Mosfet p General Purposes

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    Diode Protected P-ChannelEnhancement Mode MOSFETGeneral Purpose Amplifier/Switch

    3N172 / 3N173

    FEATURES

    High Input Impedance Diode Protected Gate

    ABSOLUTE MAXIMUM RATINGS(TA = 25

    oC unless otherwise specified)

    Drain-Source or Drain-Gate Voltage3N172. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40V3N173. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30V

    Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mAGate Forward Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 10AGate Reverse Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 1mAStorage Temperature . . . . . . . . . . . . . . . . . . -65oC to +200oC

    Operating Temperature . . . . . . . . . . . . . . . . . -55

    o

    C to +150

    o

    CLead Temperature (Soldering, 10sec) . . . . . . . . . . . . . +300oCPower Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . 375mW

    Derate above 25oC . . . . . . . . . . . . . . . . . . . . . . . 3.0mW/oC

    NOTE: Stresses above those listed under "Absolute MaximumRatings" may cause permanent damage to the device. These arestress ratings only and functional operation of the device at these orany other conditions above those indicated in the operational sectionsof the specifications is not implied. Exposure to absolute maximumrating conditions for extended periods may affect device reliability.

    ORDERING INFORMATION

    Part Package Temperature Range

    3N172-73 Hermetic TO-72 -55oC to +150oCX3N172-73 Sorted Chips in Carriers -55oC to +150oC

    CORPORATION

    PIN CONFIGURATION

    TO-72

    GD

    SC,B

    1503Z

    DEVICE SCHEMATIC

    1

    2

    0200

    3

    4

    ELECTRICAL CHARACTERISTICS (TA = 25oC and VBS = 0 unless otherwise specified)

    SYMBOL PARAMETER3N172 3N173

    UNITS TEST CONDITIONSMIN MAX MIN MAX

    IGSS Gate Reverse Current-200 -500 pA VGS = -20V

    -0.5 -1.0 A TA = +125oC

    BVGSS Gate Breakdown Voltage -40 -125 -30 -125

    V

    ID = -10ABVDSS Drain-Source Breakdown Voltage -40 -30 ID = -10A

    BVSDS Source-Drain Breakdown Voltage -40 -30 IS = -10A, VDB = 0

    VGS(th) Threshold Voltage-2.0 -5.0 -2.0 -5.0 VDS = VGS, ID = -10A

    -2.0 -5.0 -2.0 -5.0 VDS = -15V, ID = -10A

    VGS Gate Source Voltage -3.0 -6.5 -2.5 -6.5 VDS = -15V, ID = -500A

    IDSS Zero Gate Voltage Drain Current -0.4 -10nA

    VDS = -15V, VGS = 0

    ISDS Zero Gate Voltage Source Current -0.4 -10 VSD = -15V, VDB = 0, VGD = 0

    rDS(on) Drain Source On Resistance 250 350 ohms VGS = -20V, ID = -100A

    ID(on) On Drain Current -5.0 -30 -5.0 -30 mA VDS = -15V, VGS = -10V

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    3N172 / 3N173

    CORPORATION

    SMALL-SIGNAL ELECTRICAL CHARACTERISTICS TA = 25oC and Bulk (substrate) Lead Connected to Source

    SYMBOL PARAMETER3N172 3N173

    UNITS TEST CONDITIONSMIN MAX MIN MAX

    | yfs |Magnitude of Small-Signal, Common-Source,Short-Circuit, Forward Transadmittance*

    1500 4000 1000 4000 S VDS = -15V, ID = -10mA, f = 1kHz

    | yos |Magnitude of Small-Signal, Common-Source,Short-Circuit, Output Admittance*

    250 250 S VDS = -15V, ID = -10mA, f = 1kHz

    CissSmall-Signal, Common-Source, Short-Circuit,Input Capacitance*

    3.5 3.5 pF VDS = -15V, ID = -10mA, f = 1MHz

    CrssSmall-Signal, Common-Source, Short-Circuit,Reverse Transfer Capacitance*

    1.0 1.0 pF VDS = -15V, ID = -10mA, f = 1MHz

    CossSmall-Signal, Common-Source, Short-Circuit,Output Capacitance*

    3.0 3.0 pF VDS = -15V, ID = -10mA, f = 1MHz

    NOISE CHARACTERISTICS

    SYMBOL PARAMETER TYPICAL UNITS TEST CONDITIONS

    NF Common-Source Spot Noise Figure 1.0 dB VDS = -15V, ID = -1mA, f = 1kHz, RG = 1M

    SWITCHING CHARACTERISTICS TA = 25oC Bulk (substrate) Lead Connected to Source

    SYMBOL PARAMETER3N172 3N173

    UNITS TEST CONDITIONSMIN MAX MIN MAX

    td (on) Turn-On Delay Time* 12 12

    ns

    VDD = -15V, ID (on) = -10mA

    tr Rise Time* 24 24 RG = RL = 1.4k

    toff Turn-Off Delay Time* 50 50 See Test Circuit Below

    *Registered JEDEC Data

    SWITCHING TIME DETAIL

    -0V

    -1V

    -15V

    10%50% 50%

    90%

    90%

    10%

    PULSE

    WIDTH

    90%

    0210

    MEASUREMENTS ON SAMPLING OSCILLOSCOPE WITH

    INPUT PULSE

    riset < 2ns

    PULSE WIDTH

    riset < 0.2ns

    inC

    inR

    VIN

    VOUT

    4(on)t

    rt

    offt

    IN-V

    > 200ns

    < 2.0pF

    > 10M

    0220

    D.U.T.

    VDD

    RL

    VOUTRG

    50

    VIN

    -0.1 -0.5 -1.0 -5.0 -10

    SWITCHINGTIS-nSEC

    SWITCHING TIMES vs. ON-STATE

    DRAIN CURRENT

    ON-STATE DRAIN CURRENT - (I D(on) ) - mA

    td(on)

    rise

    toff

    G = RL = 1.4KR

    VDD = 15V

    0230

    1000

    500

    1.0

    t

    5.0

    100

    50

    10

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