Optimal Testing: Data Management for Enhanced Quality, Reliability and Yield Improvement

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1 10 July 2012 “Optimal Testing” Data Management for Highest Yields & Best Quality ‘OptimalTest: The information backbone of the Semiconductor & Electronics supply chain’ Presented at… By Dan Glotter, CEO OptimalTest

Transcript of Optimal Testing: Data Management for Enhanced Quality, Reliability and Yield Improvement

Page 1: Optimal Testing: Data Management for Enhanced Quality, Reliability and Yield Improvement

1 10 July 2012

“Optimal Testing”

Data Management for

Highest Yields & Best Quality

‘OptimalTest: The information backbone of the Semiconductor & Electronics supply chain’

Presented at… By Dan Glotter, CEO

OptimalTest

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●OptimalTest has established a ~90% presence at the Fabless supply chain which consists of all the major:

● Subcontractors sites

● Foundry sites

● Enabling extremely fast deployment for a new Fabless company

OptimalTest has paved the Semiconuctor Information Highway

In 2011: Over 10M units run on OT per day…

~4B per year…. and growing

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• Was a “Back-End Operation”: Necessary evil to separate good from bad

• Then, became “Rear-View Mirror”: Where was the Fab positioned?

• Modern, “World-Class Test” Needs to support the escalating challenges of the Sub 28nm processes.

• Test today is the Central Hub Within a sophisticated supply chain and supports enhancements in: Design, Fab Process, Yields, Quality, Reliability, Operations, TTM & NPI

Device Test: Rapidly Changing Role

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• It’s all about the real-time data... It’s all about the off-line data... It’s all about ALL the data… Capture, Store, Move, Mine, Stack, Analyze AND Learn From

The Keystone : Leveraging Data

• Its all about Data Exchange Its all about Data Feed Forward (DFF) & Data Feed Backward (DFB) It must occur seamlessly across the enterprise

8/13/201

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• OT-Detect automatically tracks after ALL your products for ANY changes in BASELINE production

• OT-Detect creates on the fly hundreds of BASELINES for your products' yields, bins, soft-bins, failing parameters and more.

Leveraging Massive Data: OT-Detect

Lot level

Analysis Prod level

Analysis

Bin level

Analysis

Param. level

Analysis

Equip level

Analysis

Facility level

Analysis

Note: The ability to do so many baselines on the fly is a huge technological breakthrough since it requires optimized algorithms to enable super fast computations

What is a “Baseline”?

Preforming a “baseline” means that the system automatically identify the incoming product, scan the last 20-40 lots of that product and determine if the current lot signature significantly exceeds the value of the historical baseline that was created on the fly - Either in Real-Time or in Off-line

• And that's not all, once triggered it provides a step-by-step ROOT-CAUSE ANALYSIS. This means that any extreme change in the products' manufacturing, test or assembly processes will be tracked, captured and assessed.

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Correlate results across multiple operations based on:

• Mapping E-Test sites with WS dies locations

• Use die ID / Unit-Level Traceability to track units into FT, SLT & Board test

Combine all the above into cross operational unit level analysis and single view graphics based on Wafer Map Reconstruction

Leveraging Massive Data: Cross Operations

E-Test 1 E-Test 2

WS 1 WS 2

Wafer Map Reconstruction

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Reference Die/Units - For Quality Control

• Few units that are tested first with augmented test program for:

• Quality Assurance

• Health Monitor

• Reliability screens

• Additionally, the augmented testing on the reference dies/units creates BASELINE for yield learning without Sacrificing overall test-times

Note-1: in wafer-sort it’s a few dies and if unit ID exist then its in Final-Test the units are tested with augmented TP too

Note-2: The ability to augment the testing in real-time on the fly without touching the test-program I s powered by OptimalTest’s TTR engine in reverse

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1. Next to E-test structures

2. Within wafer Geographies

Reference Dies Selection

Ring 1

Ring 2

Ring 3

Upper Left Corner

Lower Right Corner

+ Etest Structure Litho:

3. Within yield failure areas

4. Within lithography locations

Testing content augmentation may vary for different baseline dies

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Summary

“Hop on” OptimalTest’s Semiconductor Information Highway… for measurable results

• Turn piles of data into actionable data

• Use OT-Detect to catch rare & extreme quality issues

• Use cross operations data – all across from EDABoard

• Use Reference dies/unit to enhance your overall Quality & Yield

• Past: Test Was A Back-End-Of-Line Operation “Disconnected Activity”

• Future: Test is the central hub for Product Optimization