Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e...
Transcript of Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e...
![Page 1: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/1.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DIP-16 Unit: mm(inch)
New Product Changed to PDIP-16 (2013.10)
5°
6°
4°
7.320(0.288)
7.920(0.312)
0.700(0.028)
8.200(0.323)
9.400(0.370)
0.204(0.008)
0.360(0.014)
6°
1.524(0.060) TYP
0.510(0.020)MIN
3.000(0.118)
3.600(0.142)
2.540(0.100)
TYP
0.360(0.014)
0.560(0.022)
3.710(0.146)
4.310(0.170)
Φ3.000(0.118)
Depth
0.050(0.002)
0.150(0.006)
3.200(0.126)
3.600(0.142)
6.200(0.244)
6.600(0.260)
18.800(0.740)
19.200(0.756)
R0.750(0.030)
4°
Note: Eject hole, oriented hole and mold mark is optional.
![Page 2: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/2.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DIP-16 (Special for AZ4052) Unit: mm(inch)
5°
6°
4°
7.320(0.288)
7.920(0.312)
0.700(0.028)
8.500(0.335)
0.204(0.008)
0.360(0.014 )
6°
1.524(0.060) TYP
0.510(0.020)MIN
3.000(0.118)
3.600(0.142)
2.540(0.100)
TYP
0.360(0.014)
0.560(0.022)
3.710(0.146)
4.310(0.170)
Φ3.000(0.118)
Depth
0.050(0.002)
0.150(0.006)
3.200(0.126)
3.600(0.142)
6.200(0.244)
6.600(0.260)
18.800(0.740)
19.200(0.756)
R0.750(0.030)
4°
Note: Eject hole , oriented hole and mold mark is optional.
TYP
![Page 3: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/3.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOIC-16 Unit: mm(inch)
New Product Changed to SO-16 (2013.10)
7°
9.8
00(0
.38
6)
10.2
00(0
.402)
5.800(0.228)
6.240(0.246)
0.310(0.012)
0.510(0.020)
20:1A
D1
7°
0°
8°
B
C
1.0
00(0
.03
9)
S 1.000(0.039)
0.200(0.008)
20:1B
C
50:1C-C
0.200(0.008)
0.250(0.010)
0.400(0.016)
1.270(0.050)
0.250(0.010)
1.2
70(0
.050)
BS
C
Depth 0.200(0.008)
0.250(0.010)
0.050(0.002)
R
0.200(0.008)
R
0.200(0.008)
0.1
70(0
.00
7)
0.2
50(0
.010)
A
3.800(0.150)
4.040(0.159)
3°
8°9.5°
8°
8°7°
0.400(0.016)×45°
Note: Eject hole, oriented hole and mold mark is optional.
φ
D
0.150(0.006)
0.070(0.003)
0.070(0.003)
.
SymbolD D1
min(mm) max(mm) max(mm)min(mm)min(inch) min(inch)max(inch) max(inch)
Option1
Option2
1.350
-
1.750
1.260
0.069
- 0.050
1.650
-
1.250
1.020
0.049
0.040
0.065
-
0.053
![Page 4: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/4.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOIC-16
Z
XE
Y
G
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059 1.270/0.050
![Page 5: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/5.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
WSOP-16 Unit: mm(inch)
1.270(0.050)
TYP0.350(0.014)
0.550(0.022)
9.950(0.392)
10.400(0.409)
5.000(0.197)
5.600(0.220)7.400(0.291)
8.200(0.323)
2.250(0.089)
MAX
0.130(0.005)
0.200(0.008)
0.300(0.012)
0.700(0.028)
0.050(0.002)
0.200(0.008)
Note: Eject hole, oriented hole and mold mark is optional.
![Page 6: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/6.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DIP-14 Unit: mm(inch)
New Product Changed to PDIP-14 (2013.10)
4°
0.254(0.010)
5°10°
10°
4°
18.800(0.740)
19.200(0.756)
0.360(0.014)
0.560(0.022)
2.540(0.100)TYP
R1.000(0.039)
0.130(0.005)MIN
7.620(0.300)TYP
0.700(0.028)
Φ3.000(0.118)
Depth
0.100(0.004)
0.200(0.008)
8.200(0.323)
9.400(0.370)
0.204(0.008)
0.360(0.014)
1.600(0.063)
1.800(0.071)
1.600(0.063)
1.800(0.071)
1.524(0.060) TYP
3.000(0.118)
3.600(0.142)0.510(0.020)MIN
6.200(0.244)
6.600(0.260)
Note: Eject hole, oriented hole and mold mark is optional.
![Page 7: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/7.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOIC-14 Unit: mm(inch)
New Product Changed to SO-14 (2013.10)
Note: Eject hole, oriented hole and mold mark is optional.
8.550(0.337)
1.3
50(0
.053)
5°
7°
0.700(0.028)0.100(0.004)
0.250(0.010)
0.400(0.016)
0°
R0.200(0.008)
20:1
A
0.250(0.010)×45°
8°
A
8°
0.1
00(0
.00
4)
9.5°
8°
0°
8°
Depth 0.060(0.002)0.100(0.004)
2.000(0.079)
1.270(0.050)
1.0
00(0
.039)
1.3
00(0
.05
1)
5.8
00(0
.22
8)
8.750(0.344)
0.250(0.010)
1.7
50(0
.069)
0.2
50(0
.01
0)
3.800(0.150)
4.000(0.157)
0.310(0.012)
0.510(0.020)
6.2
00(0
.24
4)
1.270(0.050)
8°
R0.200(0.008)
0.200(0.008)MIN
0.500(0.020)×45°
φ
15°
![Page 8: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/8.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOIC-14
E X
Y
GZ
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059 1.270/0.050
![Page 9: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/9.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DIP-8 Unit: mm(inch)
New Product Changed to PDIP-8 (2013.10)
4°
6°
R0.750(0.030)
0.254(0.010)TYP
0.130(0.005)MIN
8.200(0.323)
9.400(0.370)
0.204(0.008)
0.360(0.014)
7.620(0.300)TYP
4°
6°5°
0.700(0.028)
9.000(0.354)
9.600(0.378)
3.710(0.146)
4.310(0.170)
3.000(0.118)
3.600(0.142)
0.360(0.014)
0.560(0.022)
2.540(0.100) TYP
6.200(0.244)
6.600(0.260)
3.200(0.126)
3.600(0.142)
0.510(0.020)MIN
Φ3.000(0.118)
Depth
0.100(0.004)
0.200(0.008)
1.524(0.060) TYP
Note: Eject hole, oriented hole and mold mark is optional.
![Page 10: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/10.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TDIP-8 Unit: mm(inch)
1.500(0.059)1.700(0.067)
3.300(0.130)MAX0.600(0.024)0.800(0.031)
0.940(0.037)1.040(0.041)
1.470(0.058)1.670(0.066)
2.540(0.100)BCS
3.100(0.122)3.500(0.138)
7.570(0.298)8.200(0.323)
8.200(0.323)9.400(0.370)
9.150(0.360)9.350(0.368)
6.250(0.246)6.450(0.254)
0.500(0.020)MIN
0.390(0.015)0.550(0.022)
Note: Eject hole, oriented hole and mold mark is optional.
![Page 11: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/11.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DIP-7 Unit: mm(inch)
New Product Changed to PDIP-7 (2013.10)
8.400(0.331)
9.000(0.354)
0.204(0.008)
0.360(0.014)
7.320(0.288)
9.000(0.354)
9.400(0.370)
3.710(0.146)
4.310(0.170)
3.000(0.118)
3.600(0.142)
2.540(0.100)BSC
6.200(0.244)
6.600(0.260)
3.200(0.126)
3.600(0.142)
0.510(0.020)MIN
1.524(0.060) BSC
Note: Eject hole, oriented hole and mold mark is optional.
0.380(0.015)
0.570(0.022)
7.920(0.312)
![Page 12: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/12.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TDIP-7 Unit: mm(inch)
1.500(0.059)
1.700(0.067)
3.300(0.130)MAX0.600(0.024)0.800(0.031)
0.940(0.037)1.040(0.041)
1.470(0.058)1.670(0.066)
2.540(0.100)BCS
3.100(0.122)3.500(0.138)
7.570(0.298)8.200(0.323)
8.200(0.323)9.400(0.370)
9.150(0.360)9.350(0.368)
6.250(0.246)
6.450(0.254)
0.500(0.020)MIN
0.390(0.015)0.550(0.022)
Note: Eject hole, oriented hole and mold mark is optional.
![Page 13: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/13.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TSSOP-8 Unit: mm(inch)
4.3
00(0
.16
9)
0.4
00
(0.0
16
)
0.190(0.007)
0.300(0.012)
SEE DETAIL A
DETAIL A
2.900(0.114)
0.050(0.002)
0.150(0.006)1.200(0.047)
MAX
1.950(0.077)
0°
8°
12 °
TOP & BOTTOM
R0.090(0.004)
0.450(0.018)
0.750(0.030)
1.000(0.039)
6.4
00
(0.2
52
)
0.800(0.031)
1.050(0.041)
0.090(0.004)
0.200(0.008)
GAGE PLANE
SEATINGPLANE
0.250(0.010)
3.100(0.122)
4.5
00(0
.17
7)
TY
P
0.6
50
(0.0
26
)
TY
P
TYP
TYP
R0.090(0.004)
REF
Note: Eject hole, oriented hole and mold mark is optional.
![Page 14: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/14.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TSSOP-8
Y
G Z
E1
E X
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
E1
(mm)/(inch)
Value 7.720/0.304 4.160/0.164 0.420/0.017 1.780/0.070 0.650/0.026 1.950/0.077
![Page 15: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/15.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOIC-8 Unit: mm(inch)
New Product Changed to SO-8 (2013.10)
0°
8°
1°
7°
R0.150(0.006)
R0.1
50(0
.006)
1.000(0.039)
0.300(0.012)
0.510(0.020)
1.350(0.053)
1.750(0.069)
0.100(0.004)
0.300(0.012)
3.800(0.150)
4.000(0.157)
7°
7°
20:1
D
1.270(0.050)
TYP
0.150(0.006)
0.250(0.010)
8°
D5.800(0.228)
6.200(0.244)
0.600(0.024)
0.725(0.029)
0.320(0.013)
8°
0.450(0.017)
0.820(0.032)
4.700(0.185)
5.100(0.201)
Note: Eject hole , oriented hole and mold mark is optional.
Option 1
Option 1
Option 2 0.350(0.014)
TYP
TYP
TYP9°~
9°~
![Page 16: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/16.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOIC-8
Grid
placement
courtyard
ZG
Y
E X
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059 1.270/0.050
![Page 17: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/17.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOIC-7 Unit: mm(inch)
New Product Changed to SO-7 (2013.10)
3.800(0.150)
4.000(0.157)
1.270(0.050)
TYP
4.700(0.185)
5.100(0.201)
0.330(0.013)
0.510(0.020)
0.150(0.006)
0.250(0.010)
0.080(0.003)
0.250(0.010)
1.350(0.053)
1.750(0.069)
0.450(0.017)
0.800(0.031)8°0°
5.800(0.228)
6.200(0.244)
2.54(0.100)
TYP
1.250(0.049)
1.500(0.059)
Note: Eject hole, oriented hole and mold mark is optional.
Option 2
45°
0.350(0.014)
TYP
Option 1
![Page 18: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/18.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOIC-7
ZG
E1
E X
Y
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
E1
(mm)/(inch)
Value 6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059 1.270/0.050 2.540/0.100
![Page 19: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/19.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-223 Unit: mm(inch)
New Product Changed to SOT223 (2013.10)
3.3
00
(0.1
30
)
3.7
00
(0.1
46
)
6.7
00
(0.2
64
)
7.3
00(0
.28
7)
2.900(0.114)
3.100(0.122)
0.600(0.024)
0.810(0.032)
2.300(0.091)
TYP
6.300(0.248)
6.700(0.264)
1.750(0.069)
TYP
4.500(0.177)
4.700(0.185)
0.010(0.0004)
0.150(0.006)
1.520(0.060)
1.800(0.071)
1.500(0.059)
1.700(0.067)
0.200(0.008)
0.350(0.014)
0.250(0.010)
0°
10°
0.850(0.033)
MIN
![Page 20: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/20.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOT-223
X2
Y
X1
Y
G
E1E2
Z
Grid placement courtyard
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X1
(mm)/(inch)
X2
(mm)/(inch)
Y
(mm)/(inch)
E1
(mm)/(inch)
E2
(mm)/(inch)
Value 8.400/0.331 4.000/0.157 1.200/0.047 3.500/0.138 2.200/0.087 2.300/0.091 4.600/0.181
![Page 21: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/21.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23-3 Unit: mm(inch)
New Product Changed to SC59 (2013.10)
2.820(0.111)
3.100(0.122)
2.6
50
(0.1
04
)
3.0
00
(0.1
18
)
0.950(0.037)
TYP
0.300(0.012)
0.500(0.020)
1.5
00(0
.05
9)
1.7
00(0
.06
7)
1.800(0.071)
2.000(0.079)
0.3
00
(0.0
12
)
0.6
00
(0.0
24
)
0.100(0.004)
0.200(0.008)
0.000(0.000)
0.150(0.006)
0.900(0.035)
1.300(0.051)
1.4
50
(0.0
57
)
MA
X.
0.200(0.008)
0
8
![Page 22: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/22.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOT-23-3
Y
ZGE1
E2
X
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E1
(mm)/(inch)
E2
(mm)/(inch)
Value 3.600/0.142 1.600/0.063 0.700/0.028 1.000/0.039 0.950/0.037 1.900/0.075
![Page 23: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/23.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23-3(Only for AH920/AH921A/AH921) Unit: mm(inch)
2.820(0.111)
3.100(0.122)
2.6
50(0
.10
4)
3.0
00(0
.11
8)
0.950(0.037)
TYP
0.300(0.012)
0.500(0.020)
1.5
00(0
.059)
1.7
00(0
.067)
1.800(0.071)
2.000(0.079)
0.3
00(0
.01
2)
0.6
00(0
.02
4)
0.100(0.004)
0.200(0.008)
0.000(0.000)
0.150(0.006)
0.900(0.035)
1.300(0.051)
1.4
50(0
.05
7)
MA
X.
0.200(0.008)
0
8
0.770(0.030)
1.070(0.042)
1.230(0.048)
1.530(0.060)
Package Sensor
Location
Die
A4
Symbolmin(mm) max(mm) min(inch) max(inch)
Option 1
Option 2
0.575 0.023
A4
0.475 0.019
0.740 0.0290.640 0.025
![Page 24: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/24.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23-3(Only for AH922/AH922B/AH922C) Unit: mm(inch)
2.820(0.111)
3.020(0.119)
2.6
50(0
.10
4)
2.9
50(0
.11
6)
0.950(0.037)
TYP
0.300(0.012)
0.500(0.020)
1.5
00(0
.059)
1.7
00(0
.067)
1.800(0.071)
2.000(0.079)
0.3
00(0
.01
2)
0.6
00(0
.02
4)
0.100(0.004)
0.200(0.008)
0.000(0.000)
0.150(0.006)
0.900(0.035)
1.300(0.051)
1.4
50(0
.05
7)
MA
X.
0.200(0.008)
08
0.770(0.030)
1.070(0.042)
1.300(0.051)
1.600(0.063)
Package Sensor
Location
A4
Die
Symbolmin(mm) max(mm) min(inch) max(inch)
Option 1
Option 2
0.575 0.023
A4
0.475 0.019
0.740 0.0290.640 0.025
![Page 25: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/25.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23-3(AH49F/AH49H) Unit: mm(inch)
2.820(0.111)
3.100(0.122)
2.6
50(0
.10
4)
3.0
00(0
.11
8)
0.950(0.037)
TYP
0.300(0.012)
0.500(0.020)
1.5
00
(0.0
59)
1.7
00
(0.0
67)
1.800(0.071)
2.000(0.079)
0.3
00(0
.01
2)
0.6
00(0
.02
4)
0.100(0.004)
0.200(0.008)
0.000(0.000)
0.150(0.006)
0.900(0.035)
1.300(0.051)
1.4
50
(0.0
57)
MA
X.
0.200(0.008)
0
8
0.670(0.026)
0.970(0.038)
1.300(0.051)
1.600(0.063)
(For Hall IC)
Package Sensor Location
A4
Die
Symbolmin(mm) max(mm) min(inch) max(inch)
Option 1
Option 2
0.575 0.023
A4
0.475 0.019
0.740 0.0290.640 0.025
![Page 26: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/26.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23-3(Only for AH9247) Unit: mm(inch)
2.820(0.111)
3.100(0.122)
2.6
50(0
.10
4)
3.0
00(0
.11
8)
0.950(0.037)
TYP
0.300(0.012)
0.500(0.020)
1.5
00(0
.059)
1.7
00(0
.067)
1.800(0.071)
2.000(0.079)
0.3
00(0
.01
2)
0.6
00(0
.02
4)
0.100(0.004)
0.200(0.008)
0.000(0.000)
0.150(0.006)
0.900(0.035)
1.300(0.051)
1.4
50(0
.05
7)
MA
X.
0.200(0.008)
0
8
1.350(0.053)
1.550(0.061)
0.800(0.031)
1.000(0.039)
Package Sensor
Location
A4
Die
Symbolmin(mm) max(mm) min(inch) max(inch)
Option 1
Option 2
0.575 0.023
A4
0.475 0.019
0.740 0.0290.640 0.025
![Page 27: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/27.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23-3(2) Unit: mm(inch)
2.700(0.106)
3.100(0.122)
2.7
00
(0.1
06)
3.1
00
(0.1
22)
1.900(0.075)
TYP0.450(0.018)
0.550(0.022)
1.4
00(0
.05
5)
1.6
00(0
.06
3)
1.0
00(0
.03
9)
1.4
00(0
.05
5)
1.000(0.039)
1.300(0.051)
0.000(0.000)
0.100(0.004)
0.850(0.033)
1.050(0.041)10°
0°
0.100(0.004)0.200(0.008)
0.400(0.158)
REF
0.350(0.014)
0.500(0.020)
![Page 28: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/28.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23-3 (Only for AH9248 and AH9249) Unit: mm(inch)
2.820(0.111)
3.020(0.119)
2.6
50
(0.1
04
)
2.9
50
(0.1
16
)
0.950(0.037)
TYP
0.300(0.012)
0.500(0.020)
1.5
00(0
.05
9)
1.7
00(0
.06
7)
1.800(0.071)
2.000(0.079)
0.3
00(0
.01
2)
0.6
00(0
.02
4)
0.100(0.004)
0.200(0.008)
0.000(0.000)
0.150(0.006)
0.900(0.035)
1.300(0.051)
1.4
50
(0.0
57
)
MA
X.
0.200(0.008)
0
8
0.900(0.035)
TYP
1.45(0.057)
TYP
A4
Die
Symbolmin(mm) max(mm) min(inch) max(inch)
Option 1
Option 2
0.575 0.023
A4
0.475 0.019
0.740 0.0290.640 0.025
![Page 29: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/29.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23-3 (Only for AH49E) Unit: mm(inch)
2.820(0.111)
3.100(0.122)
2.6
50
(0.1
04
)
3.0
00
(0.1
18
)
0.950(0.037)
TYP
0.300(0.012)
0.500(0.020)
1.5
00(0
.05
9)
1.7
00(0
.06
7)
1.800(0.071)
2.000(0.079)
0.3
00
(0.0
12
)
0.6
00
(0.0
24
)
0.100(0.004)
0.200(0.008)
0.000(0.000)
0.150(0.006)
0.900(0.035)
1.300(0.051)
1.4
50
(0.0
57
)
MA
X.
0.200(0.008)
0
8
1.300(0.051)
1.600(0.063)
(For Hall IC)
Package Sensor Location
0.685(0.027)
0.985(0.039)
A4
Die
Symbolmin(mm) max(mm) min(inch) max(inch)
Option 1
Option 2
0.575 0.023
A4
0.475 0.019
0.740 0.0290.640 0.025
![Page 30: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/30.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23 Unit: mm(inch)
New Product Changed to SOT23 (2013.10)
2.300(0.091)
2.500(0.098)
1.200(0.047)
1.400(0.055)
0.890(0.035)1.030(0.041)
0.300(0.012)
0.510(0.020)
1.900(0.075)REF
2.800(0.110)3.000(0.118)
2.0°
3.0 °
0.500(0.020)0.700(0.028)
1.050(0.041)REF0.010(0.0004)
0.100(0.004)
0.900(0.035)
1.100(0.043)
4×R0.100(0.004)7.0°
7.0°
0.550(0.022)REF
0.200(0.008)MIN
0.100(0.004) GAUGE PLANE
0.080(0.003)0.180(0.007)
R0.100(0.004)
0.0°~10.0°
![Page 31: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/31.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOT-23
Y
GZ
Y
X E
Grid placement courtyard
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 2.900/0.114 1.100/0.043 0.800/0.031 0.900/0.035 0.950/0.037
![Page 32: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/32.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23 (Special for LG IT) Unit: mm(inch)
2.250(0.089)
2.500(0.098)
1.200(0.047)
1.400(0.055)
0.920(0.036)0.980(0.039)
0.300(0.012)0.500(0.020)
1.800(0.071)
2.800(0.110)
3.000(0.118)
2.0°
3.0 °
0.500(0.020)0.700(0.028)
1.050(0.041)REF0.000(0.000)0.100(0.004)
0.900(0.035)1.100(0.043)
4×R0.100(0.004)
7.0°
7.0°
0.550(0.022)REF
0.200(0.008)MIN
0.100(0.004) GAUGE PLANE
0.080(0.003)0.150(0.006)
R0.100(0.004)
0.0°~10.0°
2.000(0.079)
![Page 33: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/33.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23-5 (Except ITVS) Unit: mm(inch)
New Product Changed to SOT25 (2013.10)
2.820(0.111)
2.6
50(0
.10
4)
1. 5
00
(0.0
59
)
0.000(0.000)
0.300(0.012)0.950(0.037)
0.900(0.035)
0.100(0.004)
0.200(0.008)
0.3
00
(0. 0
12
)
8°
0°
3.100(0.122)
1.7
00
(0.0
67
)
3.0
00
(0.1
18
)
0.500(0.020)
0.150(0.006)
1.300(0.051)
0.200(0.008)
0.6
00
(0.0
24
)
1.800(0.071)
2.000(0.079)
0.700(0.028)
REF
TYP
1.4
50
(0.0
57
)
MA
X
![Page 34: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/34.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOT-23-5
E2
E1
Y
X
G Z
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E1
(mm)/(inch)
E2
(mm)/(inch)
Value 3.600/0.142 1.600/0.063 0.700/0.028 1.000/0.039 0.950/0.037 1.900/0.075
![Page 35: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/35.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23-5 (Only for AP2128 special datasheet) Unit: mm(inch)
2.820(0.111)
2.6
50(0
.10
4)
1.5
00(0
.05
9)
0.000(0.000)
0.300(0.012)0.950(0.037)
0.900(0.035)
0.100(0.004)
0.200(0.008)
0.3
00(0
.01
2)
8°
0°
3.020(0.119)
1.7
00(0
. 06
7)
2.9
50( 0
.11
6)
0.400(0.016)
0.150(0.006)
1.300(0.051)
0.200(0.008)
0.6
00(0
.02
4)
1.800(0.071)
2.000(0.079)
0.700(0.028)
REF
TYP
1.4
50(0
.05
7)
MA
X
Gauge Plane 0.000(0.000)
0.100(0.004)
![Page 36: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/36.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-89 Unit: mm(inch)
New Product Changed to SOT89 (2013.10)
45
1.550(0.061)REF
4.400(0.173)
4.600(0.181)
0.900(0.035)
1.200(0.047)
3.950(0.156)
4.250(0.167)
3.000(0.118)
TYP
0.480(0.019)
2.300(0.091)
2.600(0.102)
0.320(0.013)
0.540(0.021)
3 10
2.060(0.081)REF
1.400(0.055)
1.600(0.063)
0.350(0.014)
0.450(0.018)
R0.150(0.006)
3
10
1.500(0.059)
0.320(0.013)REF
1.620(0.064)REF2.210(0.087)REF
0.320(0.013)
0.540(0.021)
1.800(0.071)
Option 1 Option 2
0.620(0.024)
1.030(0.041)REF R 0.200(0.008)
1.620(0.064)
1.830(0.072)
2.630(0.104)
2.930(0.115)
Option 1
![Page 37: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/37.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOT-89
X1
X2
Y1
EX
Y
Z
Dimens
ions
Z
(mm)/(inch)
X
(mm)/(inch)
X1
(mm)/(inch)
X2
(mm)/(inch)
Y
(mm)/(inch)
Y1
(mm)/(inch)
E
(mm)/(inch)
Value 4.600/0.181 0.550/0.022 1.850/0.073 0.800/0.031 1.300/0.051 1.475/0.058 1.500/0.059
![Page 38: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/38.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-220-3 Unit: mm(inch)
New Product Changed to TO220-3 (2013.10)
φ3.540(0.139)
14.2
20(0
.56
0)
1.150(0.045)
0.813(0.032)
2.540(0.100)0.356 (0.014)
2.040(0.080)
3° 7°
3.560(0.140)
7°
9.660(0.380)
0.510(0.020)
0.381(0.015)
2.540(0.100)
8.3
90(0
. 330)
φ1.500(0.059)
0.200(0.008)
2.540(0.100) 0.610(0.024)
3.420(0.135)
10.660(0.420)
4.080(0.161)1.390(0.055)
27.8
80(1
. 09
8)
30. 2
80(1
.19
2)
9.5
20(0
.375)
16.5
10(0
.650)
4.820(0.190)
2.920(0.115)
1.770(0.070)
Option 1
Option 2 Option 3
![Page 39: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/39.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-220-3(u) Unit: mm(inch)
14
.23
0(0
. 56
0)
1.160(0.046)
0.813(0.032)8.763(0.345)
2.540(0.100)0.356(0.014)
2.080(0.082)
3° 7°
3.560(0.140)
7°
9.660(0.380)
0.550(0.022)
60°
0.381(0.015)
2.580(0.102)
60°
8. 5
20
( 0.3
35
)
1.500(0.059)
0.200(0.008)
1.8
50(0
. 07
3)
2.540(0.100)
0.381(0.015)
0.406(0.016)
3.380(0.133)
10.660(0.420)
4.060(0.160)1.350(0.053)
27
.88
0(1
.09
8)
30
.28
0(1
. 19
2)
9.5
20
( 0. 3
75
)
16
.51
0(0
. 65
0)
4.820(0.190)
2.880(0.113)
1.760(0.069)
3.560(0.140)F
F
![Page 40: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/40.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-220-3(2) Unit: mm(inch)
3°
3°
3°
9.800(0.386)
10.200(0.402)
3.560(0.140)
3.640(0.143)
11
.10
0(0
.43
7)
RE
F
0.700(0.028)
0.900(0.035)
1.170(0.046)
1.390(0.055)
2.540(0.100)
REF
2.540(0.100)
REF
9.6
00
(0.3
78
)
10
.60
0(0
.41
7)
12
.60
0(0
.49
6)
13
.60
0(0
.53
5)
9.0
00
(0.3
54
)
9.4
00
(0.3
70
)
1.200(0.047)
1.400(0.055)
0.600(0.024)
REF
6.3
00
(0.2
48
)
6.7
00
(0.2
64
)
4.400(0.173)
4.600(0.181)
2.200(0.087)
2.500(0.098)
0.400(0.016)
0.600(0.024)
1.620(0.064)
1.820(0.072)1.200(0.047)
1.400(0.055)
F
3.000(0.118)
REF
![Page 41: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/41.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-220-3(2) Special for Gree Unit: mm(inch)
3°
3°
3°
9.800(0.386)
10.200(0.402)
3.560(0.140)
3.640(0.143)
11.1
00(0
.437)
RE
F
0.700(0.028)
0.900(0.035)
1.170(0.046)
1.390(0.055)
2.540(0.100)
REF
2.540(0.100)
REF
9.6
00(0
.378)
10.6
00(0
.41
7)
12.6
00(0
.49
6)
13.6
00(0
.53
5)
9.0
00(0
.35
4)
9.4
00(0
.37
0)
1.200(0.047)
1.400(0.055)
0.600(0.024)
REF
6.3
00(0
.248)
6.7
00(0
.264)
4.400(0.173)
4.600(0.181)
2.200(0.087)
2.500(0.098)
0.460(0.018)
0.600(0.024)
1.620(0.064)
1.820(0.072)1.200(0.047)
1.400(0.055)
3.000(0.118)
REF
![Page 42: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/42.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-220-3(3) Unit: mm(inch)
10.060(0.396)
10.260(0.404)
5°5°
4.380(0.172)
4.580(0.180)
1.270(0.050)
3.420(0.135)
2.450(0.096)
2.650(0.104)
0.350(0.014)0.550(0.217)
0.710(0.028)
0.910(0.036)
1.270(0.050)
2.540(0.100)
R1.000(0.039)
7.900(0.311)8.100(0.319)
10.100(0.398) REF
5
5
8°
R0.500(0.020)
2.750(0.108)
3.600(0.142)
3.800(0.150)
10.200(0.402)
9.800(0.386)
Ø1.400(0.055)
1.600(0.063)
Ø3.840(0.151)
30
8.8
00(0
.34
6)
9.2
00(0
.36
2)
13
.15
0(0
.51
8)
13
.75
0(0
.54
1)
9.2
50
(0.3
64
)
9.7
50
(0.3
84
)
1.400(0.055)
1.600(0.063)
3.210(0.126)
3.410(0.134)
9.4
00(0
.37
0)
9.6
00(0
.37
8)
°°
°
2.540(0.100)
REFREF
REF
REF
REF
REF
![Page 43: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/43.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-220F-3 Unit: mm(inch)
4.300(0.169)
0.450(0.018)
0.650(0.026)2.540(0.100)
9.700(0.382)
10.300(0.406)
6.900(0.272)
7.100(0.280)
3.000(0.119)
3.400(0.134)
14.700(0.579)
16.000(0.630)
1.000(0.039)
1.400(0.055)
1.100(0.043)
1.500(0.059)2.7
90(0
.11
0)
4.5
00(0
.17
7)
12.500(0.492)
13.500(0.531)
0.500(0.020)
0.900(0.035)
2.540(0.100)
3.000(0.119)
3.550(0.140)
3.370(0.133)
3.900(0.154)
2.350(0.093)
2.900(0.114)
4.900(0.193)
2.520(0.099)2.920(0.115)
F
3.190(0.126)
3.250(0.128)
5 5
5
Option 1
Option 2
![Page 44: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/44.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO220F-3 Unit: mm(inch)
TO220F-3
Dim Min Max Typ
A 4.300 4.900 -
A2 2.520 2.920 -
A3 2.350 2.900 -
b 0.550 0.900 -
b1 1.000 1.400 -
b2 1.100 1.500 -
c 0.500 0.700 -
D 9.70 10.30 -
E 14.70 16.00 -
e - - 2.540
L 12.50 13.50 -
L1 2.790 4.500 -
X 6.90 7.10 -
Y 2.900 3.300 -
Y1 3.370 3.970 -
ø 3.000 3.550 -
All Dimensions in mm
D
X
Y
Y1
E
LL1
b1
b2
b
e e
A3
A
A2
c
ø
![Page 45: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/45.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-277 Unit: mm(inch)
New Product Changed to TO277 (2013.10)
6.400(0.252)
6.600(0.260)
5.800(0.228)
5.600(0.220)
4.1
00(0
.16
1)
4.3
00(0
.16
9)
1.700(0.067)
1.900(0.075)
1.000(0.039)
0.800(0.031)
1.000(0.039)
4.200(0.165)
4.400(0.173)
3.520(0.139)
TYP
TYP
3.0
00(0
.11
8)
3.3
00(0
.13
0)
0.850(0.033)
1.100(0.043)
1.860(0.073)
TYP
1.100(0.043)
1.400(0.055)
1.050(0.041)
1.200(0.047)
5.400(0.213)
TYP0.300(0.012)
0.400(0.016)
0.150(0.006)
TYP
Cathode line
by marking
![Page 46: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/46.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TO-277
E
Y1
X1
G
Y2
X2
Dimensions X1=Y1
mm(inch)
X2
mm(inch)
Y2
mm(inch)
E
mm(inch)
G
mm(inch)
Value 1.300(0.051) 4.600(0.181) 3.400((0.134) 1.860(0.073) 1.000(0.039)
![Page 47: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/47.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-252-2(1) Unit: mm(inch)
1.3
50
(0.0
53
)
1.6
50
(0.0
65
)0
.60
0(0
.02
4)
0.9
00
(0.0
35)
4.500(0.177)
4.700(0.185)
3°4°
3.8
00
RE
F(0
.15
0R
EF
)
4.8
00
(0.1
89)
6.5
00
(0.2
56
)
4.300(0.169)
5.400(0.213)
1.4
00
(0.0
55
)
1.7
80
(0.0
70
)
0.000(0.000)
0.127(0.005)
0.450(0.018)
0.580(0.023)
2.300TYP
9.5
00
(0.3
74
)9.9
00
(0.3
90
)
0.700(0.028)0.900(0.035)
0.500(0.020)
0.700(0.028)
5.200(0.205)5.400(0.213)
6.450(0.254)
6.650(0.262)
2.5
50
(0.1
00
)
2.9
00
(0.1
14
)
5.4
50
(0.2
15
)
6.2
50
(0.2
46
)
2.200(0.087)
2.400(0.094)
5° 5°
8°
0.450(0.018)
0.580(0.023)
![Page 48: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/48.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TO-252-2(1) Unit: mm(inch)
E1X1
Y2
Y1
Z
X2
G
Dimensions Z
(mm)/(inch)
X1
(mm)/(inch)
X2=Y2
(mm)/(inch)
Y1
(mm)/(inch)
G
(mm)/(inch)
E1
(mm)/(inch)
Value 11.600/0.457 1.500/0.059 7.000/0.276 2.500/0.098 2.100/0.083 2.300/0.091
![Page 49: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/49.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-220B-5 Unit: mm(inch)
3.790(0.149)
3.890(0.153)
10.010(0.394)10.310(0.406)
0.710(0.028)0.910(0.036)
1.700(0.067)TYP
6.700(0.264)
6.900(0.272)
1.170(0.046)
1.370(0.054)
4.470(0.176)4.670(0.184)
1.170(0.046)1.370(0.054)
2.520(0.099)2.820(0.111)
4.250(0.167)
4.550(0.179)
0.310(0.012)
0.530(0.021)
8.250(0.325)
8.550(0.337)
3.800(0.150)
4.000(0.157)5.300(0.209)
5.500(0.217)
3.400(0.134)3.600(0.142)
12.460(0.491)
12.860(0.506)
2.590(0.102)2.890(0.114)
0.950(0.037)1.050(0.041)R
8.900(0.350)
9.300(0.366)24.300(0.957)
24.700(0.972)
25.100(0.988)
25.500(1.004)
3.300(0.130)
3.500(0.138)
![Page 50: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/50.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-263-2 Unit: mm(inch)
New Product Changed to TO263-2 (2013.10)
7°
3°7°
8.3
90(0
.33
0)
9.6
50
(0.3
80
)
0.990(0.039)
0.510(0.020)
2.540(0.100)
1.150(0.045)
9.650(0.380)
3°
14.610(0.575)
8.840(0.348)
2.640(0.104)
0.000(0.000)
8°2°
0°6°
0.356(0.014)
1.7
80
(0.0
70
)
2.200(0.087)
70°
10.660(0.420)
4.070(0.160)
4.820(0.190)
1.650(0.065)
1.150(0.045)
1.770(0.070)
2.540(0.100)
1.270(0.050)
1.670(0.066)
2.7
90(0
. 11
0)
15.870(0.625)
0.250(0.010)
2.700(0.106)
5.6
00
(0. 2
20)
7.420(0.292)
7.980(0.314)
2.540(0.100)
2.540(0.100)
1.7
70
(0.0
70)
MA
X
0.730(0.029)
6.230(0.245)
Option 1
MIN6.5
50
(0.2
58
)
MIN
Option 2
![Page 51: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/51.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TO-263-2
Y3
Y2
X2
Z
X3
X1
E
Y1
Dimensions Z
(mm)/(inch)
X1
(mm)/(inch)
X2
(mm)/(inch)
X3
(mm)/(inch)
Value 16.760/0.660 1.200/0.047 8.540/0.336 10.540/0.415
Dimensions Y1
(mm)/(inch)
Y2
(mm)/(inch)
Y3
(mm)/(inch)
E
(mm)/(inch)
Value 3.830/0.151 8.560/0.337 3.000/0.118 5.080/0.200
![Page 52: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/52.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-263-2 (Special for LG) Unit: mm(inch)
7°
3°7°
8.6
40(0
.34
0)
9.6
50(0
. 38
0)
0.990(0.039)
0.510(0.020)
2.413(0.095)
1.150(0.045)
9.650(0.380)
3°
14.760(0.581)
2.640(0.104)
0.020(0.001)
8°2°
0°6°
2 .3
90(0
.09
4)
0.360(0.014)
70°
10.290(0.405)
4.070(0.160)
4.820(0.190)
1.390(0.055)
1.150(0.045)
1.390(0.055)
1.270(0.050)
1.390(0.055)
2.69
0(0
.106)
15.740(0.620)
0.250(0.010)
2.700(0.106)
0.400(0.016)
5.6
00(0
.22
0)
7.420(0.292)
7.980(0.314)
1.5
00(0
.059)
2.667(0.105)
2.413(0.095)
2.667(0.105)2.413(0.095)
2.667(0.105)2.413(0.095)
2.667(0.105)
REF
RE
F
REF
![Page 53: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/53.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-263-3 Unit: mm(inch)
New Product Changed to TO263 (2013.10)
7°
3°7°
9.6
50
(0.3
80
)
0.990(0.039)
0.510(0.020)
2.540(0.100)
1.150(0.045)
9.650(0.380)
3°
14.760(0.581)
8.840(0.348)
2.640(0.104)
0.000(0.000)
8°2°
0°6°
2.200(0.087)
70°
4.070(0.160)
4.820(0.190)
1.150(0.045)
2.540(0.100)
1.270(0.050)
15.740(0.620)
0.250(0.010)
2.700(0.106)
5.6
00(0
.22
0)
7.420(0.292)
7.980(0.314)
2.540(0.100)
2.540(0.100)
10.660(0.420)
1.670(0.066)1.650(0.065)
1.770(0.070)
0.356(0.014)
0.730(0.029)
8.3
90
(0.3
30)
1.7
80(0
. 07
0)
2.7
90
(0. 1
10
)
Option 1
6.230(0.245)
MIN6.5
50
(0.2
58
)
MIN
Option 2
![Page 54: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/54.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TO-263-3
Y3
Y2
X2
Z
X3
X1
E
Y1
Dimensions Z
(mm)/(inch)
X1
(mm)/(inch)
X2
(mm)/(inch)
X3
(mm)/(inch)
Value 16.760/0.660 1.200/0.047 8.540/0.336 10.540/0.415
Dimensions Y1
(mm)/(inch)
Y2
(mm)/(inch)
Y3
(mm)/(inch)
E
(mm)/(inch)
Value 3.830/0.151 8.560/0.337 3.000/0.118 2.540/0.100
![Page 55: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/55.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-263-3 (Special for LG) Unit: mm(inch)
7°
3°7°
8.6
40(0
.34
0)
9.6
50(0
. 380)
0.990(0.039)
0.510(0.020)
1.150(0.045)
9.650(0.380)
3°
14.760(0.581)
2.640(0.104)
0.020(0.001)
8°2°
0°6°
2.3
90(0
.09
4)
70°
10.290(0.405)
4.070(0.160)
4.820(0.190)
1.390(0.055)
1.150(0.045)
1.390(0.055)
1.270(0.050)
1.390(0.055)
2.6
90(0
.106)15.740(0.620)
0.250(0.010)
2.700(0.106)
5.6
00(0
.22
0)
7.420(0.292)
7.980(0.314)
2.413(0.095)
2.667(0.105)
2.413(0.095)
2.667(0.105)2.413(0.095)
2.667(0.105)2.413(0.095)
2.667(0.105)
0.360(0.014)
0.400(0.016)
REF
RE
F
REF
![Page 56: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/56.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-92(Bulk Packing) Unit: mm(inch)
New Product Changed to TO92(Bulk Packing) (2013.10)
2.420(0.095)
2.660(0.105)
0.360(0.014)
0.760(0.030)
Φ1.600(0.063)
MAX
12.5
00(0
.49
2)
15.5
00(0
.61
0)
1.270(0.050)
TYP
3.3
00(0
.13
0)
3.7
00(0
.14
6)
4.3
00(0
.169)
4.7
00(0
.185)
1.000(0.039)
1.400(0.055)
4.400(0.173)
4.800(0.189)
3.430(0.135)
MIN
0.320(0.013)
0.510(0.020)
0.000(0.000)
0.380(0.015)
![Page 57: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/57.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
HSOP-28 Unit: mm(inch)
17.890(0.704)
0.204(0.008)
0o~8o
18.190(0.716) 0.360(0.014)
0.400(0.016)
1.270(0.050)10.000(0.394)
10.650(0.419)
7.400(0.291)
7.600(0.300)
0.230(0.009)
0.470(0.019)0.100(0.004)
0.300(0.012)
2.280(0.090)
2.630(0.104)
2.180(0.086)
2.330(0.092)
0.800(0.031)TYP5.050(0.199)
5.250(0.207)
Note: Eject hole, oriented hole and mold mark is optional.
![Page 58: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/58.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SIP-8 Unit: mm(inch)
6.250(0.246)
6.750(0.266)
18.900(0.744)
19.400(0.764)
7.700(0.303)
8.300(0.327)1PIN
2.540(0.100)
TYP 1.200(0.047)
1.500(0.059)
0.420(0.017)
0.580(0.023)
0.200(0.008)
0.300(0.012)
2.550(0.100)
3.050(0.120)
3.100(0.122)
3.700(0.146)
1 PIN INDEX
45o
0.850(0.033)
1.150(0.045)
![Page 59: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/59.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
LQFP-44 Unit: mm(inch)
0.125 (0.005)TYP
0.050 (0.002)
0.150 (0.006)
9.900(0.390)
1.350(0.053)
11.800(0.465)
12.200(0.480)
10.100(0.398)
1.450(0.057)
11
.80
0(0
.46
5)
12
.20
0(0
.48
0)
9.9
00
(0.3
90
)
10
.10
0(0
.39
8)
0.450(0.018)
0.750(0.030)
1.600 (0.063)
MAX
7°0°
0.300(0.012)
0.450(0.018)
0.800(0.031)
TYP
![Page 60: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/60.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
PQFP-44 Unit: mm(inch)
0.130(0.005)
0.250(0.010)
MIN
9.900(0.390)
1.950(0.077)
12.950(0.510)13.800 (0.543)
10.100(0.398)
2.100(0.083)
9.9
00
(0.3
90
)1
0.1
00
(0.3
98
)
0.730(0.029)
1.030(0.041)
2.450(0.096)MAX
7°0°
12
.95
0(0
.51
0)
13
.80
0 (
0.5
43
)
0.300(0.012)
0.450(0.018)0.800(0.031)
TYP
0.230(0.009)
![Page 61: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/61.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
MSOP-8 Unit: mm(inch)
4.7
00
(0.1
85
)
0.650(0.026)TYP
5.1
00
(0.2
01
)
0.4
00
(0.0
16
)
0.8
00
(0.0
31
)
0.0
00(0
.00
0)
0. 2
00
(0.0
08)
0.300(0.012)TYP
3.1
00
(0.1
22
)
2. 9
00
(0.1
14
)
0.800(0.031)
1.200(0.047)
3.100(0.122)
2.900(0.114)
0°8°
0.150(0.006)TYP
0.750(0.030)
0.970(0.038)
`
Note: Eject hole, oriented hole and mold mark is optional.
![Page 62: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/62.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
MSOP-8
XE
Y
G Z
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 5.500/0.217 2.800/0.110 0.450/0.018 1.350/0.053 0.650/0.026
![Page 63: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/63.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
MSOP-8 (Only for AH9480 and AH9481) Unit: mm(inch)
4.700(0.185)
0.650(0.026)TYP
5.100(0.201) 0.4
10(0
.01
6)
0.6
50(0
.02
6)
0.0
00(0
.00
0)
0.2
00(0
.00
8)
0.300(0.012)TYP
3.1
00(0
.12
2)
2.9
00(0
.114)
0.800(0.031)
1.200(0.047)
3.100(0.122)
2.900(0.114)
0°6°
0.150(0.006)TYP
0.760(0.030)
0.970(0.038)
`
Note: Eject hole , oriented hole and mold mark is optional.
1.350(0.053)
1.550(0.061)
0.870(0.034)
1.070(0.042)Hall Sensor
Location
![Page 64: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/64.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
MSOP-10 Unit: mm(inch)
0.4
00
(0.0
16
)
0.8
00
(0.0
31
)
3. 1
00( 0
.12
2)
2. 9
00
(0.1
14
)
0.820(0.032)1.100(0.043)
0°6°
0.090(0.004)
0.230(0.009)
0.750(0.030)0.950(0.037)
4.7
50
(0.1
87)
5.0
50
(0.1
99)
0.280(0.011)
0.180(0.007)
0.500(0.020)
TYP
3.100(0.122)
2.900(0.114)
0.0
20
(0. 0
01
)
0.1
50
(0. 0
06
)
Note: Eject hole, oriented hole and mold mark is optional.
![Page 65: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/65.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
MSOP-10
G Z
Y
E X
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 5.800/0.228 3.000/0.118 0.300/0.012 1.400/0.055 0.500/0.020
![Page 66: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/66.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23-6 (Except ITVS) Unit: mm(inch)
New Product Changed to SOT26 (2013.10)
2.820(0.111)
3.100(0.122)
2.6
50
(0.1
04
)
3.0
00
(0.1
18
)
1.5
00
(0.0
59
)
1.7
00
(0.0
67
)
0.950(0.037)TYP
1.800(0.071)
2.000(0.079)
0.300(0.012)
0.500(0.020)
0.700(0.028)REF
0.100(0.004)
0.200(0.008)
0°
8°
0.200(0.008)
0.300(0.012)
0.600(0.024)
0.000(0.000)
0.150(0.006)
0.900(0.035)
1.300(0.051)
1.450(0.057)
MAX
1 2 3
456
Pin 1 Mark
![Page 67: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/67.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOT-23-6
E E
G Z
Y
X
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 3.600/0.142 1.600/0.063 0.700/0.028 1.000/0.039 0.950/0.037
![Page 68: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/68.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23-6 (Only for ITVS)
2.820(0. 111)
3.020(0. 119)
2.6
50(0
.10
4)
2.9
50(0
.11
6)
1.5
00(0
.05
9)
1.7
00(0
.06
7)
0.950(0. 037)TYP1. 800(0. 071)
2. 000(0. 079)
0.300(0. 012)
0.400(0. 016)
0.700(0.028) REF
0.100(0. 004)
0. 200(0. 008)
0°
8°
0.200(0. 008)
0.300(0. 012)
0.600(0. 024)
0.000(0. 000)
0.150(0. 006)
0.900(0. 035)
1.300(0. 051)
1.450(0. 057)
MAX
1 2 3
456
Pin 1 Mark
0.525
0.075
0.075
0.525
Note: Pin 1 Dot Ø 0.15mm
Pin 1 Dot area 0.6mm* 0.6mm
Unit: mm(inch) MAX
mm(inch) M I N
![Page 69: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/69.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23-8 Unit: mm(inch)
New Product Changed to SOT28 (2013.10)
2.820(0.111)
3.020(0.119)
2.6
50(0
.10
4)
2.9
50(0
.11
6)
1.5
00(0
.05
9)
1.7
00(0
.06
7)
0.975(0.038)BSC
0.300(0.012)
0.500(0.020)
0.100(0.004)
0.200(0.008)
0°
8°
0.200(0.008)
0.300(0.012)
0.600(0.024)
0.000(0.000)
0.150(0.006)
0.900(0.035)
1.300(0.051)
1.450(0.057)
MAX
Pin 1 Mark
0. 650(0.026)BSC
![Page 70: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/70.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOT-23-8
Y
G
X E
Z
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 3.600/0.142 1.600/0.063 0.500/0.020 1.000/0.039 0.650/0.026
![Page 71: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/71.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-23-5 (Only for ITVS)
2.820(0. 111)
2.6
50(0
.104)
1.5
00(0
.05
9)
0.000(0.000)
0.300(0. 012)
0.900(0.035)
0.100(0. 004)
0.200(0. 008)
0.3
00(0
.01
2)
8 °
0 °
3.020(0. 119)
1.7
00(0
. 06
7)
2.9
50( 0
.116)
0.400(0. 016)
0.150(0.006)
1.300(0.051)
0.200(0. 008)
0.6
00(0
.02
4)
1.800(0. 071)
2.000(0. 079)
0.700(0.028)
REF
1.4
50(0
.05
7)
MA
X
0.950(0. 037)
TYP
Pin 1 Mark
0.075
0.075
0.525
0.525
Note: Pin1 Dot Ø 0.15mm
Pin 1 Dot area 0.6mm* 0.6mm
Unit: mm(inch) M I N
mm(inch) MAX
![Page 72: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/72.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-126B Unit: mm(inch)
1.500(0.059)
1.900(0.075)
3.000(0.118)
3.400(0.134)
0.450(0.018)
0.600(0.024)
7.800(0.307)
8.200(0.323)
3.7
00(0
.14
6)
3.9
00(0
.15
4)
10
.80
0(0
.42
5)
11
.20
0(0
.44
1)
0.600(0.024)
0.800(0.031)
0.600(0.024)
0.800(0.031)
15
.30
0(0
.60
2)
15
.70
0(0
.61
8)
0.900(0.035)
1.100(0.043)
1.7
17(0
.06
8)
1.9
17(0
.07
5)
0.500(0.020)
0.700(0.028)
1.778(0.070) TYP
5.234(0.206)
5.434(0.214)
2.900(0.114)3.100(0.122)
F
![Page 73: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/73.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-126 Unit: mm(inch)
New Product Changed to TO126 (2013.10)
1.060(0.042)
1.500(0.059)
2.400(0.094)2.900(0.114)
0.400(0.016)
0.600(0.024)
7.400(0.291)
8.200(0.323)
3.6
00(0
.14
2)
10.6
00(0
.41
7)
11.2
00(0
.44
0)
0.660(0.026)
0.860(0.034)
14.5
00(0
.570)
15.9
00(0
.626)
1.7
00(0
.06
7)
2.1
00(0
.08
3)
1.170(0.046)
1.470(0.058)
2.280(0.090)
TYP4.560(0.180)
TYP.
3.100(0.122)3.550(0.140)
0.3
00(0
.01
2)
0.0
00(0
.00
0)
3.9
00(0
.15
4)
F
R 1.840(0.072)
TYP
R 0.760(0.030)TYP
4.850(0.191)
5.150(0.203)
5.0
10
(0.1
97
)
5.3
10
(0.2
09
)
2.850(0.112)
3.150(0.124)
![Page 74: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/74.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-220-5 Unit: mm(inch)
New Product Changed to TO220-5 (2013.10)
2.5
50
(0.1
00
)
2.9
50
(0.1
16
)
4.370(0.172)
4.770(0.188)
8.2
00(0
.32
3)
8.9
00(0
.35
0)
6.700(0.264)
6.900(0.272)
13.4
00
(0.5
28
)
13.9
00
(0.5
47
)
11
.76
0(0
.46
3)
12
.16
0(0
.47
9)
1.700(0.067)
TYP 0.310(0.012)
0.550(0.022)
2.470(0.097)
2.870(0.113)
0.640(0.025)
0.940(0.037)
9.850(0.388)10.360(0.408)
1.120(0.044)1.400(0.055)
3.640(0.143)
4.040(0.159)
F
Option 2Option 1
1.7
00
(0.0
67
)
RE
F
1.5×Dp 0.1 MAXF
![Page 75: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/75.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-220FP Unit: mm(inch)
φ
0.650(0.026)
2.550(0.100) 2.550(0.100)
0.850(0.033)
1.200(0.047)
1.500(0.059)
13.000(0.512)
13.600(0.535)
2.700(0.106)
3.100(0.122)
15.800(0.622)
16.200(0.638)
3.400(0.134)
3.600(0.142)
3.100(0.122)
3.300(0.130)
9.800(0.386)
10.200(0.402)
7.000(0.276)
7.400(0.291)
4.400(0.173)4.700(0.185)
2.700(0.106)
3.000(0.118)
2.000(0.079)
2.800(0.110)
0.600(0.024)
0.800(0.031)
0.900(0.035)
1.200(0.047)
1 2 3
![Page 76: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/76.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-252-5 Unit: mm(inch)
New Product Changed to TO252-5 (2013.10)
6.350(0.250)6.650(0.262)
5.200(0.205)5.400(0.213)
9.500(0.374)9.900(0.390)
1.270(0.050)
TYP2.540(0.100)
TYP
0.400(0.016)
0.600(0.024)
5.400(0.213)
5.700(0.224)
2.550(0.100)
2.900(0.114)
0.430(0.017)
0.580(0.023)
0.000(0.000)
0.127(0.005)
0.430(0.017)
0.580(0.023)
2.200(0.087)
2.400(0.094)
3.800(0.150)
REF
1.400(0.055)
1.780(0.070)
![Page 77: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/77.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TO-252-5
X1
Y1
G
Y
Z
E X
Dimensions Z
(mm)/(inch)
X
(mm)/(inch)
X1=Y1
(mm)/(inch)
Y
(mm)/(inch)
G
(mm)/(inch)
E
(mm)/(inch)
Value 11.000/0.433 0.600/0.024 5.600/0.220 2.000/0.079 3.400/0.134 1.270/0.050
![Page 78: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/78.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-252-5 (2) Unit: mm(inch)
New Product Changed to TO252-5 (2) (2013.10)
2.190(0.086)
2.390(0.094)
0.508(0.020)0°
10°
1.4
00
(0.0
55
)
1.7
80
(0.0
70
)
2.7
40
(0.1
08
)RE
F
9.4
00
(0.3
70
)
10.4
00
(0.4
09
)
0.000(0.000)
0.130(0.005)
6°8°
0.450(0.018)
0.580(0.023)
6.0
00
(0.2
36
)
6.2
00
(0.2
44
)
5.2
10(0
.20
5)
MIN4.320(0.170)
MIN
6.450(0.254)
6.700(0.264)
5.210(0.205)
5.500(0.217)
0.880(0.035)
1.270(0.050)
0.610(0.024)0.790(0.031)
1.270(0.050) 0.510(0.020)
0.710(0.028)
![Page 79: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/79.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TO-252-5 (2)
X1
Y1
G
Y
Z
E X
Dimensi
ons
Z
(mm)/(inch)
X
(mm)/(inch)
X1=Y1
(mm)/(inch)
Y
(mm)/(inch)
G
(mm)/(inch)
E
(mm)/(inch)
Value 11.000/0.433 0.600/0.024 5.600/0.220 2.000/0.079 3.400/0.134 1.270/0.050
![Page 80: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/80.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-263-5 Unit: mm(inch)
New Product Changed to TO263-5 (2013.10)
9.880 (0.389)
10.180 (0.401)1.560 (0.061)1.760 (0.069)
8.200 (0.323)
9.000 (0.354)
5.080 (0.200)5.480 (0.216)
0.710 (0.028)0.910 (0.036)
1.700 (0.067)
TYP
6.700 (0.264)
6.900 (0.272)
15
.14
0 (
0.5
96
)
15
.54
0 (
0.6
12
)
1.170 (0.046)1.370 (0.054)
4.470 (0.176)4.670 (0.184)
0.020(0.001)
0.250(0.010)
2.340 (0.092)
2.740 (0.108)
0.310 (0.012)0.530 (0.021)
5.600 (0.220) REF
![Page 81: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/81.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TO-263-5
Y3
X3
Z
Y2 X1
Y1
E
X2
Dimensions Z
(mm)/(inch)
X1
(mm)/(inch)
X2
(mm)/(inch)
X3
(mm)/(inch)
Value 16.760/0.660 1.200/0.047 8.540/0.336 10.540/0.415
Dimensions Y1
(mm)/(inch)
Y2
(mm)/(inch)
Y3
(mm)/(inch)
E
(mm)/(inch)
Value 3.830/0.151 8.560/0.337 3.000/0.118 1.700/0.067
![Page 82: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/82.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-92-2 Unit: mm(inch)
New Product Changed to TO92-2 (2013.10)
0.360(0.014)
0.510(0.020)
1.100(0.043)
1.400(0.055)
Φ1.600(0.063)
MAX
4.400(0.173)
4.700(0.185)
4.300(0.169)
4.700(0.185)0.380(0.015)
0.550(0.022)
14.100(0.555)
14.500(0.571)
3.300(0.130)
3.700(0.146)
2.500(0.098)
3.100(0.122)
1.270(0.050)
TYP
2.440(0.096)
2.640(0.104)
0.000(0.000)
0.380(0.015)
3.430(0.135)
MIN
![Page 83: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/83.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
FSIP-9 Unit: mm(inch)
3.7
50
(0.1
48
)
6.100(0.240)
6.500(0.256)
2.540(0.100)
1.200(0.047)
0.500(0.020) 0.400(0.016)
0.550(0.022)
20.800(0.819)
21.200(0.835)
21.700(0.854)
22.300(0.878)
3.150(0.124)
3.650(0.144)
8.1
00
(0.3
19
)
8.7
00
(0.3
43
)
5.7
00
(0.2
24
)5
.90
0(0
.23
2)
4.1
00
(0.1
61
)
4.3
00
(0.1
69
)
6.800(0.268)
7.400(0.291)
![Page 84: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/84.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TSSOP-28 (EDP) Unit: mm(inch)
0.090(0.004)0.200(0.008)
0.650(0.026) BSC
0.190(0.007)0.300(0.012)
0.050(0.002)
0.150(0.006)
0.800(0.032)
1.050(0.041)1.200(0.047)MAX
2.740(0.108)3.050(0.120)
5.640(0.222)
5.940(0.234)
EXPOSED PAD
0.450(0.018)
0.750(0.030)
4.300(0.169)
4.500(0.177)
0°8°
GAUGE LINE 0.250(0.010)
SEATING PLANE
6.250(0.246)
6.550(0.258)
PIN #1 ID.
9.600(0.378)9.800(0.386)
BASE PLANE
Note: Eject hole, oriented hole and mold mark is optional.
![Page 85: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/85.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TSSOP-28 (EDP)
X1
ZG
Y
XE
Y1
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
Value 7.720/0.304 4.160/0.164 0.450/0.018 1.780/0.070
Dimensions E
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch) ---
Value 0.650/0.026 6.200/0.244 3.300/0.130 ---
![Page 86: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/86.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-220F-4 Unit: mm(inch)
9.800(0.386)
10.200(0.402)
3.300(0.130)
3.500(0.138)
4.300(0.169)4.700(0.185)
5.000(0.197)REF
3.500(0.138)REF
15
.40
0(0
.60
6)
15
.80
0(0
.62
2) 1.5
00(0
.05
9)
10
.40
0(0
.40
9)
3.3
00
(0.1
30)
10
.00
0(0
.39
4)
10
.60
0(0
.41
7) 0.500(0.020)
0.700(0.028)3-1.050(0.041)MIN
3-1.300(0.051)MAX
1.190(0.047)REF
2.540(0.100)TYP
7.620(0.300)
REF
1.190(0.047)REF
1.250(0.049)
MIN
1.500(0.059)MAX
5°
5°
1.000(0.039)
2.600(0.102)3.000(0.118)
15
.50
0(0
.61
0)
15
.90
0(0
.62
6)
5°
5°
45 °
6.3
00
(0.2
48)
6.7
00
(0.2
64
)
5°
5°5
°
1.000(0.039)1
3.6
00
(0.5
35
)
RE
F
0.450(0.018)0.600(0.024)
1.300(0.051)
1.700(0.067)
3.500(0.138)REF
1.9
00
(0.0
75)
10
.05
0(0
.39
6)
RE
F
3-R
0.2
50(0
.01
0)
3.000(0.118)
3.400(0.134)
1.500(0.059)
Dp0.100(0.004)3-
1.5
00
(0.0
59
)
D
p0
.10
0(0
.00
4)
3-
4-R0.250(0.010)
REF
3.500(0.138)REF
3.500(0.138)REFF
F
![Page 87: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/87.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-252-4(PPAK) Unit: mm(inch)
New Product Changed to TO252-4 (PPAK) (2013.10)
0.9
50
(0.0
37
)
1.4
50(0
.05
7)
0.460(0.018)
0.560(0.022)
6.400(0.252)
6.600(0.260) 2.200(0.087)
2.400(0.094)
0.460(0.018)
0.560(0.022)
5.200(0.205)
5.400(0.213)
5.700(0.224)
5.900(0.232)
5.4
00
(0.2
13)
5.6
00
(0.2
20)
1.3
00
(0.0
51
)
1.5
00
(0.0
59
)
0.800(0.031)
1.000(0.039)
2.440(0.096)2.640(0.104)
0.450(0.018)
0.550(0.022)
4.980(0.196)
5.180(0.204)
9.2
50
(0.3
64
)
9.7
50
(0.3
84
)
![Page 88: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/88.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TO-252-4(PPAK)
X1
Y1
Y
Z
G
E XE1
Dimensions E
(mm)/(inch)
E1
(mm)/(inch)
X
(mm)/(inch)
X1
(mm)/(inch)
Value 1.270/0.050 2.540/0.100 1.000/0.039 5.730/0.226
Dimensions Y
(mm)/(inch)
Y1
(mm)/(inch)
Z
(mm)/(inch)
G
(mm)/(inch)
Value 2.000/0.079 6.170/0.243 10.830/0.426 2.660/0.105
![Page 89: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/89.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-252-4 (2) Unit: mm(inch)
New Product Changed to TO252-4 (2) (2013.10)
2.190(0.086)
2.390(0.094)
0.508(0.020)0°
10°1
.40
0(0
.05
5)
1.7
80
(0.0
70
)
2.7
40
(0.1
08
)RE
F
9.4
00
(0.3
70
)
10
.40
0(0
.40
9)
0.000(0.000)
0.130(0.005)
6°8°
0.450(0.018)
0.580(0.023)
6.0
00
(0.2
36
)
6.2
00
(0.2
44
)
5.2
10(0
.20
5)
MIN4.320(0.170)
MIN
6.450(0.254)
6.700(0.264)
5.210(0.205)
5.500(0.217)
0.880(0.035)
1.270(0.050)
0.640(0.025)
1.020(0.040)
0.610(0.024)0.790(0.031)
1.270(0.050) 0.510(0.020)
0.710(0.028)
![Page 90: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/90.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TO-252-4 (2)
X1
Y1
Y
Z
G
E XE1
Dimensions E
(mm)/(inch)
E1
(mm)/(inch)
X
(mm)/(inch)
X1
(mm)/(inch)
Value 1.270/0.050 2.540/0.100 1.000/0.039 5.730/0.226
Dimensions Y
(mm)/(inch)
Y1
(mm)/(inch)
Z
(mm)/(inch)
G
(mm)/(inch)
Value 2.000/0.079 6.170/0.243 10.830/0.426 2.660/0.105
![Page 91: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/91.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
ZIP-15 Unit: mm(inch)
0.1
27
(0.0
05
)
19.950(0.785)20.150(0.793)
5°
B1A1 A2 B2
1.270(0.050)
A4B3A3 B4 A5
0.350(0.014)0.450(0.018)
B6A6B5A
7B7 A8
0.800(0.031)
2-2.200(0.087)
×45°
10
.60
0(0
.41
7)
10
.80
0(0
.42
5)
3.9
00
(0.1
54)
4.1
00
(0.1
61)
3.730(0.147)
3.770(0.148)
2- 2.000(0.079)Dp0.100(0.004)
0.200(0.008)
12.900(0.508)13.100(0.516)
0.650(0.026)0.750(0.030)
19.850(0.781)
19.950(0.785)
60°
22
.20
0(0
.87
4)
22
.40
0(0
.88
2)
4.200(0.165)4.400(0.173)
22
.00
0(0
.86
6)
22
.20
0(0
.87
4)
2.420(0.095)2.580(0.102)
R1.000(0.039)
4.900(0.193)5.100(0.201)
BN0.490(0.019)0.510(0.020)
AN
18
.58
0(0
.73
1)
18
.78
0(0
.73
9)
17
.65
0(0
.69
5)
17
.85
0(0
.70
3)
0.9
00
(0.0
35
)1
.10
0(0
.04
3)
R0.500(0.020)
R0.500(0.020)
1.490(0.058)
1.510(0.059)
5°
5°
5°
5°
5.9
00(0
.23
2)
6.1
00(0
.24
0)
R1.920(0.076)1.200(0.047)
2.775(0.109)
2.825(0.111)
4.500(0.177)
4.700(0.185)
F
F
![Page 92: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/92.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DIP-20 Unit: mm(inch)
New Product Changed to PDIP-20 (2013.10)
1.524(0.060)TYP
2.540(0.100)
TYP
0.360(0.014)
0.560(0.022)
3.710(0.146)
4.310(0.170)
3.000(0.118)
3.600(0.142)
0.510(0.020)
MIN
3.200(0.126)
3.600(0.142)
0.204(0.008)
0.360(0.014)
7.620(0.300)TYP
8.200(0.323)
9.400(0.370)
25.950(1.022)
26.550(1.045)
6.200(0.244)
6.600(0.260)
Note: Eject hole, oriented hole and mold mark is optional.
![Page 93: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/93.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOIC-20 Unit: mm(inch)
New Product Changed to SO-20 (2013.10)
0°8°
12.520(0.493)
13.000(0.512)
7.4
00
(0.2
91
)
7.6
00
(0.2
99
)
10
.00
0(0
.39
4)
10
.65
0(0
.41
9)
0.4
00
(0.0
16)
1.2
70
(0.0
50)
0.204(0.008)
0.360(0.014)
1.270(0.050)
TYP2.100(0.083)
2.500(0.098)
0.350(0.014)
0.510(0.020)0.100(0.004)
0.300(0.012)
2.350(0.093)
2.650(0.104)
Note: Eject hole, oriented hole and mold mark is optional.
![Page 94: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/94.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOIC-20
E X
Y
G Z
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 11.400/0.449 7.400/0.291 0.600/0.024 2.000/0.079 1.270/0.050
![Page 95: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/95.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-252-3(1) Unit: mm(inch)
New Product Changed to TO252 (1) (2013.10)
1.3
50(0
.05
3)
1.6
50(0
.06
5)
4.500(0.177)4.700(0.185)
3°4°
3.8
00
RE
F(0
.15
0R
EF
)
4.8
00
(0.1
89
)
6.5
00
(0.2
56
)
4.300(0.169)
5.400(0.212)
1.4
00
(0.0
55
)1
.78
0(0
.07
0)
0.000(0.000)0.127(0.005)
0.430(0.017)
0.580(0.023)
2.300TYP
9.5
00(0
.37
4)
9.9
00
(0.3
90
)
0.700(0.028)0.900(0.035)
0.500(0.020)0.700(0.028)
5.200(0.205)5.400(0.213)
6.350(0.250)
6.650(0.262)
2.5
50
(0.1
00
)
2.9
00
(0.1
14
)
5.4
00
(0.2
13
)5.7
00
(0.2
24
)
2.200(0.087)
2.400(0.094)
5° 5°
8°
0.430(0.017)0.580(0.023)
![Page 96: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/96.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TO-252-3(1)
X2
Y2
Z
Y1
X1 E
Dimensions Z
(mm)/(inch)
X1
(mm)/(inch)
X2= Y2
(mm)/(inch)
Y1
(mm)/(inch)
E
(mm)/(inch)
Value 11.600/0.457 1.100/0.043 7.000/0.276 2.500/0.098 2.300/0.091
![Page 97: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/97.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-220 Short Lead Unit: mm(inch)
9.700(0.382)10.100(0.398)
9.2
00
(0.3
62
)
3°
1.520(0.060)
1.270(0.050)
2.540(0.100)
1.4
60(0
.05
7)
4.500(0.177)
0.800(0.031)
3°
6.7
50
(0.2
66
)
2.400(0.094)
0.450(0.018)
0.600(0.024)
1.250(0.049)
1.400(0.055)
10.000(0.394)
10.200(0.402)
1.000(0.039) 3.750(0.148)
8.400(0.331)
15
.90
0(0
.62
6)
18
.95
0(0
.74
6)M
AX
3.7
00(0
.14
6) 2
.80
0(0
.11
0)
3.600(0.142)
2-R0.300(0.012)
2.540(0.100)
3-R
0.2
00
(0.0
08
)
3°3°
3°
1.500(0.059)
Dp 0.200(0.008)
1.300(0.051)
1.700(0.067)
4.6
00(0
.18
1)
45°
8.700(0.343)
2.600(0.102)TYP TYP
1.370(0.054)
0.900(0.035)
3.900(0.154)
1.620(0.064)
6.9
00(0
.27
2)
9.4
00(0
.37
0)
1.400(0.055)
3.700(0.146) 4.700(0.185)
2.9
00(0
.11
4)
16
.10
0(0
.63
4)
F
F
![Page 98: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/98.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TSSOP-20 Unit: mm(inch)
0.650(0.026)TYP
6.200(0.244)
6.600(0.260)
#1
PIN
6.400(0.252)
6.600(0.260)
4.300(0.169)
4.500(0.177)
INDEX 0.750(0.030)
0.850(0.033)
1.450(0.057)
1.550(0.061)
0.100(0.004)
0.190(0.007)
Dp0.000(0.000)
0.100(0.004)
BTM E-MARK
Dp0.000(0.000)
0.100(0.004)
10°14°
0.250(0.010)TYP
0.450(0.018)0.750(0.030)
1.000(0.039)
REF
0°8°
R0.090(0.004)MIN
R0.090(0.004)MIN
TOP & BOTTOM
4-
0.200(0.008)MIN0.200(0.008)
0.280(0.011)
0.050(0.002)
0.150(0.006)
0.800(0.031)
1.050(0.041)
1.200(0.047)
MAX
0.340(0.013)
0.540(0.021)
Ф
Note: Eject hole, oriented hole and mold mark is optional.
Ф
![Page 99: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/99.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TSSOP-20
E X
Y
G Z
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 7.720/0.304 4.160/0.164 0.420/0.017 1.780/0.070 0.650/0.026
![Page 100: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/100.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-89-5 Unit: mm(inch)
New Product Changed to SOT89-5 (2013.10)
45
1.030(0.041)REF1.550(0.061)REF
4.400(0.173)
4.600(0.181)
0.900(0.035)
1.100(0.043)
3.950(0.156)4.250(0.167)
3.000(0.118)
TYP
0.480(0.019)
2.300(0.091)
2.600(0.102)
0.320(0.013)
3 10
2.060(0.081)REF
0.350(0.014)
0.450(0.018)
R0.150(0.006)
3
10
1.500(0.059)
0.320(0.013)REF
1.620(0.064)REF2.210(0.087)REF
0.320(0.013)
1.800(0.071)
Option 1
1.100(0.043)
0.900(0.035)
TYP
0.540(0.021) 0.540(0.021)
Option 2
1.620(0.064)
1.830(0.072)
R 0.200(0.008)
2.630(0.104)
2.930(0.115)
0.950(0.037)
0.650(0.026)
0.650(0.026)
0.950(0.037)
0.500(0.020)
0.620(0.024)
1.400(0.055)1.600(0.063)
Option 1
![Page 101: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/101.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOT-89-5
X1
X2Y1
E
Z
Y
X
Dimens
ions
Z
(mm)/(inch)
X
(mm)/(inch)
X1
(mm)/(inch)
X2
(mm)/(inch)
Y
(mm)/(inch)
Y1
(mm)/(inch)
E
(mm)/(inch)
Value 4.600/0.181 0.550/0.022 1.850/0.073 0.800/0.031 1.300/0.051 1.475/0.058 1.500/0.059
![Page 102: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/102.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOT-89-5(Only for AH9281/9282) Unit: mm(inch)
45
1.030(0.041)REF
1.550(0.061)REF
4.400(0.173)
4.600(0.181)
0.900(0.035)
1.100(0.043)
3.950(0.156)
4.250(0.167)
3.000(0.118)
TYP
0.480(0.019)
1.100(0.043)
0.900(0.035)
2.300(0.091)
2.600(0.102)
0.320(0.013)
0.520(0.020)
310
2.060(0.081)REF
1.400(0.055)
1.600(0.063)
0.350(0.014)
0.450(0.018)
R0.150(0.006)
3
10
1.500(0.059)
0.320(0.013)REF
1.620(0.064)REF2.210(0.087)REF
0.320(0.013)
0.520(0.020)
1.800(0.071)
Package Sensor Location
(For Hall IC)1.840(0.072)
2.140(0.084)
1.400(0.055)
1.700(0.067)
![Page 103: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/103.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TSSOP-14 Unit: mm(inch)
Note: Eject hole, oriented hole and mold mark is optional.
SEE DETAIL A
DETAIL A
0
8
TOP&BOTTOM
1.000(0.039) REF
4.300(0.169)
4.500(0.177)
6.200(0.244)
6.600(0.260)
4.860(0.191)
5.100(0.201)
0.340(0.013)
0.540(0.021)
INDEX
0.050(0.002)
0.150(0.006)
0.800(0.031)
1.050(0.041)
0.650(0.026)0.190(0.007)
0.280(0.011)
0.250(0.010)
0.450(0.018)
0.750(0.030)# 1 PIN
0.950(0.037)
1.050(0.041)
DEP0
0.100(0.004)
0.090(0.004)
0.200(0.008)
R0.090(0.004)
R0.090(0.004)
0.200(0.008)
1.200(0.047) MAX
φ
>0o
o
o
![Page 104: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/104.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TSSOP-14
E X
Y
G Z
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 7.720/0.304 4.160/0.164 0.420/0.017 1.780/0.070 0.650/0.026
![Page 105: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/105.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SSOP-20 Unit: mm(inch)
1.700(0.067)
1.900(0.075)
OPTIONAL
CONSTRUCTION
5.100(0.201)5.500(0.217)
7.600(0.299)
8.000(0.315)
7.000(0.276)
7.400(0.291)
0.650(0.026)
0.070(0.003)
0.230(0.009)
1.400(0.055)
1.600(0.063)
0.220(0.009)
0.380(0.015)
1.690(0.067)
MAX
DETAIL
0.090(0.004)
0.250(0.010)1
0
70
SEE DETAIL A
100
140
10
70
R0.150(0.006)
0.324(0.013)
R0.150(0.006)
0.630(0.025)
0.950(0.037)
1.250(0.049)
DETAIL A
1.200(0.047)
1.200(0.047)
DEP0.020(0.001)
0.080(0.003)
F1.200(0.047)
Note: Eject hole, oriented hole and mold mark is optional
0.250(0.010)
![Page 106: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/106.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SSOP-20
G Z
XE
Y
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 9.120/0.359 5.580/0.220 0.450/0.018 1.770/0.070 0.650/0.026
![Page 107: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/107.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SSOP-24 Unit: mm(inch)
8.000(0.315)
8.400(0.331)
7.600(0.299)
8.000(0.315)5.100(0.201)
5.500(0.217)
BSC
0.650(0.026)
1.400(0.055)
1.600(0.063)
0.050(0.002)0.230(0.009)
1.730(0.068)
MAX
0.220(0.009)
0.380(0.015)
0.550(0.022)
0.950(0.037)
08
0.090(0.004)
0.250(0.010)
Note: Eject hole, oriented hole and mold mark is optional.
![Page 108: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/108.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SSOP-24
G Z
XE
Y
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 9.120/0.359 5.580/0.220 0.450/0.018 1.770/0.070 0.650/0.026
![Page 109: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/109.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-94(Only for AH477) Unit: mm(inch)
Package Sensor Location
3.780(0.149)
4.080(0.161)
0.500(0.020)
0.700(0.028)
0.700(0.028)
0.900(0.035)0.360(0.014)
0.510(0.020)
4.980(0.196)
5.280(0.208)
0.380(0.015)
0.550(0.022)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
45° TYP
3.450(0.136)
3.750(0.148)
0.850(0.033)
1.150(0.045)
1.950(0.077)
2.250(0.089)
(For Hall IC)
1.520(0.060)
1.720(0.068)
![Page 110: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/110.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-94(Only for AH477A) Unit: mm(inch)
Package Sensor Location
3.780(0.149)
4.080(0.161)
0.500(0.020)
0.700(0.028)
0.700(0.028)
0.900(0.035)0.360(0.014)
0.510(0.020)
4.980(0.196)
5.280(0.208)
0.380(0.015)0.550(0.022)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
45°TYP
3.450(0.136)
3.750(0.148)
1.100(0.043)
1.400(0.055)
1.720(0.068)
2.020(0.080)
(For Hall IC)
1.520(0.060)
1.720(0.068)
![Page 111: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/111.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-94(Only for AH287) Unit: mm(inch)
Package Sensor Location
3.780( 0.149)
4.080(0.161)
0.500(0.020)
0.700(0.028)
0.700(0.028)
0.900(0.035)0.360(0.014)
0.510(0.020)
4.980(0.196)
5.280(0.208)
0.380(0.015)
0.550(0.022)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050)
TYP3.710(0.146)
3.910(0.154)
45 ° TYP
3.450(0.136 )
3.750(0.148 )
1.100(0.043)
1.400(0.055)
1.720(0.068)
2.020(0.080)
(For Hall IC)
1.520(0.060)
1.720(0.068)
![Page 112: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/112.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-94(Only for AH9279) Unit: mm(inch)
Package Sensor Location
3.780( 0.149)
4.080( 0.161)
0.500(0.020)
0.700(0.028)
0.700(0.028)0.900(0.035)
0.360(0.014)
0.510(0.020)
4.980(0.196)
5.280(0.208)
0.380(0.015)
0.550(0.022)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
45° TYP
1.100(0.043)
1.400(0.055)
2.000(0.079)
2.300(0.091)
3.450(0.136)
3.750(0.148)
(For Hall IC)
1.520(0.060)
1.720(0.068)
![Page 113: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/113.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-94(Only for AH277A) Unit: mm(inch)
Package Sensor Location
3.780(0.149)
4.080(0.161)
0.500(0.020)
0.700(0.028)
0.700(0.028)
0.900(0.035)
0.360(0.014)
0.510(0.020)
4.980(0.196)
5.280(0.208)
1.250(0.049)
1.850(0.073)
0.380(0.015)
0.550(0.022)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
45°TYP
3.450(0.136)
3.750(0.148)
(For Hall IC)
1.520(0.060)
1.720(0.068)
![Page 114: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/114.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-94(Only for AH277A Special Datasheet) Unit: mm(inch)
Package Sensor Location
3.780(0.149)
4.080(0.161)
0.500(0.020)
0.700(0.028)
0.700(0.028)
0.900(0.035)
0.360(0.014)
0.510(0.020)
5.170(0.204)
5.270(0.207)
1.250(0.049)
1.850(0.073)
0.380(0.015)
0.550(0.022)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
45°TYP
3.600(0.142)
3.700(0.146)
(For Hall IC)
1.520(0.060)
1.720(0.068)
![Page 115: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/115.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-94 Unit: mm(inch)
New Product Changed to TO94 (2013.10)
3.780(0.149)
4.080(0.161)
0.500(0.020)
0.700(0.028)
1.520(0.060)
1.720(0.068)
0.700(0.028)
0.900(0.035)0.360(0.014)
0.510(0.020)
4.980(0.196)
5.280(0.208)
0.380(0.015)
0.550(0.022)
0.360(0.014)
0.500(0.020)
14.000(0.551)15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
45°TYP
3.450(0.136)
3.750(0.148)
![Page 116: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/116.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-94(For AH266 only) Unit: mm(inch)
Package Sensor Location
3.780(0.149)
4.080(0.161)0.500(0.020)
0.700(0.028)
0.700(0.028)
0.900(0.035)
0.360(0.014)
0.510(0.020)
4.980(0.196)
5.280(0.208)
1.250(0.049)
1.850(0.073)
0.380(0.015)
0.550(0.022)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
45°TYP
3.450(0.136)
3.750(0.148)
(For Hall IC)
1.520(0.060)
1.720(0.068)
![Page 117: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/117.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-94(For AH276 only) Unit: mm(inch)
Package Sensor Location
3.780(0.149)4.080(0.161)
0.500(0.020)0.700(0.028)
0.700(0.028)0.900(0.035)
0.360(0.014)
0.510(0.020)4.980(0.196)5.280(0.208)
1.250(0.049)
1.850(0.073)
0.380(0.015)0.550(0.022)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
45°TYP
3.450(0.136)
3.750(0.148)
(For Hall IC)
1.520(0.060)
1.720(0.068)
![Page 118: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/118.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-94(For AH278 only) Unit: mm(inch)
Package Sensor Location
3.780(0.149)
4.080(0.161)
0.500(0.020)
0.700(0.028)
0.700(0.028)
0.900(0.035)
0.360(0.014)
0.510(0.020)
4.980(0.196)
5.280(0.208)
1.250(0.049)
1.850(0.073)
0.380(0.015)
0.550(0.022)
0.360(0.014)
0.500(0.020)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)3.910(0.154)
45°TYP
3.450(0.136)
3.750(0.148)
(For Hall IC)
14.000(0.551)
1.520(0.060)
1.720(0.068)
![Page 119: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/119.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-94(For AH211 only) Unit: mm(inch)
Package Sensor Location
3.780(0.149)
4.080(0.161)
0.500(0.020)
0.700(0.028)
0.700(0.028)
0.900(0.035)
0.360(0.014)
0.510(0.020)
4.980(0.196)
5.280(0.208)
1.250(0.049)
1.850(0.073)
0.380(0.015)
0.550(0.022)
0.360(0.014)
0.500(0.020)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
45°TYP
3.450(0.136)
3.750(0.148)
14.000(0.551)
1.520(0.060)
1.720(0.068)
![Page 120: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/120.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-94(For AH9280 only) Unit: mm(inch)
Package Sensor Location
3.780(0.149)
4.080(0.161)
0.500(0.020)
0.700(0.028)
0.700(0.028)
0.900(0.035)0.360(0.014)
0.510(0.020)
4.980(0.196)
5.280(0.208)
0.380(0.015)0.550(0.022)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
45°TYP
3.450(0.136)
3.750(0.148)
1.100(0.043)
1.400(0.055)
2.000(0.079)
2.300(0.091)
(For Hall IC)
1.520(0.060)
1.720(0.068)
![Page 121: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/121.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-94(For AH9479 only) Unit: mm(inch)
Package Sensor Location
3.780(0.149)
4.080(0.161)
0.500(0.020)
0.700(0.028)
1.520(0.060)
1.720(0.068)
0.700(0.028)
0.900(0.035)0.360(0.014)
0.510(0.020)
4.980(0.196)
5.280(0.208)
0.380(0.015)0.550(0.022)
0.360(0.014)
0.500(0.020)
14.000(0.551)
15.300(0.602)
1.270(0.050) TYP
3.710(0.146)
3.910(0.154)
45°TYP
3.450(0.136)
3.750(0.148)
0.950(0.037)
1.150(0.045)
1.750(0.069)
1.950(0.077)
(For Hall IC)
![Page 122: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/122.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DO-41 Unit: mm(inch)
0.700(0.028)
0.900(0.035)25.400(1.000) MIN
4.200(0.165)
5.200(0.205)
2.000(0.080)
2.700(0.107)
DIA.
DIA.
25.400(1.000) MIN
Cathode line
by marking
![Page 123: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/123.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
HDIP-12 Unit: mm(inch)
0.460(0.018)
0.560(0.022)
7.620(0.300)
TYP
6.150(0.242)
6.550(0.258)
10°MAX
18.900(0.744)
19.300(0.760)
3.000(0.118)MIN
3.100(0.122)
3.500(0.138)
0.510(0.020)MIN
0.219(0.009)
0.339(0.013)2.540(0.100)
TYP
1.524(0.060)TYP
3.000(0.118)TYP
4.060(0.160)
TYP
![Page 124: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/124.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-92 (Ammo Packing) Unit: mm(inch)
New Product Changed to TO92(Ammo Packing) (2013.10)
4.3
00(0
.169)
4.7
00(0
.185)
12.5
00(0
.492)
14.5
00(0
.571)
2.540(0.100)
Typ
1.270(0.050)
Typ
0. (0.015)
0.550(0.022 )
4.400(0.173
)4.800(0.189
)
3.430(0.135)
MIN
0.320(0.013)0.510(0.020)
0.000(0.000)
0.380(0.015)
MAX
1.100(0.043
1.400(0.055
)
3.3
00(0
.130)
3.8
00(0
.150)
Φ1.600(0.063)
)
380
2.500(0.098
)4.000(0.157
)
13.000(0.512
)15.000(0.591
)
![Page 125: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/125.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-252-2 (2) Unit: mm(inch)
New Product Changed to TO252-2 (2) (2013.10)
6.500(0.256)
6.700(0.264)
5.230(0.206)5.430(0.214)
1.2±0.1
2.9
RE
F
1.4
00(0
.05
5)
1.7
00(0
.06
7) 0
8
0.470(0.019)
0.600(0.024)
37
37
37
9.8
00(0
.38
6)
10.4
0(0
.409)
2.2
00(0
.087)
2.3
80(0
.094)
0.900(0.035)
1.100(0.043)
15
4.700 REF
5.2
50
RE
F
0.6
00(0
.02
4)
1.0
00(0
.03
9)
1.1
50(0
.04
5)
1.5
00(0
.05
9)
6.0
00(0
.23
6)
6.2
00(0
.244)
0.770(0.030)
0.890(0.035)
2.28BSC
0.770(0.030)1.100(0.433)
0.9
00(0
.03
5)
1.2
50(0
.04
9)
1.8
0R
EF
![Page 126: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/126.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TO-252-2(2) Unit: mm(inch)
E1X1
Y2
Y1
Z
X2
G
Dimensions Z
(mm)/(inch)
X1
(mm)/(inch)
X2=Y2
(mm)/(inch)
Y1
(mm)/(inch)
G
(mm)/(inch)
E1
(mm)/(inch)
Value 11.600/0.457 1.500/0.059 7.000/0.276 2.500/0.098 2.100/0.083 2.300/0.091
![Page 127: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/127.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-252-2 (3) Unit: mm(inch)
New Product Changed to TO252-2 (3) (2013.10)
1.29±0.1
2.9
00
RE
F
1.4
00(0
.055)
1.7
00(0
.067)
0.470(0.019)0.600(0.024)
5
9
089
.800(0
.38
6)
10.4
00(0
.409)
2.200(0.087)2.380(0.094)
0.900(0.035)1.100(0.043)
4.700REF
6.500(0.256)6.700(0.264)
5.130(0.202)5.460(0.215)
0.1
50(0
.00
6)
0.7
50(0
.03
0)
6.0
00(0
.236
)6.2
00(0
.244
)
0.720(0.028)
0.850(0.033)
2.286(0.090)
BSC
0.720(0.028)0.900(0.035)
0.9
00(0
.03
5)
1.2
50(0
.049)
1.8
00
RE
F
80
0.6
00(0
.02
4)
1.0
00(0
.039)
7
3
95
5.2
50
RE
F
Option 1
Option 2
![Page 128: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/128.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TO-252-2(3) Unit: mm(inch)
E1X1
Y2
Y1
Z
X2
G
Dimensions Z
(mm)/(inch)
X1
(mm)/(inch)
X2=Y2
(mm)/(inch)
Y1
(mm)/(inch)
G
(mm)/(inch)
E1
(mm)/(inch)
Value 11.600/0.457 1.500/0.059 7.000/0.276 2.500/0.098 2.100/0.083 2.300/0.091
![Page 129: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/129.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-252-2 (3) (Only for AP2114 Special for Qisda) Unit: mm(inch)
1.29±0.1
2.9
00
RE
F
1.4
00(0
.055)
1.7
00(0
.067)
0.470(0.019)0.600(0.024)
5
9
089
.800(0
.38
6)
10.4
0(0
.409)
2.200(0.087)2.380(0.094)
0.900(0.035)1.100(0.043)
4.620(0.182)
6.500(0.256)6.700(0.264)
5.130(0.202)5.460(0.215)
0.1
50(0
.00
6)
0.7
50(0
.03
0)
6.0
00(0
.236
)6.2
00(0
.244
)
0.720(0.028)
0.850(0.033)
2.286(0.090)
BSC
0.720(0.028)0.900(0.035)
0.9
00(0
.03
5)
1.2
50(0
.049)
1.8
00
RE
F
80
0.6
00(0
.02
4)
1.0
00(0
.039)
7
3
95
4.920(0.194)
4.7
00
(0.1
85)
5.5
00
(0.2
17)
![Page 130: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/130.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-252-2 (Only for AS78XXA Special for CMI and Ampower) Unit: mm(inch)
1.29±0.1
2.9
00
RE
F
1.4
00
(0.0
55
)1
.70
0(0
.06
7)
0.470(0.019)0.600(0.024)
5
9
08
9.8
00(0
.38
6)
10
.40
(0.4
09
)
2.200(0.087)2.380(0.094)
0.900(0.035)1.100(0.043)
4.700REF
5.2
50R
EF
6.500(0.256)6.700(0.264)
5.130(0.202)5.460(0.215)
0.1
50(0
.00
6)
0.7
50
(0.0
30
)
6.0
00
(0.2
36
)6
.20
0(0
.24
4)
0.720(0.028)0.850(0.033)
2.286(0.090)
BSC
0.720(0.028)0.900(0.035)
0.9
00
(0.0
35)
1.2
50(0
.04
9)
1.8
00
RE
F
80
0.6
00
(0.0
24
)
1.0
00
(0.0
39
)
73
95
![Page 131: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/131.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-252-2 (3) (Only for AS78XXA Special for ASUS) Unit: mm(inch)
1.29±0.1
2.9
00R
EF
1.4
00
(0.0
55
)1
.70
0(0
.06
7)
0.470(0.019)0.600(0.024)
5
9
08
9.8
00
(0.3
86
)1
0.4
0(0
.40
9)
2.200(0.087)2.380(0.094)
0.900(0.035)1.100(0.043)
4.700REF
5.2
50
RE
F
6.500(0.256)6.700(0.264)
5.130(0.202)5.460(0.215)
0.1
50
(0.0
06)
0.7
50
(0.0
30)
6.0
00(0
.23
6)
6.2
00(0
.24
4)
0.720(0.028)0.850(0.033)
2.286(0.090)
BSC
0.720(0.028)0.900(0.035)
0.9
00
(0.0
35
)1
.25
0(0
.04
9)
1.8
00
RE
F
80
0.6
00
(0.0
24
)
1.0
00
(0.0
39
)
73
95
![Page 132: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/132.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-252-2(4) Unit: mm(inch)
New Product Changed to TO252-2 (4) (2013.10)
5.460(0.215)
4.960(0.195)
6.350(0.250)
6.730(0.265)
1.20±0.05
1.900(0.075)
1.700(0.067)
6.220(0.245)
5.970(0.235)
1.270(0.050)
0.890(0.035)
1.492(0.059)
1.145(0.045)
1.010(0.040)1.124(0.044)
0.765(0.030)
2.290(0.090)
0.640(0.025)
0.884(0.035)
MAX
BSC
10.340(0.407)
9.940(0.391)
0.600(0.024)
0.460(0.018)
2.380(0.094)
2.180(0.086)
4.320(0.170)MIN
MIN
5.210(0.205)15
0
3 3
0.780(0.031)
0.650(0.026)
0.884(0.035)
0.640(0.025)
0.460(0.018)0.610(0.024)
0.410(0.016)
0.560(0.022)
DETAIL “A”
2.160(0.085)
MIN
BASE METAL
PLATING
SECTION B-B
0.020(0.001)
0.120(0.005)2.740(0.108)
1.500(0.059)
REF
1.780(0.070)
0
10
SEATING
PLANE
GAUGE PLANEB
B
![Page 133: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/133.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TO-252-2(4) Unit: mm(inch)
E1X1
Y2
Y1
Z
X2
G
Dimensions Z
(mm)/(inch)
X1
(mm)/(inch)
X2=Y2
(mm)/(inch)
Y1
(mm)/(inch)
G
(mm)/(inch)
E1
(mm)/(inch)
Value 11.600/0.457 1.500/0.059 7.000/0.276 2.500/0.098 2.100/0.083 2.300/0.091
![Page 134: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/134.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-252-2 (5) Unit: mm(inch)
New Product Changed to TO252-2 (5) (2013.10)
2.190(0.086)
2.390(0.094)
0.508(0.020)0°
10°
1.4
00
(0.0
55
)
1.7
80
(0.0
70
)
2.7
40
(0.1
08
)RE
F
9.4
00
(0.3
70
)
10
.40
0(0
.40
9)
0.000(0.000)
0.130(0.005)
6°8°
0.450(0.018)
0.580(0.023)
6.0
00
(0.2
36
)
6.2
00
(0.2
44
)
5.2
10(0
.20
5)
MIN4.320(0.170)
MIN
6.450(0.254)
6.700(0.264)
5.210(0.205)
5.500(0.217)
0.880(0.035)
1.270(0.050)
0.640(0.025)
1.020(0.040)
0.760(0.030)1.140(0.045)
2.286(0.090) 0.640(0.025)
0.880(0.035)
![Page 135: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/135.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TO-252-2 (5) Unit: mm(inch)
E1X1
Y2
Y1
Z
X2
G
Dimensions Z
(mm)/(inch)
X1
(mm)/(inch)
X2=Y2
(mm)/(inch)
Y1
(mm)/(inch)
G
(mm)/(inch)
E1
(mm)/(inch)
Value 11.600/0.457 1.500/0.059 7.000/0.276 2.500/0.098 2.100/0.083 2.300/0.091
![Page 136: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/136.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-252-3(2) Unit: mm(inch)
New Product Changed to TO252 (2) (2013.10)
6.500(0.256)6.700(0.264)
5.230(0.206)5.430(0.214)
1.2±0.1
2.9
RE
F
1.4
00(0
.055)
1.7
00(0
.06
7) 08
0.470(0.019)0.600(0.024)
37
37
37
9.8
00(0
.38
6)
10.4
0(0
.409)
2.2
00(0
.087)
2.3
80(0
.09
4)
0.900(0.035)1.100(0.043)
15
4.700REF
5.2
50
RE
F
1.1
50(0
.04
5)
1.5
00(0
.05
9)
6.0
00(0
.23
6)
6.2
00(0
.24
4)
0.770(0.030)0.890(0.035)
2.28BSC
0.770(0.030)1.100(0.433)
0.9
00(0
.03
5)
1.2
50(0
.04
9)
1.8
0R
EF
![Page 137: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/137.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TO-252-3(2)
X2
Y2
Z
Y1
X1 E
Dimensions Z
(mm)/(inch)
X1
(mm)/(inch)
X2= Y2
(mm)/(inch)
Y1
(mm)/(inch)
E
(mm)/(inch)
Value 11.600/0.457 1.100/0.043 7.000/0.276 2.500/0.098 2.300/0.091
![Page 138: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/138.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DO-15 Unit: mm(inch)
0.700(0.028)
0.900( )25.400(1.000) MIN
DIA.
DIA.
25.400(1.000) MIN
Cathode line
by marking5.800(0.228)
7.600(0.299)
2.600(0.102)
3.600(0.142)
0.035
![Page 139: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/139.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TSSOP-20 (EDP) Unit: mm(inch)
New Product Changed to TSSOP-20EP (2013.10)
0.650(0.026)TYP
6.200(0.244)6.600(0.260)
#1 P
IN
6.400(0.252)6.600(0.260)
INDEX0.750(0.030)0.850(0.033)
Dp0.000(0.000)0.100(0.004)
2.900(0.114)3.100(0.122)
4.100(0.161)4.300(0.169)
0.200(0.008)0.280(0.011)
0.050(0.002)0.150(0.006)
0.800(0.031)1.050(0.041)
1.200(0.047)MAX
0.340(0.013)0.540(0.021)
10°14°
0.250(0.010)TYP
0.450(0.018)0.750(0.030)
1.000(0.039)REF
0°8°
R0.090(0.004)MIN
R0.090(0.004)MIN
TOP & BOTTOM
4-
0.200(0.008)MIN
4.300(0.169)4.500(0.177)
0.100(0.004)0.190(0.007)
EXPOSED PAD
Note: Eject hole, oriented hole and mold mark is optional.
Ф
![Page 140: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/140.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TSSOP-20 (EDP)
X1
ZGY1
E X
Y
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
Value 7.720/0.304 4.160/0.164 0.420/0.017 1.780/0.070
Dimensions E
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch) ---
Value 0.650/0.026 4.500/0.177 3.300/0.130 ---
![Page 141: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/141.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SC-70-5 Unit: mm(inch)
2.000(0.079)
2.200(0.087)
2.1
50(0
.08
5)
2.4
50(0
.09
6)
1.1
50(0
.04
5)
1.3
50(0
.05
3)
0.650(0.026)TYP
1.200(0.047)
1.400(0.055)
0.150(0.006)
0.350(0.014)
0.525(0.021)REF
0.080(0.003)
0.150(0.006)
0°
8°
0.200(0.008)
0.260(0.010)
0.460(0.018)
0.000(0.000)
0.100(0.004)
0.900(0.035)
1.000(0.039)
0.900(0.035)
1.100(0.043)
![Page 142: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/142.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SC-70-5
Y
X
E
G
E1
Z
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
E1
(mm)/(inch)
Value 2.740/0.108 1.140/0.045 0.400/0.016 0.800/0.031 1.300/0.051 0.650/0.026
![Page 143: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/143.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TSSOP-20 (EDP)(Only for AA4005) Unit: mm(inch)
0.200(0.008)0.280(0.011)
0.050(0.002)0.150(0.006)
0.900(0.035)1.050(0.041)
1.200(0.047)MAX
0.340(0.013)0.540(0.021)
10°14°
0.250(0.010)TYP
0.450(0.018)0.750(0.030)
1.000(0.039)REF
0°8°
R0.090(0.004)MIN
R0.090(0.004)MIN
TOP & BOTTOM
4-
0.200(0.008)MIN
4.300(0.169)4.500(0.177)
0.100(0.004)0.190(0.007)
INDEX 0.750(0.030)0.850(0.033)
Dp 0.000(0.000)0.100(0.004)
EXPOSED
PAD6.200(0.244)6.600(0.260)
6.400(0.252)6.600(0.260)
2.400(0.094)
3.700(0.146)
MAX
MAX
#1 P
IN
0.650(0.026)TYP
Note: Eject hole, oriented hole and mold mark is optional.
![Page 144: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/144.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
PSOP-8 Unit: mm(inch)
New Product Changed to SO-8EP (2013.10)
8°
5.800(0.228)
6.200(0.244)
1.270(0.050)
0.400(0.016)
3.800(0.150)
4.000(0.157)
0.510(0.020)0.050(0.002)
0.150(0.006)
4.700(0.185)1.270(0.050)
TYP
0°
0.250(0.010)
0.150(0.006)
1.350(0.053)
1.550(0.061)
2.110(0.083)
2.710(0.107)
2.7
50(0
.10
8)
3.4
02(0
.13
4)
5.100(0.201)
Note: Eject hole, oriented hole and mold mark is optional.
0.300(0.012)
![Page 145: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/145.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
PSOP-8
G
E X
X1
Y
Y1Z
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
E
(mm)/(inch)
Value 6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059 3.600/0.142 2.700/0.106 1.270/0.050
![Page 146: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/146.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
PSOP-16 Unit: mm(inch)
New Product Changed to SO-16EP (2013.10)
3.810(0.150)
REF
9.800(0.386)
10.000(0.394)
2.300(0.091)
REF
3.800(0.150)
4.000(0.157)
5.800(0.228)
6.200(0.244)
1.270(0.050)
BSC
0
8
0.400(0.016)
1.270(0.050)
0.250(0.010)
0.500(0.020)
0.330(0.013)
0.510(0.020)
0.050(0.002)
0.250(0.010)
1.350(0.053)
1.750(0.069)
0.190(0.007)
0.250(0.010)
Note: 1. Eject hole, oriented hole and mold mark is optional.
2 . The figure of exposed pad is not restrained as regular rectangle.
![Page 147: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/147.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
PSOP-16
ZG
Y
Y1
X1
E X
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
Value 6.900/0.272 3.900/0.154 0.650/0.026 1.500/0.059
Dimensions E
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch) ---
Value 1.270/0.050 4.200/0.165 2.700/0.106 ---
![Page 148: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/148.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
PSOP-8(D) Unit: mm(inch)
PIN1
3.998(0.157)
3.861(0.152)
5.840(0.230)
6.200(0.244)
0.351(0.014)
0.508(0.020)
2.510(0.099)
2.310(0.091)
1.440(0.057)
1.240(0.049)
1.956(0.077)1.758(0.069)
PIN1
4.801(0.189)
4.953(0.195)
0.025(0.001)
0.127(0.005)
1.397(0.055)
1.549(0.061)
1.270(0.050)
TYP
1.676(0.066)
1.422(0.056)
8°0°
0.889(0.035)
0.406(0.016)
0.190(0.008)
0.250(0.010)
0.406(0.016)
0.254(0.010)x45°
Note: Eject hole, oriented hole and mold mark is optional.
3.452(0.136)
3.252(0.128)
![Page 149: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/149.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TSOT-23-6 Unit: mm(inch)
New Product Changed to TSOT26 (2013.10)
2.800(0.110)
3.000(0.118)
1.500(0.059)
1.700(0.067)
2.600(0.102)
3.000(0.118)
0.950(0.037)
BSC
1.900(0.075)
BSC
0.700(0.028)
0.900(0.035)
0.000(0.000)
0.100(0.004) 0.350(0.014)
0.510(0.020)
0
8
0.370(0.015)
MIN
0.100(0.004)
0.250(0.010)
0.250(0.010)
BSC
GAUGE
PLANE
R0.100(0.004)
MIN
Pin 1 Mark
1.000(0.039)
MAX
![Page 150: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/150.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TSOT-23-6
X
Y
Z
E
Dimensions E
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
Z
(mm)/(inch)
Value 0.950/0.037 0.700/0.028 1.000/0.039 3.199/0.126
![Page 151: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/151.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
FTSOT-23-6 (Except AH9485/AH9486) Unit: mm(inch)
2.820(0.111)
3.020(0.119)
3.700(0.146)
3.900(0.154)
0.950(0.037)
BSC0.350(0.014)
0.500(0.020)
1.600(0.063)
1.700(0.067)
0.080(0.003)
0.200(0.008)
0.393(0.015)
0.493(0.019)
0.700(0.028)
0.800(0.031)
Pin 1 Mark
![Page 152: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/152.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
FTSOT-23-6 (Only for AH9485/AH9486) Unit: mm(inch)
2.820(0.111)
3.020(0.119)
3.700(0.146)
3.900(0.154)
0.950(0.037)
BSC0.350(0.014)
0.500(0.020)
1.600(0.063)
1.700(0.067)
0.080(0.003)
0.200(0.008)
0.393(0.015)
0.493(0.019)
0.700(0.028)
0.800(0.031)
1.180(0.046)
1.380(0.054)
0.850(0.033)
1.050(0.041)
Package Sensor
Location
Pin 1 Mark
![Page 153: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/153.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-251 Unit: mm(inch)
New Product Changed to TO251 (2013.10)
0.9
00
( 0.0
35)
1.2
50
( 0.0
49
)
5.400(0.213)
5.200(0.205)
0.550(0.022)
0.740 (0.029 )
2.240(0.088)
4.430 (0.174)
4.730 (0.186)
0.450(0.018)0.550(0.022)
2.200(0.087)
2.400(0.094)
0.450(0.018)
0.570(0.022)
5.9
50
(0.2
34)
6.2
50
(0.2
46)
8.9
00(0
.35
0)
9.5
00(0
.37
4)
6.400(0.252)
6.750(0.266)
2.340(0.092)
0.890(0.035)1.150(0.045)
Option 1
Option 2 Option 3
45
![Page 154: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/154.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
QFN-2×2-12 Unit: mm(inch)
1.900(0.075)
0.152(0.006)
REF0.000(0.000)
0.050(0.002)
0.750(0.030)
0.850(0.033)
0.300(0.012)
0.400(0.016)
0.300(0.012)
0.400(0.016)
0.500(0.020)
BSC
0.180(0.007)
0.280(0.011)
Pin 1 Mark
PIN # 1
IDENTIFICATION
2.100(0.083)
1.900(0.075)
2.100(0.083)
![Page 155: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/155.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
QFN-2×2-12
Y
X1
Y1
E
X
X2
Y2
X3
Dimensions Y=X
(mm)/(inch)
X1=Y2
(mm)/(inch)
Y1=X2=X3
(mm)/(inch)
E
(mm)/(inch)
Value 2.300/0.091 0.300/0.012 0.600/0.024 0.500/0.020
![Page 156: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/156.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
QFN-3×3-16 Unit: mm(inch)
A
0.000(0.000)0.050(0.002)
A1
0.180(0.007)
0.280(0.011)
BSC
0.500(0.020) 1.400(0.055)
1.860(0.073)
0.550(0.022)
0.250(0.010)
Exposed
Pad
Pin 1 Mark3.100(0.122)
2.900(0.114)
3.1
00(0
. 12
2)
2.9
00(0
.11
4)
N1 PIN # 1 IDENTIFICATION
See DETAIL A
Pin 1 Options
DETAIL A
1 2
15
16
1 12 2
16 16
15 15
.
SymbolA A1
min(mm) max(mm) max(mm)min(mm)min(inch) min(inch)max(inch) max(inch)
Option1
Option2
0.700
0.550
0.028
0.022
0.900 0.035
0.650 0.026
0.0070.178
0.150 (TYP)
0.228
0.006 (TYP)
0.009
1.400(0.055)
1.860(0.073)
![Page 157: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/157.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
QFN-3×3-16
E
Y2
X1
E
Y1
Y
X2
X
X3
Y3
Dimensions X=Y
(mm)/(inch)
X1=Y1
(mm)/(inch)
X2=Y2
(mm)/(inch)
X3=Y3
(mm)/(inch)
E
(mm)/(inch)
Value 3.400/0.134 0.650/0.026 0.300/0.012 1.700/0.067 0.500/0.020
![Page 158: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/158.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
QFN-3.5×3.5-14 Unit: mm(inch)
3.400(0.134)
3.600(0.142)
3.400(0.134)
3.600(0.142)1.900(0.075)
2.100(0.083)
1.500(0.059)BSC
0.500(0.020)
BSC
0.350(0.014)
0.450(0.018)
0.200(0.008)0.300(0.012)
0.750(0.030)
0.900(0.035)
0.000(0.000)
0.050(0.002)
A1
Pin 1 Mark
PIN #1 IDENTIFICATION
See DETAIL A
1
DETAIL A
Pin 1 options
N1
N2
N6
N8
N13
N14
2
3
4
1
2
3
4
1
2
3
4
SymbolA1
min(mm) max(mm) min(inch) max(inch)
Option1
Option2
0.203(REF)
0.150(REF)
0.008(REF)
0.006(REF)
1.900(0.075)
2.100(0.083)
![Page 159: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/159.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
QFN-3.5×3.5-14
E2
X2
X1
Y1
Y2
E1
Y3
X3
X
Y
Dimensions X=Y
(mm)/(inch)
X1=Y1
(mm)/(inch)
X2=Y2
(mm)/(inch)
X3=Y3
(mm)/(inch)
E1
(mm)/(inch)
E2
(mm)/(inch)
Value 3.800/0.150 2.100/0.083 0.650/0.026 0.300/0.012 0.500/0.020 1.500/0.059
![Page 160: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/160.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TSSOP-24 (EDP) Unit: mm(inch)
New Product Changed to TSSOP-24EP (2013.10)
GAGE PLANE0.250(0.010)
SEATING PLANE0.500(0.020)0.700(0.028) 1.000(0.039)
0°8°
0.650(0.026) 0.190(0.007)0.300(0.012)
D
4.3
00(0
.169)
4.5
00(0
.177)
6.2
00(0
.24
4)
6.6
00(0
.26
0)
E
1.200(0.047)MAX0.000(0.000)0.150(0.006)
1 12
1324
Note: Eject hole, oriented hole and mold mark is optional.
.
7.700(0.303)
7.900(0.311)
0.200(0.008)
0.080(0.003)
SymbolD E
min(mm) max(mm) max(mm)min(mm)min(inch) min(inch)max(inch) max(inch)
Option1
Option2
1.500
2.700
1.800
3.000 3.900
2.700 3.000
4.200
0.059 0.071
0.106 0.118
0.106 0.118
0.154 0.165
![Page 161: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/161.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TSSOP-24 (EDP)
X1
Y1
E X
GZ
Dimen-
sions
Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
E
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
Option1 7.350/0.289 4.450/0.175 0.450/0.018 0.650/0.026 3.200/0.126 2.000/0.079
Option2 7.350/0.289 4.450/0.175 0.450/0.018 0.650/0.026 4.400/0.173 3.200/0.126
![Page 162: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/162.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TSOT-23-8 Unit: mm(inch)
2.692(0.106)
3.099(0.122)
2.5
91
(0.1
02
)
3.0
00
(0.1
18
)
1.3
97
(0.0
55
)
1.8
03
(0.0
71
)
0.220(0.009)
0.380(0.015)
0.700(0.028)
1.000(0.039)0.000(0.000)
0.100(0.004)
0.300(0.012)
0.610(0.024)
0.080(0.003)
0.254(0.010)
0.585(0.023)
0.715(0.028)
Pin 1 Mark
![Page 163: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/163.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
HTSSOP-14 Unit: mm(inch)
6.350(0.250)
6.550(0.258)
1.470(0.058)
1.570(0.062)
1.450(0.057)
1.550(0.061)
0.750(0.030)
0.850(0.033)
0.650(0.026)
BSC
1.300(0.051)
BSC
6.200(0.244)
6.600(0.260)
0.340(0.013)
0.540(0.021)
1.200(0.047)
MAX
0.050(0.002)
0.200(0.008)
0.900(0.035)
1.050(0.041)
4.300(0.169)
4.500(0.177)
SEE
DETAIL A
0.250(0.010)
BSC
R0.090(0.004)
MIN
R0.090(0.004)
MIN
0.200(0.008)
MIN
10
14
0.450(0.018)
0.750(0.030)
1.000(0.039)
REF
0
8
DETAIL A
Note: Eject hole, oriented hole and mold mark is optional.
0.200(0.008) or 1.480(0.058)
0.280(0.011) or 1.610(0.063)
0.100(0.004)
0.150(0.006)
0.100(0.004)
0.190(0.007)
0.200(0.008) or 1.470(0.058)
0.240(0.009) or 1.570(0.062)
BASE METAL
F
F
![Page 164: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/164.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
HTSSOP-14
E1 E2
X1
G Z
X
Y
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
X1
(mm)/(inch)
Value 7.720/0.304 4.160/0.164 0.420/0.017 1.710/0.067
Dimensions Y
(mm)/(inch)
E1
(mm)/(inch)
E2
(mm)/(inch)
Value 1.780/0.070 1.300/0.051 0.650/0.026
![Page 165: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/165.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SC-82 Unit: mm(inch)
New Product Changed to SC82 (2013.10)
1.800(0.071)
2.400(0.094)
1.150(0.045)
1.350(0.053)
0.250(0.010)
0.400(0.016)
0.350(0.014)
0.500(0.020)
1.300(0.051)
Typ
1.800(0.071)
2.200(0.087)
0.700(0.027)
1.000(0.039)0.800(0.031)
1.100(0.043)
0.000(0.000)
0.100(0.004)
0.100(0.004)
0.260(0.010)
0.260(0.010)
0.460(0.018)
0.150(0.006)
Typ
4
12
4
12
4
12
0
8
![Page 166: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/166.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SC-82
E
Y
X2
X1
G Z
e
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X1
(mm)/(inch)
X2
(mm)/(inch)
Value 2.740/0.108 1.140/0.045 0.600/0.024 0.500/0.020
Dimensions Y
(mm)/(inch)
E
(mm)/(inch)
e
(mm)/(inch) ---
Value 0.800/0.031 1.300/0.051 0.050/0.002 ---
![Page 167: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/167.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-3×3-8 Unit: mm(inch)
2.900(0.114)
3.100(0.122)
2.900(0.114)
3.100(0.122)
2.200(0.087)
2.400( 0.094)1.400(0.055)
1.600(0.063)
N8N5
N4 N1
0.375(0.015)
0.575(0.023)
0.180(0.007)
0.300(0.012)
0.153(0.006)
0.253(0.010)
0.000(0.000)
0.050(0.002)0.700(0.028)
0.800(0.031)
PIN #1 IDENTIFICATION
See DETAIL A
BSC
0.650(0.026)
Pin 1 Mark
12
DETAIL A
12 12
Pin 1 options
![Page 168: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/168.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-3×3-8
X1
Y1
Y2
X2Y
E
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
E
(mm)/(inch)
Value 3.400/0.134 0.370/0.015 0.750/0.030 2.600/0.102 1.600/0.063 0.500/0.020
![Page 169: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/169.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-2×3-8 Unit: mm(inch)
1.924(0.076)
2.076(0.082)
2.924(0.115)
3.076(0.121)
0.200(0.008)
MIN 0.500(0.020)
TYP
0.224(0.009)
0.376(0.015)
1.300(0.051)
1.500(0.059)
1.400(0.055)
1.600(0.063)
0.200(0.008)
0.300(0.012)
0.550(0.022)
0.650(0.026)
0.000(0.000)
0.050(0.002) 0.152(0.006)
REF
N1
Pin 1 Mark
![Page 170: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/170.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-2×3-8 Unit: mm(inch)
X1
Y1
X2
Y2
Y
E
X
Dimensions X
(mm)/(inch)
Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
Value 1.800/0.071 3.300/0.130 0.300/0.012 0.600/0.024
Dimensions X2
(mm)/(inch)
Y2
(mm)/(inch)
E
(mm)/(inch)
Value 1.700/0.067 1.600/0.063 0.500/0.020
![Page 171: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/171.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-3.3×1.3-8 (Except ITVS) Unit: mm(inch)
3.224(0.127)
3.376(0.133)
1.224(0.048)
1.376(0.054)
1.250(0.049)
TYP
0.500(0.020)
TYP
0.200(0.008)
MIN
0.544(0.021)
0.696(0.027)
0.200(0.008)
0.300(0.012)
0.304(0.012)
0.456(0.018)
0.350(0.014)0.450(0.018)
0.000(0.000)
0.050(0.002)0.127(0.005)
REF
N1N6
N7 N8
Pin 1 Mark
![Page 172: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/172.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-3.3×1.3-8 (Only for ITVS)
3.224(0.127)
3.376(0.133)
1.224(0.048)
1.376(0.054)
1.250(0.049)
TYP
0.500(0.020)
TYP
0.200(0.008)
MIN
0.544(0.021)
0.696(0.027)
0.200(0.008)
0.300(0.012)
0.304(0.012)
0.456(0.018)
0.350(0.014)0.450(0.018)
0.000(0.000)
0.050(0.002)0.127(0.005)
REF
N1N6
N7 N8
Pin 1
Mark
0.075
0.075
0.325
0.625
Note: Pin1 Dot Ø 0.15mm Pin1 Dot area 0.4mm * 0.7mm
Unit: mm(inch) MAX
mm(inch) M I N
![Page 173: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/173.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-3.3×3.3-8 Unit: mm(inch)
New Product Changed to POWERDI3333-8 (2013.10)
Pin 1 Mark
3.250(0.128)
3.350(0.132)
3.250(0.128)
3.350(0.132)
2.220(0.087)2.320(0.091) 0.350(0.014)
0.450(0.018)N1 N4
0.200(0.008)MIN
0.390(0.015)
TYP0.650(0.026)TYP
0.270(0.011)
0.370(0.015)
1.560(0.061)1.660(0.065)
0.515(0.020)
TYP
N8
0.200(0.008)TYP
0.750(0.030)
0.850(0.033)
0.000(0.000)0.050(0.002)
0.203(0.008)TYP
![Page 174: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/174.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-3.3×3.3-8
X2 E
Y2
Y
Y3
X1
Y1
E
Dimensions Y
(mm)/(inch)
X1=X2
(mm)/(inch)
Y1
(mm)/(inch)
Y2
(mm)/(inch)
Y3
(mm)/(inch)
E
(mm)/(inch)
Value 3.700/0.146 0.420/0.017 0.700/0.028 0.600/0.024 2.250/0.089 0.650/0.026
![Page 175: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/175.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-92S Unit: mm(inch)
New Product Changed to SIP-3 (2013.10)
1.480(0.058)
1.680(0.066)
0.710(0.028)
0.810(0.032)
3.080(0.121)
3.280(0.129)
2.200(0.087)
2.400(0.094)0.440(0.017)
TYP
13.500(0.531)
14.500(0.571)
0.380(0.015)
TYP
1.270(0.050)
TYP
44
46
4.000(0.157)
4.200(0.165)
![Page 176: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/176.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO92S (TYPE B) (Only for AH9247)
Die
PART
MARKING
SURFACE
0.67/0.83
0.35/0.55
Hall Sensor
1.85/2.15
1.05/1.35
1 2 3
Min/Max
Sensor Location
E
L
L1
e
bb2
A
A2
0
c
D
![Page 177: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/177.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SC59 (Only for AH9247)
0.8
0/1
.00
1.35/1.55
Hall Sensor
Min/Max
0.5
7/0
.77
0.1
0/0
.20
Die
PART
MARKING
SURFACE
Pin1
Sensor Location
A
M
JLD
B C
H
K
G
N
![Page 178: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/178.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SC59 (Only for AH9247)
X E
Y
CZ
![Page 179: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/179.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
U-DFN2020-3 (Only for AH9247)
Die
PART MARKING
SURFACE
0.2
0/0
.40
0.5
7/0
.63
1.00/1.20
0.7
5/0
.95
Hall Sensor
Min/Max
Top View
Sensor Location
D
D2
E
e
b L
E2
A A1A3
Seating Plane
Pin #1 ID
R0.200
E3
D3
L
![Page 180: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/180.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
U-DFN2020-3 (Only for AH9247)
Y4
X3
X
Y
G
X1Y1
R0.200
R0.225
C
Y2
X2
Y3
R0.050
R0.200
![Page 181: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/181.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-92S(Only for AH49F)
Die
PART
MARKING
SURFACE
0.71/0.81
0.35/0.55
Hall Sensor
1.90/2.20
1.15/1.45
1 2 3
PART
MARKING
SURFACE
Min/Max
Sensor Location
L
J
ND
C
G H
B P
A
E F
a3
a4
a1
a2
![Page 182: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/182.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SC59(Only for AH49F)
0.6
7/0
.97
1.3/1.6
Hall Sensor
Min/Max
0.4
75
/0.5
75
0.1
0/0
.20
Die
PART
MARKING
SURFACE
Pin1
Sensor Location
A
M
JLD
B C
H
K
G
N
![Page 183: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/183.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
U-DFN2020-6 (Only for AH49F)
Bottom View
Die
Hall Sensor
0.9
5/1
.15
0.86/1.06
0.2
0/0
.40
0.5
7/0
.63
Min/Max
PART MARKING
SURFACE
Pin1
Top View
Sensor Location
D
D2
E
e b
L
E2
AA1
A3 Seating Plane
Pin #1 ID
Z(4x)
![Page 184: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/184.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-1.6×1.6-6 Unit: mm(inch)
New Product Changed to U-DFN1616-6 (2013.10)
0.950(0.037)
1.050(0.041)
0.500(0.020)
BSC
0.550(0.022)
0.650(0.026)
1.550(0.061)
1.650(0.065)
1.550(0.061)
1.650(0.065)
0.290(0.011)
0.190(0.007)
0.180(0.007)
0.280(0.011)
0.700(0.028)
0.800(0.031)
0.000(0.000)
0.050(0.002)
0.195(0.008)
0.211(0.008)
Pin 1 Mark
PIN # 1 IDENTIFICATION
See DETAIL A
1
DETAIL A
Pin 1 options
2 12 12
![Page 185: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/185.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-1.6×1.6-6
E
YY2
X2
Y1
X1
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
Y1=E
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
Value 2.000/0.079 0.300/0.012 0.500/0.020 1.200/0.047 0.800/0.031
![Page 186: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/186.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
U-DFN1616-6 (Type G) Unit: mm(inch)
1.250(0.049)
1.350(0.053)
0.500(0.020)Pin 1 Mark
0.550(0.022)0.600(0.024)
PIN # 1 IDENTIFICATION
0.250(0.010)
0.150(0.006)
Typ
0.200(0.008)Typ
Typ
0.200(0.008)
Typ
Top View
Bottom View
Side View
0.200(0.008)0.300(0.012)
0.650(0.026)
0.750(0.030)
1.550(0.061)
1.650(0.065)
1.550(0.061)
1.650(0.065)
0.127(0.005)0.000(0.000)
0.050(0.002)
![Page 187: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/187.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
U-DFN1616-6 (Type G)
YY2
Y1
E
X2
X1
G
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
E
(mm)/(inch)
G
(mm)/(inch)
Value 1.900/0.075 0.300/0.012 0.500/0.020 0.150/0.006
Dimensions Y1
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch) ---
Value 0.450/0.018 1.300/0.051 0.700/0.028 ---
![Page 188: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/188.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-1.8×2-6 Unit: mm(inch)
1.900(0.075)
2.100(0.083)
1.700(0.067)
1.900(0.075)
P in 1 Mark
0.550(0.022)
0.650(0.026)
0.000(0.000)
0.050(0.002)0.150(0.006)
REF
0.900(0.035)
REF
0.500(0.020)
TYP
0.180(0.007)0.280(0.011)
N6
0.200(0.008)
MIN
0.174(0.007)0.326(0.013)
1.400(0.055)
REF
N1N3
N4
DETAIL A
Pin 1 options
PIN #1 IDENTIFICATIONSee DETAIL A
1211 22
![Page 189: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/189.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-1.8×2-6
E
YY2
X2
X1
Y1
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
Y1=E
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
Value 2.400/0.094 0.300/0.012 0.500/0.020 1.600/0.063 1.000/0.039
![Page 190: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/190.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-1.8×2-6A Unit: mm(inch)
1.900(0.075)
2.100(0.083)
1.700(0.067)
1.900(0.075)
Pin 1 Mark
0.450(0.018)
0.550(0.022)
0.000(0.000)
0.050(0.002)0.150(0.006)
REF
0.900(0.035)REF
0.500(0.020)
TYP
0.180(0.007)0.280(0.011)
N6
0.200(0.008)MIN
0.174(0.007)0.326(0.013)
1.400(0.055)REF
N1N3
N4
DETAIL A
Pin 1 options
PIN #1 IDENTIFICATIONSee DETAIL A
1211 22
![Page 191: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/191.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-1.8×2-6A
E
YY2
X2
X1
Y1
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
Y1=E
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
Value 2.400/0.094 0.300/0.012 0.500/0.020 1.600/0.063 1.000/0.039
![Page 192: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/192.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-2×2-6 Unit: mm(inch)
1.900(0.075)
2.100(0.083)
1.900(0.075)
2.100(0.083)
Pin 1 Mark
0.650(0.026)
TYP0.250(0.010)
0.450(0.018)
E
D
0.180(0.007)0.350(0.014)
N1N3
N4 N6
A
0.000(0.000)
0.050(0.002)
A3
12 12 12
PIN #1 IDENTIFICATION
See DETAIL A
DETAIL A
Pin 1 Options
.
SymbolD E
min(mm) max(mm) max(mm)min(mm)min(inch) min(inch)max(inch) max(inch)
Option1
Option2
1.200 (TYP)
1.550 1.750 0.061 0.069 1.060
0.700 (TYP)
0.860
0.028 (TYP)
0.034 0.042
.
A
max(mm)min(mm) min(inch) max(inch)
0.800
0.630
0.700
0.570
0.028
0.022
0.031
0.025
A3
max(mm)min(mm) min(inch) max(inch)
0.203 (TYP)
0.150 (TYP)
0.008 (TYP)
0.006 (TYP)
Symbol
Option1
Option2
0.047 (TYP)
![Page 193: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/193.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-2×2-6
X1
Y
Y2
Y1
EX2
X
Dimensions X
(mm)/(inch)
Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
Value 1.700/0.067 2.400/0.094 1.650/0.065 1.010/0.040
Dimensions X2
(mm)/(inch)
Y2
(mm)/(inch)
E
(mm)/(inch) –
Value 0.350/0.014 0.525/0.021 0.650/0.026 –
![Page 194: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/194.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
(140331 confirmed by AE Zhang Tao)
DFN-2×2-6 (Only for AH49F) Unit: mm(inch)
1.900(0.075)
2.100(0.083)
1.900(0.075)
2.100(0.083)
Pin 1 Mark
0.650(0.026)
TYP0.250(0.010)
0.450(0.018)
E
D
0.180(0.007)0.350(0.014)
N1N3
N4 N6
A
0.000(0.000)
0.050(0.002)
A3
12 12 12
PIN #1 IDENTIFICATION
See DETAIL A
DETAIL A
Pin 1 Options
.
SymbolD E
min(mm) max(mm) max(mm)min(mm)min(inch) min(inch)max(inch) max(inch)
Option1
Option2
1.200 (TYP)
1.550 1.750 0.061 0.069 1.060
0.700 (TYP)
0.860
0.028 (TYP)
0.034 0.042
.
A
max(mm)min(mm) min(inch) max(inch)
0.800
0.630
0.700
0.570
0.028
0.022
0.031
0.025
A3
max(mm)min(mm) min(inch) max(inch)
0.203 (TYP)
0.150 (TYP)
0.008 (TYP)
0.006 (TYP)
Symbol
Option1
Option2
0.047 (TYP)
Package Sensor
Location0.900(0.035)
1.100(0.043)
0.900(0.035)
1.100(0.043)
0.220(0.009)
0.320(0.013)
Die
![Page 195: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/195.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-2×2-8 Unit: mm(inch)
New Product Changed to W-DFN2020-8 (2013.10)
1.950(0.077)
2.050(0.081)
1.950(0.077)
2.050(0.081)
N1N4
N5 N8
0.500(0.020)
BSC
PIN #1 IDENTIFICATION
1.150(0.045)
1.250(0.049)
0.550(0.022)
0.650(0.026)
0.178(0.007)
0.228(0.009)
0.000(0.000)
0.050(0.002)0.700(0.028)
0.800(0.031)
0.200(0.008)
0.300(0.012)
0.300(0.012)
0.400(0.016)
Pin 1 Mark See DETAIL A
DETAIL A
Pin 1 options
1 1 12 2 2
![Page 196: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/196.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-2×2-8
X1
Y1
Y2X2Y
E
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
E
(mm)/(inch)
Value 2.400/0.094 0.300/0.012 0.600/0.024 1.300/0.051 0.700/0.028 0.500/0.020
![Page 197: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/197.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-2.2×2.2-8 Unit: mm(inch)
2.100(0.083)
2.300(0.091)
2.1
00(0
.08
3)
2.3
00(0
.09
1)
0.550(0.022)
BSC
1.050(0.041)
1.150(0.045) 1.550(0.061)
1.650(0.065)
0.300(0.012)
0.400(0.016)0.200(0.008)
0.300(0.012)
0.200(0.008)
MIN.
0.700(0.028)
0.800(0.031)
0.000(0.000)
0.050(0.002)
0.200(0.008)
REF
N1N4
N5 N8
Pin 1 MarkPIN #1 IDENTIFICATION
See DETAIL A
DETAIL A
1 11 2 22
Pin 1 options
![Page 198: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/198.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-2.2×2.2-8
E
Y1X1
X2
Y2
Y
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
E
(mm)/(inch)
Value 2.600/0.102 1.900/0.075 1.100/0.043 0.300/0.012 0.600/0.024 0.550/0.022
![Page 199: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/199.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-2.5×1.0-10(Except ITVS) Unit: mm(inch)
New Product Changed to U-DFN2510-10 (2013.10)
0.545(0.021)0.650(0.026)
0.325(0.013)0.450(0.018)
0.350(0.014)0.450(0.018)
0.150(0.006)0.250(0.010)
0.500(0.020)TYP
0.350(0.014)0.450(0.018)
0.000(0.000)0.050(0.002)
0.152(0.006)
REF
0.950(0.037)1.075(0.042)
2.450(0.096)2.575(0.101)
N10N6
N5 N1
PIN #1 IDENTIFICATIONPin 1 Mark
Option 1
Option 2 Option 3
![Page 200: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/200.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-2.5×1.0-10 (Only for ITVS)
0.550(0.022)0.650(0.026)
0.350(0.014)0.450(0.018)
0.350(0.014)0.450(0.018)
0.150(0.006)0.250(0.010)
0.500(0.020)TYP
0.350(0.014)0.450(0.018)
0.000(0.000)0.050(0.002)
0.152(0.006)
REF
0.950(0.037)1.050(0.041)
2.450(0.096)2.550(0.100)
N10N6
N5 N1
PIN #1 IDENTIFICATIONPin 1 Mark
0.075
0.075
0.325
0.625
Note: Pin1 Dot Ø 0.15mm Pin1 Dot area 0.4mm * 0.7mm
Unit: mm(inch) MAX
mm(inch) M I N
![Page 201: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/201.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-2.5×1.0-10
Y
Z
X2
EEX1
G
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X1
(mm)/(inch)
X2
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 1.350/0.053 0.150/0.006 0.250/0.010 0.450/0.018 0.600/0.024 0.500/0.020
![Page 202: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/202.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-2.5×1.0-10(1) Unit: mm(inch)
0.450(0.018)
0.550(0.022)
0.350(0.014)0.450(0.018)
0.350(0.014)
0.450(0.018)
0.150(0.006)
0.250(0.010)
0.500(0.020)TYP
0.350(0.014)
0.450(0.018)
0.000(0.000)
0.050(0.002)
0.152(0.006)REF
0.950(0.037)
1.050(0.041)
2.450(0.096)
2.550(0.100)N10N6
N5 N1
PIN#1 IDENTIFICATIONPin 1 Mark
![Page 203: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/203.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
QFN-4×4-24 Unit: mm(inch)
3.900(0.154)
4.100(0.161)
3.900(0.154)
4.100(0.161)
0.200(0.008)
MIN
0.500(0.020)
BSC
0.300(0.012)
0.500(0.020)0.180(0.007)
0.300(0.012)0.000(0.000)
0.050(0.002)
N1
N7
N13
N19 N24
Pin 1 Mark
Pin 1 Options
DETAIL A
1
2
3
2422 23
1
2
3
2422 23
1
2
3
2422 23
PIN # 1 IDENTIFICATION
See DETAIL A
.
SymbolD=E A
min(mm) max(mm) max(mm)min(mm)min(inch) min(inch)max(inch) max(inch)
Option1
Option2
2.600
2.350
2.800
2.550
0.102 0.110
0.093 0.100
0.850
0.850
0.700
0.700
0.028
0.028
0.033
0.033
D
E
A3
max(mm)min(mm) min(inch) max(inch)
0.253
0.253
0.153
0.153
0.006
0.006
0.010
0.010
Option3 2.600 2.800 0.102 0.110 0.6500.550 0.022 0.026 0.1750.125 0.005 0.007
A
A3
![Page 204: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/204.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
QFN-4×4-24
E
Y1
Y2
X1
E
X2
Y
X
X3
Y3
Dimensions X=Y
(mm)/(inch)
X1=Y2
(mm)/(inch)
Y1=X2
(mm)/(inch)
X3=Y3
(mm)/(inch)
E
(mm)/(inch)
Value 4.400/0.173 0.300/0.012 0.650/0.026 2.800/0.110 0.500/0.020
![Page 205: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/205.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
QFN-4×4-24 (Type B) Unit: mm(inch)
3.950(0.156)
4.050(0.159)
3.950(0.156)
4.050(0.159)
0.500(0.020)
TYP
0.350(0.014)
0.450(0.018)0.190(0.007)
0.290(0.011)
0.000(0.000)
0.050(0.002)
N1
N7
N13
N19 N24
Pin 1 Mark
PIN # 1 IDENTIFICATION
2.650(0.104)
2.750(0.108)
2.650(0.104)
2.750(0.108)
0.550(0.022)
0.650(0.026)
0.150(0.006)
TYP
0.630(0.025)
TYP
![Page 206: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/206.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
QFN-4×4-24 (Type B)
E
Y2
X1
EY
X2
Y3
X
Y1
Dimensions X=Y1
(mm)/(inch)
Y
(mm)/(inch)
X1
(mm)/(inch)
Y2
(mm)/(inch)
Value 2.840/0.112 4.300/0.169 0.340/0.013 0.600/0.024
Dimensions X2=Y3
(mm)/(inch)
E
(mm)/(inch) – –
Value 2.800/0.110 0.500/0.020 – –
![Page 207: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/207.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
QFN-6×6-48 Unit: mm(inch)
5.900(0.232)
6.100(0.240)
6.100(0.240)
5.900(0.232)
Pin 1 Mark
0.400(0.016)
BSC
0.000(0.000)
0.050(0.002)
0.200(0.008)
REF0.150(0.006)
0.250(0.010)
N1
N13
N25
N37
N48
0.300(0.012)
0.500(0.020)
PIN # 1 IDENTIFICATION
See DETAIL A
12
Pin 1 Options
DETAIL A
3
48
47
46
123
48
47
46
123
48
47
46
.
SymbolJ=K A
min(mm) max(mm) max(mm)min(mm)min(inch) min(inch)max(inch) max(inch)
Option1
Option2
4.400
4.150
4.600
4.450
0.173 0.181
0.163 0.175
0.800
0.900
0.700
0.800
0.028
0.031
0.031
0.035
J
K
A
![Page 208: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/208.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
QFN-6×6-48
E
X2
E
Y2
X1
Y1
Y
X3
Y3
X
Dimensions X=Y
(mm)/(inch)
X1=Y2
(mm)/(inch)
Y1=X2
(mm)/(inch)
X3=Y3
(mm)/(inch)
E
(mm)/(inch)
Value 6.300/0.248 0.250/0.010 0.600/0.024 4.600/0.181 0.400/0.016
![Page 209: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/209.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
QFN-7×7-56 Unit: mm(inch)
6.900(0.272)
7.100(0.280)
6.900(0.272)
7.100(0.280)5.100(0.201)
5.300(0.209)
0.400(0.016)
BSC
5.100(0.201)
5.300(0.209)
0.400(0.016)
BSC
0.150(0.006)
0.250(0.010)
Pin 1 Mark
N1
N15
N29
N43 N56
0.700(0.028)
0.800(0.031)0.000(0.000)
0.050(0.002)
0.203(0.008)
REF
0.300(0.012)
0.500(0.020)
PIN # 1 IDENTIFICATION
See DETAIL A
1
2
Pin 1 Options
DETAIL A
3
56
55
54
4
53
1
2
3
56
55
54
45
3
1
2
3
56
55
54
4
53
![Page 210: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/210.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
QFN-7×7-56
X
Y
Y2
E
EX2
X1
Y1
Y3 X3
Dimensions X=Y
(mm)/(inch)
X1=Y1
(mm)/(inch)
X2=Y2
(mm)/(inch)
X3=Y3
(mm)/(inch)
E
(mm)/(inch)
Value 7.400/0.291 5.400/0.213 0.250/0.010 0.700/0.028 0.400/0.016
![Page 211: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/211.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
QFN-8×8-68 Unit: mm(inch)
7.900(0.311)
8.100(0.319)
7.900(0.311)
8.100(0.319)
Pin 1 Mark
1
2
Pin 1 Options
DETAIL A
3
68
67
66
4
65
1
2
3
68
67
66
4
65
1
2
3
68
67
66
4
65
# 1 IDENTIFICATION
See DETAIL A
PIN
.
SymbolD E
min(mm) max(mm) max(mm)min(mm)min(inch) min(inch)max(inch) max(inch)
Option1
Option2
4.300
5.400
4.500
5.600
0.169 0.177
0.213 0.220
4.500
5.600
4.300
5.400
0.169
0.213
0.177
0.220
0.400(0.016)
BSC
0.150(0.006)
0.250(0.010)
N18
N1
D
N680.300(0.012)0.500(0.020)
E
N52
N35
0.700(0.028)
0.800(0.031)0.000(0.000)
0.050(0.002)
0.203(0.008)
REF
.Option3 6.100 6.300 0.240 0.248 6.3006.100 0.240 0.248
![Page 212: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/212.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
QFN-8×8-68
X
Y
X1
Y1
Y3
X3
Y2
E
X2 E
Dimensions X=Y
mm(inch)
X1=Y1
mm(inch)
X2=Y2
mm(inch)
E
mm(inch)
X3=Y3
mm(inch)
Option1 8.400(0.331) 4.700(0.185) 0.250(0.010) 0.400(0.016) 0.700(0.028)
Option2 8.400(0.331) 5.800(0.228) 0.250(0.010) 0.400(0.016) 0.700(0.028)
Option3 8.400(0.331) 6.500(0.256) 0.250(0.010) 0.400(0.016) 0.700(0.028)
![Page 213: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/213.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SSOP-16 Unit: mm(inch)
3.800(0.150)
4.000(0.157)
0.200(0.008)
0.300(0.012)
0.800(0.031)
0.635(0.025)
BSC
0.900(0.035)1.000(0.039)0.100(0.004)
0.250(0.010)
1.350(0.053)
1.750(0.069)
0.400(0.016)
1.270(0.050)
4.700(0.185)
5.100(0.201)
5.800(0.228)
6.200(0.244)
0.650(0.026)
0.750(0.030)0.200(0.008)
0.250(0.010)
1.350(0.053)
1.550(0.061)
0.020(0.001)
0.050(0.002)
R0.150(0.006)
R0.150(0.006)
0.250(0.010)SEE
DETAIL A
7
7
8
8
0.150(0.006)
0.250(0.010)
0
8
F
DETAIL A
Note: Eject hole, oriented hole and mold mark is optional.
![Page 214: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/214.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SSOP-16
ZG
XE
Y
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 7.400/0.291 3.400/0.134 0.400/0.016 2.000/0.079 0.635/0.025
![Page 215: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/215.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SSOP-10 Unit: mm(inch)
3.800(0.150)4.000(0.157)
4.700(0.185)
5.100(0.201)
0.300(0.012)0.450(0.018)
5.800(0.228)
6.200(0.244)
1.350(0.053)
1.550(0.061)
1.000(0.039)
BSC
1.350(0.053)
1.750(0.069)
0.100(0.004)
0.250(0.010)
0.170(0.007)0.250(0.010)
0.400(0.016)1.270(0.050) 0
8
![Page 216: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/216.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SSOP-10
ZG
Y
XE
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 7.400/0.291 3.400/0.134 0.600/0.024 2.000/0.079 1.000/0.039
![Page 217: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/217.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
QFN-5×5-28 Unit: mm(inch)
4.900(0.193)
5.100(0.201)
4.900(0.193)
5.100(0.201)
0.000(0.000)
0.050(0.002)
0.178(0.007)
0.228(0.009)
0.800(0.031)
0.900(0.035)
3.050(0.120)
3.250(0.128)
0.500(0.020)
BSC
3.050(0.120)
3.250(0.128)0.200(0.008)
0.300(0.012)
N28N22
N15
N8
N1Pin 1 Mark
0.450(0.018)
0.650(0.026)
PIN # 1 IDENTIFICATION
See DETAIL A
Pin 1 Options
DETAIL A
2
3
26 2827
1
2
3
26 2827
1
2
3
26 2827
1
![Page 218: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/218.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
QFN-5×5-28
E
Y1
Y2
X1
E
X2
X3
Y3Y
X
Dimensions X=Y
(mm)/(inch)
X1=Y2
(mm)/(inch)
Y1=X2
(mm)/(inch)
X3=Y3
(mm)/(inch)
E
(mm)/(inch)
Value 5.200/0.205 0.300/0.012 0.700/0.028 3.300/0.130 0.500/0.020
![Page 219: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/219.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
QFN-5×5-40 Unit: mm(inch)
J
K
0.4000(0.016)BSC
0.325(0.013)
0.475(0.019)
4.900(0.193)
5.100(0.201)
0.700(0.028)
0.800(0.031)
0.000(0.000)
0.050(0.002)0.150(0.006)
0.250(0.010)
0.203(0.008)
REF
12
Pin 1 Options
DETAIL A
3
40
39
38
123
40
39
38
123
40
39
38
PIN # 1 IDENTIFICATION
See DETAIL A
Pin 1 Mark
N1
N11
N21
N31
N40
4.900(0.193)
5.100(0.201)
.
SymbolJ=K
max(mm)min(mm) min(inch) max(inch)
Option1
Option2
3.400
3.500
3.200
3.300
0.126
0.130
0.134
0.138
Option3 3.600 3.800 0.1500.142
![Page 220: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/220.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
QFN-5×5-40
E
Y1
E
X2
X1
X
Y2Y
X3
Y3
Dimensions X=Y
(mm)/(inch)
X1=Y2
(mm)/(inch)
Y1=X2
(mm)/(inch)
X3=Y3
(mm)/(inch)
E
(mm)/(inch)
Option1 5.400/0.213 0.250/0.010 0.650/0.026 3.500/0.138 0.400/0.016
Option2 5.400/0.213 0.250/0.010 0.650/0.026 3.600/0.142 0.400/0.016
Option3 5.400/0.213 0.250/0.010 0.650/0.026 3.800/0.150 0.400/0.016
![Page 221: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/221.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-95 (Only for AH487) Unit: mm(inch)
1.295(0.051)
1.803(0.071)
0.610(0.024)
MIN
0.360(0.014)
0.510(0.020)
5.105(0.201)
5.359(0.211)
0.330(0.013)
0.432(0.017)
0.950(0.037)
REF
14.000(0.551)
16.000(0.630)
0.381(0.015)
0.581(0.023)
3.531(0.139)
3.785(0.149)
1.220(0.048)
1.620(0.064)
0.850(0.033)
1.150(0.045)
1.700(0.067)
2.000(0.079)
Package Sensor Location
(For Hall IC)
![Page 222: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/222.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-95 Unit: mm(inch)
New Product Changed to TO95 (2013.10)
1.295(0.051)
1.803(0.071)
0.610(0.024)
MIN
0.360(0.014)
0.510(0.020)
5.105(0.201)
5.359(0.211)
0.330(0.013)
0.432(0.017)
0.950(0.037)
REF
14.000(0.551)
16.000(0.630)
0.381(0.015)
0.581(0.023)
3.531(0.139)
3.785(0.149)
1.220(0.048)
1.620(0.064)
![Page 223: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/223.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-95(for AH9281/9282 only) Unit: mm(inch)
1.295(0.051)
1.803(0.071)
0.610(0.024)
MIN
0.360(0.014)
0.510(0.020)
5.105(0.201)
5.359(0.211)
0.330(0.013)
0.432(0.017)
0.950(0.037)
REF
14.000(0.551)
16.000(0.630)
0.381(0.015)
0.581(0.023)
3.531(0.139)
3.785(0.149)
1.220(0.048)
1.620(0.064)
1.150(0.045)
1.350(0.053)
2.250(0.089)
2.450(0.096)
Package Sensor Location
(For Hall IC)
![Page 224: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/224.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-95(for AH9480/9481only) Unit: mm(inch)
1.295(0.051)
1.803(0.071)
0.610(0.024)
MIN
0.360(0.014)
0.510(0.020)
0.330(0.013)
0.432(0.017)
0.950(0.037)
REF
14.000(0.551)
16.000(0.630)
0.381(0.015)
0.581(0.023)
3.531(0.139)
3.785(0.149)
1.220(0.048)
1.620(0.064)
1.000(0.039)
1.200(0.047)
2.200(0.087)
2.400(0.094)
Package Sensor Location
(For Hall IC)
5.105(0.201)
5.359(0.211)
![Page 225: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/225.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TSOT-23-5 Unit: mm(inch)
New Product Changed to TSOT25 (2013.10)
4X7°
5°
2.800(0.110)
3.000(0.118)
1.500(0.059)
1.700(0.067)
2.600(0.102)
3.000(0.118)
0.300(0.012)
0.510(0.020)
1.900(0.075)
TYP
A1
0.250(0.010)
TYP
0.100(0.004)
0.250(0.010)
0.300(0.012)
0.500(0.020)
0.600(0.024)
REF
0.950(0.037)
TYP
R0.100(0.004)
MIN
1 2 3
45
0°
8°
GA
UG
E P
LA
NE
A2
.
SymbolA A1
min(mm) max(mm) max(mm)min(mm)min(inch) min(inch)max(inch) max(inch)
Option1
Option2
0.700
-
0.900
1.000
0.028 0.035
- 0.039
0.800
0.900
0.700
0.840
0.028
0.033
0.031
0.035
A
A2
max(mm)min(mm) min(inch) max(inch)
0.100
0.100
0.000
0.010
0.000
0.000
0.004
0.004
![Page 226: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/226.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
TSOT-23-5
E E
Z
X
Y
Dimensions E
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
Z
(mm)/(inch)
Value 0.950/0.037 0.700/0.028 1.000/0.039 3.199/0.126
![Page 227: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/227.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
CSP-9 (For web) Unit: mm(inch)
0.215(0.008)
0.255(0.010)
0.600(0.024)
0.700(0.028)
0.500(0.020)
1.000(0.039)
1.000(0.039)
0.500(0.020)
0.320(0.013)
TYP
FBC A
1
2
3
TYP
TYP
TYP
TYP
X
Y
Note: X & Y: To determine the exact package size of a particular device, refer to the devicedatasheet.
Pin 1 Mark
![Page 228: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/228.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
CSP-9 Unit: mm(inch)
1.500(0.059)
1.500(0.059)
0.215(0.008)
0.255(0.010)
0.600(0.024)
0.700(0.028)
Pin 1 Mark 0.500(0.020)
1.000(0.039)
1.000(0.039)
0.500(0.020)
0.320(0.013)
TYP
FBC A
1
2
3
TYP
TYP
TYP
TYP
TYP
TYP
![Page 229: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/229.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-92S-3 Unit: mm(inch)
1.270(0.050)
TYP
1.600(0.063)
TYP
2.900(0.114)
3.310(0.130)
3.850(0.152)
4.150(0.163)
44
46
0.750(0.030)
TYP
1.420(0.056)
1.620(0.064)
0.380(0.015)
0.550(0.022)
0.360(0.014)
0.480(0.019)
14.000(0.551)
15.500(0.610)
0.360(0.014)
0.510(0.020)
![Page 230: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/230.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-92S-3 (Only for AH920/AH922/AH922B/AH922C) Unit: mm(inch)
Package Sensor Location
1.270(0.050)
TYP
1.600(0.063)
TYP
0.750(0.030)
TYP
1.420(0.056)
1.620(0.064)
1.200(0.047)
1.500(0.059)
1.850(0.073)
2.150(0.085)
44
46
3.850(0.152)
4.150(0.163)
2.900(0.114)
3.310(0.130)
0.380(0.015)
0.550(0.022)
0.360(0.014)
0.480(0.019)
14.000(0.551)
15.500(0.610)
0.360(0.014)
0.510(0.020)
![Page 231: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/231.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-92S-3(Only for AH41/AH921/AH921A/AH49F/AH49H) Unit: mm(inch)
Package Sensor Location
1.270(0.050)
TYP
1.600(0.063)
TYP
0.750(0.030)
TYP
1.420(0.056)
1.620(0.064)
1.200(0.047)
1.500(0.059)
1.850(0.073)
2.150(0.085)
44
46
3.850(0.152)
4.150(0.163)
2.900(0.114)
3.310(0.130)
0.380(0.015)
0.550(0.022)
0.360(0.014)
0.480(0.019)
14.000(0.551)
15.500(0.610)
0.360(0.014)
0.510(0.020)
![Page 232: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/232.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-92S-3(Only for AH9248 and AH9249) Unit: mm(inch)
1.270(0.050)
TYP
1.600(0.063)
TYP
2.900(0.114)
3.310(0.130)
3.850(0.152)
4.150(0.163)
0.750(0.030)
TYP
1.420(0.056)
1.620(0.064)
0.380(0.015)
0.550(0.022)
1.050(0.041)
1.350(0.053)
1.850(0.073)
2.150(0.085)
Package Sensor Location
0.360(0.014)
0.480(0.019)
44
46
0.360(0.014)
0.510(0.020)
14.000(0.551)
15.500(0.610)
![Page 233: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/233.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-92S-3(Only for AH9247) Unit: mm(inch)
1.270(0.050)
TYP
1.600(0.063)
TYP
2.900(0.114)
3.310(0.130)
3.850(0.152)
4.150(0.163)
0.750(0.030)
TYP
1.420(0.056)
1.620(0.064)
0.380(0.015)
0.550(0.022)
1.050(0.041)
1.350(0.053)
1.850(0.073)
2.150(0.085)
Package Sensor Location
0.360(0.014)
0.480(0.019)
44
46
0.360(0.014)
0.510(0.020)
14.000(0.551)
15.500(0.610)
![Page 234: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/234.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DO-27 Unit: mm(inch)
25.400(1.000) MIN
25.400(1.000) MIN
1.300(0.051)
1.200(0.047)
8.500(0.335)
9.500(0.374)
5.000(0.197)
5.600(0.220)
DIA.
DIA.
Cathode line
by marking
![Page 235: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/235.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DO-27 (A) Unit: mm(inch)
8.500(0.335)
9.500(0.374)
19.500(0.768
20.500(0.807)3.500(0.138)
4.500(0.177)
15.100(0.594)
16.100(0.634)
1.800(0.071)
MIN.
1.500(0.059)
MAX.
5.000(0.197)
5.600(0.220)DIA.
1.300(0.051)
DIA.
1.200(0.047)
Cathode line
by marking
)
![Page 236: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/236.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DO-27 (B) Unit: mm(inch)
8.500(0.335)
9.500(0.374)Cathode line
by marking
5.000(0.197)5.600(0.220)
DIA.
13.500(0.531)
14.500(0.571)
3.500(0.138)
4.500(0.177)19.500(0.768)
20.500(0.807)
1.200(0.047)
1.300(0.051)
DIA.
1.700(0.067)
MIN
![Page 237: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/237.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DO-27 (C) Unit: mm(inch)
8.500(0.335)
9.500(0.374)
19.500(0.768)
20.500(0.807)
6.000(0.236)
7.000(0.276)
5.000(0.197)
5.600(0.220)DIA.
1.300(0.051)
1.200(0.047)
Cathode line
by marking
90°±2°
1.200(0.047)
MAX
![Page 238: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/238.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DO-214AA Unit: mm(inch)
New Product Changed to SMB (2013.10)
1.930(0.076)
2.080(0.082)
Cathode line
by marking
4.250(0.167)
4.750(0.187)
3.480(0.137)
3.730(0.147)
5.260(0.207)
5.460(0.215)
1.990(0.078)
2.610(0.103)
0.900(0.035)
1.410(0.056)
0.000(0.000)0.200(0.008)
0.150(0.006)
0.310(0.012)
![Page 239: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/239.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DO-214AA
G
X1
X
Y
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Value 2.720/0.107 2.072/0.082 1.760/0.069 5.904/0.232
![Page 240: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/240.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DO-214AB Unit: mm(inch)
New Product Changed to SMC (2013.10)
6.600(0.260)
7.110(0.280)
5.590(0.220)
6.220(0.245)
2.900(0.114)
3.200(0.126)
0.760(0.030)
1.520(0.060)
7.750(0.305)
8.130(0.320)
2.006(0.079)
2.620(0.103)
0.203(0.008)
MAX
Cathode line
by marking
![Page 241: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/241.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DO-214AC Unit: mm(inch)
New Product Changed to SMA (2013.10)
3.990(0.157)
4.750(0.187)
2.4
00(0
.094)
2.8
30(0
.11
1)
1.2
50(0
.049)
1.6
50(0
.065)
4.800(0.189)
5.280(0.208)
0.760(0.030)
1.520(0.060)
1.900(0.075)
2.290(0.090)
0.080(0.003)
0.310(0.012)
0.150(0.006)
0.310(0.012)
Cathode line by
marking
![Page 242: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/242.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DO-214AC
G
X
X1
Y
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Value 2.100/0.083 2.000/0.079 1.600/0.063 5.600/0.220
![Page 243: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/243.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOD-123 Unit: mm(inch)
New Product Changed to SOD123 (2013.10)
2.600(0.102)
3.100(0.122)
3.500(0.138)
3.900(0.154)
0.850(0.033)
1.250(0.049)
1.630(0.064)
2.000(0.079)
0.000(0.000)
0.100(0.004)
0.900(0.035)
1.080(0.043)
0.100(0.004)
0.250(0.010)
0.430(0.017)
0.830(0.033)
Cathode line
by marking
Option 1 Option 2
1.100(0.043)
TYP
0.200(0.008)
TYP
0.950(0.037)
1.250(0.049)
0.400(0.016)
0.500(0.020)0.400(0.016)
0.500(0.020)
1.350(0.053)
TYP
![Page 244: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/244.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOD-123
Option 1
X1 G X2
Y1Y2
Y2 Y1
X1 G X2
Option 2
Dimensions G
(mm)/(inch)
X1
(mm)/(inch)
X2
(mm)/(inch)
Y1
(mm)/(inch)
Y2
(mm)/(inch)
Option1 2.100/0.083 1.000/0.039 1.000/0.039 1.400/0.055 1.400/0.055
Option2 1.000/0.039 2.200/0.087 0.900/0.035 1.400/0.055 1.400/0.055
![Page 245: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/245.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
R-1 Unit: mm(inch)
20.000(0.787)
MIN.
20.000(0.787)
MIN.
2.600(0.102)
2.200(0.087)
DIA.
0.500(0. )
0.640(0.025)
DIA.
2.900(0.114)
3.500(0.138)DIA.
Cathode line
by marking
020
![Page 246: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/246.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOIC-24 Unit: mm(inch)
New Product Changed to SO-24 (2013.10)
0.2
04(0
.00
8)
0.3
30(0
.01
3)
0°
8°
7.400(0.291)
7.600(0.299)
15
.20
0(0
.59
8)
15
.60
0(0
.61
4)
1.2
70(0
.05
0)
BS
C
0.330(0.013)
0.510(0.020)
0.400(0.016)
1.270(0.050)
0.050(0.002)
0.300(0.012)
2.350(0.093)
2.800(0.110) 2.100(0.083)
2.650(0.104)
9.800(0.386)
10.610(0.418)
Note: Eject hole, oriented hole and mold mark is optional.
![Page 247: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/247.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOIC-24
E X
Y
G Z
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 11.400/0.449 7.400/0.291 0.600/0.024 2.000/0.079 1.270/0.050
![Page 248: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/248.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-3X3-10 Unit: mm(inch)
2.900(0.114)
3.100(0.122)
2.900(0.114)
3.100(0.122)
1.500(0.059)
1.800(0.071)
0.200(0.008)
0.300(0.012)
0.500(0.020)
TYP
0.250(0.010)
0.550(0.022)
0.000(0.000)
0.050(0.002)
2.300(0.090)
2.500(0.098)
N1N5
N6 N10
Pin 1 Mark
PIN #1 IDENTIFICATION
See DETAIL A
12
DETAIL A
12 12
Pin 1 options
SymbolA
min(mm) max(mm) min(inch) max(inch)
Option 1
Option 2
0.700
0.570
0.800
0.630
0.028
0.022
0.031
0.025
A3
min(mm) max(mm) min(inch) max(inch)
0.153
0.150 (Typ)
0.253 0.006
0.006 (Typ)
0.010
AA3
![Page 249: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/249.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-3X3-10
X1
Y1
X2
Y2 Y
E
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
E
(mm)/(inch)
Value 3.300/0.130 0.300/0.012 0.600/0.024 2.600/0.102 1.800/0.071 0.500/0.020
![Page 250: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/250.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
WDFN-3X3-10 Unit: mm(inch)
N5
N6
Pin 1 Mark
See DETAIL A
N1
N10
1212
DETAIL A
Pin 1 Mark options
2.900(0.114)
3.100(0.122)
2.900(0.114)
3.100(0.122)
2.000(0.079)
REF
2.250(0.089)
2.500(0.098)1.550(0.061)
1.800(0.071)
0.180(0.007)
0.300(0.012)
0.500(0.020)BSC
0.300(0.012)
0.500(0.020)
0.700(0.028)
0.800(0.031)
0.000(0.000)
0.050(0.002)
0.153(0.006)
0.253(0.010)
Pin 1 Mark
![Page 251: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/251.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
WDFN-3×3-10
E
Y
X1
Y2
X2
Y1
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
E
(mm)/(inch)
Value 3.400/0.134 0.300/0.012 0.650/0.026 2.500/0.098 1.800/0.071 0.500/0.020
![Page 252: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/252.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-3X3-6 Unit: mm(inch)
2.950(0.116)
3.050(0.120)
2.950(0.116)
3.050(0.120)
Pin 1 Mark
1.550(0.061)
1.650(0.065)
REF1.900(0.075)
0.950(0.037)
BSC
0.250(0.010)
0.350(0.014)
0.350(0.014)
0.450(0.018)
2.250(0.089)
2.350(0.093)
0.350(0.014)
0.450(0.018)
0.700(0.028)
0.800(0.031)
0.195(0.008)
0.050(0.002)
0.000(0.000)
N1N3
N4 N6
0.211(0.008)
PIN #1 IDENTIFICATIONSee DETAIL A
12 1 12 2
DETAIL A
Pin 1 options
![Page 253: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/253.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-3×3-6
E
Y2 Y
X2
X1
Y1
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
E
(mm)/(inch)
Value 3.400/0.134 0.550/0.022 0.650/0.026 2.500/0.098 1.700/0.067 0.950/0.037
![Page 254: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/254.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-3X3-12 Unit: mm(inch)
2.450(0.096)
2.650(0.104)
0.700(0.028)
0.800(0.031)
2.900(0.114)
3.100(0.122)
N6 N1
N12N7
1.500(0.059)
1.700(0.067)
0.324(0.013)
0.476(0.019)
0.150(0.006)
0.250(0.010)
0.450(0.018)TYP
0.200(0.008) MIN
0.000(0.000)
0.050(0.002)
0.203(0.008)REF
3.100(0.122)
2.900(0.114)
Pin 1 Mark
PIN #1 IDENTIFICATIONSee DETAIL A
12
DETAIL A
Pin 1 options
3 123 123
![Page 255: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/255.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-3X3-12
E
Y2
X1
Y1
Y
X2
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
E
(mm)/(inch)
Value 3.400/0.134 0.250/0.010 0.650/0.026 2.800/0.110 1.700/0.067 0.450/0.018
![Page 256: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/256.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
WDFN-3X3-12 Unit: mm(inch)
2.900(0.114)
3.100(0.122)
2.900(0.114)
3.100(0.122)
0.450(0.018)BSC
0.350(0.014)
0.470(0.019)
0.150(0.006)
0.280(0.011)
1.350(0.053)
1.800(0.071) 2.250(0.089)
2.500(0.098)
N1N6
N12N7
Pin 1 Mark PIN #1
IDENTIFICATION
0.700(0.028)
0.800(0.031)
0.203(0.008)REF
0.000(0.000)
0.050(0.002)
2.250(0.089)REF
TOP VIEW BOTTOM VIEW
SIDE VIEW
2.200(0.087)
0.800(0.031)
1.500(0.059)
0.450(0.018)0.250(0.010)
2.400(0.094)
Recommend Footprint
![Page 257: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/257.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
WDFN-3×3-12
E
Y2
X2
Y
Y1
X1
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
E
(mm)/(inch)
Value 3.400/0.134 0.280/0.011 0.650/0.026 2.500/0.098 1.800/0.071 0.450/0.018
![Page 258: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/258.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
WDFN-2X2-6 Unit: mm(inch)
1.950(0.077)
2.050(0.081)
1.950(0.077)
2.050(0.081)
0.650(0.026)BSC
0.250(0.010)
0.350(0.014)
0.250(0.010)
0.350(0.014)
0.550(0.022)
0.650(0.026)
1.350(0.053)
1.450(0.057)
N1N3
N6N4
Pin 1 Mark PIN #1IDENTIFICATION
0.700(0.028)
0.800(0.031)
0.203(0.008)REF
0.000(0.000)
0.050(0.002)
1.300(0.051)REF
TOP VIEW BOTTOM VIEW
SIDE VIEW
![Page 259: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/259.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
WDFN-2×2-6
E
Y2Y
X2
Y1
X1
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
E
(mm)/(inch)
Value 2.400/0.094 0.400/0.016 0.600/0.024 1.500/0.059 0.700/0.028 0.650/0.026
![Page 260: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/260.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
QFN-4.5X3.5-20 Unit: mm(inch)
N20 N1
N2
N9
N11 N10
N19
N12
BSC
4.500(0.177)
3.500(0.138)
BSC
0.700(0.027)
0.800(0.031)
Pin 1 Mark
1.950(0.077)
2.100(0.083)
0.300(0.012)
0.500(0.020)
2.950(0.116)
0.180(0.007)
0.300(0.012)
0.500(0.020)
BSC
0.000(0.000)
0.050(0.002)
0.200(0.008)
REF
1.500(0.059)
BSC
3.100(0.122)
PIN # 1 IDENTIFICATION
See DETAIL A
12
Pin 1 Options
DETAIL A
3
4
12
3
4
12
3
4
![Page 261: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/261.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
QFN-4.5X3.5-20
E1
Y1
Y2E2
X3
Y3
X2
X1
X
Y
Dimensions X
(mm)/(inch)
Y
(mm)/(inch)
X1=Y2
(mm)/(inch)
Y1=X2
(mm)/(inch)
Value 3.900/0.154 4.900/0.193 0.300/0.012 0.650/0.026
Dimensions X3
(mm)/(inch)
Y3
(mm)/(inch)
E1
(mm)/(inch)
E2
(mm)/(inch)
Value 2.100/0.083 3.100/0.122 1.500/0.059 0.500/0.020
![Page 262: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/262.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
QFN-4X4-16 Unit: mm(inch)
P in 1 Mark
N5
PIN # 1 IDENTIFICATION
N1
N9
N13 N16
3.850(0.152)
4.150(0.163)
3.850(0.152)
4.150(0.163)
1.950(0.077)
REF
0.250(0.010)
0.300(0.012)
0.500(0.020)
0.650(0.026)
BSC
0.350(0.014)
2.250(0.089)
2.650(0.104)
2.250(0.089)
2.650(0.104)
0.700(0.028)
0.800(0.031)
0.000(0.000)
0.050(0.002)
0.153(0.006)
0.253(0.010)
See DETAIL A
1615
1
2
1615
1
2
1615
1
2
Pin 1 Options
DETAIL A
![Page 263: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/263.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
QFN-4X4-16
E
X2
E
X1
Y2
Y1Y
X
X3
Y3
Dimensions X=Y
(mm)/(inch)
X1=Y1
(mm)/(inch)
X2=Y2=E
(mm)/(inch)
X3=Y3
(mm)/(inch)
Value 4.400/0.173 0.400/0.016 0.650/0.026 2.700/0.106
![Page 264: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/264.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
HMSOP-10 Unit: mm(inch)
New Product Changed to MSOP-10EP (2013.10)
3.100(0.122)
2.900(0.114)
3.1
00
(0.1
22)
2.9
00
(0.1
14)
5.1
00
(0.2
01)
4.7
00
(0.1
85)
0.270(0.011)
0.170(0.007) 0.500(0.020)
BSC
MAX.
1.100(0.043)0.150(0.006)
0.000(0.000)
0°6°
0.4
00
(0.0
16)
0.950(0.037)
REF
0.270(0.011)
0.170(0.007)
0.170(0.007)
0.230(0.009)
0.1
30(0
.00
5)
0.2
00(0
.00
8)
0.080(0.003)
0.180(0.007)
0.8
00(0
.03
1)
Note: 1. Eject hole, oriented hole and mold mark is optional.
2. The figure of exposed pad is not restrained as regular rectangle.
2.5
00
(0.1
00)
0.7
50
(0.0
30)
PLATING
BASE METAL
2.500(0.100)
0.750(0.030)
![Page 265: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/265.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
HMSOP-10
X1
Y1 ZG
Y
E X
1
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
X1=Y1
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 5.800/0.228 3.000/0.118 0.300/0.012 2.600/0.102 1.400/0.055 0.500/0.020
![Page 266: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/266.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-2X2-3 Unit: mm(inch)
1.900(0.075)
2.100(0.083)
1.900(0.075)
2.100(0.083)
0.650(0.026)
TYP0.200(0.008)
MIN.
1.220(0.048)
1.420(0.056)
0.780(0.031)
0.980(0.039)
0.300(0.012)
0.500(0.020)
0.700(0.028)
0.800(0.031)
0.180(0.007)
0.300(0.012)
0.203(0.008)
REF0.000(0.000)
0.050(0.002)
N3
N2 N1
Pin 1 Mark
![Page 267: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/267.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-2X2-3
X1
Y2
X2
Y1
Y
E
Y3
X3
Dimensions Y
(mm)/(inch)
X1=X3
(mm)/(inch)
Y1
(mm)/(inch)
X2
(mm)/(inch)
Value 2.200/0.087 0.400/0.016 0.300/0.012 1.600/0.063
Dimensions Y2
(mm)/(inch)
Y3
(mm)/(inch)
E
(mm)/(inch) ---
Value 1.100/0.043 0.600/0.024 1.300/0.051 ---
![Page 268: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/268.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-2X2-3 ( Only for AH9248/AH9249) Unit: mm(inch)
1.900(0.075)
2.100(0.083)
1.900(0.075)
2.100(0.083)
Package Sensor Location
(For Hall IC)
0.850(0.033)
1.150(0.045)0.990(0.039)
1.290(0.051)
0.650(0.026)
TYP0.200(0.008)
MIN.
1.220(0.048)
1.420(0.056)
0.780(0.031)
0.980(0.039)
0.300(0.012)
0.500(0.020)
N3
N2 N1
Pin 1 Mark
0.700(0.028)
0.800(0.031)
0.180(0.007)
0.300(0.012)
0.203(0.008)
REF0.000(0.000)
0.050(0.002)
Die
0.220(0.009)
0.320(0.013)
![Page 269: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/269.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-2X2-3 (Only for AH9247) Unit: mm(inch)
1.900(0.075)
2.100(0.083)
1.900(0.075)
2.100(0.083)
Package Sensor Location
1.000(0.039)
1.200(0.047)
0.750(0.030)
0.950(0.037)
0.650(0.026)
TYP0.200(0.008)
MIN.
1.220(0.048)
1.420(0.056)
0.780(0.031)
0.980(0.039)
0.300(0.012)
0.500(0.020)
N3
N2 N1
Pin 1 Mark
0.700(0.028)
0.800(0.031)
0.180(0.007)
0.300(0.012)
0.203(0.008)
REF0.000(0.000)
0.050(0.002)
0.220(0.009)
0.320(0.013)
Die
![Page 270: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/270.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-4X3-12 Unit: mm(inch)
3.900(0.154)
4.100(0.161)2.9
00(0
.11
4)
3.1
00(0
.12
2)
0.330(0.013)
0.430(0. 017)
0.450(0.018)
0.550(0.022)0.200(0.008)
MIN.
1.6
50(0
.06
5)
1.7
50(0
.06
9)
3.250(0.128)
3.350(0.132)
0.200(0.008)
0.300(0.012)
Pin 1 Mark
0.700(0.028)
0.800(0.031)
0.000(0.000)
0.050(0.002)0.200(0.008)
REF
N1N6
N7 N12
Bottom View
Exposed Pad
PIN #1 IDENTIFICATIONSee DETAIL A
12
DETAIL A
Pin 1 options
3 123 123
![Page 271: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/271.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-4X3-12
E
YY2
Y1
X2
X1
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
E
(mm)/(inch)
Value 3.400/0.134 0.300/0.012 0.600/0.024 3.500/0.138 1.800/0.071 0.500/0.020
![Page 272: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/272.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
PDFN-5X6-8 Unit: mm(inch)
New Product Changed to POWERDI5060-8 (2013.10)
1.20±0.10
4.700(0.185)
5.100(0.201)1.000(0.039)
1.200(0.047)
5.600(0.220)
6.000(0.236)
0.100(0.004)
MAX
E
0.900(0.035)
1.100(0.043)
0.510(0.020)
0.710(0.028)
0.510(0.020)
0.710(0.028)
1.170(0.046)
1.370(0.054)
3.820(0.150)4.020(0.158)
0.510(0.020)
MIN
0.330(0.013)0.510(0.020)
0.210(0.008)
0.340(0.013)
812
0.060(0.002)
0.200(0.008)
Symbolmin(mm) max(mm) min(inch) max(inch)
Option 1
Option 2 5.150(BSC)
5.100
0.203(BSC)
0.201
DEPTH 0.05+0-0.05 3.180(0.125)
3.540(0.139)
D
3.700(0.146)
4.100(0.161)
3.280(0.129)
3.680(0.145)
1.000(0.039)
1.400(0.055)
D
min(mm) max(mm) min(inch) max(inch)
5.900
6.150(BSC)
6.100 0.232
0.242(BSC)
0.240
E
Option 1
Pin 1 Mark
Option 1
Option 2
-- --
![Page 273: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/273.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
PDFN-5X6-8
X
Y2
X1
Y1
Y
Y3
E
E
Dimensions X
(mm)/(inch)
Y
(mm)/(inch)
X1
(mm)/(inch)
Y1=E
(mm)/(inch)
Value 5.700/0.224 6.600/0.260 0.610/0.024 1.270/0.050
Dimensions Y2
(mm)/(inch)
Y3
(mm)/(inch) – –
Value 3.800/0.150 0.710/0.028 – –
![Page 274: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/274.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
PDFN-5X6-8 (2) Unit: mm(inch)
1.20±0.10
4.800(0.189)
5.000(0.197)
5.100(0.201)
MAX
1.000(0.039)
1.200(0.047)
5.700(0.224)
5.800(0.228)
0.100(0.004)
MAX
5.900(0.232)
6.100(0.240)
1.000(0.039)
1.200(0.047)
0.510(0.020)
0.710(0.028)
0.510(0.020)
0.710(0.028)
1.170(0.046)
1.370(0.054)
E2
1.100(0.043)
MIN
0.350(0.014)0.450(0.018)
0.210(0.008)
0.340(0.013)
812
0.060(0.002)
0.200(0.008)
SymbolD2
min(mm) max(mm) min(inch) max(inch)
Option 1
Option 2
3.820
3.820
4.020
4.020
0.150
0.150
0.158
0.158
DEPTH 0.05+0.05-0.05
D2
E2
min(mm) max(mm) min(inch) max(inch)
3.340
3.180
3.540
3.380
0.131
0.125
0.139
0.133
Option 3 3.910 4.110 0.154 0.162 3.340 3.540 0.131 0.139
![Page 275: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/275.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOIC-28 Unit: mm(inch)
New Product Changed to SO-28 (2013.10)
0°
17.700(0.697)
18.100(0.713)
10
.21
0(0
.40
2)
10
.61
0(0
.41
8)
7.4
00(0
.29
1)
7.7
00(0
.30
3)
1.270(0.050)
BSC
0.330(0.013)
0.510(0.020)
2.350(0.093)
2.650(0.104)
2.290(0.090)
2.500(0.098)
0.100(0.004)
0.300(0.012)
0.400(0.016)
1.270(0.050)
0.204(0.008)
0.330(0.013)
8°
Note: Eject hole, oriented hole and mold mark is optional.
![Page 276: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/276.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOIC-28
E X
Y
G Z
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 11.400/0.449 7.400/0.291 0.600/0.024 2.000/0.079 1.270/0.050
![Page 277: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/277.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
SOIC-32 Unit: mm(inch)
New Product Changed to SO-32 (2013.10)
1.270(0.050)
TYP
20.880(0.822)
21.080(0.830)
7.400(0.291)
7.600(0.299)
0.300(0.012)
0.500(0.020)
19.050(0.750)
REF
2.540(0.100)
MAX
8.700(0.343)
9.100(0.358)
0.100(0.004)
0.200(0.008)
10.200(0.402)
10.600(0.417)
0.550(0.022)0.950(0.037)
0.550(0.022)
0.950(0.037)
0.200(0.008)
0.300(0.012)
"A"
0.350(0.014)
0.550(0.022)
0.950(0.037)
Note: Eject hole, oriented hole and mold mark is optional.
Details of "A"
![Page 278: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/278.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
SOIC-32
E X
Y
G
Z
Dimensions Z
(mm)/(inch)
G
(mm)/(inch)
X
(mm)/(inch)
Y
(mm)/(inch)
E
(mm)/(inch)
Value 11.400/0.449 7.400/0.291 0.600/0.024 2.000/0.079 1.270/0.050
![Page 279: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/279.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-1.5x2-6 Unit: mm(inch)
1.424(0.056)
1.576(0.062)
1.9
24(0
.07
6)
2.0
76(0
.08
2)
0.500(0.020)
TYP.
0.200(0.008)
MIN.
0.174(0.007)
0.326(0.013)
0.8
00(0
.03
1)
1.0
00(0
.03
9)
1.000(0.039)
1.200(0.047)
0.200(0.008)
0.300(0.012)
Pin 1 Mark
0.350(0.014)
0.450(0.018)
0.127(0.005)
REF
0.000(0.000)
0.050(0.002)
N1N3
N4 N6
1
DETAIL A
Pin 1 options
2
PIN #1 IDENTIFICATION
See DETAIL A
12 12
![Page 280: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/280.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-1.5x2-6
E
YY1
X1
Y2
X2
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
X2
(mm)/(inch)
Y2=E
(mm)/(inch)
Value 2.400/0.094 1.400/0.055 1.000/0.039 0.300/0.012 0.500/0.020
![Page 281: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/281.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DO-27(L) Unit: mm(inch)
8.500(0.335)
9.500(0.374)
19.500(0.768)
20.500(0.807)
6.000(0.236)
7.000(0.276)
5.000(0.197)
5.600(0.220)DIA.
1.300(0.051)
1.200(0.047)
Cathode line
by marking
![Page 282: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/282.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
CSP-4 (P 0.4) Unit: mm(inch)
Pin 1 Mark
0.400(0.016)
TYP.
0.4
00(0
.016)
TY
P.
F0.270(0.011)
TYP.B A
1
2
0.550(0.022)
0.650(0.026)
0.180(0.007)
0.220(0.009)
Note : X & Y : To determine the exact package size of a particular device, refer to the device datasheet.
X
Y
![Page 283: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/283.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
CSP-4 (P 0.5) Unit: mm(inch)
0.500(0.020)
TYP.
0.5
00(0
.020)
TY
P.
F0.320(0.013)
TYP.
Pin 1 Mark
0.600(0.024)
0.700(0.028)0.215(0.008)
0.255(0.010)
B A
1
2
Y
X
Note : X & Y : To determine the exact package size of a particular device, refer to the device datasheet.
![Page 284: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/284.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
CSP-4 (P 0.4)(Only for AP2121) Unit: mm(inch)
0.960(0.038)
1.060(0.042)
Pin 1 Mark
0.9
40(0
.037)
1.0
40(0
.041)
0.400(0.016)
TYP.
0.4
00(0
.016)
TY
P.
F0.270(0.011)
TYP.B A
1
2
0.550(0.022)
0.650(0.026)
0.180(0.007)
0.220(0.009)
![Page 285: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/285.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
CSP-4 (P 0.5)(Only for AP2121) Unit: mm(inch)
0.960(0.038)
1.060(0.042)
0.9
40(0
.03
7)
1.0
40(0
.04
1)
0.500(0.020)
TYP.
0.5
00(0
.020)
TY
P.
F0.320(0.013)
TYP.
Pin 1 Mark
0.600(0.024)
0.700(0.028)0.215(0.008)
0.255(0.010)
B A
1
2
![Page 286: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/286.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-2x2-6 (1) Unit: mm(inch)
New Product Changed to U-DFN2020-6 (2013.10)
1.900(0.075)
2.100(0.083)
0.650(0.026)
TYP.
0.200(0.008)
MIN.
0.224(0.009)
0.376(0.015)
0.850(0.033)
1.050(0.041)
0.000(0.000)
0.050(0.002)
0.152(0.006)
REF.0.550(0.022)
0.650(0.026)
0.250(0.010)
0.350(0.014)
Pin 1 Mark
1.500(0.059)
1.700(0.067)
N1N2N3
N4 N5 N6
1.900(0.075)
2.100(0.083)
PIN #1 IDENTIFICATION
See DETAIL A
DETAIL A
Pin 1 options
1211 22
![Page 287: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/287.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mounting Pad Layout
DFN-2x2-6 (1)
E
Y2
Y1
Y
X1
X2
Dimensions Y
(mm)/(inch)
X1
(mm)/(inch)
Y1
(mm)/(inch)
X2
(mm)/(inch)
Y2
(mm)/(inch)
E
(mm)/(inch)
Value 2.400/0.094 0.400/0.016 0.525/0.021 1.800/0.071 1.050/0.041 0.650/0.026
![Page 288: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/288.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
DFN-2x2-6 (1) (Only for AH9482/AH9483) Unit: mm(inch)
1.900(0.075)2.100(0.083)
0.650(0.026)TYP.
0.200(0.008)MIN.
0.224(0.009)0.376(0.015)
0.850(0.033)1.050(0.041)
0.000(0.000)0.050(0.002)
0.152(0.006)REF.
0.550(0.022)0.650(0.026)
0.250(0.010)0.350(0.014)
Pin 1 Mark
1.500(0.059)1.700(0.067)
N1N2N3
N4 N5 N6
1.900(0.075)2.100(0.083)
PIN # 1 IDENTIFICATION
See DETAIL A
DETAIL A
Pin 1 options
1211 22
Hall Sensor
Location
0.830(0.033)1.030(0.041)
0.580(0.023)0.780(0.031)
![Page 289: Packaging Information - Diodes Incorporated...New Product Changed to PDIP-16 (2013.10) 5e 6e 4e 7.320(0.288) 7.920(0.312) 0.700(0.028) 8.200(0.323) 9.400(0.370) 0.204(0.008) 0.360(0.014)](https://reader034.fdocuments.in/reader034/viewer/2022052617/60af2e580d5f9c28e30d788c/html5/thumbnails/289.jpg)
Packaging Information
Dec. 2014 BCD Semiconductor Manufacturing Limited
Mechanical Dimensions
TO-3P Unit: mm(inch)
New Product Changed to TO3P (2013.10)
15.450 (0.608)
15.850 (0.624)
13.400 (0.528)
13.800 (0.543)
9.400 (0.370)
9.800 (0.386)5.000 (0.197)
REF
13
.70
0 (
0.5
39)
14
.10
0 (
0.5
55)
20
.30
0 (
0.7
99
)
20
.60
0 (
0.8
11
)
23
.20
0 (
0.9
13
)
23
.60
0 (
0.9
29
)
1.450 (0.057)
1.650 (0.065)
4.600 (0.181)
5.000 (0.197)
3.2
00
(0.1
26)
RE
F
3.300 (0.130)
REF
13
.45
0 (
0.5
30
)
RE
F
39
.90
0 (
1.5
71
)
40
.30
0(1
.58
7)
1.800 (0.071)
2.200 (0.087)
2.800 (0.110)
3.200 (0.126)
5.450 (0.215)
TYP
0.800 (0.031)
1.200 (0.047)
1.200 (0.047)
1.600 (0.063)
6.900 (0.272)
7.100 (0.280)
5.1
50
(0
.20
3)
5.5
50
(0
.21
9)
0.000 (0.000)
0.300 (0.012)
0.500 (0.020)
0.700 (0.028)