Office of the Secretary of Defense Defense Microelectronics Activity (DMEA) Defense Microelectronics...

8
Office of the Secretary of Defense Defense Microelectronics Activity (DMEA) Doug Casanova Defense Microelectronics Activity (DMEA)

Transcript of Office of the Secretary of Defense Defense Microelectronics Activity (DMEA) Defense Microelectronics...

Page 1: Office of the Secretary of Defense Defense Microelectronics Activity (DMEA) Defense Microelectronics Activity (DMEA) Doug Casanova Defense Microelectronics.

Office of the Secretary of DefenseOffice of the Secretary of Defense

Defense Microelectronics Activity(DMEA)

Defense Microelectronics Activity(DMEA)

Doug CasanovaDefense Microelectronics Activity

(DMEA)

Doug CasanovaDefense Microelectronics Activity

(DMEA)

Page 2: Office of the Secretary of Defense Defense Microelectronics Activity (DMEA) Defense Microelectronics Activity (DMEA) Doug Casanova Defense Microelectronics.

DMEA MissionDMEA Mission

DoD Mission - Provide microelectronics technology solutions

Leverage advanced microelectronics technologies Improve reliability and maintainability Enhance capability and performance Address effects of rapid obsolescence

Assigned as DoD Executive Agent for microelectronics DMS Coordinate DOD activities Develop OSD policy and strategy

Serve as joint resource for DoD / government / industry / foreign allies

Established by Secretary of Defense Defined DMEA’s joint mission & explicit organizational structure Report directly to the Deputy Under Secretary of Defense for Logistics &

Materiel Readiness

DoD Mission - Provide microelectronics technology solutions

Leverage advanced microelectronics technologies Improve reliability and maintainability Enhance capability and performance Address effects of rapid obsolescence

Assigned as DoD Executive Agent for microelectronics DMS Coordinate DOD activities Develop OSD policy and strategy

Serve as joint resource for DoD / government / industry / foreign allies

Established by Secretary of Defense Defined DMEA’s joint mission & explicit organizational structure Report directly to the Deputy Under Secretary of Defense for Logistics &

Materiel Readiness

Page 3: Office of the Secretary of Defense Defense Microelectronics Activity (DMEA) Defense Microelectronics Activity (DMEA) Doug Casanova Defense Microelectronics.

The ChallengeThe Challenge

Increased DoD use / reliance on microelectronics (“Smart” weapon systems) Essential technology for all military missions

Strategic, tactical, C4I, special ops “Critical” DoD technology

Enabling technology for transformational opportunities

Extended system life cycles (20 – 40 years) Increased reliability and maintainability issues Rapidly evolving, expanding missions - new capability requirements Diminishing Manufacturing Sources (DMS)

Decreased technology stability Dynamic development drives obsolescence cycles of 18 months or less Over 95% of all DoD DMS cases are electronics

Increased DoD use / reliance on microelectronics (“Smart” weapon systems) Essential technology for all military missions

Strategic, tactical, C4I, special ops “Critical” DoD technology

Enabling technology for transformational opportunities

Extended system life cycles (20 – 40 years) Increased reliability and maintainability issues Rapidly evolving, expanding missions - new capability requirements Diminishing Manufacturing Sources (DMS)

Decreased technology stability Dynamic development drives obsolescence cycles of 18 months or less Over 95% of all DoD DMS cases are electronics

2040+ 94+ Years94+ YearsB-5219551946

Notional Projected LifetimeNotional Projected Lifetime Extended LifeExtended Life

0 50 100Years

Page 4: Office of the Secretary of Defense Defense Microelectronics Activity (DMEA) Defense Microelectronics Activity (DMEA) Doug Casanova Defense Microelectronics.

DMEA’s Total Solution ApproachDMEA’s Total Solution Approach

Key: Understand ALL the military requirements Verify System Problems

Reliability and maintainability of system/boards Adequacy of spares Testability and repair issues Existing and projected obsolescence

Develop Solution Options Component

Aftermarket Substitution Emulation Custom

Board / Box / System Technology Compression

TOC savings over chip for chip Increased capability (transformation)

Opportunity for open architecture

Key: Understand ALL the military requirements Verify System Problems

Reliability and maintainability of system/boards Adequacy of spares Testability and repair issues Existing and projected obsolescence

Develop Solution Options Component

Aftermarket Substitution Emulation Custom

Board / Box / System Technology Compression

TOC savings over chip for chip Increased capability (transformation)

Opportunity for open architecture

Page 5: Office of the Secretary of Defense Defense Microelectronics Activity (DMEA) Defense Microelectronics Activity (DMEA) Doug Casanova Defense Microelectronics.

DMEA’s Advanced Reconfigurable Manufacturing for Semiconductors (ARMS)

DMEA’s Advanced Reconfigurable Manufacturing for Semiconductors (ARMS)

Government / Semiconductor Industry partnership New flexible foundry technology New business model

Government-held process licenses No commercial conflicts Prototype / low volume production by DMEA High volume production by industry

Terminal transfer to DMEA upon OEM business decision Transfers industry-developed (commercial) IP & technology COTS as a solution, not a problem Ensures continued DoD supply as industry flexes with market

Government / Semiconductor Industry partnership New flexible foundry technology New business model

Government-held process licenses No commercial conflicts Prototype / low volume production by DMEA High volume production by industry

Terminal transfer to DMEA upon OEM business decision Transfers industry-developed (commercial) IP & technology COTS as a solution, not a problem Ensures continued DoD supply as industry flexes with market

Save processes, Not parts !Save processes, Not parts !

Page 6: Office of the Secretary of Defense Defense Microelectronics Activity (DMEA) Defense Microelectronics Activity (DMEA) Doug Casanova Defense Microelectronics.

DoD / Industry PartnershipTogether Supporting the Warfighter

DoD / Industry PartnershipTogether Supporting the Warfighter

Boeing / F-22 Obsolescence Problem Custom power management device no longer available Used throughout the weapon system Multi-year production requirement

500 parts / year X 10 years Part for Part solution determined the best value

Requested DMEA’s ARMS Foundry Support

Solution - DMEA & Boeing “Cooperative Research And Development Agreement” (CRADA) DMEA / Boeing worked together on developing new IC DMEA provided design engineering DMEA tested & delivered new IC

Boeing / F-22 Obsolescence Problem Custom power management device no longer available Used throughout the weapon system Multi-year production requirement

500 parts / year X 10 years Part for Part solution determined the best value

Requested DMEA’s ARMS Foundry Support

Solution - DMEA & Boeing “Cooperative Research And Development Agreement” (CRADA) DMEA / Boeing worked together on developing new IC DMEA provided design engineering DMEA tested & delivered new IC

Page 7: Office of the Secretary of Defense Defense Microelectronics Activity (DMEA) Defense Microelectronics Activity (DMEA) Doug Casanova Defense Microelectronics.

DMEA B2 SupportDMEA B2 Support

B-2 Defensive Management System (DMS) unsupportable DMSMS plus lack of repair procedures, lack of

tech data, spares, etc

Prime Contractor wanted $54M to redesign system

DMEA Proposed $22M to make supportable for next 10 years

DMEA performing System-level DMS Supportability Improvement Program System level assessment IC / board / box solution strategies Reverse engineering Solution design, prototype, and test

Cost avoidance = $32 Million

B-2 Defensive Management System (DMS) unsupportable DMSMS plus lack of repair procedures, lack of

tech data, spares, etc

Prime Contractor wanted $54M to redesign system

DMEA Proposed $22M to make supportable for next 10 years

DMEA performing System-level DMS Supportability Improvement Program System level assessment IC / board / box solution strategies Reverse engineering Solution design, prototype, and test

Cost avoidance = $32 Million

Page 8: Office of the Secretary of Defense Defense Microelectronics Activity (DMEA) Defense Microelectronics Activity (DMEA) Doug Casanova Defense Microelectronics.

DoD / Industry Partnership

Evolved Sea Sparrow Missile (ESSM)

DoD / Industry Partnership

Evolved Sea Sparrow Missile (ESSM)

Raytheon / ESSM Obsolescence and R&M Problems Obsolete Custom Microprocessor & Interface Logic Devices Impacts future production of Missile Borne Computer (MBC)

Subsystem Requested DMEA’s Support to Eliminate Obsolescence

DMEA Provided 3 Options

Navy and Raytheon decided to improve R&M, and testability, as well as resolve DMS

DMEA to redesign 6 boards and 2 ASIC’s Microprocessor & Interface Logic redesign Technology Compression to replace other

ICs & develop new FFF MBC Subsystem DMEA / Raytheon to Integrate & Test new MBC Cost Avoidance of $20,000,000

Raytheon / ESSM Obsolescence and R&M Problems Obsolete Custom Microprocessor & Interface Logic Devices Impacts future production of Missile Borne Computer (MBC)

Subsystem Requested DMEA’s Support to Eliminate Obsolescence

DMEA Provided 3 Options

Navy and Raytheon decided to improve R&M, and testability, as well as resolve DMS

DMEA to redesign 6 boards and 2 ASIC’s Microprocessor & Interface Logic redesign Technology Compression to replace other

ICs & develop new FFF MBC Subsystem DMEA / Raytheon to Integrate & Test new MBC Cost Avoidance of $20,000,000