New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental...

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New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management [email protected] ECRM

Transcript of New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental...

Page 1: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

New UEF Emission Factors for SMC Production and Compression Molding

David Lipiro

Environmental Compliance & Risk Management

[email protected]

ECRM

Page 2: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Terminology

• SMC = Sheet Molding Compound• BMC = Bulk Molding Compound• LCM = Liquid Composites Molding

• UEF = ANSI/ACMA/ICPA UEF-1-2009, Estimating Emission Factors from Open Molding and Other  Composite Processes (Current Version)

Page 3: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Factors for VOC Emissions

• Compounding (in UEF) – from SMC machines – based on ECRM study

• Compression molding (proposed) – SMC, BMC, LCM – based on EECS studies (R. Haberlein)

Page 4: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Estimating Emissions • Emission Factor = ratio

– Lb emitted/lb compound used = E/C = 0.002– Lb emitted/lb styrene used = E/S = 0.02

• Equivalent Emission Models– E = 0.002*C– E = 0.02*S– Simplest model constant factor

• Derive models and factors from test data

Page 5: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

S E E/S

100 19.55 0.20

80 15.44 0.19

60 12.28 0.20

40 8.44 0.21

20 3.89 0.19

10 1.98 0.20

0.20Average EF =

Emissions vs Styrene Run

E = 0.2S

0

5

10

15

20

25

0 50 100 150

S, lb/hr

E, lb

/hr

Page 6: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

S E E/S

100 25.80 0.26

80 21.29 0.27

60 17.59 0.29

40 13.65 0.34

20 8.85 0.44

10 7.79 0.78

0.40Average EF =

Emissions vs Styrene Run

E = 0.2S + 5

E = 0.4S

0

5

10

15

20

25

30

35

40

0 50 100 150

S, lb/hr

E, l

b/hr

Page 7: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Compounding Emission Model

• Theory

• Lab weight loss experiments at MFG Research – C. Piper

• Evaluate recent VOC emission tests of 7 SMC machines

Page 8: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.
Page 9: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Theory• Areas where paste is not covered by

carrier film = window to environment

• Exposed area A ft2 is constant for each SMC machine

• Simplest model:E lb/hr = kA, k = constant

Upper Lower

Page 10: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Styrene Content?

• Affects skinover?

• Expected to be important based on UEF for open molding

Page 11: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Line Speed?

• Skinover effect at longer travel times lower emissions at lower linespeeds?

• Induced air velocity as paste moves under air impact depends on vent airflow patterns?

Page 12: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

MFG Lab Tests

• Wt loss by analytical balance + datalogger, 10 readings per second, 6-8 reps

• Constant sample pan area = 0.16379 ft2

• Range of S.G. and styrene % in pastes used

• “Wind tunnel” w anemometer – simulate motion-induced airflow

• Run times cover realistic line travel times - simulate skinover

Page 13: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Conclusions/Predictions

• Not much skinover effect – most weight loss curves linear or near

• Styrene content will probably have little impact on emissions

• Line speed probably won’t effect emissions

• Emissions will vary with open area, temperature and air velocity - only area practical for permitting

Page 14: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Field Verification• Method 24 TTE emission tests

• 7 uncontrolled machines – 24”, 48”, 60”

• Wide range of open areas, styrene contents, linespeeds

• No temperature control at doctor boxes

• Doctor boxes open to nearly closed

Page 15: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Field Data Analysis

• Regression: Emissions vs Predictor

• Predictors compared:– Area– Styrene throughput (traditional)– SMC throughput

Page 16: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Emission vs Total Wet Area, withConfidence and Prediction Limits

(k=3 for Prediction Limits)E = 0.1457A - 0.1454

R2 = 0.9917

0

2

4

6

8

10

12

14

16

18

0 50 100 150

Area, ft2

Em

iss

ion

s, l

b/h

r

Actual

LCL

UCL

LPL

UPL

Page 17: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Figure 2. Throughput Model 1y = 0.0009x - 1.773

R2 = 0.4

0

2

4

6

8

10

12

14

16

0 5,000 10,000 15,000

SMC Run, lb/hr

Sty

rene

Em

itted

, lb/

hr

1

2

3

4

5

6

7

Page 18: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Compounding Emission Model in UEF

• Er = 0.1457*A-0.1454, where:– Er = emission rate of SMC machine, lb/hr– A = open wet area of machine (including

uncovered doctor box area), ft2

• Emissions = Er * t (hrs)• Permitting: E is constant when paste

on line - throughput irrelevant

Page 19: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Compression Molding• SMC, BMC, LCM• Emissions from charge prep only -

Once press closes, negligible emissions

• EECS Study: Charge prep emissions measured in Method 204 TTE

Page 20: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

SMC Compression Molding

• Two “traditional” EFs proposed based on test data

• Which is best predictor?• What are underlying models?

Page 21: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Compound Throughput Model

C, lb/hr E, lb/hr E/C16 0.027 0.0016486 0.250 0.00292115 0.231 0.00201229 0.540 0.00236191 0.264 0.00138189 0.627 0.00332306 0.651 0.00213388 0.750 0.00193237 0.169 0.00071319 0.672 0.00211279 0.715 0.00256142 0.335 0.00235628 0.736 0.00117602 0.682 0.00113690 1.472 0.00213690 1.200 0.00174

0.0020Average EF =

Emissions vs SMC MoldedE = 0.00148C + 0.10955

R2 = 0.74233

E = 0.002C

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0 100 200 300 400 500 600 700 800

SMC molded, lb/hr

Emis

sion

s lb

/hr

Page 22: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Styrene Throughput Model

S, lb/hr E, lb/hr E/C2.16 0.027 0.01250

12.75 0.250 0.0196115.51 0.231 0.0148931.80 0.540 0.0169823.52 0.264 0.0112228.31 0.627 0.0221549.35 0.651 0.0131954.00 0.750 0.0138927.56 0.169 0.0061338.22 0.672 0.0175833.55 0.715 0.0213115.40 0.335 0.0217567.16 0.736 0.0109674.07 0.682 0.0092195.20 1.472 0.0154673.84 1.200 0.01625

0.0152Average EF =

Emissions vs Styrene Molded E = 0.0129S + 0.0646

R2 = 0.8093

E = 0.0152S

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

0 20 40 60 80 100

Styrene molded, lb/hr

Emis

sion

s lb

/hr

Page 23: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

EFs Compared• E/C = 0.002 is poorer predictor

(R2=0.74, 10% total overestimate)

• E/S = 0.0152 is better predictor (R2=0.81, 5% total overestimate), same form as published AP-42 factor

• UEF: E lb = 1.5% styrene lb run vs 2% AP-42 factor

Page 24: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

BMC and LCM• UEF: BMC Molding Emissions = 1.15% of

styrene in compound molded

• UEF: LCM EF, lb styrene / lb paste molded =– Spread prep: 0.0072*S% + 0.008– Pour prep: 0.0022*S% + 0.008– LCM Emissions = EF * lb paste molded

Page 25: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Why Use These Factors?

• Best available methods to estimate emissions w/o site testing

• Most credible factors available – adopted into UEF by transparent ANSI consensus process involving industry and state/fed regulators

Page 26: New UEF Emission Factors for SMC Production and Compression Molding David Lipiro Environmental Compliance & Risk Management dlipiro@ecrminc.com ECRM.

Thank you for attending

Questions

ECRM