HY4008W/A

N-Channel Enhancement Mode MOSFET

1

Pin DescriptionF

•

•

•

•

TO-247-3L

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AW A : TO-3P-3LW : TO-247-3L

HOOYIHOOYI

HOOYI

reserves the right to make changes to improve reliability or manufacturability without notice, andadvise customers to obtain the latest version of relevant information to verify before placing orders.

Ordering and Marking Information

N-Channel MOSFETG

S

D

Note: lead-free products contain molding compounds/die attach materials and 100% matte tin platetermination finish; which are fully compliant with RoHS. lead-free products meet or exceed the lead-freerequirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature.defines “Green”to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight inhomogeneous material and total of Br and Cl does not exceed 1500ppm by weight).

Package Code

HOOYI

HY4008ÿYYXXXJWW G

HY4008ÿYYXXXJWW G

TO-3P-3L

GD

SG

DS

Applications

• Power Management for Inverter Systems.

• Switching application

2.9

eatures

80V/200A

RDS(ON)= mΩ (typ.) @ VGS=10V

Reliable and Rugged

Lead Free and Green DevicesAvailable

(RoHS Compliant)

100% avalanche tested

141225

G : Lead Free Device

Date Code Assembly Material

YYXXX WW

2.9

1736***

800**

80

HY4008

2

Absolute Maximum Ratings

Symbol Parameter Rating Unit

Common Ratings (TC=25°C Unless Otherwise Noted)

VDSS Drain-Source Voltage 80

VGSS Gate-Source Voltage ±25 V

TJ Maximum Junction Temperature 175 °C

TSTG Storage Temperature Range -55 to 175 °C IS Diode Continuous Forward Current TC=25°C 200 A

Mounted on Large Heat Sink

IDM TC=25°C A

TC=25°C 200 ID Continuous Drain Current

TC=100°C 153 A

TC=25°C 397 PD Maximum Power Dissipation

TC=100°C 199 W

RθJC Thermal Resistance-Junction to Case 0.38

RθJA Thermal Resistance-Junction to Ambient 40 °C/W

Avalanche Ratings

EAS Avalanche Energy, Single Pulsed L=0.5mH mJ

Note：

Electrical Characteristics (TC = 25°C Unless Otherwise Noted)

Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Static Characteristics

BVDSS Drain-Source Breakdown Voltage VGS=0V, IDS=250µA - - V

VDS=80V, VGS=0V - - 1 IDSS Zero Gate Voltage Drain Current

TJ=85°C - - 10 µA

VGS(th) Gate Threshold Voltage VDS=VGS, IDS=250µA 2.0 3.0 4.0 V

IGSS Gate Leakage Current VGS=±25V, VDS=0V - - ±100 nA

RDS(ON) Drain-Source On-state Resistance VGS=10V, IDS=100A - 3.5 mΩ

Diode Characteristics

VSD Diode Forward Voltage ISD=100A, VGS=0V - 0.8 1.2 V

trr Reverse Recovery Time - 30 - ns

Qrr Reverse Recovery Charge ISD=100A, dlSD/dt=100A/µs

- 52 - nC

Note：** Drain current is limited by junction temperature*** VD=64V

* Repetitive rating ; pulse width limiited by junction temperature

Pulsed Drain Current *

*

*

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HY4008W/A

-18

HY4008

3

Electrical Characteristics (Cont.) (TC = 25°C Unless Otherwise Noted)

Symbol Parameter Test Conditions

Min. Typ. Max. Unit

Dynamic Characteristics

RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 3.2 - Ω

Ciss Input Capacitance - 7398 -

Coss Output Capacitance - 1029 -

Crss Reverse Transfer Capacitance

VGS=0V, VDS=25V, Frequency=1.0MHz - 650 -

pF

td(ON) Turn-on Delay Time - 28 -

Tr Turn-on Rise Time -

td(OFF) Turn-off Delay Time - 42 -

Tf Turn-off Fall Time

VDD=40V, RG=6 Ω, IDS =100A, VGS=10V,

- 54 -

ns

Gate Charge Characteristics

Qg Total Gate Charge - 195

Qgs Gate-Source Charge - 31 -

Qgd Gate-Drain Charge

VDS=64V, VGS=10V, IDS=100A

- 75 -

nC

Note * : Pulse test ; pulse width ≤300µs, duty cycle≤2%.

-

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HY4008W/A

Typical Operating Characteristics

ID -

Dra

in C

urre

nt (A

)

Drain Current

0 20 40 60 80 100 120 140 160 180 2000

30

60

90

120

150

180

210

TC=25oC,V

G=10V

limited by package

Power Dissipation

Pto

t - P

ower

(W)

0 20 40 60 80 100 120 140 160 180 2000

40

120

200

280

360

TC=25oC

0.0001 0.001 0.01 0.1 1 10

0.0001

0.001

0.01

0.1

Thermal Transient Impedance

Square Wave Pulse Duration (sec)

Nor

mal

ized

Effe

ctiv

e Tr

ansi

ent

1

0.01

0.02

0.05

0.1

0.2

Duty = 0.5

Mounted on minimum padR

θJA : 40 oC/W

Single

4

TC -Case Temperature (°C)TC -Case Temperature (°C)

0.1 1 101

10

100

1000

100 400

Safe Operation Area

VDS - Drain - Source Voltage (V)

ID -

Dra

in C

urre

nt (A

) 100us

10ms

1ms

DC

Rds(on

) Lim

it

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HY4008W/A

440

5

Typical Operating Characteristics (Cont.)

VDS - Drain - Source Voltage (V)

ID -D

rain

Cur

rent

(A)

Output Characteristics

Tj - Junction Temperature (°C)

Gate Threshold Voltage

Nor

mal

ized

Thre

shol

dVo

ltage

VGS - Gate - Source Voltage (V)

RD

S(O

N) -

On

-Res

ista

nce

(mΩ

)

Drain-Source On Resistance

ID - Drain Current (A)

RD

S(O

N) -

On

-Res

ista

nce

(mΩ

)

Gate-Source On Resistance

0 50 100 150 200 250

2.0

2.5

3.0

3.5

4.0

4.5

5.0

1.5

VGS=10V

3 4 5 6 7 8 9 100

2

4

6

8

10

12

14IDS=100A

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HY4008W/A

200

0.0 1.0 2.0 3.0 4.0 5.0 6.00

40

804V

5V

4.5V

VGS

= 5.5,6,7,8,9,10V

120

160

240

280

320

-50 -25 0 25 50 75 100 125 150 1750.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6IDS

=250µA

40

6

Typical Operating Characteristics (Cont.)

VSD - Source - Drain Voltage (V)

Source-Drain Diode Forward

IS-S

ourc

eC

urre

nt(A

)

Drain-Source On Resistance

Nor

mal

ized

On

Res

ista

nce

Tj - Junction Temperature (°C)

Gate Charge

QG -Gate Charge (nC)

VGS

-Gat

e-so

urce

Volta

ge(V

)

0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.40.1

1

10

100

200

Tj=175oC

Tj=25oC

0 80 120 160 2000

1

2

3

4

5

6

7

8

9

10V

DS= 64V

IDS

= 100A

6000

VDS - Drain - Source Voltage (V)

C-C

apac

itanc

e(p

F)

Capacitance

0 8 16 24 32 400

1500

3000

4500

7500

9000

10500

Frequency=1MHz

CrssCoss

Ciss

12000

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HY4008W/A

-50 -25 0 25 50 75 100 125 150 1750.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

2.0

2.2

2.4

RON

@Tj=25oC: 2.9mΩ

VGS

= 10V

IDS

= 100A

7

Avalanche Test Circuit and Waveforms

Avalanche Test Circuit and Waveforms

DUT

0.01Ωtp

VDD

VDSL

IL

RG

EAS

VDD

tAV

IAS

VDS

tpVDSX(SUS)

VDD

RD

DUT

VGS

VDS

RG

tp

td(on) tr td(off) tf

VGS

VDS

90%

10%

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HY4008W/A

HY4008W/A

8 www.hooyi.cc

MIN NOM MAXA 4.90 5.00 5.10A1 2.31 2.41 2.51A2 1.90 2.00 2.10b 1.16 1.21 1.26b2 1.96 2.01 2.06b4 2.96 3.01 3.06c 0.59 0.61 0.66D 20.90 21.00 21.10D1 16.25 16.55 16.85D2 1.05 1.20 1.35E 15.70 15.80 15.90E1 13.10 13.30 13.50E2 4.90 5.00 5.10E3 2.40 2.50 2.60eh 0.05 0.10 0.15L 19.80 19.92 20.10L1 - - 4.30ΦP 3.50 3.60 3.70ΦP1 - - 7.30ΦP2 2.40 2.50 2.60Q 5.60 5.80 6.00SRT 9.80 - 10.20T1T2T3U 6.00 - 6.40θ1 6° 7° 8°θ2 4° 5° 6°θ3 1° - 1.5°θ4 14° 15° 16°

12.80REF

0.50REF

1.65REF8.00REF

SYMBOLmm

5.44BSC

6.15BSC

Package Information

TO-247-3L

HY4008W/A

9 www.hooyi.cc

TO-3P-3L

MIN NOM MAX

A 4.60 4.80 5.00A1 1.40 1.50 1.60A2 1.33 1.38 1.43b 0.80 1.00 1.20b1 2.80 3.00 3.20b2 1.80 2.00 2.20c 0.50 0.60 0.70D 19.75 19.90 20.05D1 13.70 13.90 14.10D2 12.90 REFE 15.40 15.60 15.80E1 13.40 13.60 13.80E2 9.40 9.60 9.80e 5.45 TYPG 4.60 4.80 5.00H 40.30 40.50 40.70H1 23.20 23.40 23.60h 0.05 0.10 0.15

L 7.40 TYPL1 9.00 TYPL2 11.00 TYPL3 1.00 REFP 6.90 7.00 7.10P1 3.20 REFP2 3.50 REFP3 1.40 1.50 1.60R 0.50 REFQ 5.00 REFQ1 12.56 12.76 12.96U 7.8 8 8.2θ1 5° 7° 9°θ2 1° 3° 5°θ3

SYMBOLmm

60°REF

HY4008W/A

10

Classification Profile

Devices Per Unit

Package Type Unit Quantity

TO-247-3L Tube 30

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TO-3P-3L Tube 30

11

Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly

Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts)

100 °C 150 °C

60-120 seconds

150 °C 200 °C

60-120 seconds

Average ramp-up rate (Tsmax to TP) 3 °C/second max. 3°C/second max.

Liquidous temperature (TL) Time at liquidous (tL)

183 °C 60-150 seconds

217 °C 60-150 seconds

Peak package body Temperature (Tp)*

See Classification Temp in table 1 See Classification Temp in table 2

Time (tP)** within 5°C of the specified classification temperature (Tc)

20** seconds 30** seconds

Average ramp-down rate (Tp to Tsmax) 6 °C/second max. 6 °C/second max.

Time 25°C to peak temperature 6 minutes max. 8 minutes max.

* Tolerance for peak profile Temperature (Tp) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.

Classification Reflow Profiles

Table 2. Pb-free Process – Classification Temperatures (Tc)

Package Thickness

Volume mm3 <350

Volume mm3 350-2000

Volume mm3 >2000

<1.6 mm 260 °C 260 °C 260 °C 1.6 mm – 2.5 mm 260 °C 250 °C 245 °C

≥2.5 mm 250 °C 245 °C 245 °C

Table 1. SnPb Eutectic Process – Classification Temperatures (Tc) Package

Thickness Volume mm3

<350 Volume mm3

≥350 <2.5 mm 235 °C 220 °C

≥2.5 mm 220 °C 220 °C

Reliability Test Program

Test item Method Description SOLDERABILITY JESD-22, B102 5 Sec, 245°C HOLT JESD-22, A108 1000 Hrs, Bias @ 125°C PCT JESD-22, A102 168 Hrs, 100%RH, 2atm, 121°C TCT JESD-22, A104 500 Cycles, -65°C~150°C

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HY4008W/A