New Products Brochure
-
Upload
erick-young -
Category
Documents
-
view
25 -
download
1
Transcript of New Products Brochure
Specification (Typical Value)
Dimension
CSP SMD LEDs 12-15W :
. Compact LEDs with high Power,narrow chips gap 0.1mm;
. Eutectic bonding on Ceramic base, high conductivity ;
. Phospher film coating on vertical chips,even light output ;
. One binning , same lighting effect;
. RoHS certified material .
Specification (Typical Value)
Dimension
CSP SMD LEDs 10-20W :
. Compact LEDs with high Power,narrow chips gap 0.1mm;
. Eutectic bonding on Ceramic base, high conductivity ;
. Phospher film coating on vertical chips,even light output ;
. One binning , same lighting effect;
. RoHS certified material .
Specification (Typical value)
Dimension
C3535 RGBW 3-5W :
. Compact light source,only 0.1mm between chips ;
. Symmetrical package, higher color-mixing effect ;
. Eutectic bonding with vertical chips, Lower thermalresistance ;
. RoHS certified .
C2525 SMD LEDs 1-3W:
. Ceramic base with higher heat conductivity;
. . Eutectic bonding, Lower thermalresistance;
. High stablity & efficiency ;
. Smaller package size ;
. RoHS certified.
Specification (Typical value)
Dimension
C6065 SMD RGBW / White 60W:
. Compact High power SMD LEDs, Smaller LES 3.0×3.3mm;
. Eutectic bonding with thermal-electric isolation ceramic base;
. Using vertical chips covered with glass ;
. 4.5A forward current to get high lumen output & high density ;
. RoHS certified materials .
C6070 SMD 7in1 25W:. Compact high power LEDs, single control 7 chips in Dia. 4 mm ;. Eutectic bonding package on thermal-electric isolation, ceramic MCPCB, higher conductivity ;. Vertical chios covered by extra-thin glass optics ;. Homologous anode/cathod, easy for PCB designning ;. RoHS certified material .. RoHS certified material .
Specification (Typical value)
Dimension
Dual-White COB 8-50W:
. Dual CCT COB LEDs, extraordinary color-mixing & color
temperature tunning from 2700K-6500K;
. Using superconductivity Al.122W/m*k, higher stability &
lower thermal resistance;
. Eutectic bonding package with CSP chips ;
. Phospher filling to ensure uniform light effect & anti glare ;. Phospher filling to ensure uniform light effect & anti glare ;
. Binning @ 85℃, close to actual using conditions ;
. RoHS certified material .