NFF MA6 Nanoimprint Upgrade

Workshop for NFF Nanoimprint System

NFF MA6 Nanoimprint NFF MA6 Nanoimprint Upgrade Upgrade

OutlineOutline

Nanoimprint Lithography (NIL)Nanoimprint Lithography (NIL) Upgrade PartsUpgrade Parts


Nanoimprint Lithography (NIL)

Versatile, cost effective, flexible and high throughput (parallel) method for fabrication of down to 10 nm structures even over large areas (wafers)

Applications in:

•Semiconductor memory•Micro and nano fluidics •Optical devices e.g. LEDs and lasers •Life science, e.g. lab-on-a-chip systems, bio sensors•Radio frequency components•Renewable energy•Security (holography, tags, etc.)•Nanotechnology


Residual imprint polymer under stamp protrusionremoved by ‘descum’ process

Imprinted pattern transferred into substrate bydry etching

Nanoimprint processNanoimprint process

The stamp is pressed into a soft thermoplastic, thermosetting or UV-curable polymer ona substrate combined with heating or UV radiation

A stamp is fabricated by electron beam lithography(EBL) and dry etching

Stamp

Substrate Polymer

The polymer is cured and the stamp releasefrom substrate


Upgrade Parts IncludeUpgrade Parts Include

StampStamp Stamp HolderStamp Holder Substrate HolderSubstrate Holder Stamping controlStamping control


StampStamp

BBare Quartz Plate Patterned Stampare Quartz Plate Patterned Stamp


Stamp HolderStamp Holder


Substrate HolderSubstrate Holder


Stamping ControlStamping ControlWith Firmware upgradeWith Firmware upgrade


StampStamp

Stamp Plate DimensionStamp Plate Dimension Stamp PatternStamp Pattern Anti- sticking LayerAnti- sticking Layer Stamp HandlingStamp Handling


Stamp Plate DimensionStamp Plate Dimension

Square Quartz Plate 65mm x 65mm x 6.35 mm thick A Square Shape Mesa ~ 25 um height at the center Probably 3 E-beam Alignment marks will be set nearly at the corners (will further discuss)

6.35 mm

65mm

65mm

Mesa

~ 25 um

6.35 mm

Mesa


Stamp Pattern

All pattern should be inside the Mesa area

Standard Mesa size in NFF: 10 mm square

Mesa can change to another size but it will take longer time to fabricate, more chance to jammed with the substrate and extra charge for new mesa mask

Large patterned area also cause flatness problem of stamp

To avoid drawing at boundary or a large enclosed pattern, especially near at the edges of Mesa. Because it will block the excess imprint resist flow


Beware of the imprint resist thickness to the depth of stamp patternUnit cell

dot

LS

(Vto fill) of resist needed to fill completely this structure. For our design, Vto fill = Hm{LS + (L + S)S}, where Hm is the mould’s depth, L the dot’s size andS the spacing between each dot. Now the available volume of resist for this unit cell is Vresist = Hi (L + S)2, where Hi is the initial resist layer thickness.

Nanotechnology 17 (2006) 2701–2709S Landis et al


Anti-sticking Layer

The Mesa is covered by an Anti-sticking layerThe Mesa is covered by an Anti-sticking layer

Anti-sticking layer is a very thin Fluorocarbon layerAnti-sticking layer is a very thin Fluorocarbon layer

AAnti-sticking layer (nti-sticking layer (>1>10 nm) for 0 nm) for easy easy stamp release from a thin impristamp release from a thin imprint resistnt resist

Don’t scratch the Anti-sticking layerDon’t scratch the Anti-sticking layer

If Anti-sticking layer gets damage, it will cause jammed stamp If Anti-sticking layer gets damage, it will cause jammed stamp during stamp releasing step or imprint resist stick onto the stamp during stamp releasing step or imprint resist stick onto the stamp surfacesurface


Stamp handling

Cleaning the stamp by Acetone, IPA, thinner and DI Cleaning the stamp by Acetone, IPA, thinner and DI water water ONLYONLY. (No oxygen plasma, EKC or MS2001). (No oxygen plasma, EKC or MS2001)

Before put the stamp back into the packing box, please Before put the stamp back into the packing box, please make sure the box is dust freemake sure the box is dust free

Mesa side always face downward inside the packing box Mesa side always face downward inside the packing box and don’t make it face upward even in normal caseand don’t make it face upward even in normal case

Seal the packing box by aSeal the packing box by adhesivedhesive tape if it will not be tape if it will not be used for a period of timeused for a period of time

Don’t touch the Mesa surface with anything elseDon’t touch the Mesa surface with anything else.. Of course, don’t drop itOf course, don’t drop it


Thank you for your attention!


NFF MA6 Nanoimprint Upgrade

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