Package Dimensions for ESD -, Zener -, Small Signal ...
38
Package Information www.vishay.com Vishay Semiconductors Rev. 1.2, 03-Mar-2020 1 Document Number: 80128 For technical questions within your region: [email protected] , [email protected] , [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Package Dimensions for ESD -, Zener -, Small Signal Switching -, and Schottky Diodes PACKAGE PAGE CLP0603-2L 3 CLP1006-2L 4 CLP1406-2L 5 CLP1608-2L 6 CLP0603-2M 7 CLP1007-5L 8 DFN1006-2A 9 DFN1110-3A 10 LLP1006-2L 11 LLP1006-2M 12 MM YY XX MM YY XX MM YY XXX X MM YY Type 1 LLP1006-3L 13 LLP1010-5L 14 LLP1010-6M 15 LLP1713-7L 16 LLP1713-9L 17 LLP2513-13L 18 LLP3313-17L 19 LLP75-4L 20 LLP75-6L 21 LLP75-7L 22 PACKAGE PAGE 1 1 1
Transcript of Package Dimensions for ESD -, Zener -, Small Signal ...
Package Informationwww.vishay.com Vishay Semiconductors
Rev. 1.2, 03-Mar-2020 1 Document Number: 80128For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Package Dimensions for ESD -, Zener -, Small Signal Switching -, and Schottky Diodes
PACKAGE PAGE
CLP0603-2L 3
CLP1006-2L 4
CLP1406-2L 5
CLP1608-2L 6
CLP0603-2M 7
CLP1007-5L 8
DFN1006-2A 9
DFN1110-3A 10
LLP1006-2L 11
LLP1006-2M 12
MMYYXX
MMYYXX
MMYYXXX
X
MM
YYType
1
LLP1006-3L 13
LLP1010-5L 14
LLP1010-6M 15
LLP1713-7L 16
LLP1713-9L 17
LLP2513-13L 18
LLP3313-17L 19
LLP75-4L 20
LLP75-6L 21
LLP75-7L 22
PACKAGE PAGE
1
1
1
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SOD-123 23
SOD-323 24
SOD-523 25
SOT-23 26
SOT-323 27
SOT-363 28
SMF (DO-219AB) 29
SMA (DO-214AC) 30
MELF DO-213AB (Plastic) 31
MELF DO-213AB (Glass) 32
MicroMELF 33
PACKAGE PAGE
1
MicroSMF (DO-219-AC)
34
MiniMELF (SOD-80)
35
QuadroMELF (SOD-80)
36
DO-35 (DO-204AH)
37
DO-35_2 37
DO-41 (DO-204AL) (glass)
37
SOD-57 38
SOD-64 38
PACKAGE PAGE
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Rev. 1.2, 03-Mar-2020 3 Document Number: 80128For technical questions within your region: [email protected], [email protected], [email protected]
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CLP0603-2L PACKAGE DIMENSIONS in millimeters (inches)
< back
0.25 9.84
0.40 15.75
0.12 0.15
0.54
0.14
0.24
0.14
0.18 4.72 5.91 7.09
0.57 0.60 0.63 22.44 23.62 24.80
0.27 0.30 0.33 10.62 11.81 12.99
0.22 0.25 0.28 8.66 9.84 11.02
0.24 0.27 0.28 9.54 10.63 11.02
0.01 0.01 0.02 0.39 0.39 0.79
0.25 0.28 0.30 9.84 11.02 11.81
L e1
e
E
bA
A2
A2
b
D
E
e
L
e1
D
A1
A1
A
min.
mm mils
nom. max. min. nom. max.
Package Informationwww.vishay.com Vishay Semiconductors
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CLP1006-2L PACKAGE DIMENSIONS in millimeters (inches)
< back
min. max.
0.25 0.29
0.48 0.53
0.02
0.59 0.63
0.99 1.03
0.23 0.28
0.65
0.23
0.89
0.240.24
0.49
0.49
0.28
L2 L3
D
A1
A
e
E
bb
e
b
D
E
L2
L3
A1
A
Package Informationwww.vishay.com Vishay Semiconductors
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CLP1406-2L PACKAGE DIMENSIONS in millimeters (inches)
< back
foot print recommendation:
Created - Date: 22. Jan. 2016Document no.:S8-V-3906.04-045 (4)
L2 L3
e
E
bA
D
A1
1.29
0.77
0.25
0.48
0.48
min. max.
0.25 0.29
0.46 0.50
0.02
0.59 0.63
1.39 1.43
0.23 0.27
0.77
0.75 0.79
e
b
D
E
L2
L3
A1
A
Package Informationwww.vishay.com Vishay Semiconductors
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CLP1608-2L PACKAGE DIMENSIONS in millimeters (inches)
< back
foot print recommendation:
Created - Date: 10. Feb. 2014
Document no.:S8-V-3906.04-033 (4)
Rev.4 - Date: 02. July. 2019
0.29
0.28
1.47
0.88
0.62
0.02
0.25
0.65
0.58
0.85
0.75
0.93
0.85
0.33
0.25
1.65
1.55
1.52
1.42mm
min.
max.
L3
L3L2Lb
L/2
A A1L2
L
bA
E
A1
K
D
D E
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CLP0603-2M PACKAGE DIMENSIONS in millimeters (inches)
< back
min. max.
0.25 0.29
0.19 0.24
0.02
0.17 0.22
0.29
0.59
0.33
0.63
0.10 0.15
0.40
0.10
0.5
0.120.12
0.19
0.21
0.15
L2 L3
D
A1
A
e
E
b3
b2
e
b2
b3
D
E
L2
L3
A1
A
Package Informationwww.vishay.com Vishay Semiconductors
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CLP1007-5L PACKAGE DIMENSIONS in millimeters
< back
foot print recommendation:
Document no.: S8-V-3906.04-041 (4)
E
L
D
A
A1
TypeMM
YY
Millimeters
A
A1
b
D
E
Radius
L
min. max.
0.25
0.68
0.98
0.23
0.29
0.17
0.73
1.03
0.075
d 0.03
0.35
0.35
0.155
0.855
0.7
0.25
0.27
- 0.02
0.13
e 0.35
e
4 5
eb
d12
3
Created - Date: 11-Aug- 2015
Rev. 1 - Date: 30-Jul-2019
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Rev. 1.2, 03-Mar-2020 9 Document Number: 80128For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
DFN1006-2A PACKAGE DIMENSIONS in millimeters (inches)
< back
foot print recommendation:
Document no.:S8-V-3906.04-059 (4)
Created - Date: 11.July.2018
0.3 [0.012]
1.4 [0.055]
0.3
[0.0
12]
0.55
[0.0
22]
0.4 [0.016]
0.95 [0.037]
0.4
[0.0
16]
max
.0.0
5 [0
.002
]
min
.0.1
[0.0
04]
0.55 [0.022]
Orientation Identification
0.5
[0.0
20]
1.05 [0.041]
0.65 [0.026]
Rev.1 - Date: 15.January.2019
0.45
[0.0
18]
0.175 [0.007]
0.3
[0.0
12]
0.4 [0.016]
0.275 [0.011]
0.2
[0.0
08]
0.55
[0.0
22]
Package Informationwww.vishay.com Vishay Semiconductors
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DFN1110-3A PACKAGE DIMENSIONS in millimeters (inches)
< back
Created - Date: 04-Apr-2019
Package name: DFN1110-3A
Document no.: S8-V-3906.04-062 (4)
foot print recommendation:
1.1 ±0.05
1±
0.05
0.25 ±0.05
0.8 ±0.05
0.25 ±0.05
0.65 Ref.
0.4 ±0.05
0.26
±0.
050.
5±
0.05
0.35 Ref.
0.04 Ref. (0.07 max.)
0.06
Ref
.
0.45
±0.
050.
4±
0.05
min
. 0.1
0.46
0.4
0.35 0.8
0.65
0.71.4
0.34
PIN1
PIN1
Package Informationwww.vishay.com Vishay Semiconductors
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
LLP1006-2L PACKAGE DIMENSIONS in millimeters (inches)
< back
0.3 [0.012]0.2 [0.008]
0.45 [0.018]0.35 [0.014]
0.65 [0.026]0.55 [0.022]
1.05 [0.041]0.95 [0.037]
Foot print recommendation:
1 [0.039]
Solder resist mask
Solder pad
Document no.: S8-V-3906.04-005 (4)Created - Date: 13.July.2007Rev. 7 - Date: 11.May 201620812
0.05 [0.002] 0.5 [0.020]
0.55
[0.0
22]
0.45
[0.0
18]
0.4
[0.0
16]
0.33
[0.0
13]
0.6
[0.0
24]
0.5
[0.0
20]
0.25
[0.0
10]
0.15
[0.0
06]
0.05
[0.0
02]
0 [0
.000
]
0.2
[0.0
08]
0.12
5 [0
.005
] ref
.
Orientation identification
0.25 [0.010]
Pad Design Patented: US 9.018.537 B2)P(
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
LLP1006-2M PACKAGE DIMENSIONS in millimeters (inches)
< back
0.3 [0.012]0.2 [0.008]
0.45 [0.018]0.35 [0.014]
0.65 [0.026]0.55 [0.022]
1.05 [0.041]0.95 [0.037]
Foot print recommendation:
1 [0.039]
Solder resist mask
Solder pad
Document no.: S8-V-3906.04-005 (4)Created - Date: 15.Jun 2009Rev. 7 - Date: 11.May 201620812
0.05 [0.002]0.5 [0.020]
0.55
[0.0
22]
0.45
[0.0
18]
0.4
[0.0
16]
0.33
[0.0
13]
0.6
[0.0
24]
0.5
[0.0
20]
0.25
[0.0
10]
0.15
[0.0
06]
0.05
[0.0
02]
0 [0
.000
]
0.2
[0.0
08]
0.12
5 [0
.005
] ref
.
Orientation identification
0.25 [0.010]
Pad Design Patented: US 9.018.537 B2)P(
Package Informationwww.vishay.com Vishay Semiconductors
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LLP1006-3L PACKAGE DIMENSIONS in millimeters (inches)
< back
Foot print recommendation:
Document no.:S8-V-3906.04-044 (4)
Created - Date: 03. Sep. 2015
A
A1
E
L
e
D
A B
Millimeters
Min. Max.
0.95D 1.05
0.55 0.65
0.33 0.40
0
0.2
0.6
0.05
0.20 0.30
E
A
A1
b
L
e
0.3
0.3
0.6
0.7
b
0.2
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LLP1010-5L PACKAGE DIMENSIONS in millimeters (inches)
< back
Solderresist mask
Solder pad
0.12
5 (0
.005
) re
f.
0.03
(0.
001)
0 (0
.000
)
Pin 1 marking
0.4
(0.0
16)
0.33
(0.
013)
0.5
(0.0
20)
Bsc
0.2 (0.008) exp. DAP
0.28
(0.
011)
0.22
(0.
009) 0.65
(0.
026)
exp
. DA
P
0.25 (0.010)
0.15 (0.006)
1.05 (0.041)
0.95 (0.037)
1.05
(0.
041)
0.95
(0.
037)
0.25
(0.
010)
0.5
(0.0
20)
0.65
(0.
026)
0.2 (0.008)
0.15 (0.006)
0.35 (0.014)
0.2 (0.008)
Foot print recommendation:
Document no.:S8-V-3906.04-007 (4)
Created - Date: 15. April. 2008
Rev. 3 - Date: 11. May. 2016
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LLP1010-6M PACKAGE DIMENSIONS in millimeters
< back
Solderresist mask
Solder pad
0.12
5 (0
.005
) re
f.
0.03
(0.
001)
0 (0
.000
)
Pin 1 marking
0.4
(0.0
16)
0.33
(0.
013)
0.35
(0.
014)
Bsc
0.7
(0.0
28)
Ref
.
0.22 (0.009) Exp. DAP
0.2
(0.0
08)
0.1
(0.0
04) 0.
5 (0
.020
) E
xp. D
AP
0.25 (0.010)
0.15 (0.006)
1.05 (0.041)
0.95 (0.037)
1.05
(0.
041)
0.95
(0.
037)
0.05
(0.
002)
0.17
5 (0
.007
)
0.35
(0.
014)
0.7
(0.0
28)
0.35 (0.014)
0.3 (0.012)
0.22 (0.009)
0.5
(0.0
20)
Foot print recommendation:
Document no.:S8-V-3906.04-004 (4)
Rev. 5 - Date: 11.May 2016
Created - Date: 17.July 2007
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Rev. 1.2, 03-Mar-2020 16 Document Number: 80128For technical questions within your region: [email protected], [email protected], [email protected]
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LLP1713-7L PACKAGE DIMENSIONS in millimeters (inches)
< back
Created - Date: 15. April 2008Document no.:S8-V-3906.04-008 (4)
Rev. 3 - Date: 10.Okt.2019
PIN 1 marking
0.05
[0.0
02]
0 [0
.000
]
0.15
2 [0
.006
] Ref
.
1 [0.039] Ref.
0.5 [0.020] Bsc
0.28 [0.011]
0.22 [0.009]
1.4 [0.055]
1.3 [0.051]
0.6
[0.0
24]
0.5
[0.0
20]
1.75 [0.069]1.65 [0.065]
0.25
[0.0
10]
0.19
[0.0
07]
0.4
[0.0
16]
foot print recommendation:
solderresist mask
solder pad
0.5 [0.020] 0.25 [0.010]
1 [0.039]
0.15
[0.0
06]
0.37
[0.0
15]
0.22
[0.0
09]
0.4
[0.0
16]
1.65
1 [0
.065
]
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LLP1713-9L PACKAGE DIMENSIONS in millimeters (inches)
< back
Foot print recommendation:
Created - Date: 28. August 2006
Document no.:S8-V-3906.04-001 (4)
1.75 (0.069)1.65 (0.065)
Pin 1 marking
0.05
(0.
002)
0 (0
.000
)
0.15
2 (0
.006
) re
f.
1.2 (0.047) ref.
0.3
(0.0
12)
0.24
(0.
009)
0.4 (0.016) bsc0.23 (0.009)0.17 (0.007)
1.05 (0.041)
1.4 (0.055)
1.3 (0.051)
0.6
(0.0
24)
0.5
(0.0
20)
0.45
(0.
018)
0.35
(0.
014)
exp.
DA
P0.2
(0.0
08)
x 45
°
Solderresist mask
Solder pad
0.4 (0.016) 0.2 (0.008)
3 x 0.4 = 1.2 (0.047)
1 (0.039)
0.4
(0.0
16)
0.15
(0.
006)
0.4
(0.0
16)
0.42
(0.
017)
Rev. 1 - Date: 27. May 2008
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
LLP2513-13L PACKAGE DIMENSIONS in millimeters (inches)
< back
Foot print recommendation:
Pin 1 marking
0.05
(0.
002)
0 (0
.000
) 0.15
2 (0
.006
) re
f.
2 (0.079) ref.
0.3
(0.0
12)
0.24
(0.
009)
0.4 (0.016) bsc0.23 (0.009)0.17 (0.007)
2.55 (0.100)2.45 (0.096)
1.4 (0.055)
1.3 (0.051)
0.6
(0.0
24)
0.5
(0.0
20)
0.45
(0.
018)
0.35
(0.
014)
Exp
. DA
P
Solderresist mask
Solder pad
0.4 (0.016) 0.2 (0.008)
5 x 0. 4 = 2 (0.079)
1.8 (0.071)
0.4
(0.0
16)
0.15
(0.
006)
0.4
(0.0
16)
0.2
(0.0
08)
x 45
°
1.85 (0.073)
1.75 (0.069) exp. DAP
0.42
(0.
017)
Document no.:S8-V-3906.04-002 (4)Created - Date: 28. August 2006Rev. 1 - Date: 27. May 2008
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LLP3313-17L PACKAGE DIMENSIONS in millimeters (inches)
< back
Document no.:S8-V-3906.04-003 (4)
3.35 (0.132)3.25 (0.128)
Pin 1 marking
0.05
(0.
002)
0 (0
.000
)
0.15
2 (0
.006
) re
f.
2.8 (0.110) ref.
0.3
(0.0
12)
0.24
(0.
009)
0.4 (0.016) bsc 0.23 (0.009)
0.17 (0.007)
2.65 (0.104)
2.55 (0.100) exp. DAP
0.6
(0.0
24)
0.5
(0.0
20)
1.4 (0.055)
1.3 (0.051)
0.45
(0.
018)
0.35
(0.
014)
exp.
DA
P
Solderresist mask
Solder pad
0.4 (0.016) 0.2 (0.008)
7 x 0.4 = 2.8 (0.110)
2.6 (0.102)
0.4
(0.0
16)
0.15
(0.
006)
0.4
(0.0
16)
0.2
(0.0
08)
x 45
°
0.42
(0.
017)
Created - Date: 28. August 2006
Rev. 1 - Date: 27. May 2008
Foot print recommendation:
Package Informationwww.vishay.com Vishay Semiconductors
Rev. 1.2, 03-Mar-2020 20 Document Number: 80128For technical questions within your region: [email protected], [email protected], [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENTARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
LLP75-4L PACKAGE DIMENSIONS in millimeters (inches)
< back
0.15
(0.
006)
1.55 (0.061)1.65 (0.065)
1.55
(0.
061)
1.65
(0.
065)
1.05
(0.
041)
0.95
(0.
037)
0.3
(0.0
12)
0.2
(0.0
08)
Pin 1 marking
0.05
(0.
002)
0 (0
.000
)
0.25
(0.
010)
0.3 (0.012)
1 (0
.039
)
0.5 (0.020) 0.5 (0.020)
0.15 (0.006)
0.3 (0.012)
0.15 (0.006)
Solderresist mask
Solder pad
0.6
(0.0
24)
0.5
(0.0
20)
0.3 (0.012)
0.2 (0.008)
0.55 (0.022)
0.45 (0.018)
0.5 (0.020)
Document no.:S8-V-3906.02-015 (4)
Foot print recommendation:
Rev. 2 - Date: 09. Sep. 2008
Created - Date: 04. September 2007
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LLP75-6L PACKAGE DIMENSIONS in millimeters (inches)
< back
1.05
(0.
041)
0.5 (0.020)
0.95
(0.
037)
Heat sink
0.3
(0.0
12)
0.2
(0.0
08)
0.3
(0.0
12)
0.2
(0.0
08)
0.3
(0.0
12)
0.2
(0.0
08)
0.55
(0.
022)
0.45
(0.
018)
0.6 (0.024)
0.25 (0.010)
0.05
(0.
002)
0 (0
.000
)
0.15
(0.
006)
0.60
(0.
023)
0.54
(0.
021)
1.65 (0.065)
1.55 (0.061)
1.65
(0.
065)
1.55
(0.
061)
Pin 1 marking
0.5 (0.020) 0.5 (0.020)
0.3 (0.012) 0.3 (0.012)
0.15 (0.006) 0.15 (0.006)
0.5 (0.020)
0.5
(0.0
20)
1 (0
.039
)
0.25
(0.
010)
Solder resist mask
Solder padDocument no.:S8-V-3906.02-010 (4)
Rev. 4 - Date: 21. March 2006
Created - Date: 04. May 2005
Foot print recommendation:
1 (0
.039
)
1 (0
.039
)
Package Informationwww.vishay.com Vishay Semiconductors
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LLP75-7L PACKAGE DIMENSIONS in millimeters (inches)
< back
1.05
(0.
041)
0.5 (0.020)
0.95
(0.
037)
Heat sink
0.3
(0.0
12)
0.2
(0.0
08)
0.3
(0.0
12)
0.2
(0.0
08)
0.3
(0.0
12)
0.2
(0.0
08)
0.55
(0.
022)
0.45
(0.
018)
0.6 (0.024)
0.25 (0.010)
0.6
(0.0
24)
0.54
(0.
021)
0.05
(0.
002)
0 (0
.000
)
0.15
(0.
006)
1.65 (0.065)
1.55 (0.061)
1.65
(0.
065)
1.55
(0.
061)
Pin 1 marking
0.5 (0.020) 0.5 (0.020)
0.3 (0.012) 0.3 (0.012)
0.15 (0.006) 0.15 (0.006)
0.5 (0.020)
0.5
(0.0
20)
1 (0
.039
)
0.25
(0.
010)
Solder resist mask
Solder padDocument no.:S8-V-3906.02-014 (4)
Created - Date: 04. April 2006
Foot print recommendation:
1 (0
.039
)
1 (0
.039
)
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SOD-123 PACKAGE DIMENSIONS in millimeters (inches)
< back
0.1
(0.0
04)
max
.
2.85 (0.112)
2.55 (0.100)
3.85 (0.152)
3.55 (0.140) 1.7
(0.0
67)
1.40
(0.
055)
Mounting Pad Layout
2.5 (0.098)
0.85 (0.033) 0.85 (0.033)
0.85
(0.
033)
Cathode bar
0.65
(0.
026)
0.45
(0.
018)
0.10
(0.
004)
1 (0
.039
)
0.15
(0.
006)
1.35
(0.
053)
0.2
(0.0
08)
0° to
8°
0.45 (0.018)
0.25 (0.010)
0.5 (0.020) ref.
Rev. 4 - Date: 24. Sep. 2009Document no.: S8-V-3910.01-001 (4)
Package Informationwww.vishay.com Vishay Semiconductors
Rev. 1.2, 03-Mar-2020 24 Document Number: 80128For technical questions within your region: [email protected], [email protected], [email protected]
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SOD-323 PACKAGE DIMENSIONS in millimeters (inches)
< back
Rev. 6 - Date: 23.Sept.2016
Document no.: S8-V-3910.02-001 (4)Created - Date: 24.August.2004
Footprint recommendation:
0.6
[0.0
24]
1.1
[0.0
43]
1.5
[0.0
59]
2.50 [0.098]
2.85 [0.112]
1.60 [0.063]
1.95 [0.077]
0° -
8°
0.25 [0.010]
0.40 [0.016]
Cathode bar
0.20
[0.0
08]
0.40
[0.0
16]
0.8
[0.0
31]
0.2
[0.0
08]
1.15
[0.0
45]
0.1
0 [0
.004
]
0.1
[0.0
04] m
ax.
0.15
[0.0
06]
1.6 [0.063]
0.8 [0.031] 0.8 [0.031]
Package Informationwww.vishay.com Vishay Semiconductors
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SOD-523 PACKAGE DIMENSIONS in millimeters (inches)
< back
1.3 [0.051]
1.1 [0.043]
0.35
[0.0
14]
0.18
[0.0
07]
1.7 [0.067]
1.5 [0.059]
0.2
[0.0
08]
0.1
[0.0
04]
0.9 [0.035]
0.7 [0.028]
0.75
[0.0
29]
0.55
[0.0
21]
0.1
[0.0
04] m
ax.
0.85 [0.033] min.
foot print recommendation:
0.5
[0.0
20] 1.45 [0.057]
0.35 [0.014]
Create Date: 04-Apr-2017Rev. 3 Date: 27-May-2019
Document no.: S8-V-3880.02-003 (4)
Package Informationwww.vishay.com Vishay Semiconductors
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SOT-23 PACKAGE DIMENSIONS in millimeters (inches)
< back
Foot print recommendation:
Rev. 8 - Date: 23. Sep. 2009Document no.: 6.541-5014.01-4
0.9 (0.035)1 (0.039)
0.9 (0.035)1 (0.039)
1.43
(0.0
56)
0.45 (0.018)
0.35 (0.014)
2.8 (0.110)3.1 (0.122)
0.45 (0.018)
0.35 (0.014)
0.45 (0.018)
0.35 (0.014)0.
1 (0
.004
) max
.2.35 (0.093)
2.6 (0.102)
0.17
5 (0
.007
)
0.09
8 (0
.004
)
1.15
(0.0
45)
0.9
(0.0
35)
1.20
(0.0
47)
0.95 (0.037) 0.95 (0.037)
2 (0
.079
)
0.7 (0.028)
0.9
(0.0
35)
0° to
8°
0.2
(0.0
08)
0.3 (0.012)
0.5 (0.020)
0.550 ref. (0.022 ref.)
Package Informationwww.vishay.com Vishay Semiconductors
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SOT-323 PACKAGE DIMENSIONS in millimeters (inches)
< back
foot print recommendation:
Rev. 1 - Date: 06. April 2010Document no.: 6.541-5040.02-4
1.3 (0.051)
0.65 (0.026) 1.8
(0.0
71)
0.8
(0.0
31)
0.6 (0.024)0.
15 (0
.006
)
0.08
(0.0
03)
1.1
(0.0
43)
0.8
(0.0
31)2.2 (0.087)
2.0 (0.079)
0.4 (0.016)
0.2 (0.008)
1.35
(0.0
53)
1.15
(0.0
45)
1.4 (0.055)
1.2 (0.047)
1.0
(0.0
39)
0.8
(0.0
31)
0.525 (0.021) ref.
2.45 (0.096)
2.15 (0.085)
0.65 (0.026) typ
0.46 (0.018)
0.26 (0.010)
8° 0°
0.1
(0.0
04)
0.0
(0.0
00)
Package Informationwww.vishay.com Vishay Semiconductors
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SOT-363 PACKAGE DIMENSIONS in millimeters (inches)
< back
foot print recommendation:
Created - Date: 23.June.2017
Document no.: S8-V-3855.02-002 (4)
1.35 [0.053]
1.15 [0.045]
0.525 [0.021] REF 0.46 [0.018]
0.26 [0.010]
0.2
[0.0
08]
0.15
[0.0
06]
0.08
[0.0
03]
2.45
[0.0
97]
2.15
[0.0
85]
1.4 [0.055]
1.2 [0.047]0.65 [0.026] Typ.
2.2 [0.087]
2.0 [0.079]
0.35 [0.014]
0.15 [0.006]
1.0
[0.0
39]
0.9
[0.0
35]
0.1
[0.0
04]
0.0
[0.0
00]
0.4
[0.0
16]
0.65
[0.0
26]
1.3
[0.0
51]
1.3 [0.051]
2.8 [0.110]
0.75 [0.030]
1.1
[0.0
43]
0.9
[0.0
35]
Package Informationwww.vishay.com Vishay Semiconductors
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SMF (DO-219AB) PACKAGE DIMENSIONS in millimeters (inches)
< back
2.9 [0.114]
2.7 [0.106]
3.9 [0.154]
3.5 [0.138]
0.85 [0.033]
0.35 [0.014]
1.2
[0.0
47]
0.8
[0.0
31]
1.9
[0.0
75]
1.7
[0.0
67]
1.08 [0.043]
0.88 [0.035]
0.25
[0.0
10]
0.05
[0.0
02]
0.1
[0.0
04]
0 [0
.000
]
5°
5°
foot print recommendation:
1.3 [0.051] 1.3 [0.051]
2.9 [0.114]
1.4
[0.0
55]
Reflow soldering
1.8 [0.071] min.
Rev. 5 - Date: 09. Oct. 2017
Document no.: S8-V-3915.01-001 (4)Created - Date: 15. February 2005
Detail Z enlarged
Package Informationwww.vishay.com Vishay Semiconductors
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SMA (DO-214AC) PACKAGE DIMENSIONS in millimeters (inches)
< back
Foot print recommendation:
Rev. 8 - Date: 10. November 2006
Document no.: S8-V-3848.01-003 (4)
4.2 (0.164)
2.0
(0.0
78)
2.5 (0.098)
0.1
(0.0
04)
2.3
(0.0
90)
2.8
(0.1
09)
1.4
(0.0
55)
1.7
(0.0
66)
3.3 (0.130)
0.2
(0.0
08)
2.3
(0.0
90)
4.5 (0.176)
4.9 (0.193)
5.5 (0.217)
2.21
(0.0
87)
2.2 (0.087) max.
6.7 (0.264) ref.
2.3 (0.091) max.
Created - Date: 18. February 1997
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MELF DO-213AB (PLASTIC) PACKAGE DIMENSIONS in millimeters (inches)
< back
Ref.
Min
.
Min. Max.
1.25 [0.049] 4.00 [0.157]
6.50 [0.256]
3.00
[0.1
18]
Document no.:S8-V-3453.03-001 (4)
foot print recommendation:
Created - Date: 13.May.2009
4.7 [0.185]
5.2 [0.205]
0.56 [0.022]
2.41 [0.095]
D1 = 2.67 [0.105]D
2 =
D1+
0-0.
2 (0
.008
)
1st Band denotes type and positive end (cathode)
1st Band
0.46 [0.018]
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MELF DO-213AB (GLASS) PACKAGE DIMENSIONS in millimeters (inches)
< back
Foot print recommendation:
The gap between plug and glass canbe either on cathode or anode side
Cathode identification
4.00 (0.157)max.
1.25 (0.049)
min.
ref.
6.50 (0.256)
2.6 (0.102)
2.4 (0.094)
0.55 (0.022)
5.2 (0.205)
4.8 (0.189)
3.00
(0.
118)
min
.
Package Informationwww.vishay.com Vishay Semiconductors
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MicroMELF PACKAGE DIMENSIONS in millimeters (inches)
< back
Document no.:6.560-5007.02-4
foot print recommendation:
1.1
[0.0
43]
1.2
[0.0
47]
1.8 [0.071]
2 [0.079]0.15 [0.006]
0.25 [0.010]
<1.
08 [0
.043
]
1 [0.039"]
0.9 [0.035]0.9 [0.035]
1 [0.039]
2.8 [0.110]
0.8 [0.031]0.8 [0.031]
0.8 [0.031]
2.4 [0.094]
1.4
[0.0
55]
1.2
[0.0
47]
*
* The gap between plug and glass canbe either on cathode or anode side
Rev. 02 - Date: 27.February.2007Created - Date: 23.February.2004
Cathode identification
Surface plan
Reflow soldering Wave soldering
Package Informationwww.vishay.com Vishay Semiconductors
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MicroSMF (DO-219AC) PACKAGE DIMENSIONS in millimeters
< back
0.5 0.3
1.2
1.5 0.8
3.1
0.94.4
1.3 ± 0.1
0.6
± 0
.1
0.15
0.6
+0.
1-0
.05
1.9 ± 0.1
2.5 ± 0.1
Cathode bar
Package Informationwww.vishay.com Vishay Semiconductors
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MiniMELF (SOD-80) PACKAGE DIMENSIONS in millimeters (inches)
< back
Cathode indentification
0.47 (0.019) max.
2.5 (0.098) max. 1.25 (0.49) min.
3.7 (0.146)3.3 (0.130)
5 (0.197) ref.2
(0.0
79)
min
.
1.6
(0.0
63)
1.4
(0.0
55)
Foot print recommendation:
*
* The gap between plug and glass can be either on cathode or anode side
Document no.:6.560-5005.01-4
Rev. 8 - Date: 07.June.2006
Package Informationwww.vishay.com Vishay Semiconductors
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QuadroMELF (SOD-80) PACKAGE DIMENSIONS in millimeters (inches)
< back
Cathode identification
1.25 (0.049) min.
3.7 (0.146)
3.3 (0.130)
0.47 (0.019) max.
2.5 (0.098) max.
1.6
(0.0
63)
1.4
(0.0
55)
5 (0.197) ref.
Foot print recommendation:
2 (0
.079
) m
in.
> R3 (R0.118)
glass
1.7
(0.0
67)
glass
The gap between plug and glass canbe either on cathode or anode side
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DO-35 (DO-204AH) PACKAGE DIMENSIONS in millimeters (inches)
< back
DO-35_02 PACKAGE DIMENSIONS in millimeters (inches)only for 1N4148 from Tak Cheong (non-automotive part)
< back
DO-41 (DO-204AL) (GLASS) PACKAGE DIMENSIONS in millimeters (inches)
< back
Rev. 6 - Date: 19. December 2011
Document no.: SB-V-3906.04-031(4)
26 min. [1.024] 3.9 max. [0.154] 26 min. [1.024]
Cathode Identification
1.7
[0.0
67]
1.3
[0.0
50]
3.1 min. [0.120]
Ø 0
.6 m
ax. [
0.02
4]
Ø 0
.4 m
in. [
0.01
5]
Cathode identification
3.4 (0.134) max. 25.4 (1.000) min.
1.75
(0.
069)
1.5
(0.0
59)
0.55
(0.
022)
max
.
Created - Date: 17. March 2008
Document no.: 6.560-5004.12-4
25.4 (1.000) min.
Cathode identification
26 (1.024) min. 4.1 (0.161) max. 26 (1.024) min.
0.86
(0.
034)
max
.
2.6
(0.1
02)
max
.
Rev. 3 - Date: 09 - February 2005
Document no.: 6.561-5001.02-4
Package Informationwww.vishay.com Vishay Semiconductors
Rev. 1.2, 03-Mar-2020 38 Document Number: 80128For technical questions within your region: [email protected], [email protected], [email protected]
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SOD-57 PACKAGE DIMENSIONS in millimeters (inches)
< back
SOD-64 PACKAGE DIMENSIONS in millimeters (inches)
< back
3.6
(0.1
42)
max
.
26 (1.024) min. 4 (0.157) max. 26 (1.024) min.
0.82
(0.
032)
max
.
Rev. 3 - Date: 09.February 2005Document no.:6.563-5006.4-4
26 (1.024) min. 26 (1.024) min.
4.
3 (0
.169
) m
ax.
4 (0.157) max.
1.35
(0.
053)
max
.
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