ISO 9001:2000

ISO 9004:2000

TS-16949:1999

Chad Kymal - OmnexRon Ramos - Philips

OMNEX

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Proposed SAC Quality System Standard

SAC Quality System Standard = ISO 9001 + ISO 9004 + ISO/TS 16949 +

QS-9000 Semiconductor Supplement + SAC

Value added practices

SAC Requirements

ISO 9004:2000 +

TS-16949

ISO 9001:2000

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Quality Management SystemContinual Improvement

REQUIREMENTS

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SATISFACTION

Quality Management Process ModelSource: ISO 9001:2000

February 1999

Figure 1

ResourceManagement

Measurement,Analysis,

Improvement

Product

Input Output

ManagementResponsibility

ProductRealization

Process Model

PLAN

PLAN CHECK/ACT

DO

ISO 9001:2000

• Currently released as a Draft International Standard

• The ISO 9001:2000 International Standard will be released in the fourth quarter

• Companies will have to conform to the new standard by fourth quarter 2003

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ISO 9004:2000

• Fully embraces the management principles of current management theory

• Synergistic with ISO 9001:2000 and provides guidelines for implementation and overall performance enhancement

• Enhances ISO 9001:2000Management Principles

Customer focused organization

Leadership

Involvement of people

Continual Improvement

Factual approach to decision making

Mutually beneficial supplier relationship

System Approach to Management

Process Approach

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ISO 9001:2000 A Business Model

• Quality defined as - “meeting the needs and expectations of customers and interested parties”

• Process model focusing on process management

• Quality/Business objectives at each relevant function and level

• Business processes for product realization

• Measurement of business process• Measurement of customer

satisfaction• Improvement of processes and

customer satisfaction

MalcolmBaldridge

ISO14001

QS-9000 andOther Industry

SpecificStandards

ISO 9001:2000

This is the quality standard your management always wanted

6

ISO/TS 16949:1999

• ISO/TS 16949 harmonizes the supplier quality

system requirements of Standards from the US,

Germany, Italy, and France with the purpose of

having a single document and registration scheme

that the European and US industries would accept.

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ISO/TS 16949:1999

• This document follows the same structure as ISO 9001:1994 and is acceptable in lieu of (some conditions apply):– QS-9000 Quality System Requirements, 3rd Edition

– VDA 6, Part 1: Quality System Audit

– AVSQ’94 Guida per l’applicazione (guidelines for use)

– Evaluation Aptitude Qualité Fournisseur (EAQF 94)

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ISO/TS 16949 Influences

QS 9000

ISO 9001:2000

VDA 6.1

OtherEuropeanStandards

TS 16949: 1999

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Future of ISO/TS 16949 & Implications to QS-9000

• 2000-2001: ISO 9000:2000 & ISO/TS 16949, 2nd Edition (harmonized US, European, and Asia-Pacific Standard)– planned for release in mid-2001

– Note: Asia-Pacific includes: Japan, Korea, and Malaysian

automotive manufacturers

• QS-9000 is not getting revised to include ISO 9001:2000

• ISO has imposed 3-year deadlines (end of ISO 2003) to adopt ISO 9001:2000– QS-9000 registered companies stand to lose ISO certification

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Why ISO 9001 + ISO/TS 16949 + ISO 9004 + Semiconductor Supplement

• ISO 9001:2000 will be released in the 4th quarter of 2000 and ISO 9001:1994 will become obsolete

• ISO/TS 16949 is already internationally accepted

– USA and Europe today

– USA, Europe, and Asia-Pacific mid next year

• ISO/TS 16949 will be upgraded to ISO 9001:2000 while QS-9000 will not

The Semiconductor industry—as leaders—always stay ahead

the pack

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SAC Best Practices

• Key Performance Measures– Overall yield percentage– Outgoing PPM– Cycle Time– On time delivery/performance to schedule– Cost trend– Number of customer complaints– Customer complaint response time

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SAC Best Practices

• Process performance measures– Design first pass success– Percent Cpk > 1.67– Productivity trend– Operating Equipment Efficiency (OEE)– Equipment uptime trend– Equipment MTBF/MTTR– Tool lifetime limits prevent tool wear from

affecting the process/products

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SAC Best Practices

• FMEA usage to prevent problems and improve processes

• Processes and product– Characterization– Optimization

• Package and process qualification standard• Suppliers use SAC requirements• Computer-based identification and

traceability

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SAC Best Practices

• Environmental controls– Temperature– Relative Humidity (RH)

• Process control and monitor guidelines

• Statistical Process Controls– Effective - result in improvement– Require action for all out-of-control events– Reduce number of out-of-control events

• Continuous improvement in all activities

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SAC Results

• Productivity improvements– Equipment 10 - 30%– People 10 - 30%

• Yield improvement– Subcontractor yield - 99.88% (higher than Mfg)

• Performance to schedule improvement– Attaining 100%

• Number of customer complaints decreases– Up to 10x reduction

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SAC Results

• Cost reduction– Plating chemicals 10 - 30%– Tooling (increased lifetimes) 10 - 30%

• Outgoing PPM– Mechanical < 10 PPM– Electrical < 5 PPM

• Cpk > 1.67 97%

• Cycle time < 3 Days

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Measurables and Controlables

• Wafer Saw - chips/cracks/backside cracks– Blade RPM & feed speed, blade exposure

• Die attach - glue line thickness/die tilt– Force/time & glue amount/distribution

• Wire bond - ball shear/wire pull/nonstick on pad/post– 1st bond power/force/time– 2nd bond power/force/time– Capillary lifetime

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Measurables and Controlables

• Mold - bubbles/voids/incomplete fill - DPM mold flash thickness & amount/bleedout– Temperature/time/compound moisture content– Mold wear

• Ink mark - legibility/light mark/smeared mark/incomplete characters– Ink viscosity/platen pressure/pad wear

• Laser mark - contrast/incomplete characters– Beam power/pulse duration & frequency

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Measurables and Controlables

• Solderplate - minimum & maximum thickness/composition– Bath composition/replenishment frequency

• Trim/form/singulation - burr length/lead coplanarity & dimensions– tool lifetime