Mostafa Soliman, Ph.D. February 9th 2015
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1 Mostafa Soliman, Ph.D. Mostafa Soliman, Ph.D. February 9 th 2015
Transcript of Mostafa Soliman, Ph.D. February 9th 2015
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Mostafa Soliman, Ph.D.
February 9th 2015
Course objectives
Course contents
Introduction to MEMS industry
Market Shares and Revenues
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To provide students with foundational background, methods of
fabrication, and mechanisms of operation of modern MEMS-based
sensors and actuators along with their measuring instruments in
different fields of application.
To introduce the students to basic MEMS design.
To introduce the students to design different MEMS-based
measurement systems, inertial sensing systems, pressure sensing
systems, …etc.
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o Course introduction and Introduction to MEMS
o MEMS Scaling Laws
o Micromachining technology, bulk, surface, and Silicon On Insulator (SOI)
o MEMS Electromechanics, Microstructures
o MEMS Electromechanics, Damping
o Time and frequency responses of 2nd order systems
o Microactuators
o Capacitive actuation
o Thermal actuation
o Sensors
o Capacitive, Thermal, Piezoelectric, Piezoresistive sensing
o Inertial and pressure measurement systems.
Mid-Term: 15 %.
Quizzes (2-3): 5 %
Project: 10 %
Final: 70 %
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To be discussed in the class!!!
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Measurand
Physical Process
Sensor
Analog to Digital
Converter
Physical measurement Value
Signal variable
Analog Signal Processing
(e.g. Amp., Filters...etc)
Digital Signal
Processing
Display
Analog signal
Digital signal
Data Acquisition System PC/Server
MEMS is the second silicon revolution.
MEMS is fabricated by microfabrication technologies.
MEMS technology is a batch fabrication process,
same as ICs technology.
MEMS technology is mature, more than 25 years.
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Manufactured onto semiconductor material.
Used to make sensors, actuators,
accelerometers, switches, and light reflectors
Used in automobiles, aerospace technology,
biomedical applications, ink jet printers,
wireless and optical communications
Range in size from a micrometer to a
millimeter range.
Three MEMS blood pressure sensors
on a head of a pin
[Photo courtesy of Lucas
NovaSensor, Fremont, CA]
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Inertial Measurements: Accelerometers, gyroscopes, vibration sensors.
Pressure Measurements: TPMS (Tire Pressure Monitoring System) ,
disposable blood pressure sensors and various industrial applications.
Display Technology: Optical MEMS in projectors, plasma displays.
RF Technology: Tunable filters, RF switches, antennas, phase shifters,
passive components (capacitors, inductors).
Chemical Measurements: Micro-fluidics: Lab-On-Chip devices, DNA test
structures, micro-dispensing pumps, hazardous chemical and biological
agent detectors
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3-axis accelerometer
3-axix gyroscope
Module size
A conventional
gyroscopes
Aviation Missiles
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Ant Leg
Each mirror is about 17μm square!
DMD mirrors – complete DLP units have over 2 million mirrors – all functioning!
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Variable Optical Attenuators
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Scratch Drive Actuators (SDA)
SDAs push-pull a mirror
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Melting
point (°C)
Thermal
expansion
(10-6/°C)
Density
(g/cm3)
Young’s
modulus
(GPa)
Si 1415 2.5 2.4 130-169
SiN 1900 2.8 1.48 243
SiO2 1610 0.5 2.27 73
Al 660 25 2.70 70
Steel 1500-2000 12 7.9 210
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