M.Oriunno, SLAC

Stave cable and module options

M.Oriunno, SLAC

Background - module

The IBL electrical unit for data output is a single chip

The use of the term “module” can be confusing when talking about IBL

The stave cable only knows about single chips

The number of chips per sensor depends on sensor technology

For 3D sensors we assume single chip sensors with active edges

For planar sensors we assume multi-chip tiles: 3 chips per tile if 4” sensor wafers 4 chips per tile if 6” sensor wafers

The cable DOES NOT CARE about the sensor, only the chips.

M.Oriunno, SLAC

The stave cable

Options for a stave flex cable have been proposed for a “traditional” single-width stave

Cable on top of modules

Cable on back of stave with wrap-around pigtail (similar to present staves, but flex cable instead of wire bundle)

Flying cable: cable “in the air” next to the stave

All these options have difficult problems for assembly feasibility

A bi-stave layout can provide an easier and reliable alternative

M.Oriunno, SLAC

Qty per chip Qty per module Total EoS Gage OD (mm) Raw Area mm2 packing factor scaled area mm2

Signals 2 32 36 0.127 0.41 2 0.81Command and clock input 2 32 36 0.127 0.41 2 0.81HV 4 16 36 0.127 0.20 2 0.41LV 2 8 17 1.150 8.30 1.5 12.45LV sensing 2 8 22 0.644 2.60 1.5 3.91DCS NTC 2 8 36 0.127 0.10 2 0.20DCS.env 6 36 0.127 0.08 2 0.15Cooling pipe: Inlet 1 1 0.79 1.5 1.18Cooling pipe: Outlet (opposite side) 1 3 7.07 1.1 7.78Total Area 12.02 18.59

0

2

4

6

8

10

12

14

Signals

Comm

and

and

clock

inpu

tHV LV

LV se

nsing

DCS NTC

DCS.env

Coolin

g pip

e: In

let

Coolin

g pip

e: O

utle

t

Are

a, m

m2

Cables cross section

M.Oriunno, SLAC

Castellated bi-stave layout (bi-tube)

Connectors out of envelop

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Castellated bi-stave layout (bi-tube)

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Castellated bi-stave layout (single tube)

Diving EoS region

Two tubes merged in a single one

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Castellated bi-stave layout (single tube)

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Cable design

M.Oriunno, SLAC

Turbine single stave

Need sharp bending radius

Limited in width

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Turbine single stave

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Inverted Turbine single stave

No need of sharp bending radius

Connector directly on the thick kapton in the EoS region

Limited in width

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Inverted Turbine single stave

M.Oriunno, SLAC

14

FE-I3 active edge prototype3D Stave Prototype

• Motivation:– Replacement/upgrade is converging

towards stave design– Make a prototype to discover possible

pitfalls• Cooling• Flex hybrid• Power

• Assembly– Use learning from first prototype to

make progress toward a final module with FE-I4

• One row with up to 16 FE-I3 bump bonded to 3D sensor

• Individual connection using flex cable• Cooling/support carbon structure

http://indico.cern.ch/conferenceDisplay.py?confId=52370

M.Oriunno, SLAC

15

FE-I3 active edge prototypeFlex Cable

• Use one cable to interface to 4 FE-I3 ASICs

• Stack them on bottom side of stave

• Critical parameter will be bending radius (see next slide) and routing density

• Will be routed in 2 layers in the bending part

• Layout finished!

http://indico.cern.ch/conferenceDisplay.py?confId=52370

See Erlend Bolle ‘s talk

M.Oriunno, SLAC

IBL EOS Services

IBL – 84 cm

EOS Shrink & surgical

Tubing

EOS with HRS

Connectors & 0-80

Screws – 10 cmSee Dave Nelson’s talk

M.Oriunno, SLAC

IBL EOS Services with traveling harness EOS with traveling

with traveling harness

All wires soldered

and spooled

IBL

10 cm -15 cmdiameter spool

Directsolderwires

M.Oriunno, SLAC

FE-I4 layout prototyping plans

Plan to make real stave cable Continuation of prototyping exercise

M.Oriunno, SLAC

SummaryThe main challenge of the IBL is to fit and perform in the narrow gap between the Pixel and the beam pipe

On-stave-cables and EoS’s integration are the bottle neck

The single stave layout may put heavy requirements on the cable design

The bi-stave layout accommodate a standard kapton cable with comfortable real estate

Beside a connectorized EoS region, a solution with soldered wires deserve consideration.