Need of Quality Engineering and Failure analysis Techniques

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M. S. Ramaiah School of Advanced Studies 1 M. Sc. (Engg.) in Electronics System Design Engineering GREESHMA S CWB0913004 , FT-2013 9 th Module Presentation Module code : ESE2515 Module name : Mechanical Aspects of Electronic System Design Module leader : Mr. Ugra Mohan Presentation on : 25/08/2014 Need of Quality Engineering and Failure analysis Techniques

Transcript of Need of Quality Engineering and Failure analysis Techniques

Page 1: Need of Quality Engineering and Failure analysis Techniques

M. S. Ramaiah School of Advanced Studies 1

M. Sc. (Engg.) in Electronics System Design Engineering

GREESHMA SCWB0913004 , FT-2013

9th Module Presentation

Module code : ESE2515Module name : Mechanical Aspects of Electronic System DesignModule leader : Mr. Ugra Mohan Presentation on : 25/08/2014

Need of Quality Engineering and Failure analysis Techniques

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Overview

FAT

1.INTRODUCTION

2. Importance of Failure Analysis

3.Classification of tests to capture failures

4. Failure Analysis for Electrical Overstress [EoS]

5. Failure Rate Curve

6. Role of FA in Electronic Component

7. FA Techniques

QE

1.INTRODUCTION

2.Authors View

3.Taguchi Loss Functions

4.Taguchi Robust Design

5. Examples

• REFERENCES• CONCLUSION

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Introduction

THE overall objective of quality assurance is customer satisfaction. Conformance to customer

requirements is a basic requisite for this. Quality of delivery and dependability are the major

properties used in the quality evaluations

Quality engineering results in reliable products that meet the needs of the user, performs its

mission without variation, increases combat capability and has low monetary losses

The quality engineering concepts developed by Genichi Taguchi are the key to making the

seemingly incompatible goals of achieving high reliability and maintainability for future weapon

systems at reduced development, production, and operation costs

Taguchi’s quality engineering process was used in the conceptual design of a unique flight

vehicle

From the viewpoint of quality engineering, the downstream quality problems of a product are

symptoms of its functional instability (lack of robustness)

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Authors View

► Different authors have given various definitions of QE. Krishnamurthy [1] defined the term QE

as: the discipline that includes the technical methods, management and costing approaches,

statistical problem-solving tools, training and motivational methods, computer information

systems, and all the sciences behind them that are needed for designing, producing and delivering

products and services to satisfy customer needs

► Taguchi [1] described quality engineering as the technique used to improve performance and

reduce functional variations caused by three types of noises, namely, environnemental conditions

(outer noise), deterioration (inner noise) and manufacturing imperfection. He noted that the overall

aim of quality engineering is to produce products that are robust to all noise factors. Taguchi

separates quality control activities into two parts, which are off-line quality control and online

quality control

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► Gaspersz [1] defines quality engineering (QE) as the analysis of a manufacturing system at

all stages to maximize the quality of the process and the product it produces. QE have become

very important in every organization including whether manufacturing industry, ceramic and

paint industry, chemical manufacturer, hospital, education, business and others, and there are

many tools and techniques created to be implemented in order to be leader among their

challenge

► Quality engineering may be defined as follows: 'Engineering work related to the

conformance of the output of a production line with specification. It involves the design of

quality systems and the investigation of nonconformance with feedback for corrective action.

This can only be achieved by creative interaction with the other functions in a manufacturing

unit

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that excessive variation lay at the root of poor manufactured quality and that reacting to

individual items inside and outside specification was counterproductive. understanding

of quality costs in various situations

Loss Functions by Taguchi

Figure 1: A Comparison of Methodologies [2] Figure 2: Taguchi Loss Function[2]

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Taguchi Robust Design

Figure 3: Taguchi Robust Design[2]

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Examples

Improves overall quality, improves programs, initiatives root cause and Manufactured practices,Improved Productivity,

Table 1: Examples of Taguchi QE and Robust Design [1]

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Introduction

Failure Analysis (FA) is a process of collecting and analyzing data to determine the cause

of failure. E.g. Failed components are taken for analysis and determine cause of the failure

using a wide array of methods and techniques

Failure analysis engineers often play the lead role in this department

Types of failures can be due to component, manufacturing or during production processing

Failure analysis (FA) capability supports the development of semiconductor technology and

packaging. Failure analysts need new techniques and advanced equipment to match the rate

of Moore's Law so that problem solving can remain efficient and accurate

Moore's Law is the observation made in 1965 by Gordon Moore, co-founder of Intel, that

the number of transistors per square inch on integrated circuits has doubled every year since

the integrated circuit was invented

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Importance of Failure Analysis

• Electronic parts, why they fail?

• Preserve failure mechanism, don’t loose

(Carelessness)

• Failure of Critical applications e.g. Space

satellite systems

• Big loss due to chain reaction

Figure 5: Chain reaction [3]Figure 4: Failure Mechanism [FRACAS] [3]

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Classification of tests to capture failures [5]

• Environmental Tests

Temperature operating conditions, corrosion etc

• Mechanical Tests

Packaging, Materials, insulation resistance etc

• Electrical Tests

Electrical overstress, ground bounce etc

• Test Procedure, analysis and results

Documentation of the overall results, analysis and the desired modifications

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Failure Analysis for Electrical Overstress [EoS]

• EOS- Thermal damage due to V or I beyond

limit specification

• Trace VI curve for i/p’s of each part “ part

characterization”

•Causes: [4]

a. Poor grounding

b.EMI

c. Uncontrolled supply

d. latchup

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Failure Rate Curve

Figure 6: Failure Rate Curve [4]

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Role of FA in Electronic Component [4]

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FA Techniques [5]

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Conclusion

To prevent thermally- induced failures in electronic systems and to achieve a high reliability

of operation quality engineering is needed. Loss function, robust design clearly signifies the

QE role. FRACAS failure mechanism , EoS , Failure rate curve focused on need for failure

analysis.

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Reference

1. Jinyu Wang (2008). Robust Design Method in Quality Engineering and Its Application. China:

School of Economy and Management,. 2570-2576.

2. Ed Pohl (2009). SYSTEM DESIGN WITH QUALITY ENGINEERING. Usa: Wright-Patterson

AFB. 26-38.

3. Walter Willing, Jonathan Fleisher & Michael Cascio (2012) ,“Electronic Part Failure

Analysis Tools and Techniques” Northrop Grumman Corporation, USA.

4. ITEM Software, Inc (2007) ,“Reliability Prediction Basics” USA.

5. Jim Glancey (2006), “Failure Analysis Methods What, Why and How” USA.

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Thank You