Patents of laser micro-machining technology for Semicon drilling/cutting...
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Patents of laser micro-machining technology for Semicon drilling/cutting applications Dr. Li, Chun Hao (Owen Li) President of Hortech Company
Transcript of Patents of laser micro-machining technology for Semicon drilling/cutting...
Patents of laser micro-machining technology for
Semicon drilling/cutting applications Dr. Li, Chun Hao (Owen Li) President of Hortech Company
Company Introduction
Laser Micro-machining technology
Integration technology of Opto-mechatronic、Control、Software、Material 、 Processing
Laser micro-machining / dry etching solution
Laser & Material reaction Opto-mechatronic system Optimal-processing
Laser-Opto Mechanic Electical Control Software Process
Patents for manufacturing solution
Related patents Countries Type
of Patent Application Status
Laser processing machine
US/Japan/K
orea/Taiwan
/China
Invention
USA Patent No.US 8,710,401
B2(2014)/特許第5531060/No. 10-1378619/第M417976號/第M417976號
Laser Device Of Equal-Energy Pulse
Synchronous With Motion
US/Taiwan/
China Invention
USA 8,422,521 B2/第I 403376號/ZL2011.1.0003852.2號CN
DOUBLE-DIRECTIONAL MACHINING
LASER MACHINE TOOL
US/Taiwan/
China Invention
This non-provisional application claims
priority under 35 U.S.C. § 119(a) on
Patent Application No. 201520663067.3
filed in China/第M515922/ZL2015.2.0663067.3
DOUBLE-SIDED MACHINING LASER
MACHINE TOOL
US/Taiwan/
China Invention
This non-provisional application
claims priority under 35 U.S.C. §
119(a) on Patent Application No.
201620426817.X filed in China
雷射製程參數調校方法及自動參數調校之雷射加工機
Taiwan/China
Invention 第I411484號/第1387752號CN
Video for laser micro-machining
system with Automation
Video for Demo-2
Video for Demo-1
Laser micro-drilling application
Laser drilling on ceramic : 50um diameter, thickness 200um
Laser drilling on ceramic : 50um square, thickness 200um
Laser drilling on PI/ceramic/ABF :
20~100um diameter hole/blind hole
Laser drilling on stainless : 50um diameter bowl dot
Laser drilling on Al : 7/15/25um diameter surface structure
Laser drilling on stainless : 3.6um diameter focus spot size
Laser drilling on stainless : 2um diameter focus spot size
Laser cutting application
Laser cut on sapphire wafer :
groove width around 24um, the depth around >60um
Laser cutting for IC package
Laser dry etching applications
Laser dry etching thin film ITO on thick film BM or glass
