PCB Labels: Properties you need for your process
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YOUR PROCESS PROPERTIES YOU NEED FOR PCB LABELS: PROPERTIES HIGH TEMPERATURE RESISTANCE • Needed for pre-process labeling • Labels need to survive temperatures as high as
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views http://www.bradyid.com/polyimide-infographic Labeling printed circuit boards (PCBs) for traceability can be tricky. Your labels may need to survive wash and reflow processes. In most situations they will need to be ESD-safe and some may need to have a rigidity designed for auto-apply applicators. If any of those things go wrong, your labeling efforts could be much more costly.
Transcript of PCB Labels: Properties you need for your process
YOUR PROCESS
PROPERTIES YOU NEEDFOR
PCB LABELS:
PROPERTIES
PROCESSES
BROUGHT TO YOU BY:
BRADYSources:
http://en.wikipedia.org/wiki/Thermal_transfer_printingzhttp://encyclopedia2.thefreedictionary.com/Electrostatic+Discharge
http://www.europe.fasson.com/FRE/planets/deposit.nsf/vObjectStore/FINAL%2028582-1_Avery%20Brochure_EN.pdf/$file/FINAL%2028582-1_Avery%20Brochure_EN.pdfhttps://www.google.com/search?q=reflow+definition&oq=reflow+definition&aqs=chrome..69i57j0l5.3870j0j4&sourceid=chrome&es_sm=91&ie=UTF-8
HIGH TEMPERATURERESISTANCE
INLINE AND BATCHWASH SYSTEMS
AUTO-APPLY COMPATIBLE
BARCODING
TRACEABILITY
The label topcoat and adhesiveMUST PROTECT AGAINST:
BENEFITS:
300˚C (572˚F)
• Needed for pre-process labeling• Labels need to survive temperatures as high as
• Data rich • Error correction• Consistency • Small• Omnidirectional • Good contrast
BENEFITS:• Reduce labor• Reduce material waste• Improve asset utilization• Improve reliability
• Reduce rework• Reduce product recall• Reduce cost of warranty• Improve root cause analysis
Label rigidity designed to lay atto maximize performance in automationequipment or applications.
ABRASION CHEMICALS PRESSURE HEAT
Wash processes attack a label inmany different ways.
LABELING VS.DIRECT PRODUCT MARKING
Labels are the most flexible way tomaintain traceability in manufacturing.
LABELING:• Low capital investment• Cost ef cient• Easy to read• No additional cleaning
LASER:• High capital investment• Marking errors increase scrap rate
ELECTROSTATIC DISCHARGE
A high performance ESD label should INCLUDE:• ANSI Grade A topcoat designed to dissipate a static charge.
• Adhesive with a short static decay time.
Labels can create a static discharge thatcan ruin PCB components.
YOUR PROCESS
PROPERTIES YOU NEEDFOR
PCB LABELS:
PROPERTIES
PROCESSES
BROUGHT TO YOU BY:
BRADYSources:
http://en.wikipedia.org/wiki/Thermal_transfer_printingzhttp://encyclopedia2.thefreedictionary.com/Electrostatic+Discharge
http://www.europe.fasson.com/FRE/planets/deposit.nsf/vObjectStore/FINAL%2028582-1_Avery%20Brochure_EN.pdf/$file/FINAL%2028582-1_Avery%20Brochure_EN.pdfhttps://www.google.com/search?q=reflow+definition&oq=reflow+definition&aqs=chrome..69i57j0l5.3870j0j4&sourceid=chrome&es_sm=91&ie=UTF-8
HIGH TEMPERATURERESISTANCE
INLINE AND BATCHWASH SYSTEMS
AUTO-APPLY COMPATIBLE
BARCODING
TRACEABILITY
The label topcoat and adhesiveMUST PROTECT AGAINST:
BENEFITS:
300˚C (572˚F)
• Needed for pre-process labeling• Labels need to survive temperatures as high as
• Data rich • Error correction• Consistency • Small• Omnidirectional • Good contrast
BENEFITS:• Reduce labor• Reduce material waste• Improve asset utilization• Improve reliability
• Reduce rework• Reduce product recall• Reduce cost of warranty• Improve root cause analysis
Label rigidity designed to lay atto maximize performance in automationequipment or applications.
ABRASION CHEMICALS PRESSURE HEAT
Wash processes attack a label inmany different ways.
LABELING VS.DIRECT PRODUCT MARKING
Labels are the most flexible way tomaintain traceability in manufacturing.
LABELING:• Low capital investment• Cost ef cient• Easy to read• No additional cleaning
LASER:• High capital investment• Marking errors increase scrap rate
ELECTROSTATIC DISCHARGE
A high performance ESD label should INCLUDE:• ANSI Grade A topcoat designed to dissipate a static charge.
• Adhesive with a short static decay time.
Labels can create a static discharge thatcan ruin PCB components.
YOUR PROCESS
PROPERTIES YOU NEEDFOR
PCB LABELS:
PROPERTIES
PROCESSES
BROUGHT TO YOU BY:
BRADYSources:
http://en.wikipedia.org/wiki/Thermal_transfer_printingzhttp://encyclopedia2.thefreedictionary.com/Electrostatic+Discharge
http://www.europe.fasson.com/FRE/planets/deposit.nsf/vObjectStore/FINAL%2028582-1_Avery%20Brochure_EN.pdf/$file/FINAL%2028582-1_Avery%20Brochure_EN.pdfhttps://www.google.com/search?q=reflow+definition&oq=reflow+definition&aqs=chrome..69i57j0l5.3870j0j4&sourceid=chrome&es_sm=91&ie=UTF-8
HIGH TEMPERATURERESISTANCE
INLINE AND BATCHWASH SYSTEMS
AUTO-APPLY COMPATIBLE
BARCODING
TRACEABILITY
The label topcoat and adhesiveMUST PROTECT AGAINST:
BENEFITS:
300˚C (572˚F)
• Needed for pre-process labeling• Labels need to survive temperatures as high as
• Data rich • Error correction• Consistency • Small• Omnidirectional • Good contrast
BENEFITS:• Reduce labor• Reduce material waste• Improve asset utilization• Improve reliability
• Reduce rework• Reduce product recall• Reduce cost of warranty• Improve root cause analysis
Label rigidity designed to lay atto maximize performance in automationequipment or applications.
ABRASION CHEMICALS PRESSURE HEAT
Wash processes attack a label inmany different ways.
LABELING VS.DIRECT PRODUCT MARKING
Labels are the most flexible way tomaintain traceability in manufacturing.
LABELING:• Low capital investment• Cost ef cient• Easy to read• No additional cleaning
LASER:• High capital investment• Marking errors increase scrap rate
ELECTROSTATIC DISCHARGE
A high performance ESD label should INCLUDE:• ANSI Grade A topcoat designed to dissipate a static charge.
• Adhesive with a short static decay time.
Labels can create a static discharge thatcan ruin PCB components.
YOUR PROCESS
PROPERTIES YOU NEEDFOR
PCB LABELS:
PROPERTIES
PROCESSES
BROUGHT TO YOU BY:
BRADYSources:
http://en.wikipedia.org/wiki/Thermal_transfer_printingzhttp://encyclopedia2.thefreedictionary.com/Electrostatic+Discharge
http://www.europe.fasson.com/FRE/planets/deposit.nsf/vObjectStore/FINAL%2028582-1_Avery%20Brochure_EN.pdf/$file/FINAL%2028582-1_Avery%20Brochure_EN.pdfhttps://www.google.com/search?q=reflow+definition&oq=reflow+definition&aqs=chrome..69i57j0l5.3870j0j4&sourceid=chrome&es_sm=91&ie=UTF-8
HIGH TEMPERATURERESISTANCE
INLINE AND BATCHWASH SYSTEMS
AUTO-APPLY COMPATIBLE
BARCODING
TRACEABILITY
The label topcoat and adhesiveMUST PROTECT AGAINST:
BENEFITS:
300˚C (572˚F)
• Needed for pre-process labeling• Labels need to survive temperatures as high as
• Data rich • Error correction• Consistency • Small• Omnidirectional • Good contrast
BENEFITS:• Reduce labor• Reduce material waste• Improve asset utilization• Improve reliability
• Reduce rework• Reduce product recall• Reduce cost of warranty• Improve root cause analysis
Label rigidity designed to lay atto maximize performance in automationequipment or applications.
ABRASION CHEMICALS PRESSURE HEAT
Wash processes attack a label inmany different ways.
LABELING VS.DIRECT PRODUCT MARKING
Labels are the most flexible way tomaintain traceability in manufacturing.
LABELING:• Low capital investment• Cost ef cient• Easy to read• No additional cleaning
LASER:• High capital investment• Marking errors increase scrap rate
ELECTROSTATIC DISCHARGE
A high performance ESD label should INCLUDE:• ANSI Grade A topcoat designed to dissipate a static charge.
• Adhesive with a short static decay time.
Labels can create a static discharge thatcan ruin PCB components.
flat
YOUR PROCESS
PROPERTIES YOU NEEDFOR
PCB LABELS:
PROPERTIES
PROCESSES
BROUGHT TO YOU BY:
BRADYSources:
http://en.wikipedia.org/wiki/Thermal_transfer_printingzhttp://encyclopedia2.thefreedictionary.com/Electrostatic+Discharge
http://www.europe.fasson.com/FRE/planets/deposit.nsf/vObjectStore/FINAL%2028582-1_Avery%20Brochure_EN.pdf/$file/FINAL%2028582-1_Avery%20Brochure_EN.pdfhttps://www.google.com/search?q=reflow+definition&oq=reflow+definition&aqs=chrome..69i57j0l5.3870j0j4&sourceid=chrome&es_sm=91&ie=UTF-8
HIGH TEMPERATURERESISTANCE
INLINE AND BATCHWASH SYSTEMS
AUTO-APPLY COMPATIBLE
BARCODING
TRACEABILITY
The label topcoat and adhesiveMUST PROTECT AGAINST:
BENEFITS:
300˚C (572˚F)
• Needed for pre-process labeling• Labels need to survive temperatures as high as
• Data rich • Error correction• Consistency • Small• Omnidirectional • Good contrast
BENEFITS:• Reduce labor• Reduce material waste• Improve asset utilization• Improve reliability
• Reduce rework• Reduce product recall• Reduce cost of warranty• Improve root cause analysis
Label rigidity designed to lay atto maximize performance in automationequipment or applications.
ABRASION CHEMICALS PRESSURE HEAT
Wash processes attack a label inmany different ways.
LABELING VS.DIRECT PRODUCT MARKING
Labels are the most flexible way tomaintain traceability in manufacturing.
LABELING:• Low capital investment• Cost ef cient• Easy to read• No additional cleaning
LASER:• High capital investment• Marking errors increase scrap rate
ELECTROSTATIC DISCHARGE
A high performance ESD label should INCLUDE:• ANSI Grade A topcoat designed to dissipate a static charge.
• Adhesive with a short static decay time.
Labels can create a static discharge thatcan ruin PCB components.
YOUR PROCESS
PROPERTIES YOU NEEDFOR
PCB LABELS:
PROPERTIES
PROCESSES
BROUGHT TO YOU BY:
BRADYSources:
http://en.wikipedia.org/wiki/Thermal_transfer_printingzhttp://encyclopedia2.thefreedictionary.com/Electrostatic+Discharge
http://www.europe.fasson.com/FRE/planets/deposit.nsf/vObjectStore/FINAL%2028582-1_Avery%20Brochure_EN.pdf/$file/FINAL%2028582-1_Avery%20Brochure_EN.pdfhttps://www.google.com/search?q=reflow+definition&oq=reflow+definition&aqs=chrome..69i57j0l5.3870j0j4&sourceid=chrome&es_sm=91&ie=UTF-8
HIGH TEMPERATURERESISTANCE
INLINE AND BATCHWASH SYSTEMS
AUTO-APPLY COMPATIBLE
BARCODING
TRACEABILITY
The label topcoat and adhesiveMUST PROTECT AGAINST:
BENEFITS:
300˚C (572˚F)
• Needed for pre-process labeling• Labels need to survive temperatures as high as
• Data rich • Error correction• Consistency • Small• Omnidirectional • Good contrast
BENEFITS:• Reduce labor• Reduce material waste• Improve asset utilization• Improve reliability
• Reduce rework• Reduce product recall• Reduce cost of warranty• Improve root cause analysis
Label rigidity designed to lay atto maximize performance in automationequipment or applications.
ABRASION CHEMICALS PRESSURE HEAT
Wash processes attack a label inmany different ways.
LABELING VS.DIRECT PRODUCT MARKING
Labels are the most flexible way tomaintain traceability in manufacturing.
LABELING:• Low capital investment• Cost ef cient• Easy to read• No additional cleaning
LASER:• High capital investment• Marking errors increase scrap rate
ELECTROSTATIC DISCHARGE
A high performance ESD label should INCLUDE:• ANSI Grade A topcoat designed to dissipate a static charge.
• Adhesive with a short static decay time.
Labels can create a static discharge thatcan ruin PCB components.
• Cost efficient
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