New Soft Magnetic FlakeComposite2 · 2018. 10. 16. · Efficiency and Dynamics of 3D Integrated...
Transcript of New Soft Magnetic FlakeComposite2 · 2018. 10. 16. · Efficiency and Dynamics of 3D Integrated...
© TOKIN 2018 Confidential
Soft magnetic Metal-flake Composite Material Suitable for Highly Integrated Power Modules
26 June. 2018
Ken’ichi Chata’niTOKIN Corporation
© TOKIN 2018 Confidential
Outline
n Material characteristics of FlakeCompositeTM ,in comparison with existing magnetic materials.
-Permeability, magnetic saturation, core loss, etc.
n Inductor performance benchmarking.
n PCB embedded inductor test fabrication result.
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What is FlakeCompositeTM?
FlakeCompositeConventional Metal composite
Permeability 300(Same as ferrite)
< 40
Metal-flakeCompactingTechnology
Thickness >0.5mmBrittle
>50μmFlexible
Heat resistance <200℃℃Organic binder
>200℃℃Inorganic binder
Enable PCB Embedding
Suitable for Automotive
Smaller component's volume
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Comparison of Magnetic Materials for PCB Embedding
Conventional metal composite
0.0
0.5
1.0
1.5
2.0
100 100010
Bs(T
)
MnZnNiZn
CoZrO(film)
CoZrTa(film)
Fla
keC
om
posite
Co Fe(film)
Fe nanocrystal
Permalloy
FeSiAl
FeSi
Fe amorphous
Permeability(1MHz)
ØLow permeability
ferrite
Deposited Film
ØBrittle
ØDifficult to increase the core volume.PCB embedded
Magnetic Material
ØHigh permeability (300 at 1 MHz.)
Ø50µm to 2mm thickness
ØThin, Flexible(Rigid)
FlakeComposite
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Permeability vs Frequency
NiZn ferrite
FlakeComposite
μ’// = 300
μ^̂≦≦ 5
Ø Comparable to NiZn ferrite for MHz powerapplication.
Frequency dispersion of complex permeability
LimitationLower Out-plane
permeability.
Per
mea
bilit
y (R
e, Im
)
Frequency (MHz)
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0
1000
2000
0 1 2 3 4 5
Pcv(mW/cc)
f(MHz)
f Bm=25MHz mT23
Core Loss
Ø Core loss of FlakeComposite is comparable to NiZn ferrite,but much larger than MnZn ferrite.
NiZn ferrite
MnZn ferrite
ConventionalMetal Composite
Core Loss vs Temp.
FlakeComposite
FlakeComposite
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0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0 2000 4000 6000 8000
B (T
)
H (A/m)
Magnetic Saturation (BH curve)
Ø Soft-saturation in FlakeComposite.
Ø Smaller drop of saturated magnetic moment against temperature, comparing to MnZn ferrite.
125℃℃
25℃℃
MnZn ferrite
FlakeComposite
ConventionalMetal Composite
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Deduction of Permeability under DC-bias Field from BH curve
Hm3Hm2Hm1
dB/dH3
dB/dH2
dB/dH1
Bm3
Bm2
Bm1
(Hm1, Bm1, dB/dH1)
(Hm2, Bm2, dB/dH2)
(Hm3, Bm3, dB/dH3)
DemagnetizingCoefficient N
(H1, µ1)
(H2, µ2)
(H3, µ3)
!" ≅ !$" − &×($"
)" = 1 + ⁄.( .!" − 11 + & ⁄.( .!" − 1
Ø From the set of partial BH curve
and slope value at Hm,
permeability under DC-bias field
with arbitral demagnetizing
coefficient
can be deduced.
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0
10
20
30
40
50
60
70
80
0 2000 4000 6000 8000
Permeability
Hdc(A/m)
Permeability under DC-bias Field
125℃℃
25℃℃
MnZn ferrite
FlakeComposite
ConventionalMetal Composite
Ø In metals, permeability under DC-bias field is insensitive to temperature.
Ø In metals, permeability survives under high DC-bias field.
In MnZn ferrite and FlakeComposite, effective permeability under zero bias field is tuned to be 70 by corresponding demagnetizing coefficient, i.e, air-gap.
N=0.01384
N=0.01091
N=0
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0
50
100
150
200
250
300
0.1 1 10 100
Perm
eabi
lity(
Re,
Im)
Frequency(MHz)
0102030405060708090100
0 500 1000
Perm
eabi
lity
Chan
ge(%
)
Plane Pressure(kgf/cm2)
Effect of Plane Compression
Ø Only 7.6 permeability decreaseunder 1000kgf/cm2 compression.
Plane Pressure(kgf/cm2)
-7.6%
FlakeComposite
Ø Apply 1000kgf/cm2 plane pressureon the toroidal core.
After 1000kgf/cm2compression
Initial
Ø Only 2.7% permeability decreaseafter 1000kgf/cm2 compression.
Ø No apparent damage was found.
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10
100
1000
10000P
erm
eabi
lity
(25
)
Curie Temperature( )
Curie Temperature
Ø Higher Curie temperature than ferrite.
NiZn ferrite
MnZn ferrite
FlakeComposite
0
50
100
150
200
250
300
-50 0 50 100 150
Real
Per
mea
bilit
y
Temp( )
FlakeComposite
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n Material characteristics of FlakeCompositeTM ,in comparison with existing magnetic materials.
-Permeability, magnetic saturation, core loss, etc.
n Inductor performance benchmarking.
n PCB embedded inductor test fabrication result.
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Lateral Flux Inductor Structure
Qiang Li, Fred C. Lee, “High Inductance Density Low-Profile Inductor Structure for Integrated Point-of-Load Converter”, 2009 IEEE Applied
Power Electronics Conference and Exposition (APEC), Washington, District of Columbia, Feb. 15 – 19, 2009, pp. 1011 – 1017.
Dongbin Hou, Yipeng Su, Qiang Li, Fred C. Lee, “Improving theEfficiency and Dynamics of 3D Integrated POL”, IEEE AppliedPower Electronics Conference and Exposition (APEC), 2015,pp. 1011 – 1017.
Ø FlakeComposite is suitable to demonstrate the proposed advantage of “Lateral flux” inductor design.
Ø As inductor goes thinner, the advantage of “Lateral flux” inductor structure should be more prominent.
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0
10000
20000
30000
0 1 2 3 4 5 6
L x
Imax
/ DC
R(nH
A/m
Ω)
Inductor Height(mm) Imax 20A
Benchmarking Result
Met
alCo
mpo
site
FlakeCompositeLateral flux
MnZ
nFe
rrite
Good
Ø The advantage of FlakeComposite Lateral flux inductor becomes prominent as the inductor height goes lower.
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Storage Result (N=22)
-50℃ 1000h Pass
150℃ 1000h Pass
Unbiased HastWith MSL 3Pre-Conditioning
130℃85% 96hPass
33.3psia(2.3atm)
JESD22-A119 JESD22-A103 Condition B
Heat Cycle-65⇔150℃ 500cycle Pass
JESD22-A104 Condition C Soak Mode 4
JESD22-A118
MSL test (Level 1)Pre-bake 125℃ 24h
PassMoisture Soak 85℃85%RH 192hReflow 260℃ x 3
J-STD-020E
Reliability Test Example (On samples to CPES)Sample StructureTin plated lead frame and Cu pins
(without insulation coating) are attached on the FlakeComposite core. Image
Hi Temp and Humidity85℃85% 1000h Pass
MIL-STD-202 Method 103
• Acceptance Criteria: Change of Ls, Rs and
DCR<10% pre-test to post-test.No cracks, chips or
discoloration
Ø AEC-Q200 compatible.(RoHS2.0, Halogen free, REACH compliant.)
13mm
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Application Target
PCB embedded inductor to minimize:- PCB board area.- parasitic inductance of Cu trace.
Power Inductors
Ferrite FlakeCompositeTM
40% height reduction with FlakeComposite inductor.
Embedded noise shielding layer
Flexible shielding layer (for WPT)- Combined with PCB embedding technology.
FlexSuppressor® Flex "Embedded" Suppressor
Magnetic Sheets
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n Material characteristics of FlakeCompositeTM ,in comparison with existing magnetic materials.
-Permeability, magnetic saturation, core loss, etc.
n Inductor performance benchmarking.
n PCB embedded inductor test fabrication result.
© TOKIN 2018 Confidential
Y. Su, W. Zhang, Q. Li, F. C. Lee, and M. Mu, "High frequency integrated Point of Load (POL) module with PCB embedded inductor substrate," in Energy Conversion Congress and Exposition (ECCE), 2013 IEEE, 2013, pp. 1243-1250.
PCB Embedded Inductor Demonstrated by CPES
Ø Under the testing of similar prototypes.
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PCB Embedded Inductor Prototype
2 turn
Upside Downside
DCR2.8mΩ
3 turn
Upside Downside
DCR4.4mΩ
With insertedpins
0.8mΩ
With insertedpins
2.1mΩ
0
50
100
150
200
250
300
350
0 10 20 30 40L(
nH)
@1M
Hz
Idc(A)
2 turn
3 turn
t2.5mm11
mm
12mm
Embedded core size9 x 8 x t1.5mm
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0
10
20
30
Cou
nt
L(nH, 1MHz)
0
10
20
30
Cou
nt
L(nH, 1MHz)
Dispersion of Inductance , |Z|
0
25
50
75
100
125
150
1 10 100 1000
L(nH)
Frequency(MHz)
1
10
100
1000
1 10 100 1000
|Z|(Ω)
Frequency(MHz)
0
100
200
300
1 10 100 1000
L(nH)
Frequency(MHz)
1
10
100
1000
1 10 100 1000
|Z|(Ω)
Frequency(MHz)
2 turn (n=100)
3 turn (n=100)
10%
3σ
3σ
+10%Ave.
125nH
Ave.277nH
10% +10%
SRF=400MHz
SRF=250MHz
Ø Tight tolerance of inductance is readily achieved in test fabrication.
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Summary
Ø FlakeCompositeTM is:-Thin, Flexible, PCB-embed-enabling, -High permeability at multi-MHz swithcing frequency,-High-saturated magnetic moment than ferrite,-High temperature tolerant
soft magnetic material for power supply application.
Ø We believe this material will contribute to the miniturization of electronic circuits, especially in:
- DC/DC converters,- Wireless Power Transfer system.
Ø We are continuing to scale-up this technology for use in several applications.
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Thank you very much for your attention.
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Back Ups
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MnZn ferrite NiZn ferrite FlakeComposite
Permeability 1000~10000 50~1000 300
Bs (T) <0.55 <0.5 >0.7
Core loss(kW/m3)(1MHz,Bm20mT)
<50 500(typ) 500
Resistivity (Ω cm) <1k >100M >100k
Curie Temperature(℃℃) <250 <300 >450
Specific weight(g/cc) 4.8~5.0 4.9~5.1 5.0
CTE (10-7/℃℃) 120 150 100 In-plane120, Out- 90
CTC (W/m k) 10 16 In-plane18, Out- 2
Magnetic anisotropy None None High µ only in-plane
Comparison to ferrite
PCB embed No. (Brittle) Yes. (Flexible)
Plane compression tolerance No >0.7t/cm2
RoHS2.0, Halogen free,REACH compliant.
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Applied Power Electronics Conference and Exposition (APEC), 2015 Thirtieth Annual IEEE, 2015, pp. 140-145.
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105min 4 presenters25min/man