NBMC Workshop: Flexible Hybrid Sensor Integration ... · Flexible Hybrid Sensor Integration:...

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Flexible Hybrid Sensor Integration: Combining Sensors with Flexible Electronics

Sensor Technology and Systems Integration for Human Performance & Health Devices Workshop

October 17, 2014 Northeastern University

©2014 American Semiconductor, Inc. All rights reserved.

Printed & Silicon: Strengths and Weaknesses

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Flexible Development Has Focused on Printed Technology

Printed is great for displays and sensors!

However…

Printed transistors are too big for ICs Printed transistor dimensions are measured in microns; semiconductors are measured in nanometers

Printed transistors are not dense Dense printed transistors are measured in tens or hundreds; ICs are measured in millions

Printed transistors are not fast

Printed transistors are not low power

Traditional Semiconductors Are Not Compatible with Printed/Flexible

ICs are great for processors, memory, and SoCs

However…

Packaged ICs are relatively large ICs are thick and too big for flexible systems

Packaged ICs do not bend or conform ICs are not designed for flexible electrical or mechanical connections

ICs are not flexible Silicon IC die are fragile and not physically flexible

ICs are not suitable for large areas The cost per area of silicon is high


Physical Sensor

Display

Bio Sensor

Comm

ADC µCtrl

Data Bus or Wireless

Flexible Hybrid Systems Span Multiple Markets

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Flexible Hybrid System “Combination of flexible printed materials and

flexible silicon-based ICs to create a new class of flexible electronics.”

Printed Electronics Low Cost, R2R, Large

Format

Flexible FleX ICs High Performance, High Density

Automotive/Aerospace: − Conformal − Structural Integration − Sensors − Fly-by-Feel Smart Cards:

− SIM/PIV/CIV − Identity − Finance − Contacted − Contactless

Consumer: − Tablets − Phones − Wearable − TVs − Gaming − Toys

Bio Medical: − Body Worn − Monitoring − Health & Safety

Printed Electronics • Sensors & Displays • Low Cost • Large Format • Roll-To-Roll or Screen Print

FleX-ICs • Logic, Memory, Signal Processing,

Communications • Physically Flexible CMOS • High Performance • High Density • Compatible with Printed Electronics


LG Chem has curved batteries in production, ready for 'phones, watches and glasses' LG Chem, a leading battery manufacturer, is ready to unveil batteries that have not existed before. The types of LG Chem's future batteries can be categorized as the following. Stepped Battery, Curved Battery and Cable Battery.

Smartphone Makers Race to Build Flexible Screens Samsung Electronics Co. and LG Electronics Inc. released curved-screen smartphones within weeks of one another, raising one obvious question: why would anyone want curves on their phone? The answer, it turns out, doesn't seem to matter much to the two South Korean technology giants themselves, who see curved-screen phones as a steppingstone to the real prize: mobile and wearable devices with completely bendable screens...

LG confirms production of 'bendable and unbreakable' smartphone displays "The flexible display market is expected to grow quickly as this technology is expected to expand further into diverse applications including automotive displays, tablets and wearable devices.,“said Dr. Sang Deog Yeo, Executive Vice President and Chief Technology Officer of LG Display.

5

The Ecosystem for Flexible Devices Exists Now!


FleXform™ Development Kit Market release scheduled Dec 2014

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FleXForm: Flexible development hardware – FleX-MCU on a flexible demo board – Standard connectors for interfacing to

PC and prototyping boards – Flexible, printed display and buttons – Voltage regulators – Serial EEPROM

FleXform: Software & Documentation

– C-compiler and assembler – Product specifications – User’s guide – Data sheet – Demonstration software

PRODUCTS are what our industry needs Products require concept demonstrations Capability is needed to enable product development FleXform is a kit platform for product developers

New Technology: FleXform


FleXform™ Development Kit

7

User Printable

Sensor Region

User Flexible Display Region

FleX-MCU

7

Ribb

on C

able

ZIF

Conn

ecto

r

Connections to printed pads made by user or ASI. Software and Documentation

C-compiler & Assembler EEPROM Programming

User’s Guide & Specifications

User prints or applies flexible sensors and/or

displays.

54 mm

85 mm

50 mm

User makes connections to from user device to existing printed pads.

FleX-MCU 5mm X 5mm

8-bit RISC CPU 8KB SRAM, 2KB ROM

UART, SPI, I2C 18 I/O – 2.5V CMOS

Prototyping Board PC interface

EEPROM for User Code

Voltage Regulators

FleX ADC

FleX-ADC 8-bits

8 input channels 100ksps

I2C comm to MCU

Support for this work has been provided by AFRL FA8650-14-C-5010

©2014 American Semiconductor, Inc. All rights reserved. 8

User are for IO intensive devices and flexible displays

User area for sensors and I2C devices

FleXform™ Development Kit



FHS (Flexible Hybrid System) Manufacturing Demonstration

9

The industry SOTA development for hybrid systems is focused on die attach and electrical interconnect for printed and conventional materials.

American Semiconductor & Soligie have successfully demonstrated a solution using anisotropic adhesive to mechanically adhere die to substrate as well as make electrical connections to printed substrate traces

Printed Substrate • Physical dimension: 6” x 0.85” • Material: PET • Thickness: 5mil (127um) • Traces: Silver nanoparticle ink • Dielectric overcoat (green) • ZIF Connectors

Die (Mechanical Test Die) • Replica of FleX-MCU • Physical dimension: 5mm x 5mm • Thickness/material: 2mil (51um) PET • Number of pads: 68 (17 per side) • Pad size: 200um x 200um • Pitch: 260um

Rainbow™ Hybrid Test Coupon (AS_MEC4001.FHS)



“Rainbow™” FHS Assembly

BOM: FleX test die FleX-MCU – flexible IC Flexible printed circuits Rainbow demonstrator

Rainbow Demonstrator: Development tool Fully flexible demonstration Electrical verification of

assembly methods Verification/demonstration of

MCU capability

10

Rainbow demonstrator for Flexible Hybrid System (FHS) demonstration

of FleX-MCU™

Purpose: Assembly Technology Development (demonstrate FHS manufacturing)


FleX-RFIC™ Demonstration Proprietary Information 11

Product Overview • IP-X™ TTO protocol • Programmable via 2-wire I2C

interface • 860-960MHz (UHF) • 64-bit unique identification

(UID) including 16-bit CRC • 0.1m–10m read range • 64kpbs or 256kpbs • Anti-collision protocol


FleX-IC™ and FHS Product Roadmap

12

FleX-MCU™ 8-bit RISC, 1.2V core, 2.5V I/O, 8K SRAM, UART, I2C, SPI; Sampling 2014

FleX-MCU™ With FleX-ADC and FleX-NVM onboard

FleX-ADC™ 8-bit Analog-to-Digital Converter 100k samples/s, I2C, 2.5V; Sampling 2014

FleX-RFIC™ 860-960MHz (UHF) IP-X™ TTO RFID 64-bit UID, 0.1m–10m range, Sampling 2014

FleX-LNA™ Low Noise Amplifier

FleX-NVM™ Non-Volatile Memory

In Process In Development Planning

FleX-ASIC Custom IC

Chipset for flexible product demonstration

FleXform 1

FleXform 2

Flexible Hybrid System Development Kit FleX-MCU, FCB, User Sensor and Display Connectivity, Sampling 2014

Flexible Hybrid System Development Kit FleX-MCU, FleX-ADC, FleX-RFIC, FCB, User Sensor and Display Connectivity, Sampling 2014

2

3

4

5

6


FleX Operational Amplifier 13

Product Overview • 2.5V CMOS Operational Amplifier • TowerJazz 180nm SOI CMOS with FleX option • High impedance CMOS inputs • Internally compensated for unity gain stability • >60dB gain • Adjustable bias input FleX-OpAmp Physical Specifications • Die Size: 2.4mm X 2.4mm • Pin Count: 6 • Pad Openings 160um X 160um • Pad Pitch 300um • Thickness 24-60um • Flexible Yes • Conformal Yes • Mass ~0.23mg Suggested Applications • Basic amplification and filtering of flexible printed sensor signals • Comparator for threshold or button detection

+

-

Bias

In+ Out

In-


Flexible Electronic Products and Services

14

Corporate Headquarters – Boise, Idaho, USA Engineering – Design, Process, Modeling FleX™ Silicon-on-Polymer™ Mfg and Assembly Test & Characterization Cleanroom Sales, Marketing, Administration

Process Engineering Center – Santa Clara, CA

Manufacturing – pilot FleX operations

Small Business Privately Held Founded November, 2001

Product Lines FleX™ – IC, SoP, FHS (Flexible ICs) Custom Wafer Fabrication (TowerJazz & Cypress) IC Design Services – Conventional & Flexible

14

2007 Supplier of the Year

DoME 45nm CMOS

This work is sponsored by the Air Force Research Laboratory)

FleX™ CMOS

Rainbow™ CMOS

FHS

ASI is moving!

Thank You

American Semiconductor, Inc. 3100 South Vista Avenue, Suite 230

Boise, ID 83705 Tel: 208.336.2773 Fax: 208.336.2752

www.americansemi.com

© 2014 American Semiconductor, Inc. All rights reserved. American Semiconductor Inc., the American Semiconductor logo, Flexfet, FleX, and the Flexfet logo are trademarks of American Semiconductor, Inc. All other trademarks are the property of their respective owners.

[email protected] 208.336.2773

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