NeSSI*: Enabling Technology for µAnalytical Transducers

Pittcon 2002 - New Orleans, USA - Mar 20, 2002

Rob Dubois - Peter van Vuuren - Jim Tatera .

C PΛ C

“the best way to predict the future is to create it”

Tatera and Associates

*New Sampling/Sensor Initiative

Courtesy of Owen Beattie,

University of Alberta, Canada

Q. Is Process Analytical frozen in time?

A. No! A renaissance is in progress.

John Torrington Chief Petty Officer on the HMS Terror - preserved in the permafrost. Victim of lead poisoning. ”The Franklin Expedition” d. 1846 (age 20)

3

Tutorial Outline

z Introduction, Drivers & Historyz A Vision and the Market Trendsz NeSSI Generation I and II comparisonz 7 Elements of a NeSSI Generation II Systemz What will a Generation II prototype look like?z Opportunities for microanalyticsz NeSSI Roadmap & Summaryz How do I get involved with NeSSI?

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NeSSI Initiative

z An ad hoc global industry initiative, formed in June, 2000 to drive permanent change in Process Analysis.y NeSSI mail-out has now grown to 250+ subscribersy Composed of End Users, Manufacturing Companies,

Integrators

z Sponsored by the Center for Process Analytical Chemistry (CPAC) - legal umbrella

z Originated from various CPAC focus sessions z IFPAC 2000 plenary paper presented NeSSI visionz Focus Groups and Workshops

y Pittcon 2000; ISA Expo 2000; IFPAC 2001, Pittcon2001, CPACT Edinburgh, ISA Analytical Division, ISA 2001, IFPAC 2002

z Tutorials:y ISA2001 Houston, INTERMAC 2001 Tokyo,

Pittcon2002

A Brief History of

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NeSSI Objectives

z Facilitate the acceptance/implementation of...y modular, miniature & smart process analytical

technologyz Promote the concept of...

y at the pipe/field-mounted (“byline”) analytical systems

z Lay the groundwork for...y open connectivity communication architecture

z Provide a technology bridge to the process for...y “sensor/lab-on-a-chip” microanalytical devices

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The drivers for change...

z Reduce Cost to Buildy Design and Engineeringy Manufacturing and Installation

z Reduce Cost of Ownershipy Design Standardizationy Simpler, less expensive maintenance

z Enhance Reliabilityy Validate sample, data, communication

Market AcceptanceLower CostEase of DesignSystem Reliability

Time

What’s going on in the world?What’s going on in the world?

On the Post

AnalyzerHouse

NeSSI

Technology Explosion!

• Fast networks; robust electronics

• Lab-on-a-chip; lasers; wireless

• Open software platforms

What does the Market Need?

• Reliable, rugged, low cost & fast

What are the Critical Issues?

• Adoption of standard footprint

• Component Availability

1938 2000

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Process Analytical systems have been accused of being...

z complexz expensivez proprietaryz “big box”

(battleship)z hi maintenancez suspect

regarding data integrity

z slow to changePhoto Credit: Erich Lessing/Art Resource, NY

Edvard Munch, The Scream.National Gallery, Oslo, Norway.

© 2000 The Munch Museum, The Munch-Ellingsen Group, Artists Rights Society, New York

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Project Segmentation

Gen III

Gen II

Gen I Mechanical (mostly)

Electrical/Smart (Diagnostic)

MicroAnalyticalValue

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Gen I - Standardize on a miniature, modular system

z “Borrowed” from the semiconductor industry

z LEGO® like designz ISA Standard

y rugged

Courtesy of CIRCOR

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Elastomer Seals are desired in HP Industries

Courtesy of the Swagelok Co

Manufacturers…

• Parker-Hannifin

• Autoflow

• CIRCOR

• Kinetics

• Swagelok

• Fujikin

What is ISA SP76?

Copyright 2001 ISA. All rights reserved.

Reproduced and distributed with permission of ISA.

Note: Draft provided for promotion

only.

Refer to ISA SP76.

Imagine the Future after

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Vision: The End of the Analyzer House System

An Analytical SystemAn Analytical System...Will Look More Like Us!

z Single Processor - Overall Controly Sensor Analytical Manager (SAM)

z System will be Multifunctionaly Equal emphasis on all sensors

z System will be Adaptabley Predictive maintenance; self-healing

z Capable of Multivariate Analysisy Use many sensors for analysis

Courtesy of Ken Creasy, Honeywell. IFPAC 2001

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Gen. I versus Gen. IIFeatureSignalProtection MethodsClassificationSensorsIntelligenceControl PhilosophyRegulating Comp.Passive Comp.ActuatorsHeatingWiring

Generation I4-20 mAPurgeDiv 2Non-substrateLimitedCentralizedSelf-containedMechanicalStand-aloneExternalConduit/Cable

Generation IISerial BusISDiv 1SubstrateSmartDistributed (SAM)PID control loopsElectro-mechanicalSubstrate MountSubstrate integratedIS Wiring

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Generation II Dimensions- 7 Elements

z 1. Heated Substratez 2. Physical t-Sensorsz 3. Combi Valves

z 4. SAM ☺z 5. PC with HMI

z 6. IS Multi-drop busz 7. Enclosure

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1. Heated, Programmable Substrate

AC PowerAC Power

Conduction Heating- cartridge heater(s)

- over-temperature cut-off

Furn. by

substrate mfg.

Heating Fluids

(alternative)

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2a. Physical Sensors for System Diagnostics

z Doing analytical is not good enough!z Miniature Flow, Pressure, Temperature

y Gas and/or liquid servicey Rugged constructiony Intrinsically Safe (IEC Ex ia)y Div/Zone 1 Gp A-D; T4 (135 C)

A/D

COM

FLOW:

∆ P, coriollis,

thermal, other?

Substrate

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2b. Conceptual Sensor for NeSSI

Process Cavity- no unswept voids

- low volume

BARRIER- Process Seal- Electrical Isolation- Thermal

Insulation Skirt- engineered

A/D

Comm.

SensorBase

- pressure rated

µP

Mem

ory

Body- encapsulated

“Top Hat” Comm. Chip

A

Port- standard size/pin

- daisy chain

1.50”

Digital “Smart” Sensor- engineering units

- memory

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3a. Electrical Actuators on the Substrate - COMBO

z Miniature substrate mounty Gas and/or liquid servicey Wide P & T servicey Intrinsically Safe (IEC Ex ia)y Div/Zone 1 Gp A-D; T4 (135 C)

COMBO Valve /w integral solenoid

SV

Comm.

Act.

AIR

On/Off andProportional

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3b. Conceptual “Combo” Valve

A

Actuator

Instrument Air

ValveVent

Vent

Comm.

D/ASolenoid

Conventional pneumatic valve

“TopHat” Comm. Chip

3-way “pilot” solenoidvalve - Intrinsically Safe

Actuator- NO or NC

Engineered InsulationSkirt

Port- standard size/pin

- daisy chain

Digital On-Board

Thermal Barrier

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4a. Introducing SAM “I do 5 jobs!”

Gateway to an Ethernet LAN

- OPC perhaps

Host to a

Sensor/Actuator Bus

Field Interface

- Graphical

- Wireless

- e.g. Bluetooth™, 802.11

Software Applets for

Sample System

Repetitive Tasks

(Industry Common)

“Open” Development Space for Custom Software

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4b. Standalone “SAM” - Wired Sensor/Actuator Bus

SensorAnalyticalManager(SAM)

Analyzer System Ethernet LAN

PLegend:

Pressure Sensor Temp SensorValve/Actuator Analytical Sensor

VA

T

PC or Analyzer Controller

VTP

A

?☺

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4c. Embedded SAM - Wired Sensor/Actuator Bus

Analyzer System Ethernet LAN

PLegend:

Pressure Sensor Temp SensorValve/Actuator Analytical Sensor

VA

T

VTP

A

?Analyzer Controller

w/ Embedded SAM Functionality

☺

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4d. SAM “Pick-list” for Common Sampling Tasks

4Zero & span validation4Pressure regulation4Temperature monitoring3Stream switching4Maintenance diagnosticsz Interoperability

y talk to all analytical systemsSAM

Enabling Technology

for microAnalytical

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5. PC/PDA Graphical HMI (Human Machine Interface)

F Vv T P

☺

FVvA

HMIPersonal digital

assistant

PC

Hello?

Vv=automatic valve; P=pressure sensor; F=Flow Sensor; A=Analytical Sensor;T=Temp. Sensor

☺HMI

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6. Serial Multi-drop Bus -“Au Revoir 4-20 mA?”

z CANbusy DeviceNet, SDS, etc.y Intrinsically Safe

z Engineering units on board sensors

z Reduces wiring loady multi-drop

z Eliminates I/Oz Rugged, low cost

VTP

A

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7. Enclosure“X-team” Haz. Review Process

AC Power

Div/Zone 1GP. A-D, T4

Enclosure- NEMA 4/IP56 Rated- all climate operation- no purges- no X-proof tubs- low cost of operation

Sensor Bus

Intrinsically Safe (IEC Ex ia)- no gas “sniff” tests req..- allows hot disconnects- plug & play

Heaters- Substrate & Enclosure- IEC Ex d- programmable temp.

AC Power

Designed forGlobal Use

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Gen. II“Get on the substrate (bus)!”

A

Actuator

ValveVent

Vent

Comm.D/A

SolenoidFlow Sensor

A

A/D

Comm.

µP

Mem

ory

“combi” valve

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Programmable Substrate Heater

Let’s build a Gen II system

VP

A

F

Ethernet LAN

Analyzer

Controller

SAM

CANbus

PDA

Auxiliary Heating/Cooling

SubstrateT

T

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Gen III Wireless SignalAnalyzer System Ethernet LAN

VTP

A

z Eg Bluetooth , 802.11z Plug and Play!z Power Supplied by...

y X-proof or IS miniature power bus

SensorAnalyticalManager(SAM)

☺

P.S.

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Generation IIIPlug & Play µAnalytical

F Vv T

☺

A

SAM

Fiber Optic

ATOne sensor

per component“lab on a chip”

One Sensor and Multiple Analytes

A

Ethernet

Transducer Bus

Enabling Technologyfor µAnalytical - GC-on-a-chip

- micro MS

- chem. sensors

Application Ranges Notespecific Compounds/Properties

Moisture in gases/vapours 0-1 PPM; 0-10 PPM; 0-100 PPMv/v

Moisture in liquids 0-10 PPM w/w; 0-100 PPM w/wOxygen 0-1 PPM; 1-10 PPM; 0-100

PPM; 0-1%; 0-25%; 0-100%ranges (typ.)

Mini pH liquidDissolved oxygen liquid

Conductivity liquidORP liquid

Hydrogen PPM, hi and low percentSulphur PPM; PPB

LEL 0-100 LELElectrochemical sensors component specific

Multi-Analyte TechniquesMiniature spectrometers: Includes UV, VIS, IR, NIR TDL

and Raman - scanningMiniature mass spectrometers Time of Flight, others…Gas chromatograph module

Some examples of MicroAnalytical Sensors Wanted

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Keys to development

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Don’t (re)invent…leverage existing standards

z Make use of existing connectivity and communication...

x Ethernetx OPCx CANbusx wireless e.g. Bluetooth™ x WEB servers/Internet

Personal Digital Assistant (PDA)

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Communicate…globally!

z Internationaly Europe, Japan,

Canada, USA

z Consortiay CPAC, CPACT

z Upcomingy ISA - AD 2002

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Design & certify to globalrequirements...

z NEC, UL, FM (USA)z CEC, CSA (Canada)z CENELEC (Europe)z ATEX Directive

(Europe)z CE Markz JAPAN, ASIA…

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Around the Loop: The New Sampling/Sensor Initiative

CONTROL MAGAZINE

Great publicity...

“It's estimated that 70-80%

of analyzer outages can

be traced to the sample system”Terrence McMahon

August 01, 2001

Also ISA InTech Magazine; Chem. & Eng. News

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New Developments

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NeSSI Analyzers - here today

Courtesy of Panametrics & Swagelok Courtesy of Rosemount Analytical

Courtesy of Rosemount AnalyticalCourtesy of Panametrics & Swagelok

Oxygen

H2O

pH

Conductivity

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Just announced...

Courtesy of Applied Analytics

MIR ATR

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Courtesy of Porter Instruments and the Swagelok Co.

MFC’s here today

y Porter Inst. (Div. 2)y Others…Gen Purpose

x Unit Instrumentsx Brooks

Undergoing

Certification

Today’s Typical Technology - Sasquatch Size

Armored rotametersand flow switches

Explosion ProofFittings

and Conduit SealsCustom each job

Skilled electricianMultiple fittings, valves

tubed by skilledinst. fitter

IS SolenoidValves and

Pneumatic Valves

Z-purge

assemblies

Courtesy of a major petrochemical facility

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Petrochemical installs...

Coutesy of a

gulf coast

petrochemical facility

Courtesy of an east coast petrochemical facility

and Parker-Hannifin

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What’s New - Generation II Specification

z Draft version now competez Global Review Teams in Progress

y X-team (hazardous areas)y C-team (connectivity issues)y A-team (simple applets)

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White Paper in Progress

z Driven by Honeywell Automationz Will adapt final NeSSI Gen II spec as

criteria for buildz Expand End Users, Manufacturers

y Looking for involvement!!

z 10-20 Gen II prototypes will be builtz DoE being approached for funding in June

Time (years)

03 04

NeSSI Roadmap

02

Mechanical Components e.g. filters, valves, etc.

Mechanical FieldInstallations

SP76 Substrate Available

NeSSI/CPAC Vision & Roadmap

2000

Design /Prototype - Gen II Smart/Heating/SAM

Smart Field Installations

MechanicalGen. I

Smart/”Electrified”Gen. II

µAnalytical & WirelessGen. III

01 0605

Rev. 1, Dec. 2001

µ Analytics/Sensors (e.g. laser based)/Wireless

Simple Analyzers (H2O, O2, pH, UV/VIS, etc.)

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References & involvement...

...a few references you may want tolook over.z The NeSSI portion of the CPAC web site at

www.cpac.washington.eduz The ISA Draft Standard - ISA Draft 76.00.02 , “Modular

Component Interfaces for Surface-Mount FluidDistribution Components--Part 2: Elastomeric Seals”

z "The New Sampling/Sensor Initiative", Terence K.McMahon, Control, August/2001, Vol XIV, No. 8, page158

z "Molding the Future of Process Analytical Sampling",Ellen Fussell, InTech, August/2001, page 32

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Acknowledgements I

z Dowy Danny Quevillony Reg Hartwigy Walt Hensleey Bac Vu (SP76)y John Leach IIy Craig Snook

z ExxonMobil Chemicaly Dan Podkulski (SP76)y Jeff Gunnelly John Cumbusy Rajko Puzic

z CPACy Mel Kochy Dave Veltkamp

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Acknowledgements II

y Doug Mitchell -Panametrics

y John Wawrowski, Rick Ales, Dave Simko -Swagelok

y Yoav Barshad -Applied Analytics

y Nick van Bruggen -Porter

y Gary Frank, Raj Adani- Kinetics

y CD Feng - RosemountAnalytical

y Bob Nickels, Ulrich Bonne, Ken Creasy -Honeywell

y Chris Towle/Don Long - MTL

y Steve Doe - Parkery X-Team

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A parting thought...

"When men got structural steel, they did not use

it to build steel copies of wooden bridges."

Ayn Rand. Atlas Shrugged. 1957.

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Summary...Enabling technology for...

y Miniature physicalsensors

• Flow• Temperature• Pressure

y Miniature chemicalsensors

x “lab-on-a-chip”

y Component Mfgs.x Calibrators, pumps &x dryers, etc.

Courtesy of Mass-Sensors Inc.