P14452: Detailed Design Review
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![Page 1: P14452: Detailed Design Review](https://reader035.fdocuments.in/reader035/viewer/2022062321/56813863550346895da01208/html5/thumbnails/1.jpg)
P14452: Detailed Design
Review
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Agenda
• Review (10 mins)• Updated Specifications
• Mechanical Design (30 minutes)• Temperature• Vibration• Solutions
• Analog Design (20 minutes)• Analog Signal Conditioning• Example Sensors• Power
• Digital Design (10 minutes)• Microprocessor Selection• Software Processes
• Moving Forward (10 minutes)
• Questions (10 minutes)
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Review
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Updated Specifications
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Mechanical Design
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Temperature
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μC
Battery
Lid
Case
PCB
3D Model
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Tamb = 55°C
ANSYS Results
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Tamb = 95°C
ANSYS Results
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ANSYS Results
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Excel Model
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Excel Formulas
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Excel Results
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Excel Results
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Excel Results
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Vibration
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“Most component failures in a severe vibration environment will be due to cracked solder joints, cracked seals, or broken electrical lead wires.”
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Vibration-related Failure
• Cause:• Due to stresses from relative
motion between component body, electrical lead wires, and the PCB
• Solutions:• Tying or cementing
component to PCB to eliminate resonance
• Proper component placement on rectangular PCB
• Attributes• Most severe during resonant
conditions• Can develop when component
body acts as mass and lead wires act as springs
• Most severe conditions at center of PCB
• On rectangular PCB, most severe conditions are when component part is parallel to short side of board
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𝑓 𝑛=𝐶 √ 𝐸𝐼𝑔𝑤 𝐿4
Where C = Modal constant
E = 2.7e6b = 30mm =1.18 inchesh =1/8 inchI = bh3/12 = 0.000192g = 386 in./s2
p = 1850 kg/m³ = .0668 lb/in3
L = 35mm = 1.378 inchesW = pbhL = 0.0136 lbw = W/L = .00985 lb/in.
𝑓 𝑛=3.56√ (2.7∗106 )∗ .000192∗386.00985∗1.3784
𝑓 𝑛=8450Hz
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Solutions
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Aluminum Case
• Aluminum Case for Harsh Environment• Watertight• Integrated Standoff
•No Integrated Flange Mount
Hammond Mfg.1590Z SeriesVarious Sizes Available
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Plastic Case
• Lightweight Plastic Case• Integrated Flange Mount• Integrated PCB Standoff• Black or Grey!!
Hammond Mfg.1551 FL SeriesVarious Sizes Available
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Test Plan
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Eng Spec
Name Measure Method InstrumentPassing Criteria
ES1 Easily Mountable Process -
ES14 Mountable on Moving Part Possible -
ES2 Small Size Volume Measure Volume Ruler Small (≈1in3)
ES13 Harsh EnvironmentPassing of Sub-specifications
ES13.1 High Temperature TempRaise ambient
TempTest at CIMS
Reaches 140F
ES13.2 High Pressure Pressure Raise ambient PresTest at CIMS
Reaches 100psi
ES13.3 Oily Environment Possible Submerge in oil Oil tank Withstands oil
ES13.4 Withstand Vibration Acceleration Raise Vibration Vibe table Reaches 5G
ES3 Set Sampling Rate in Field Present -ES4 No External Wires Not Present -ES5 Universal Sensor Connector Present -ES7 Data Storage Capacity (Time) Store Data Computer Stores 60 min
ES7.1 Start Capture Present -
ES7.2 Stop Capture Present -
ES6 Types of Sensor # of Different Sensors -ES8 Power To Sensors Voltage
ES9Multiple Sampling Frequencies
Frequency
ES10 Timestamps Accuracy ES11 High Sampling Frequency Max Sampling Frequency Measure Max Freq 20kHzES12 Digital Bit Width (Accuracy) Bits per Sample Max Accuracy 12bit
ES12.1 Voltage Accuracy ADC LSB ES15 Multiple Sensors Maximum Sensors -
ES16 Sensor Voltage Range Voltage
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Analog Design
Sensing the World
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Low-pass Filter
• Passes low frequency signals and attenuates signals with higher frequencies than the cutoff
• Used for smoothing data
• Reduces noise
• Necessary for SAR style ADC
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First order LPF
• Circuit above is a inverting op-amp with a RC 1st Order LPF
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MAX7403 8th Order LPF
• 8th order Low-pass Elliptic Filter
• 8 times faster cutoff than 1st order LPF
• Lower Band Reject frequency• Lower ADC sampling
rate
• Eliminates the need for discrete resistors in the Analog Signal Path
• Maxim EE-SIM
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MAX7403 Interfacing
• I2C interfacing
• Set the cutoff frequency in software to accommodate other sampling rates
• 8 pin package
• About 1mV offset at 85C
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Maxim DS4420
• Programmable gain amplifier
• -35dB-40dB Range
• -11 dB attenuation on 0-10V range yields 0-2.818 signal• 2.88 mV accuracy with 12
bit ADC
• Up to 8 devices on the same I2C bus
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Example Compatible Sensors
ADXL203• 2 –axis Accelerometer
• +/- 1.7, 5 , 15 g range
• 2.5 kHz bandwidth
• 0 – 5V range
AC2626• 0.5 C Accurate Temperature
Sensor
• -55 C – 150 C
• 0 – Vs Voltage Range
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LiPo Charging
• Spark Fun Power Cell – LiPo Charger/Booster
• Micro USB charging
• $19.99 breakout board for testing
• Eagle Files Available for PCB layout
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Schematic for LiPo Charging and Booster
https://www.sparkfun.com/products/11231
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Components Required LiPo Charger and Booster
• MCP73831/2: LiPo Charging IC• Can get free samples
• TPS61200: 5 volt, 1.2A boost converter • Can get free samples • Used for powering
sensors and other components
• JST connector $0.95
• Micro USB SMD Connector $1.95
• Resistors and Capacitors <$2.00
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Li-Po Temperature Issues
• Prof. Landi, Chemical Engineering, said that he does not know of any technologies that can operate up to 200F
• Battery’s composition layers begin to breakdown at max temperature
• Risk explosion if operating over the indicated max operating temperature (60C)
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Digital Design
As easy as 0xABC123
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Microcontroller Selection
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Necessary Features
• ADC• 1-4 Channels• 12-bit Accuracy• 25 kHz Sampling Rate per
channel
• Digital• 1 SPI (SD)• 1 I2C (Attenuator Config)• 1 PWM (LPF Config)• 2 GPIO (Power Monitoring)
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Freescale KL05
• 3 x 3 mm footprint
• 48 MHz
• ADC• 12-bit• 12 Channels• ~800 kS/s Max
• SPI
• I2C
• PWM (6 Ch + 2 Ch)
• ~$2 ea.
• $13 FRDM-KL05Z Dev Board
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Software Processes
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Modes of Operation
• Charging• Not Sampling• Peripherals Disabled
• Delay• Not Sampling• Peripherals Initialized• Timer Running
• Normal• Sampling• Timer Running
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Main Program Execution
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Peripheral Initialization
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Sampling Process (ADC Subroutine)
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Write Process (SPI Subroutine)
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Moving Forward
The long road to graduation
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BOM – Small Design
Component Price Quantity TotalPlastic Case $5 4 $20.00 MKL05Z32VFK4 (uC) $1.91 4 $7.64 DS4420N+ (Attenuator) $3.69 4 $14.76 MAX7403CSA+ (Low Pass Filter) $7.09 4 $28.36 MCP73831 (LiPo Charger) $0.64 4 $2.56 TPS61200DRCR (Boost Converter) $2.43 4 $9.72 LiPo 3.7 240 mAh $3.39 4 $13.56 CDRH2D18 (Inductor) $0.81 4 $3.24 DX4R005HJ5R2000 (Micro USB) $0.89 4 $3.56 SCHA5B0200 (microSD Socket) $1.48 4 $5.92 2 - layer PCB $83.70 1 $83.70 MISC $25.00
Total $218.02
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BOM - Large Design
Component Price Quantity TotalPlastic Case $5 4 $20.00 MKL05Z32VFK4 (uC) $1.91 4 $7.64 DS4420N+ (Attenuator) $3.69 16 $59.04 MAX7403CSA+ (Low Pass Filter) $7.09 16 $113.44 MCP73831 (LiPo Charger) $0.64 4 $2.56 TPS61200DRCR (Boost Converter) $2.43 4 $9.72 LiPo 3.7 450 mAh $4.00 4 $16.00 CDRH2D18 (Inductor) $0.81 4 $3.24 DX4R005HJ5R2000 (Micro USB) $0.89 4 $3.56 SCHA5B0200 (microSD Socket) $1.48 4 $5.92 2 - layer PCB $87.20 1 $87.20 MISC $50.00
Total $378.32
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Budget Allocation
Component Cost
Small Design $218.02
Large Design $378.32
Programmer Cable $120
Dev Board $13
Total $729.34
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Risk Assessment
ID Risk Effect CauseLikelihood
Severity
Priority Preventative Action
Person(s) Rsponsible
R1
Casing Rupture Total System Failure Material Failure 1 5 5
Prevent by selecting quality casing material and seals
Chris/Dennis
R2 Storage Full Data LossInadequate Storage 2 5 10 Capacity Theory and Testing Bryan
R3
Poor Timestamp Accuracy Unreliable Data
Poorly written code 2 4 8
Comparison of results with Lab DAQ Bryan
R4
PCB Manufacturing Latency
Delays in Implementation and Testing
Poor PCB Design or Assembly 2 5 10
Designs will be verified by third-party Matt
R5
Battery Overheats
Device Loses Power/Battery Explodes Temp too high 2 5 10 Reduce Operating Temp Dennis
R6
Electronics get too hot Innacurate Data Temp too high 2 4 8
Reduce Operating Temp, Temp Compensating Filters Dennis/Matt
R7
Internal Damage to PCB Vibration too high Poor dampening 1 4 4
Have proper vibration dampening for system Chris
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Schedule (Break)
Week 1 2 3 4 5 6
Phase 0
Matt PCB Design and Order
Chris Determine Suitable Compressor Mounting Locations
Dennis Research PCB Electrical Isolation and Heat Sinking Techniques
Bryan Microcontroller Initialization
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Schedule (MSD II)
Week 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
Phase 1 2 3 4 5
Matt PCB Assembly PCB Functionality TestingPCB
PerformanceTesting
TechnicalPaper
Chris MountingSolutions
Design / Build VibrationTest Rig
PCB Vibration Testing
Dennis Case Modification and Preparation PCB Integration
Bryan Write Basic Firmware Test Firmware Additional Functionality
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Questions?
El fin.