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Document Number DS40252 Rev 4-2 PI7C9X130 PCI Express to PCI-X Reversible Bridge DATASHEET Revision 4 March 2018 1545 Barber Lane Milpitas, CA 95035 Telephone: 408-232-9100 FAX: 408-434-1040 Internet: http://www.diodes.com
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  • Document Number DS40252 Rev 4-2

    PI7C9X130

    PCI Express to PCI-X Reversible Bridge

    DATASHEET Revision 4

    March 2018

    1545 Barber Lane Milpitas, CA 95035

    Telephone: 408-232-9100

    FAX: 408-434-1040

    Internet: http://www.diodes.com

    http://www.diodes.com/

  • PI7C9X130 Page 2 of 160 March 2018 Document Number DS40252 Rev 4-2 www.diodes.com Diodes Incorporated

    PI7C9X130

    IMPORTANT NOTICE DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the final and determinative format released by Diodes Incorporated.

    LIFE SUPPORT

    Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein: A. Life support devices or systems are devices or systems which:

    1. are intended to implant into the body, or

    2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user.

    B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright 2016, Diodes Incorporated www.diodes.com

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  • PI7C9X130 Page 3 of 160 March 2018 Document Number DS40252 Rev 4-2 www.diodes.com Diodes Incorporated

    PI7C9X130

    REVISION HISTORY

    Date Revision Number Description

    02/24/2006 0.1 First Draft of PI7C9X130 Data Sheet

    03/20/2006 0.2 Correct INTA, B, C, D buffer type

    Update configuration map and registers Update JTAG chain order

    Add PCI/PCI-X selection information

    04/07/2006 0.3 Update on configuration register bit definitions. 1) Bit [10, 7:2] of offset 40h 2) Bit [31:30] of offset 68h 3) Bit [0] of offset 70h 4) Bit [23:22] of offset 94h 5) Bit [7:1] of offset 164h

    Correct typo of pin CLKRUN_L in pin assignment and JTAG section.

    06/07/2006 0.4 Add Absolute Maximum Ratings

    Correct pin description:

    1. REQ_L as GPI and GNT_L as GPO 2. CLKOUT [8:0] as CLKOUT [6:0]

    06/19/2006 0.5 Correct default setting for bit [31:30] of offset 68h

    03/26/2007 0.6

    04/18/2007 0.7 Completed non-transparent function for address 28h 2Bh in the Configuration Register Map

    section 7.1

    Corrected pin HSEN (R3) in section 2.6 Miscellaneous Signals. Should read tie LOW if Hot

    Swap is not used instead of tie HIGH

    05/02/2007 0.8 Revised table 8-1 in section 8

    Address bit[5] corrected to equal 0

    Address bit[4] corrected to equal GPIO[3]

    05/15/2007 0.9 Revised PCIe Base Specification Compliancy from 1.0a to 1.1

    06/08/2007 0.91 Corrected pin HSSW (T3) in section 2.6 Miscellaneous Signals. Remove

    Tied high if hot swap function is not used.

    07/13/2007 1.0 Corrected bit[13] offset 110h from reserved to Advisory Non-Fatal Error Status Changed Logos and some font types

    08/07/2007 1.1 Corrected Pin #s of GNT_L[1], GNT_L[2], GNT_[3], GNT_[4], GNT_[5] on

    Table 14-1JTAG Boundary Scan Register Definition

    09/28//2007 1.2 Recommendation of Pull-up Resistor for PI7C9X130 Control Signals added to section 16.3 of PI7C9X130 Datasheets; pin numbers of SMBCLK and SMBDAT are corrected under section 5.2.

    Added PCIX Clock Detection to Chapter 9, Clock Scheme.

    01/03/2008 1.3 Revised Ambient Temperature Maximum Ratings Compliancy

    04/21/2008 1.4 Updated to revision D

    04/24/2008 1.5 Added package thermal data. RREF pin description change. Removed CDM information

    08/08/2008 1.6 Added Power-Up Sequencing Description

    10/30/2008 1.7 Revised Product Ordering Info

    07/01/2009 1.8 Added Extended Configuration Access / Data Register under section 7.1 and 7.4

    01/20/2010 1.9 Added Asynchronous Clock Support to Section 19

    03/29/2010 2.0 Revised configuration register definitions:

    1) 7.4.31 bit[5:4] and bit[7:6] of PCI Data Buffering Control Register )Offset 40h) 2) 7.4.87 Extended Configuration Access Address Register (Offset E0h) 3) 7.4.88 Extended Configuration Access Data Register (Offset E4h) 4) 7.4.129 bit[30] of Replay and Acknowledge Latency Timers (Offset 310h) 5) 7.5.24 bit[5:4] and bit[7:6] of PCI Data Buffering Control Register )Offset 40h) 6) 7.5.135 bit[30] of Replay and Acknowledge Latency Timers (Offset 310h)

    Revised Section 9 Clock Scheme

    04/27/2011 2.1 Updated Section 2.2 PCI Express Signals

    06/29/2011 2.2 Updated Section 2.3 PCI Signals (REQ_L [3:0], GNT_L [3:0]) Updated Section 7.5.9, 7.5.11, 7.5.12, 7.5.13, 7.5.34, 7.5.36, 7.5.37, 7.5.38 (bit[31:12]).

    09/17/2012 2.3 Updated Section 7.4.70 Device Capability Register (bit[2:0])

    Updated Section 7.5.76 Device Capability Register (bit[2:0])

    04/15/2015 2.4 Updated Section 7.4 PCI Configuration Registers For Transparent Bridge Mode Updated Section 7.5 PCI Configuration Registers For Non-Transparent Bridge Mode

    04/20/2016 2.5 Updated Section 7.4 PCI Configuration Registers For Transparent Bridge Mode

    Updated Section 7.5 PCI Configuration Registers For Non-Transparent Bridge Mode Updated Section 2.5 JTAG Boundary Scan Signals

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  • PI7C9X130 Page 4 of 160 March 2018 Document Number DS40252 Rev 4-2 www.diodes.com Diodes Incorporated

    PI7C9X130

    PREFACE The datasheet of PI7C9X130 will be enhanced periodically when updated information is available. The technical information

    in this datasheet is subject to change without notice. This document describes the functionalities of PI7C9X130 (PCI Express

    Bridge) and provides technical information for designers to design their hardware using PI7C9X130.

    06/02/2017 2.6 Updated Section 16.1 Absolute Maximum Ratings Updated Section 16.2 DC SPECIFICATIONS

    Added Table 16-4 PCIe Reference Clock Timing Parameters

    Added Table 16-5 PCI Express Interface - Differential Transmitter (TX) Output Characteristics Added Table 16-6 PCI Express Interface - Differential Receiver (RX) Input Characteristics

    Added Section 16.5 Operating Ambient Temperature

    09/27/2017 3 Added Section 16 Power Sequencing Updated Section 19 Ordering Information

    Revision numbering system changed to whole number 03/16/2018 4 Updated Section 19 Ordering Information

    Added Figure 18-4 PART MARKING

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  • PI7C9X130 Page 5 of 160 March 2018 Document Number DS40252 Rev 4-2 www.diodes.com Diodes Incorporated

    PI7C9X130

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  • PI7C9X130 Page 6 of 160 March 2018 Document Number DS40252 Rev 4-2 www.diodes.com Diodes Incorporated

    PI7C9X130

    TABLE OF CONTENTS

    1 INTRODUCTION ............................................................................................................................................. 15

    1.1 PCI EXPR