.
Visual
Inspection
Goal: Check for visual mechanicalLot quantity: 1
Units per lot: 500 Temperature: 25C BI Duration: N/A Type of units: goodSite: TTTJ and KESC
Y
Less than 2%
variation or agreed
upon by PE/TE and
R&QA.
Use the same units from Burn-in
Yield check in BI correlation.
Solderability
Test
Goal: Check for solderability on the leads Lotquantity: 1 lot for each packageUnits per lot: 20Type of units: goodSite: TTTJ
YAs per
12MRM27364A
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.3 Correlation/Qualification Results:
2.3.1 Pattern Verify:
Table 1 summarizes the pattern comparison results.
Table 1
LQFP 44: Burn-in Board
Unit # Maskset BI Program BI Pattern Description KESC TTTJ
Unit 1 5M75B AW_44LQFP Bin2 Check Pass Pass
Unit 2 5M75B AW_44LQFP Bin2 Check Pass Pass
Unit 3 5M75B AW_44LQFP Bin2 Check Pass Pass
Unit 4 5M75B AW_44LQFP Bin2 Check Pass Pass
Unit 5 5M75B AW_44LQFP Bin2 Check Pass Pass
QFN 48: Burn-in Board
Unit # Maskset BI Program BI Pattern Description KESC TTTJ
Unit 1 5M75B AW_48QFN Bin2 Check Pass Pass
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Unit 1 5M75B AW_48QFN Bin2 Check Pass Pass
Unit 2 5M75B AW_48QFN Bin2 Check Pass Pass
Unit 3 5M75B AW_48QFN Bin2 Check Pass Pass
Unit 4 5M75B AW_48QFN Bin2 Check Pass Pass
Unit 5 5M75B AW_48QFN Bin2 Check Pass Pass
Conclusion: Passed requirement.
2. Burn In Qualification Results
2.3.2 Equipment Release: (TTTJ equipment Buy-off and release stuff, TTTJ CAB#120121220001)
2.3.3 Burn-in Board Voltage Measurements:
Tables 2 summarize the voltage measurements taken from an empty and full burn-in board.
Table 2. Burn-in Board Voltage Measurements at 125C
1) LQFP44
BIB Condition Driver Location Target
(V)
KESC
(V)
Delta from
Target (mV)
TTTJ(V)
Delta from
Target (mV)
Empty VDUT1 6.00 5.97 30 5.99 10
VDUT3 6.00 5.96 40 5.98 20
Full VDUT1 6.00 5.99 10 6.00 0
VDUT3 6.00 5.98 20 5.98 20
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27
2) QFN48
BIB Condition Driver Location Target
(V)
KESC
(V)
Delta from
Target (mV)
TTTJ(V)
Delta from
Target (mV)
Empty VDUT1 6.00 5.98 20 5.99 10
VDUT3 6.00 5.99 10 5.98 20
Full VDUT1 6.00 5.97 30 6.00 0
VDUT3 6.00 5.98 20 5.98 20
Conclusion: Passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.4 Package Case Temperature:
Table 3 shows the temperature of five chip packages run in a full burn-in board under normal burn-in conditions. At the time of
the measurement, the oven temperature had stabilized for 30 minutes and pattern was being executed. The thermocouples were
located in all four corner sockets and one socket at the center of the burn-in board (see Figure 1). The thermocouples were
epoxied to the top of the device.
Figure 1. Location of Thermocouples
51
3 Feedthrough
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Slide 28
4 2
Feedthrough
Connector
(Driver-side)
Correlation Results (CHD - TJN)2. Burn In Qualification Results
Table 3. Case Temperatures
1) LQFP44
Thermocouple # Thermocouple Location KESC (C) TTTJ (C) % Delta
1 Upper Left Corner 127.10 127.10 0.00%
2 Lower Left Corner 127.80 127.00 0.60%
3 Center of BIB 127.90 127.10 0.60%
4 Lower Right Corner 127.10 126.90 0.20%
5 Upper Right Corner 127.50 127.30 0.20%
2) QFN48
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Thermocouple # Thermocouple Location KESC (C) TTTJ (C) % Delta
1 Upper Left Corner 127.60 127.10 0.39%
2 Lower Left Corner 127.10 127.00 0.08%
3 Center of BIB 127.40 126.90 0.39%
4 Lower Right Corner 127.10 127.40 0.24%
5 Upper Right Corner 127.30 127.10 0.16%
Conclusion: Passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.5 Ambient Temperature:
Table 4 shows the ambient air temperature in the chamber while the burn-in system is running under normal operating conditions at BI Ta.
Table 4. Chamber Air Temperature
Thermocouple Location KESC (C) TTTJ (C) % Delta
Open Area in Chamber 126.80 126.90 0.10%
Conclusion: Passed requirement.
2.6 Burn-in Board Current:
Table 5 shows the current reading on a full burn-in board running various patterns at BI Ta.
Table 5. Burn-in Board Current
BI Program BI Pattern # Units on BIB KESC (A) TTTJ (A) % Delta
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AW_44LQFP AW_44LQFP Full 1.41 1.40 0.7% AW_48QFN AW_48QFN Full 1.40 1.38 1.4%
Conclusion: Passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.7 3-Lot Burn-in Check:
Table 6 shows the result of the burn-in check.
Table 6. 3-Lot Burn-in Check
Lot Package Burn-
in Site
Lot Size Burn-in
Result
YZMEA15X2Q03 10x10 LQFP44 TTTJ 500 Pass
YZMEA1G9RM02 10x10 LQFP44 TTTJ 500 Pass
YZMEA1GEJQ02 10x10 LQFP44 TTTJ 500 Pass
YZMEA1BPDK02 7x7 QFN48 TTTJ 500 Pass
YZMEA1B0PW02 7x7 QFN48 TTTJ 500 Pass
YZMEA1D1MU02 7x7 QFN48 TTTJ 500 Pass
Conclusion: Passed requirement.
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Slide 31
Conclusion: Passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results 2.8 Burn-in Yield:
Table 7 shows the result of the post burn-in yield.
Table 7. Burn-in Yield
Lot Package Burn-in Site Burn-in
YZMEA15X2Q03 10x10 LQFP44 TTTJ Pass
YZMEA1G9RM02 10x10 LQFP44 TTTJ Pass
YZMEA1GEJQ02 10x10 LQFP44 TTTJ Pass
YZMEA1BPDK02 7x7 QFN48 TTTJ Pass
YZMEA1B0PW02 7x7 QFN48 TTTJ Pass
YZMEA1D1MU02 7x7 QFN48 TTTJ Pass
YZMEA15X2Q00 10x10 LQFP44 KESC Pass
YZMEA1G9RM01 10x10 LQFP44 KESC Pass
YZMEA1GEJQ01 10x10 LQFP44 KESC Pass
YZMEA1BPDK01 7x7 QFN48 KESC Pass
7x7 QFN48 KESC Pass
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YZMEA1B0PW01 7x7 QFN48 KESC Pass
YZMEA1D1MU01 7x7 QFN48 KESC Pass
Conclusion: No abnormal non-Burn-in failures found, all correlation lots BI yield variation less than criteria, passed requirement.
2.9 Visual inspection
Table 8 shows the result of the visual inspection post burn-in.
Table 8.Visual Inspection
BI Site Final Test Lot # Package Inspection Qty Visual Yield
TTTJ YZMEA15X2Q03 10x10 LQFP44 500 Pass
TTTJ YZMEA1BPDK02 7x7 QFN48 500 Pass
KESC YZMEA15X2Q00 10x10 LQFP44 500 Pass
KESC YZMEA1BPDK01 7x7 QFN48 500 Pass
Conclusion: All correlation lots VM yield variation less than criteria, passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.10 Solderability Test
Refer to 9S08AW16A data. (Page 15)
Conclusion: All result showed passed
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Slide 33
3. Conclusion and Recommendation
3.1 Conclusion
� Based on this report, 5M75B/7M75B passed all correlation requirements without any
issues.
� TTTJ is capable to implement burn-in for S9S08AW60 QFN48 & LQFP44 package
3.2 Recommendation
� Burn-In for 5M75B/7M75B, QFN48 & LQFP44(6152/8256) can be released in TTTJ.
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� Burn-In for 5M75B/7M75B, QFN48 & LQFP44(6152/8256) can be released in TTTJ.
Freescale Semiconductor Confidential and Proprietary Information. Freescale™ and the
Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service
names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
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the property of their respective owners. © Freescale Semiconductor, Inc. 2006.
TM
24/09/13, Chen Li
KES-China Burn-In to Trio Tech-Tianjin Burn-In Expansion1M74K/2M74K- S9S08DZ60 Correlation
0. Introduction – Reason for Burn-In Expansion
� Logistical Expansion
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1. Objective and Considerations
1.1 Objective
� Objective is to qualify Trio Tech-Tianjin(TTTJ) Burn-In facility as joint Burn-In site
for 1M74K/2M74K. Complete list of affected parts is outlined in PCN15880.
� This report details the correlation result of below FSL part# to demonstrate that
KES-China(KESC) Burn-In facility correlates with the TTTJ Burn-In facility.
� No impact of customer deliveries
� Completed on Sep/20/2013
1.2 Considerations
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� Burn-In Platform Hardware in TTTJ is identical platform used in KESC, and
verified by dual sites correlation analysis.
� Identical Burn-In board design used in both sites
� Burn-In drivers are the same in both sites.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.1 Introduction:
This report details the burn-in correlation plan and result of S9S08DZ60 LQFP64, LQFP48 and LQFP32 with correlation vehicle, so that the TrioTech-
Tianjin(TTTJ) site can burn-in the same production line as in the KES-China(KESC) site. These correlation units were first processed at the KESC BI site
and then processed in TTTJ, with the ambient burn-in temperature at 125C.
S9S08DZ60
Mask set: 1M74K/2M74K
Production Line: G9FZDZ6A / G9FZDZ6B/ G9FZDZ6C
Package code: 6300/6089/8426
• TTTJ
Hardware:
Burn-in System : IBE
Burn-in Pattern Generator : Flash Memory
Burn-in Driver : CC3
Burn-in Program Software: : MBI
Environment Plan : 125C
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Environment Plan : 125C
Burn-in Program(s) : DZ60E_32LD
DZ60_48LD
DZ60_64LD
• KESC
Hardware:
Burn-in System : IBE
Burn-in Pattern Generator : Flash Memory
Burn-in Driver : CC3
Burn-in Program Software: : MBI
Environment Plan : 125C
Burn-in Program(s) : DZ60E_32LD
DZ60_48LD
DZ60_64LD
Conclusion: Same hardware and software environment were used in both TTTJ and KESC
Correlation Results (CHD - TJN)2. Burn In Qualification Results
• Correlation Lot Information:
BI Site Wafer Lot # Final Test Lot # Device Part ID Package Mask/Rev Qty.
TTTJ T1DE314191 YZMEA1EXME01 S9S08DZ60F1MLC LQFP32 1M74K 500
TTTJ T1DE306681 YZMEA1GA6402 S9S08DZ60F1MLC LQFP32 1M74K 500
TTTJ T1DE324821 YZMEA1GGBM02 S9S08DZ60F1MLC LQFP32 1M74K 500
TTTJ T1DE294601 YZMEA1EB7901 S9S08DZ60F1MLF LQFP48 1M74K 500
TTTJ T1DE292371 YZMEA1EB7B01 S9S08DZ60F1MLF LQFP48 1M74K 500
TTTJ T1DE306711 YZMEA1ENNA01 S9S08DZ60F1MLF LQFP48 1M74K 500
TTTJ T1DE318421 YZMEA1G50G02 S9S08DZ60F1MLH LQFP64 1M74K 500
TTTJ T1DE318391 YZMEA1G50402 S9S08DZ60F1MLH LQFP64 1M74K 500
TTTJ T1DE318381 YZMEA1G4K402 S9S08DZ60F1MLH LQFP64 1M74K 500
KESC T1DE314191 YZMEA1EXME02 S9S08DZ60F1MLC LQFP32 1M74K 500
KESC T1DE306681 YZMEA1GA6401 S9S08DZ60F1MLC LQFP32 1M74K 500
KESC T1DE324821 YZMEA1GGBM01 S9S08DZ60F1MLC LQFP32 1M74K 500
KESC T1DE294601 YZMEA1EB7902 S9S08DZ60F1MLF LQFP48 1M74K 500
KESC T1DE292371 YZMEA1EB7B02 S9S08DZ60F1MLF LQFP48 1M74K 500
KESC T1DE306711 YZMEA1ENNA02 S9S08DZ60F1MLF LQFP48 1M74K 500
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KESC T1DE306711 YZMEA1ENNA02 S9S08DZ60F1MLF LQFP48 1M74K 500
KESC T1DE318421 YZMEA1G50G01 S9S08DZ60F1MLH LQFP64 1M74K 500
KESC T1DE318391 YZMEA1G50401 S9S08DZ60F1MLH LQFP64 1M74K 500
KESC T1DE318381 YZMEA1G4K401 S9S08DZ60F1MLH LQFP64 1M74K 500
2.2 Engineering Qualification Plan
2.2.1 Requirements:
The requirements and acceptance criteria based on agreements between AMPG Reliability and AMPG Product Engineering. If a
specification exists for this transfer/change, then the specification overrides these requirements.
2. Burn In Qualification Results
NameDetail Description
Req’d per
Correlation
Plan,
(Y / N?)
Acceptance Criteria Comment
Pattern Verify
Goal: Correlate and verify correct functionality of burn-in
patterns, cycling, etc
Lot quantity: 1
Units per lot: 5
Temperature: 25C, or as possible
BI Duration: N/A
Y
Correct pattern written
to array or other
product module(s)
This capability may be dependent upon
type of product.
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BI Duration: N/A
Type of units: good
Site: TTTJ
Equipment
Release
Goal: Calibration and verification of entire system
according to site standard equipment release procedure
(May include performing voltage calibration on all drivers
including debug station, meet GR&R requirements, etc.)
Lot quantity / Units per lot: 0
Temperature: BI Ta
BI Duration: N/A
Type of units: N/A
Site: TTTJ
YApproval by
manufacturing CAB.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
Burn-in Board
Voltages
Goal: Verify that the parts on the burn-in board are
receiving the correct voltage
Lot quantity: 1
Units per lot: Empty and Full Board
Temperature: BI Ta
BI Duration: N/A
Type of units: good
Site: TTTJ and KESC
Y
Voltage within range of
target to be agreed by
PE/TE and R&QA.
Measure at front & back of empty and full
burn-in board.
Package Case
Temperature
Goal: Compare temperature at surface of mold compound
or on-chip temperature monitor
Lot quantity: 1
Units per lot: Full Board
Temperature: BI Ta
BI Duration: N/A
Type of units: good
Y
Less than 15%
variation or to be
agreed by PE/TE and
R&QA.
Thermocouples on five units with full burn-
in board running stress pattern. For high
power devices, also verify with single part
on nearly-empty board to ensure no
overheating.
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Type of units: good
Site: TTTJ and KESC
overheating.
Ambient
Temperature (Ta)
Goal: Compare temperature of air inside chamber
Lot quantity: 1
Units per lot: Full Board
Temperature: BI Ta
Type of units: good
BI Duration: N/A
Site: TTTJ and KESC
Y
Less than 10%
variation or to be
agreed by PE/TE and
R&QA.
One thermocouple. Can be performed
along with Package Case Temperature.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
Burn-in Board
Current
Goal: Compare burn-in board current
Lot quantity: 1
Units per lot: Full board
Temperature: BI Ta
BI Duration: N/A
Type of units: good
Site: TTTJ and KESC
Y
Less than 15% variation
or to be agreed by PE/TE
and R&QA.
Best measured on individual devices. Or
measure entire full board current minus
empty board current divided by # of devices
on full board.
Three Lot Burn-in
Check
Goal: Verify that burn-in system does not cause abnormal non-
burn-in failures
Lot quantity: 3
Units per lot: 500
Temperature: BI Ta
BI Duration: Typical BI Duration
Type of units: good
Site: TTTJ
Y
Address manufactur-
ability / over-stress
issues.
Run through standard test flow.
Goal: Verify that burn-in system does not cause unusually low
yield
Lot quantity: 1Post BI yield within PDA
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Burn-in Yield
Lot quantity: 1
Units per lot: 500
Temperature: BI Ta
BI Duration: Typical BI Duration
Type of units: good
Site: TTTJ and KESC
Optional
Post BI yield within PDA
limit or agreed up by
PE/TE and R&QA.
May set a target here based on typical yields.
Visual
Inspection
Goal: Check for visual mechanicalLot quantity: 1
Units per lot: 500 Temperature: 25C BI Duration: N/A Type of units: goodSite: TTTJ and KESC
Y
Less than 2%
variation or agreed
upon by PE/TE and
R&QA.
Use the same units from Burn-in
Yield check in BI correlation.
Solderability
Test
Goal: Check for solderability on the leads Lotquantity: 1 lot for each packageUnits per lot: 20Type of units: goodSite: TTTJ
YAs per
12MRM27364A
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.3 Correlation/Qualification Results:
2.3.1Pattern Verify:
Table 1 summarizes the pattern comparison results.
Table 1.
LQFP32: Burn-in Board
Unit # Maskset BI Program BI Pattern Description KESC TTTJ
Unit 1 1M74K DZ60E_32LD Bin2 Check Pass Pass
Unit 2 1M74K DZ60E_32LD Bin2 Check Pass Pass
Unit 3 1M74K DZ60E_32LD Bin2 Check Pass Pass
Unit 4 1M74K DZ60E_32LD Bin2 Check Pass Pass
Unit 5 1M74K DZ60E_32LD Bin2 Check Pass Pass
LQFP48: Burn-in Board
Unit # Maskset BI Program BI Pattern Description KESC TTTJ
Unit 1 1M74K DZ60_48LD Bin2 Check Pass Pass
Unit 2 1M74K DZ60_48LD Bin2 Check Pass Pass
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Unit 2 1M74K DZ60_48LD Bin2 Check Pass Pass
Unit 3 1M74K DZ60_48LD Bin2 Check Pass Pass
Unit 4 1M74K DZ60_48LD Bin2 Check Pass Pass
Unit 5 1M74K DZ60_48LD Bin2 Check Pass Pass
LQFP64: Burn-in Board
Unit # Maskset BI Program BI Pattern Description KESC TTTJ
Unit 1 1M74K DZ60_64LD Bin2 Check Pass Pass
Unit 2 1M74K DZ60_64LD Bin2 Check Pass Pass
Unit 3 1M74K DZ60_64LD Bin2 Check Pass Pass
Unit 4 1M74K DZ60_64LD Bin2 Check Pass Pass
Unit 5 1M74K DZ60_64LD Bin2 Check Pass Pass
Conclusion: pattern verify pass.
2. Burn In Qualification Results
2.3.2 Equipment Release: (TTTJ equipment Buy-off and release stuff, TTTJ CAB#120121220001)
2.3.3 Burn-in Board Voltage Measurements:
Tables 2 summarize the voltage measurements taken from an empty and full burn-in board.
Table 2. Burn-in Board Voltage Measurements at 125C
1) LQFP32
BIB Condition Driver Location Target
(V)
KESC
(V)
Delta from
Target (mV)
TTTJ(V) Delta from
Target (mV)
Empty VDUT1 5.75 5.74 10 5.75 0
VDUT3 6.00 5.99 10 6.00 0
Full VDUT1 5.75 5.75 0 5.75 0
VDUT3 6.00 5.99 10 5.99 10
2) LQFP48
BIB Condition Driver Location Target
(V)
KESC
(V)
Delta from
Target (mV)
TTTJ(V) Delta from
Target (mV)
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(V) (V) Target (mV) Target (mV)
Empty VDUT1 5.75 5.75 0 5.75 0
VDUT3 6.00 5.99 10 5.99 10
Full VDUT1 5.75 5.75 0 5.74 10
VDUT3 6.00 6.00 0 5.99 10
3) LQFP64
BIB Condition Driver Location Target
(V)
KESC
(V)
Delta from
Target (mV)
TTTJ(V) Delta from
Target (mV)
Empty VDUT1 5.75 5.74 10 5.74 10
VDUT3 6.00 5.98 20 5.99 10
Full VDUT1 5.75 5.74 10 5.75 0
VDUT3 6.00 5.99 10 5.98 20
Conclusion: Passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.4 Package Case Temperature:
Table 3 shows the temperature of five chip packages run in a full burn-in board under normal burn-in conditions. At the time of the measurement, the
oven temperature had stabilized for 30 minutes and pattern was being executed. The thermocouples were located in all four corner sockets and one
socket at the center of the burn-in board (see Figure 1). The thermocouples were epoxied to the top of the device.
Figure 1. Location of Thermocouples
51
3 Feedthrough
Connector
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Slide 45
4 2
Connector
(Driver-side)
Correlation Results (CHD - TJN)2. Burn In Qualification Results
Table 3. Case Temperatures
1) LQFP32
Thermocouple # Thermocouple Location KESC (C) TTTJ (C) % Delta
1 Upper Left Corner 125.10 125.20 0.08% 2 Lower Left Corner 125.30 125.20 0.08% 3 Center of BIB 125.20 125.00 0.16% 4 Lower Right Corner 125.10 125.20 0.08% 5 Upper Right Corner 125.00 125.10 0.08%
2) LQFP48
Thermocouple # Thermocouple Location KESC (C) TTTJ (C) % Delta
1 Upper Left Corner 125.00 125.20 0.16%
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1 Upper Left Corner 125.00 125.20 0.16% 2 Lower Left Corner 124.90 125.10 0.16% 3 Center of BIB 125.10 124.90 0.16% 4 Lower Right Corner 125.00 125.20 0.16% 5 Upper Right Corner 125.10 125.10 0.00%
3) LQFP64
Thermocouple # Thermocouple Location KESC (C) TTTJ (C) % Delta
1 Upper Left Corner 125.30 125.20 0.08% 2 Lower Left Corner 125.10 125.00 0.08% 3 Center of BIB 125.20 125.00 0.16% 4 Lower Right Corner 125.00 125.10 0.08% 5 Upper Right Corner 124.90 125.10 0.16%
Conclusion: Passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.5 Ambient Temperature:
Table 4 shows the ambient air temperature in the chamber while the burn-in system is running under normal operating conditions at BI Ta.
Table 4. Chamber Air Temperature
Thermocouple Location KESC (C) TTTJ (C) % Delta
Open Area in Chamber 125.40 125.20 0.16%
Conclusion: Passed requirement.
2.6 Burn-in Board Current:
Table 5 shows the current reading on a full burn-in board running various patterns at BI Ta.
Table 5. Burn-in Board Current
BI Program BI Pattern # Units on BIB KESC (A) TTTJ (A) % Delta
DZ60E_32LD DZ60_32LD Full 0.79 0.79 0%
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DZ60E_32LD DZ60_32LD Full 0.79 0.79 0% DZ60_48LD DZ60_48LD Full 0.82 0.82 0% DZ60_64LD DZ60_64LD Full 0.8 0.8 0%
Conclusion: Passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.7 3-Lot Burn-in Check:
Table 6 shows the result of the burn-in check.
Table 6. 3-Lot Burn-in Check
Lot Package Burn-
in Site
Lot Size Burn-in
Result
YZMEA1EXME01 7X7 LQFP32 TTJ 500 Pass YZMEA1GA6402 7X7 LQFP32 TTJ 500 Pass YZMEA1GGBM02 7X7 LQFP32 TTJ 500 Pass YZMEA1EB7901 7X7 LQFP48 TTJ 500 Pass YZMEA1EB7B01 7X7 LQFP48 TTJ 500 Pass YZMEA1ENNA01 7X7 LQFP48 TTJ 500 Pass
Conclusion: Passed requirement.
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Slide 48
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.8 Burn-in Yield:
Table 7 shows the result of the post burn-in yield.
Table 7. Burn-in Yield
Lot Package Burn-in Site Burn-in
YZMEA1EXME01 7X7 LQFP32 TTJ pass
YZMEA1GA6402 7X7 LQFP32 TTJ pass
YZMEA1GGBM02 7X7 LQFP32 TTJ pass
YZMEA1EB7901 7X7 LQFP48 TTJ pass
YZMEA1EB7B01 7X7 LQFP48 TTJ pass
YZMEA1ENNA01 7X7 LQFP48 TTJ pass
YZMEA1G50G02 10X10 LQFP64 TTJ pass
YZMEA1G50402 10X10 LQFP64 TTJ pass
YZMEA1G4K402 10X10 LQFP64 TTJ pass
YZMEA1EXME02 7X7 LQFP32 KESC pass
YZMEA1GA6401 7X7 LQFP32 KESC pass
YZMEA1GGBM01 7X7 LQFP32 KESC pass
YZMEA1EB7902 7X7 LQFP48 KESC pass
YZMEA1EB7B02 7X7 LQFP48 KESC pass
YZMEA1ENNA02 7X7 LQFP48 KESC pass
YZMEA1G50G01 10X10 LQFP64 KESC pass
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YZMEA1G50G01 10X10 LQFP64 KESC pass
YZMEA1G50401 10X10 LQFP64 KESC pass
YZMEA1G4K401 10X10 LQFP64 KESC pass
Conclusion: No abnormal non-Burn-in failures found, all correlation lots BI yield variation less than criteria, passed requirement.
2.9 Visual inspection
Table 8 shows the result of the visual inspection post burn-in.
Table 8.Visual Inspection
BI Site Final Test Lot # Package Inspection Qty Visual Yield
TTTJ YZMEA1EXME01 7X7 LQFP32 500 Pass
TTTJ YZMEA1EB7901 7X7 LQFP48 500 Pass
TTTJ YZMEA1G50G02 10X10 LQFP64 500 Pass
KESC YZMEA1EXME02 7X7 LQFP32 500 Pass
KESC YZMEA1EB7902 7X7 LQFP48 500 Pass
KESC YZMEA1G50G01 10X10 LQFP64 500 Pass
Conclusion: All correlation lots VM yield variation less than criteria, passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.10 Solderability Test
LQFP package solderability test result refer to 9S08AW16A data. (Page15)
Conclusion: All result showed passed
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3. Conclusion and Recommendation
3.1 Conclusion
� Based on this report, 1M74K /2M74K passed all correlation requirements without any issues.
� TTTJ is capable to implement burn-in for S9S08DZ60 LQFP32&48 & LQFP64 package
3.2 Recommendation
� Burn-In for 1M74K /2M74K , LQFP32&48 & LQFP64(6300/6089/8426) can be released in
TTTJ.
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51
TTTJ.
Freescale Semiconductor Confidential and Proprietary Information. Freescale™ and the
Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service
names are the property of their respective owners. © Freescale Semiconductor, Inc. 2005.
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the property of their respective owners. © Freescale Semiconductor, Inc. 2006.
TM
24/09/2013, Sun Z.R
KES-China Burn-In to Trio Tech-Tianjin Burn-In Expansion
2M78G- S9S08DZ128 Correlation
0. Introduction – Reason for Burn-In Expansion
� Logistical Expansion
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53
1. Objective and Considerations
1.1 Objective
� Objective is to qualify Trio Tech-Tianjin(TTTJ) Burn-In facility as joint Burn-In site
for 2M78G. Complete list of affected parts is outlined in PCN15880.
� This report details the correlation result of below FSL part# to demonstrate that
KES-China(KESC) Burn-In facility correlates with the TTTJ Burn-In facility.
� No impact of customer deliveries
� Completed on Sep/20/2013
1.2 Considerations
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� Burn-In Platform Hardware in TTTJ is identical platform used in KESC, and
verified by dual site correlation analysis.
� Identical Burn-In board design used in both sites
� Burn-In drivers are the same in both sites.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.1 Introduction:
This report details the burn-in correlation plan and result of S9S08DZ128 LQFP48 & LQFP64 with correlation vehicle. So that the TrioTech-
Tianjin(TTTJ) site can burn-in the same production line as in the KES-China(KESC) site. These correlation units were first processed at the KESC BI site
and then processed in TTTJ, with the ambient burn-in temperature at 125C.
S9S08DZ128
Mask set: 2M78G
Production Line: G9FDZ28C/ G9FZDZ8B
Package code: 6089/8426
• TTTJ
Hardware:
Burn-in System : IBE
Burn-in Pattern Generator : Flash Memory
Burn-in Driver : CC3
Burn-in Program Software: : MBI
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Burn-in Program Software: : MBI
Environment Plan : 125C
Burn-in Program(s) : dz128_48
dz128_64
• KESC
Hardware:
Burn-in System : IBE
Burn-in Pattern Generator : Flash Memory
Burn-in Driver : CC3
Burn-in Program Software: : MBI
Environment Plan : 125C
Burn-in Program(s) : dz128_48
dz128_64
Conclusion: Same hardware and software environment were used in both TTTJ and KESC
Correlation Results (CHD - TJN)2. Burn In Qualification Results
• Correlation Lot Information:
BI Site Wafer Lot # Final Test Lot # Device Part ID Package Mask/Rev Qty.
TTTJ T1DE292411 YZMEA1EKVH01 S9S08DZ96F2VLF LQFP48 2M78G 500
TTTJ T1DE306771 YZMEA1EW4L01 S9S08DZ96F2VLF LQFP48 2M78G 500
TTTJ T1DE304361 YZMEA1EW4G01 S9S08DZ96F2VLF LQFP48 2M78G 500
TTTJ T1DE319521 YZMEA1G4KE02 S9S08DZ96F2CLH LQFP64 2M78G 500
TTTJ T1DE319541 YZMEA1G6J102 S9S08DZ96F2CLH LQFP64 2M78G 500
TTTJ T1DE319551 YZMEA1GDJ402 S9S08DZ96F2CLH LQFP64 2M78G 500
KESC T1DE292411 YZMEA1EKVH02 S9S08DZ96F2VLF LQFP48 2M78G 500
KESC T1DE306771 YZMEA1EW4L02 S9S08DZ96F2VLF LQFP48 2M78G 500
KESC T1DE304361 YZMEA1EW4G02 S9S08DZ96F2VLF LQFP48 2M78G 500
KESC T1DE319521 YZMEA1G4KE01 S9S08DZ96F2CLH LQFP64 2M78G 500
KESC T1DE319541 YZMEA1G6J101 S9S08DZ96F2CLH LQFP64 2M78G 500
KESC T1DE319551 YZMEA1GDJ401 S9S08DZ96F2CLH LQFP64 2M78G 500
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KESC T1DE319551 YZMEA1GDJ401 S9S08DZ96F2CLH LQFP64 2M78G 500
2.2 Engineering Qualification Plan
2.2.1 Requirements:
The requirements and acceptance criteria based on agreements between AMPG Reliability and AMPG Product Engineering. If a
specification exists for this transfer/change, then the specification overrides these requirements.
2. Burn In Qualification Results
NameDetail Description
Req’d per
Correlation
Plan,
(Y / N?)
Acceptance Criteria Comment
Pattern Verify
Goal: Correlate and verify correct functionality of burn-in
patterns, cycling, etc
Lot quantity: 1
Units per lot: 5
Temperature: 25C, or as possible
BI Duration: N/A
Y
Correct pattern written
to array or other
product module(s)
This capability may be dependent upon
type of product.
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57
BI Duration: N/A
Type of units: good
Site: TTTJ
Equipment
Release
Goal: Calibration and verification of entire system
according to site standard equipment release procedure
(May include performing voltage calibration on all drivers
including debug station, meet GR&R requirements, etc.)
Lot quantity / Units per lot: 0
Temperature: BI Ta
BI Duration: N/A
Type of units: N/A
Site: TTTJ
YApproval by
manufacturing CAB.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
Burn-in Board
Voltages
Goal: Verify that the parts on the burn-in board are
receiving the correct voltage
Lot quantity: 1
Units per lot: Empty and Full Board
Temperature: BI Ta
BI Duration: N/A
Type of units: good
Site: TTTJ and KESC
Y
Voltage within range of
target to be agreed by
PE/TE and R&QA.
Measure at front & back of empty and full
burn-in board.
Package Case
Temperature
Goal: Compare temperature at surface of mold compound
or on-chip temperature monitor
Lot quantity: 1
Units per lot: Full Board
Temperature: BI Ta
BI Duration: N/A
Type of units: good
Y
Less than 15%
variation or to be
agreed by PE/TE and
R&QA.
Thermocouples on five units with full burn-
in board running stress pattern. For high
power devices, also verify with single part
on nearly-empty board to ensure no
overheating.
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Type of units: good
Site: TTTJ and KESC
overheating.
Ambient
Temperature (Ta)
Goal: Compare temperature of air inside chamber
Lot quantity: 1
Units per lot: Full Board
Temperature: BI Ta
Type of units: good
BI Duration: N/A
Site: TTTJ and KESC
Y
Less than 10%
variation or to be
agreed by PE/TE and
R&QA.
One thermocouple. Can be performed
along with Package Case Temperature.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
Burn-in Board
Current
Goal: Compare burn-in board current
Lot quantity: 1
Units per lot: Full board
Temperature: BI Ta
BI Duration: N/A
Type of units: good
Site: TTTJ and KESC
Y
Less than 15% variation
or to be agreed by PE/TE
and R&QA.
Best measured on individual devices. Or
measure entire full board current minus
empty board current divided by # of devices
on full board.
Three Lot Burn-in
Check
Goal: Verify that burn-in system does not cause abnormal non-
burn-in failures
Lot quantity: 3
Units per lot: 500
Temperature: BI Ta
BI Duration: Typical BI Duration
Type of units: good
Site: TTTJ
Y
Address manufactur-
ability / over-stress
issues.
Run through standard test flow.
Burn-in Yield
Goal: Verify that burn-in system does not cause unusually low
yield
Lot quantity: 1
Units per lot: 500Optional
Post BI yield within PDA
limit or agreed up by May set a target here based on typical yields.
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Burn-in YieldUnits per lot: 500
Temperature: BI Ta
BI Duration: Typical BI Duration
Type of units: good
Site: TTTJ and KESC
Optional limit or agreed up by
PE/TE and R&QA.
May set a target here based on typical yields.
Visual
Inspection
Goal: Check for visual mechanicalLot quantity: 1
Units per lot: 500 Temperature: 25C BI Duration: N/A Type of units: goodSite: TTTJ and KESC
Y
Less than 2%
variation or agreed
upon by PE/TE and
R&QA.
Use the same units from Burn-in
Yield check in BI correlation.
Solderability
Test
Goal: Check for solderability on the leads Lotquantity: 1 lot for each packageUnits per lot: 20Type of units: goodSite: TTTJ
YAs per
12MRM27364A
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.3 Correlation/Qualification Results:
2.3.1Pattern Verify:
Table 1 summarizes the pattern comparison results.
Table 1.
LQFP48: Burn-in Board
Unit # Maskset BI Program BI Pattern Description KESC TTTJ
Unit 1 2M78G dz128_48 Bin2 Check Pass Pass
Unit 2 2M78G dz128_48 Bin2 Check Pass Pass
Unit 3 2M78G dz128_48 Bin2 Check Pass Pass
Unit 4 2M78G dz128_48 Bin2 Check Pass Pass
Unit 5 2M78G dz128_48 Bin2 Check Pass Pass
LQFP64: Burn-in Board
Unit # Maskset BI Program BI Pattern Description KESC TTTJ
Unit 1 2M78G dz128_64 Bin2 Check Pass Pass
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Unit 1 2M78G dz128_64 Bin2 Check Pass Pass
Unit 2 2M78G dz128_64 Bin2 Check Pass Pass
Unit 3 2M78G dz128_64 Bin2 Check Pass Pass
Unit 4 2M78G dz128_64 Bin2 Check Pass Pass
Unit 5 2M78G dz128_64 Bin2 Check Pass Pass
Conclusion: Passed requirment.
2. Burn In Qualification Results
2.3.2 Equipment Release: (TTTJ equipment Buy-off and release stuff, TTTJ CAB#120121220001)
2.3.3 Burn-in Board Voltage Measurements:
Tables 2 summarize the voltage measurements taken from an empty and full burn-in board.
Table 2. Burn-in Board Voltage Measurements at 125C
1) LQFP48
BIB Condition Driver Location Target
(V)
KESC
(V)
Delta from
Target (mV)
TTTJ(V)
Delta from
Target (mV)
Empty VDUT1 6.00 5.98 20 5.99 10
VDUT3 6.00 6.00 0 6.00 0
Full VDUT1 6.00 5.99 10 5.98 20
VDUT3 6.00 5.98 20 5.98 20
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2) LQFP64
BIB Condition Driver Location Target
(V)
KESC
(V)
Delta from
Target (mV)
TTTJ(V)
Delta from
Target (mV)
Empty VDUT1 6.00 6.00 0 6.00 0
VDUT3 6.00 5.99 10 5.98 20
Full VDUT1 6.00 5.98 20 5.99 10
VDUT3 6.00 6.00 0 6.00 0
Conclusion: Passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.4 Package Case Temperature:
Table 3 shows the temperature of five chip packages run in a full burn-in board under normal burn-in conditions. At the time of
the measurement, the oven temperature had stabilized for 30 minutes and pattern was being executed. The thermocouples were
located in all four corner sockets and one socket at the center of the burn-in board (see Figure 1). The thermocouples were
epoxied to the top of the device.
Figure 1. Location of Thermocouples
51
3 Feedthrough
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Slide 62
4 2
Feedthrough
Connector
(Driver-side)
Correlation Results (CHD - TJN)2. Burn In Qualification Results
Table 3. Case Temperatures
1) LQFP48
Thermocouple # Thermocouple Location KESC (C) TTTJ (C) % Delta
1 Upper Left Corner 125.30 125.50 0.16%
2 Lower Left Corner 125.10 125.70 0.48%
3 Center of BIB 125.80 125.80 0.00%
4 Lower Right Corner 125.50 125.00 0.40%
5 Upper Right Corner 125.00 125.10 0.08%
2) LQFP64
Thermocouple # Thermocouple Location KESC (C) TTTJ (C) % Delta
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1 Upper Left Corner 125.30 125.10 0.16%
2 Lower Left Corner 125.10 125.20 0.08%
3 Center of BIB 125.40 125.40 0.00%
4 Lower Right Corner 125.50 125.30 0.16%
5 Upper Right Corner 125.00 125.30 0.24%
Conclusion: Passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.5 Ambient Temperature:
Table 4 shows the ambient air temperature in the chamber while the burn-in system is running under normal operating conditions at BI Ta.
Table 4. Chamber Air Temperature
Thermocouple Location KESC (C) TTTJ (C) % Delta
Open Area in Chamber 125.10 125.00 0.08%
Conclusion: Passed requirement.
2.6 Burn-in Board Current:
Table 5 shows the current reading on a full burn-in board running various patterns at BI Ta.
Table 5. Burn-in Board Current
BI Program BI Pattern # Units on BIB KESC (A) TTTJ (A) % Delta
dz128_48 DZ128_48LD Full 0.3 0.3 0%
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dz128_48 DZ128_48LD Full 0.3 0.3 0%
dz128_64 DZ128_64LD Full 0.3 0.3 0%
Conclusion: Passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.7 3-Lot Burn-in Check:
Table 6 shows the result of the burn-in check.
Table 6. 3-Lot Burn-in Check
Lot Package Burn-
in Site
Lot Size Burn-in
Result
YZMEA1EKVH01 7x7 LQFP48 TTTJ 500 pass
YZMEA1EW4L01 7x7 LQFP48 TTTJ 500 pass
YZMEA1EW4G01 7x7 LQFP48 TTTJ 500 pass
YZMEA1G4KE02 10x10 LQFP64 TTTJ 500 pass
YZMEA1G6J102 10x10 LQFP64 TTTJ 500 pass
YZMEA1GDJ402 10x10 LQFP64 TTTJ 500 pass
Conclusion: Passed requirement.
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2. Burn In Qualification Results
2.8 Burn-in Yield:
Table 7 shows the result of the post burn-in yield.
Table 7. Burn-in Yield
Lot Package Burn-in
Site
Burn-in
Result
YZMEA1EKVH01 7x7 LQFP48 TTTJ pass
YZMEA1EW4L01 7x7 LQFP48 TTTJ pass
YZMEA1EW4G01 7x7 LQFP48 TTTJ pass
YZMEA1G4KE02 10x10 LQFP64 TTTJ pass
YZMEA1G6J102 10x10 LQFP64 TTTJ pass
YZMEA1GDJ402 10x10 LQFP64 TTTJ pass
YZMEA1EKVH02 7x7 LQFP48 KESC pass
YZMEA1EW4L02 7x7 LQFP48 KESC pass
YZMEA1EW4G02 7x7 LQFP48 KESC pass
YZMEA1G4KE01 10x10 LQFP64 KESC pass
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YZMEA1G4KE01 10x10 LQFP64 KESC pass
YZMEA1G6J101 10x10 LQFP64 KESC pass
YZMEA1GDJ401 10x10 LQFP64 KESC pass
Conclusion: No abnormal non-Burn-in failures found, all correlation lots BI yield variation less than criteria, passed requirement
2.9 Visual inspection
Table 8 shows the result of the visual inspection post burn-in.
Table 8.Visual Inspection
BI Site Final Test Lot # Pacakge Inspection Qty Visual Yield
TTTJ YZMEA1EKVH01 7x7 LQFP48 500 Pass
TTTJ YZMEA1G4KE02 10x10 LQFP64 500 Pass
KESC YZMEA1EKVH02 7x7 LQFP48 500 Pass
KESC YZMEA1G4KE01 10x10 LQFP64 500 Pass
Conclusion: All correlation lots VM yield variation less than criteria, passed requirement
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.10 Solderability Test
LQFP package solderability test result refer to 9S08AW16A data. (Page15)
Conclusion: All result showed passed
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Slide 67
3. Conclusion and Recommendation
3.1 Conclusion
� Based on this report, 2M78G passed all correlation requirements without any issues.
� TTTJ is capable to implement burn-in for S9S08DZ128 LQFP48 & LQFP64 package.
3.2 Recommendation
� Burn-In for 2M78G, LQFP48 & LQFP64(6089/8426) can be released in new Burn-In Site
TTTJ.
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68
TTTJ.
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30/Sep/2013, Guo Xinlei
KES-China Burn-In to Trio Tech-Tianjin Burn-In Expansion1M15D/2M15D- S9S08QD4 Correlation
0. Introduction – Reason for Burn-In Expansion
� Logistical Expansion
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1. Objective and Considerations
1.1 Objective
� Objective is to qualify Trio Tech-Tianjin(TTTJ) Burn-In facility as joint Burn-In site for
1M15D/2M15D. Complete list of affected parts is outlined in PCN15880.
� This report details the correlation result of below FSL part# to demonstrate that KES-
China(KESC) Burn-In facility correlates with the TTTJ Burn-In facility.
� No impact of customer deliveries
� Completed on Sep/20/2013
1.2 Considerations
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� Burn-In Platform Hardware in TTTJ is identical platform used in KESC, and verified
by dual site correlation analysis.
� Identical Burn-In board design used in both sites
� Burn-In drivers are the same in both sites.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.1 Introduction:
This report details the burn-in correlation plan and result of S9S08QD4 SOICNB8 with correlation vehicle. So that the TrioTech-Tianjin(TTTJ) site can
burn-in the same production line as in the KES-China(KESC) site. These correlation units were first processed at the KESC BI site and then processed in
TTTJ, with the ambient burn-in temperature at 125C.
S9S08QD4
Mask set: 1M15D/2M15D
Production Line: G9DZQD4A
Package code: 0095
• TTTJ
Hardware:
Burn-in System : IBE
Burn-in Pattern Generator : Flash Memory
Burn-in Driver : CC1
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Slide 72
Burn-in Driver : CC1
Burn-in Program Software: : MBI
Environment Plan : 125C
Burn-in Program(s) : QD4
• KESC
Hardware:
Burn-in System : IBE
Burn-in Pattern Generator : Flash Memory
Burn-in Driver : CC1
Burn-in Program Software: : MBI
Environment Plan : 125C
Burn-in Program(s) : QD4
Conclusion: Same hardware and software environment were used in both TTTJ and KESC
Correlation Results (CHD - TJN)2. Burn In Qualification Results
• Correlation Lot Information:
BI Site Wafer Lot # Final Test Lot # Device Part ID Mask/Rev Qty.
KESC ZHPC2A165900 YZME007T1P00 S9S08QD4J1MSC 1M15D 500
KESC ZHPC2A166200 YZME007T1M00 S9S08QD4J1MSC 1M15D 500
KESC ZHPC2A166300 YZME007T1J00 S9S08QD4J1MSC 1M15D 500
TTTJ ZHPC2A165900 YZME007T1N00 S9S08QD4J1MSC 1M15D 500
TTTJ ZHPC2A166200 YZME007T1K00 S9S08QD4J1MSC 1M15D 500
TTTJ ZHPC2A166300 YZME007T1H00 S9S08QD4J1MSC 1M15D 500
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Slide 73
2.2 Engineering Qualification Plan
2.2.1 Requirements:
The requirements and acceptance criteria based on agreements between AMPG Reliability and AMPG Product Engineering. If a
specification exists for this transfer/change, then the specification overrides these requirements.
2. Burn In Qualification Results
NameDetail Description
Req’d per
Correlation
Plan,
(Y / N?)
Acceptance Criteria Comment
Pattern Verify
Goal: Correlate and verify correct functionality of burn-in
patterns, cycling, etc
Lot quantity: 1
Units per lot: 5
Temperature: 25C, or as possible
BI Duration: N/A
Y
Correct pattern written
to array or other
product module(s)
This capability may be dependent upon
type of product.
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BI Duration: N/A
Type of units: good
Site: TTTJ
Equipment
Release
Goal: Calibration and verification of entire system
according to site standard equipment release procedure
(May include performing voltage calibration on all drivers
including debug station, meet GR&R requirements, etc.)
Lot quantity / Units per lot: 0
Temperature: BI Ta
BI Duration: N/A
Type of units: N/A
Site: TTTJ
YApproval by
manufacturing CAB.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
Burn-in Board
Voltages
Goal: Verify that the parts on the burn-in board are
receiving the correct voltage
Lot quantity: 1
Units per lot: Empty and Full Board
Temperature: BI Ta
BI Duration: N/A
Type of units: good
Site: TTTJ and KESC
Y
Voltage within range of
target to be agreed by
PE/TE and R&QA.
Measure at front & back of empty and full
burn-in board.
Package Case
Temperature
Goal: Compare temperature at surface of mold compound
or on-chip temperature monitor
Lot quantity: 1
Units per lot: Full Board
Temperature: BI Ta
BI Duration: N/A
Type of units: good
Y
Less than 15%
variation or to be
agreed by PE/TE and
R&QA.
Thermocouples on five units with full burn-
in board running stress pattern. For high
power devices, also verify with single part
on nearly-empty board to ensure no
overheating.
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Type of units: good
Site: TTTJ and KESC
overheating.
Ambient
Temperature (Ta)
Goal: Compare temperature of air inside chamber
Lot quantity: 1
Units per lot: Full Board
Temperature: BI Ta
Type of units: good
BI Duration: N/A
Site: TTTJ and KESC
Y
Less than 10%
variation or to be
agreed by PE/TE and
R&QA.
One thermocouple. Can be performed
along with Package Case Temperature.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
Burn-in Board
Current
Goal: Compare burn-in board current
Lot quantity: 1
Units per lot: Full board
Temperature: BI Ta
BI Duration: N/A
Type of units: good
Site: TTTJ and KESC
Y
Less than 15% variation
or to be agreed by PE/TE
and R&QA.
Best measured on individual devices. Or
measure entire full board current minus
empty board current divided by # of devices
on full board.
Three Lot Burn-in
Check
Goal: Verify that burn-in system does not cause abnormal non-
burn-in failures
Lot quantity: 3
Units per lot: 500
Temperature: BI Ta
BI Duration: Typical BI Duration
Type of units: good
Site: TTTJ
Y
Address manufactur-
ability / over-stress
issues.
Run through standard test flow.
Goal: Verify that burn-in system does not cause unusually low
yield
Lot quantity: 1Post BI yield within PDA
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Slide 76
Burn-in Yield
Lot quantity: 1
Units per lot: 500
Temperature: BI Ta
BI Duration: Typical BI Duration
Type of units: good
Site: TTTJ and KESC
Optional
Post BI yield within PDA
limit or agreed up by
PE/TE and R&QA.
May set a target here based on typical yields.
Visual
Inspection
Goal: Check for visual mechanicalLot quantity: 1
Units per lot: 500 Temperature: 25C BI Duration: N/A Type of units: goodSite: TTTJ and KESC
Y
Less than 2%
variation or agreed
upon by PE/TE and
R&QA.
Use the same units from Burn-in
Yield check in BI correlation.
Solderability
Test
Goal: Check for solderability on the leads Lotquantity: 1 lot for each packageUnits per lot: 20Type of units: goodSite: TTTJ
YAs per
12MRM27364A
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.3 Correlation/Qualification Results:
2.3.1Pattern Verify:
Table 1 summarizes the pattern comparison results.
Table 1.
SOIC NB8: Burn-in Board
Unit # Maskset BI Program BI Pattern Description KESC TTTJ
Unit 1 1M15D QD4 Bin2 Check Pass Pass
Unit 2 1M15D QD4 Bin2 Check Pass Pass
Unit 3 1M15D QD4 Bin2 Check Pass Pass
Unit 4 1M15D QD4 Bin2 Check Pass Pass
Unit 5 1M15D QD4 Bin2 Check Pass Pass
Conclusion: pattern verify pass.
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Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.3.2 Equipment Release: (TTTJ equipment Buy-off and release stuff, TTTJ CAB#120121220003)
2.3.3 Burn-in Board Voltage Measurements:
Tables 2 summarize the voltage measurements taken from an empty and full burn-in board.
Table 2. Burn-in Board Voltage Measurements at 125C
1) SOIC NB8
BIB Condition Driver Location Target
(V)
KESC
(V)
Delta from
Target (mV)
TTTJ
(V)
Delta from
Target (mV)
Empty VDUT1 6.00 5.98 20 5.97 30
VDUT3 6.00 5.98 20 5.99 10
Full VDUT1 6.00 5.99 10 5.98 20
VDUT3 6.00 5.98 20 5.99 10
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Slide 78
Conclusion: Passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.4 Package Case Temperature:
Table 3 shows the temperature of five chip packages run in a full burn-in board under normal burn-in conditions. At the time of the measurement, the
oven temperature had stabilized for 30 minutes and pattern was being executed. The thermocouples were located in all four corner sockets and one socket
at the center of the burn-in board (see Figure 1). The thermocouples were epoxied to the top of the device.
Figure 1. Location of Thermocouples
51
4 2
3 Feedthrough
Connector
(Driver-side)
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Table 3. Case Temperatures
Thermocouple # Thermocouple Location KESC (C) TTTJ (C) % Delta
1 Upper Left Corner 125.00 125.10 0.08%
2 Lower Left Corner 124.90 125.00 0.08%
3 Center of BIB 125.20 125.10 0.08%
4 Lower Right Corner 125.10 124.90 0.16%
5 Upper Right Corner 125.00 125.00 0.00%
Conclusion: Passed requirement.
4 2
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.5 Ambient Temperature:
Table 4 shows the ambient air temperature in the chamber while the burn-in system is running under normal operating conditions at BI Ta.
Table 4. Chamber Air Temperature
Thermocouple Location KESC (C) TTTJ (C) % Delta
Open Area in Chamber 125.00 125.10 0.08%
Conclusion: Passed requirement.
2.6 Burn-in Board Current:
Table 5 shows the current reading on a full burn-in board running various patterns at BI Ta.
Table 5. Burn-in Board Current
1) SOIC NB8
BI Program BI Pattern # Units on BIB KESC (A) TTTJ (A) % Delta
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BI Program BI Pattern # Units on BIB KESC (A) TTTJ (A) % Delta
QD4 QD4 Full 0.35 0.35 0%
Conclusion: Passed requirement.
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.7 3-Lot Burn-in Check:
Table 6 shows the result of the burn-in check.
Table 6. 3-Lot Burn-in Check
Lot Package Burn-
in Site
Lot Size Burn-in
Result
YZME007T1K00 SOIC NB8 TTTJ 500 pass
YZME007T1N00 SOIC NB8 TTTJ 500 pass
YZME007T1H00 SOIC NB8 TTTJ 500 pass
Conclusion: Passed requirement.
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Slide 81
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.8 Burn-in Yield:
Table 7 shows the result of the post burn-in yield.
Table 7. Burn-in Yield
Lot Package Burn-in
Site
Burn-in
Result
YZME007T1M00 SOIC NB8 KESC pass
YZME007T1K00 SOIC NB8 TTTJ pass
YZME007T1P00 SOIC NB8 KESC pass
YZME007T1N00 SOIC NB8 TTTJ pass
YZME007T1J00 SOIC NB8 KESC pass
YZME007T1H00 SOIC NB8 TTTJ pass
Conclusion: No abnormal non-Burn-in failures found, all correlation lots BI yield variation less than criteria, passed requirement
2.9 Visual inspection
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2.9 Visual inspection
Table 8 shows the result of the visual inspection post burn-in.
Table 8.Visual Inspection
BI Site Final Test Lot # Inspection Qty Visual Yield
KESC YZME007T1M00 500 Pass
TTTJ YZME007T1K00 500 Pass
Conclusion: All correlation lots VM yield variation less than criteria, passed requirement
Correlation Results (CHD - TJN)2. Burn In Qualification Results
2.10 Solderability Test Table 9 shoes the result of solderability test post burn-in. Note: Test were done using 20 sample parts type
Table 9.Solderability Test
BI Site Final Test Lot # Package Test Qty Result
TTTJ YZME007T1K00 SOIC NB8 20 Passed
SOIC sample photo:
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Slide 83
Conclusion: All result showed passed
3. Conclusion and Recommendation
3.1 Conclusion
� Based on this report, 1M15D/2M15D passed all correlation requirements without any
issues.
� TTTJ is capable to implement burn-in for S9S08QD4 SOICNB8 package.
3.2 Recommendation
� Burn-In for 1M15D/2M15D, SOICNB8(0095) can be released in new Burn-In Site
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� Burn-In for 1M15D/2M15D, SOICNB8(0095) can be released in new Burn-In Site
TTTJ.
TM
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