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MOTOROLA CMOS LOGIC DATAMC14510B
352
Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î
Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î
Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î
Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
V – 55 C 25 C 125 C
Characteristic Symbol Vdc Min Max Min Typ # Max Min Max Unit
Output Voltage “0” Level
Vin = VDD or 0
VOL 5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
Vin = 0 or VDD
VOH 5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
Input Voltage “0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
Vdc
“1” Level
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIH5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
Vdc
Output Drive Current
(VOH = 2.5 Vdc) Source
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
IOH5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
mAdc
(VOL = 0.4 Vdc) Sink
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
IOL 5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current Iin 15 — ± 0.1 — ±0.00001 ± 0.1 — ± 1.0 µAdc
Input Capacitance
(Vin = 0)
Cin — — — — 5.0 7.5 — — pF
Quiescent Current
(Per Package)
IDD 5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
µAdc
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL
= 50 pF on all outputs, all
buffers switching)
IT 5.0
10
15
IT = (0.58 µA/kHz) f + IDDIT = (1.20 µA/kHz) f + IDDIT = (1.70 µA/kHz) f + IDD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
**The formulas given are for the typical characteristics only at 25 C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
PIN ASSIGNMENT
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
P2
P3
Q3
C
VDD
R
U/D
Q2
P1
P4
Q4
PE
VSS
CARRY OUT
Q1
CARRY IN
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MOTOROLA CMOS LOGIC DATA
353
MC14510B
Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î
Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î
Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î
Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î Î
SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25 C, See Figure 2)
All Types
Characteristic Symbol VDD Min Typ # Max Unit
Output Rise and Fall TimetTLH, tTHL = (1.5 ns/pF) CL + 25 nstTLH, tTHL = (0.75 ns/pF) CL + 12.5 nstTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,tTHL 5.0
1015
— — —
1005040
20010080
ns
Propagation Delay TimeClock to Q
tPLH, tPHL = (1.7 ns/pF) CL + 230 ns
tPLH, tPHL = (0.66 ns/pF) CL + 97 nstPLH, tPHL = (0.5 ns/pF) CL + 75 ns
tPLH,tPHL
5.0
1015
—
— —
315
130100
630
260200
ns
Clock to Carry OuttPLH, tPHL = (1.7 ns/pF) CL + 230 nstPLH, tPHL = (0.66 ns/pF) CL + 97 nstPLH, tPHL = (0.5 ns/pF) CL + 75 ns
tPLH,tPHL 5.0
1015
— — —
315130100
630260200
ns
Carry In to Carry OuttPLH, tPHL = (1.7 ns/pF) CL + 230 nstPLH, tPHL = (0.66 ns/pF) CL + 47 nstPLH, tPHL = (0.5 ns/pF) CL + 35 ns
tPLH,tPHL 5.0
1015
— — —
1808060
360160120
ns
Preset or Reset to QtPLH, tPHL = (1.7 ns/pF) CL + 230 nstPLH, tPHL = (0.66 ns/pF) CL + 97 nstPLH, tPHL = (0.5 ns/pF) CL + 75 ns
tPLH,tPHL 5.0
1015
— — —
315130100
630260200
ns
Preset or Reset to Carry OuttPLH, tPHL = (1.7 ns/pF) CL + 465 nstPLH, tPHL = (0.66 ns/pF) CL + 192 nstPLH, tPHL = (0.5 ns/pF) CL + 125 ns
tPLH
,tPHL 5.0
1015
— — —
550225150
1100450300
ns
Reset Pulse Width tw(H) 5.01015
360210160
18010580
— — —
ns
Clock Pulse Width tw(H) 5.01015
350170140
20010075
— — —
ns
Clock Pulse Frequency fcl 5.01015
— — —
3.06.08.0
1.53.04.0
MHz
Preset or Reset Removal TimeThe Preset or Reset Signal must be low prior to a
positive–going transition of the clock.
trem 5.010
15
650230
180
325115
90
— —
—
ns
Clock Rise and Fall Time tTLH,tTHL
5.01015
— — —
— — —
1554
µs
Setup TimeCarry In to Clock
tsu 5.01015
260120100
1306050
— — —
ns
Hold TimeClock to Carry In
th 5.01015
01010
– 50 – 15 – 5
— — —
ns
Setup TimeUp/Down to Clock
tsu 5.01015
500200175
25010075
— — —
ns
Hold TimeClock to Up/Down
th 5.010
15
– 70 – 30
– 20
– 140 – 80
– 50
— —
—
ns
Setup TimePn to PE
tsu 5.01015
– 50 – 30 – 25
– 100 – 65 – 55
— — —
ns
Hold TimePE to Pn
th 5.01015
480410410
240205205
— — —
ns
Preset Enable Pulse Width tWH 5.01015
20010080
1005040
— — —
ns
* The formulas given are for the typical characteristics only at 25 C.#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
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MOTOROLA CMOS LOGIC DATAMC14510B
354
Figure 1. Power Dissipation Test Circuit and Waveform
Figure 2. Switching Time Test Circuit and Waveforms
PULSE
GENERATOR
0.01 µF
CERAMIC
VDD
ID500 pF
PE
CARRY IN
R
UP/DOWN
CLOCK
P1
P2
P3
P4
Q1
Q2
Q3
Q4
CARRYOUT
CL
CL
CL
CL
CL
20 ns 20 nsVDD
VSS
90%50%
10%CLOCK
VARIABLE
WIDTH
PROGRAMMABLE
PULSE
GENERATOR
VDD
CL
CLCL
CLCL
VSS
PE
CARRY IN
R
UP/DOWN
CLOCK
P1
P2
P3
P4
Q1
Q2
Q3
Q4
CARRYOUT
tsu trem
50%
50%
VDD
VSS
VDD
VSS
VDD
VSS
VOH
VOL
VSS
VDD
1fcl
tw(H) tw(H)
tTLH
tPLH
tPHL
tPLHtTHL
90%10%
CARRY OUT ONLY
tw(H)
trem
20 ns
90%10%
CARRY IN OR
UP/DOWN
CLOCK
PRESET ENABLE
Q1 OR CARRY OUT
RESET
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MOTOROLA CMOS LOGIC DATA
355
MC14510B
LOGIC DIAGRAM
RESET
PRESET ENABLE
CLOCK
CARRY OUT
CARRY IN
UP/DOWN
P1
4
Q1
6
P2
12
Q2
11
P3
13
Q3
14
P4
3
Q4
2
P P P PPE
D
C
PE
D
C
PE
D
C
PE
D
C
Q
Q
Q
Q
Q
Q
Q
Q
STATE DIAGRAM FOR UP COUNTING STATE DIAGRAM FOR DOWN COUNTING
15
14
13
12 11 10 9 8
7
6
5
43210 43210
15
14
13
12 11 10 9 8
7
6
5
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MOTOROLA CMOS LOGIC DATAMC14510B
356
PIN DESCRIPTIONS
INPUTS
P1, P2, P3, P4, Preset Inputs (Pins 4, 12, 13, 3) — Data
on these inputs is loaded into the counter when PE is taken
high.
Carry In, (Pin 5) — Active–low input used when cascading
stages. Usually connected to Carry Out of the previous
stage. While high, clock is inhibited.
Clock, (Pin 15) — BCD data is incremented or de-cremented, depending on the direction of count, on the posi-
tive transition of this signal.
OUTPUTS
Q1, Q2, Q3, Q4, BCD outputs (Pins 6, 11, 14, 2) — BCD
data is present on these outputs with Q1 corresponding to
the least significant bit.
Carry Out, (Pin 7) — Used when cascading stages, this
pin is usually connected to Carry In of the next stage. This
synchronous output is active low and may also be used to
indicate terminal count.
CONTROLS
PE, Preset Enable (Pin 1) — Asynchronously loads data
on the Preset Inputs. This pin is active high and will inhibit the
clock when high.
R, Reset, (Pin 9) — Asynchronously resets the Q outputs
to a low state. This pin is active high and will inhibit the clock
when high.
Up/Down, (Pin 10) — Controls the direction of count: high
for up count, low for down count.
SUPPLY PINS
VSS, Negative Supply Voltage, (Pin 8) — This pin is
usually connected to ground.
VDD, Positive Supply Voltage, (Pin 16) — This pin is con-
nected to a positive supply voltage ranging from 3.0 Vdc to
18.0 Vdc.
Figure 3. Presettable Cascaded 8–Bit Up/Down Counter
Note: The Least Significant Digit (L.S.D.) counts from a preset value once Preset Enable (PE) goes low. The Most Significant
Digit (M.S.D.) does not change while Cin is high. When the count of the L.S.D. reaches 0 (count down mode) or reaches 9
(count up mode), Cout goes low for one complete clock cycle, thus allowing the next counter to decrement/increment one
count. The L.S.D. now counts through another cycle (10 clock pulses) and the above cycle is repeated.
Q1 Q2 Q3 Q4 Q5 Q6 Q7 Q8
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4PE
Cin
CLOCK
U/D
R
PE
CinCLOCK
U/D
RP1 P2 P3 P4 P1 P2 P3 P4
Cout CoutL.S.D.
MC14510B
M.S.D.
MC14510B
TERMINAL
COUNT
INDICATOR
0 = COUNT
PRESET
ENABLE
1 = PRESET
1 = UP
0 = DOWN
P1 P2 P3 P4 P5 P6 P7 P8
+ VDD+ VDD
THUMBWHEEL SWITCHES
(OPEN FOR “0”)RESISTORS = 10 kΩ
CLOCK
+ VDD
RESET
OPEN = COUNT
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MOTOROLA CMOS LOGIC DATA
357
MC14510B
TIMING DIAGRAM FOR THE PRESETTABLE
CASCADED 8–BIT UP/DOWN COUNTER
CLOCK
UP/DOWN
CARRY IN
(MSD)
PE
P8
P7
P6
P5
P4
P3
P2
P1
CARRY OUT
(MSD)Q8
Q7
Q6
Q5
Q4
Q3
Q2
Q1
CARRY OUT
(LSD)
RESET
COUNT MSD
COUNT LSD
6 6 6 7 7 7 7 7 7 7 6 6 6 6 9 9 9 9 9 0 0 0 0 00 0 0
7 8 9 0 1 2 3 2 1 0 9 8 7 6 6 6 7 8 9 0 1 2 1 00 1 0
PRESET ENABLE DOWN
COUNTUP COUNT DOWN COUNT UP COUNT UP COUNT
RESETPRESET
ENABLE
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MOTOROLA CMOS LOGIC DATAMC14510B
358
Figure 4. Programmable Cascaded Frequency Divider
Note: The programmable frequency divider can be set by applying the desired divide ratio, in BCD, to the preset inputs. For
example, the maximum divide ratio of 99 may be obtained by applying a 10011001 to the preset inputs P0 to P7. For this divide
operation, both counters should be configured in the count down mode. The divide ratio of zero is an undefined state and
should be avoided.
Q0 Q1 Q2 Q3 Q4 Q5 Q6 Q7
PE
Cin
CLOCK
U/D
P1 P2 P3
CoutL.S.D.
MC14510B
P1 P2 P3
P4 P5 P6 P7
THUMBWHEEL SWITCHES
(OPEN FOR “0”) RESISTORS = 10 kΩCLOCK (fin)
+ VDD
RESET
OPEN = COUNT
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
M.S.D.
MC14510B
PE
CinCLOCK
U/D
RR
BUFFER
fout
P0
+ VDD + VDD
fout =finn
Cout
P4 P1 P2 P3 P4
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MOTOROLA CMOS LOGIC DATA
359
MC14510B
OUTLINE DIMENSIONS
P SUFFIXPLASTIC DIP PACKAGE
CASE 648–08ISSUE R
NOTES:1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.5. ROUNDED CORNERS OPTIONAL.
–A–
B
F C
S
HG
D
J
L
M
16 PL
SEATING
1 8
916
K
PLANE –T–
MAM0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.740 0.770 18.80 19.55
B 0.250 0.270 6.35 6.85C 0.145 0.175 3.69 4.44D 0.015 0.021 0.39 0.53F 0.040 0.70 1.02 1.77G 0.100 BSC 2.54 BSC
H 0.050 BSC 1.27 BSCJ 0.008 0.015 0.21 0.38K 0.110 0.130 2.80 3.30L 0.295 0.305 7.50 7.74M 0 10 0 10S 0.020 0.040 0.51 1.01
L SUFFIXCERAMIC DIP PACKAGE
CASE 620–10ISSUE V
NOTES:1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHENFORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)WHERE THE LEAD ENTERS THE CERAMICBODY.
–A–
–B–
–T–
F
E
G
N K
C
SEATING
PLANE
16 PLD
SAM0.25 (0.010) T
16 PLJSBM0.25 (0.010) T
M
L
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A 0.750 0.785 19.05 19.93B 0.240 0.295 6.10 7.49C ––– 0.200 ––– 5.08D 0.015 0.020 0.39 0.50E 0.050 BSC 1.27 BSCF 0.055 0.065 1.40 1.65G 0.100 BSC 2.54 BSCH 0.008 0.015 0.21 0.38K 0.125 0.170 3.18 4.31L 0.300 BSC 7.62 BSCM 0 15 0 15
N 0.020 0.040 0.51 1.01
16 9
1 8
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