Module Metrology Peter Sutcliffe. Peter Sutcliffe – Module Metrology Wenzel CMM Module Metrology...
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Transcript of Module Metrology Peter Sutcliffe. Peter Sutcliffe – Module Metrology Wenzel CMM Module Metrology...
Module Metrology
Peter Sutcliffe
Peter Sutcliffe – Module Metrology
Wenzel CMM Module Metrology
carried out on Wenzel CMM with module jig aligned along the X axis
Peter Sutcliffe – Module Metrology
Touch Probe Each touch probe
measurement starts with measuring the base and pin to establish datums.
There are 3 touch probe measurements:
Pedestal before grinding cooling face
Pedestal after grinding cooling face
Module measurement of hybrid and cooling face
Peter Sutcliffe – Module Metrology
Optical Measurement of Silicon planes
Optical Measurement carried out using Renishaw VPN 625 and X250 lens.
First measure horizontal base and vertical post to establish datums.
10 point R and Phi planes to measure 5 fiducial points and 5 other points on silicon
9 point measurement of gold + and o to establish planarity of hybrid.
Peter Sutcliffe – Module Metrology
Optical Measurement of Silicon Edges.
First measure 2 holes to establish module CL
Take 6 point line to measure Phi and R edge.
Peter Sutcliffe – Module Metrology
Data Added to Database
Data outputted to a txt file and updated onto database.
Pedestal:Before Grinding:Add base paddle metrology summary file.After Grinding:Add base paddle metrology summary file.
Module:First Full Metrology:Phi SummaryPhi Silicon PlanePhi Hybrid PlaneR SummaryR Silicon PlaneR Hybrid PlaneTop SummaryTop Phi EdgeTop R edgeSecond Metrology after Cable Attachment:Top SummaryTop Phi EdgeTop R edgeFinal Metrology after Burn in:Top SummaryTop Phi EdgeTop R edge