OVONIC UNIFIED MEMORY

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OVONIC UNIFIED MEMORY Sarath Kumar S S7 ECE Roll no:68 Government Engineering College Sreekrishnapuram ,Palakkad October 29, 2010 Sarath Kumar S S7 ECE Roll no:68 ( Government Engineering College Sreekrishnapuram ,Palakkad) OVONIC UNIFIED MEMORY October 29, 2010 1 / 21

Transcript of OVONIC UNIFIED MEMORY

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OVONIC UNIFIED MEMORY

Sarath Kumar SS7 ECE

Roll no:68

Government Engineering CollegeSreekrishnapuram ,Palakkad

October 29, 2010

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CONTENTS

Introduction

Present memory scenario

OUM operation

Characteristics of OUM

Advantages of OUM

Disadvantages OUm

Conclusion

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Introduction

25percent of world wide chip markets are memory devices

Day by day the user needs are increasing exponentially

Memory objectives

Adequate storage capacityAcceptable level of performanceReasonable cost

Ovonic unified memory (OUM) is an advanced memory technology,which stores data via the phase change characteristics of its basematerial, which provides 3 times faster data storage performance perword than NOR chips

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Present memory scenario

Volatile

SRAMDRAM

Non Volatile

PROMEPROMEEPROMFlash Memory

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Review of memory basics

The memory components of a computer can be subdivided into three maingroups

Internal processor memory

Main memory

Secondary memory

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Memory device characteristics

Access time and access rate

Access mode-random and serial

Cycle time and data transfer rate

Size and Cost

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Limitations of present memory technologies

DRAMs are difficult to integrate

SRAMs are expensive

FLASH memory can have only a limited number of read and writecycles

EPROMs have high power requirement and poor flexibility

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OVONIC UNIFIED MEMORY

Principle

Reversible structural phase change

Applying read or write pulses

Reset state and Set state

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Memory structure

Figure: memory structure of OUM

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Temperature Vs Time graph

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Technology and performance

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I-V characteristics

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R-I characteristics

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Production Process

Melting of the raw material and subsequent milling

Achieves the defined particle size distribution

Powders are processed to discs through Hot Isotactic Pressing

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Chalcogenide alloy

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Comparison of the two states of OUM

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Advantages of OUM

High density

Read-write performance

Low programming energy

Process simplicity

Cost

CMOS embeddability

Scalability

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Disadvantages of OUM

High temperatures involved in the manufacturing process.

Higher voltages are required to write data.

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CONCLUSION

Non volatile OUM with fast read and write speeds,low voltage/low energyoperation,ease of integration and competitive cost structure is suitable forultra high density , stand alone and embedded memory applications. Itsunique combination of features collectively provide a high-density,low-power.Is still a futuristic memory

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References

OUM a a 180 nm non volatile memory cell element technology forstand alone and embedded applications a Stefan Lai and Tyler Lowrey

Current status of Phase change memory a Stefan Lai

Computer Organization a V Carl Hamacher, Zvonko G Vranesic,Safwat G Zaky

Computer Architecture and Organization - John P Hayes.

Solid State Devices- Ben G Streetman,Sanjay Banerjee

http://en.wikipedia.org/wiki/EnergyConversionDevices

http://www.ieee.xplore.org/ovonicunifiedmemory

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Thank you

...........THANK YOU...........

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