IPI Event

Modern Thermoforming September 7th 2017

09:00 - 09:15 Welcome / IntroductionSteffen Poppitz, Managing Director, IPI International Packaging Institute

09:15 - 10:45 Modern Thermoforming: Thermoforming Technology in generalDr. Manfred Reichert, Lecturer, Duale Hochschule, Stuttgart- Material characteristics which influence thermoforming- Process technology- Heating process: contact heating, infrared heating- Forming process: different methods- Examples of packaging materials- New technologies and materials

10:45 - 11:15 Coffee Break and Networking

11.15 - 12:00 Overview of Polyethylene Materials for BM, IM, Thermoforming and Skin packagingDr. Luis Zalamea, Senior Development Specialist, Dow Europe GmbH, Horgen - Injection Molding, Blow Molding, Rotomolding and Sheet Extrusion / Thermoforming- Market Review - Major performance requirements - Most relevant applications

12:00 Transfer to Restaurant

12:15 - 13:15 Lunch Break

13:15 Transfer to MEDIPACK AG

Program

IPI International Packaging InstituteNeustadt 51CH-8200 SchaffhausenTel. +41 52 675 51 51 info@ipi.eu

About the Event The pack style of products is extremely important for the differentiation of a product as well as for the cost of packaging. As a result, the production of packaging must be considered thoroughly. Plastic packages now may be produced either independently or as part of the filling process, and this is one of the key elements of packaging. It follows that in-depth understanding of the forming process is essential as well as an appropriate knowledge of new thermoforming processes.

Aims and BenefitsParticipants will acquire a broad overview and understanding of existing techniques and technologies as well as information about the advantages and limitations of thermoforming technologies. All this will help partici-pants to better decide what should be used and applied in their business.

Target Audience As the seminar deals with the benefits and limitations of thermoformed packages, this professional develop-ment event is aimed at Heads of Engineering and Heads of Development in companies which design and build packaging machinery. The seminar is also highly recommended for the senior technical staff of brand owners which produce and pack products with specific requirements and characteristics.

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www.ipi.eu

13:30 - 15:00 Welcome at MEDIPACK AGGeorg Oesterreicher, Head of Design Engineering & Development, MEDIPACK AG

Plant tour MEDIPACK AG, Schaffhausen

Innovative sealed skin blister packaging for implants and instruments Georg Oesterreicher, Head of Design Engineering & Development, MEDIPACK AG- Customer requirements- Blister packaging vs bag packaging- The skinning process

15:00 - 15:15 Coffee Break and Networking

15:15 - 16:00 In-line co-extrusion and thermoforming technology for bicolor PP cups with mineral fillers fitting existing lidsLuca Oliverio, Sales Director, WM Thermoforming Machines, Stabio / TI

16:00 - 16:45 Digital Heating – Revolution in ThermoformingDr. Sascha Bach, CTO, watttron GmbH, Dresden- Effect of inhomogeneous heating for thermoforming- A novel ceramic based contact heating technology for wall-thickness improvements and material saving- Case studies – Symbiosis of simulation and innovative technology for best thermoforming results

16:45 - 17:00 Conclusion

» Program

LecturersDr. Manfred Reichert studied Food Technology at the TU Mün-chen-Weihenstephan. In 1984 he joined Robert Bosch GmbH, Packaging Techno-logy, in Waiblingen. He worked in the En-gineering and Technology Support Depart-ment till 2011. The main focus of his work

was thermoforming processes and machines, for the food and pharmaceutical industry, thermoform materials, analy-sis and evaluation. Since 2011, he has been working as a consultant for companies and as a Lecturer at the „Duale Hochschule“ in Stuttgart.

Dr. Sascha Bachformerly worked as part of a group focusing on the joining and molding of polymeric packaging materials at the Technische Uni-versität Dresden. He specializes in sealing technologies for flexible packaging materi-als. He wrote his PhD thesis on the ultraso-

nic sealing process for flexible packaging materials. Now he is co-founder and CTO of watttron GmbH, a university spin-off, specializing in heating technologies for thermoforming and sealing applications.

Georg Oesterreicher trained as a toolmaker and studied Me-chanical Engineering at the ZHAW in Win-terthur, where he also completed his EMBA in 2009 after a period in New Zealand. Georg Oesterreicher is currently Head of Design Engineering & Development (Plant & Equipment) at MEDIPACK AG in Schaff-hausen, Switzerland.

Dr. Luis Zalamea holds a Msc Degree in Chemical and Me-chanical Engineering. Since 1999 he has been working for DOW in different countries and positions. In 2007 he was awareded his Doctorate by Purdue University. Presently, he is based at DOW Europe GmbH Hor-

gen and responsible for technical application development in microcellular foaming globally.Luca Oliverio

has a degree in Mechanical Engineering with specialization in plastic materials. He has a broad experience in international sales including business development and market research in the plastic industry. Pre-sently, he is Sales Director at WM Thermor-forming Machines based in Stabio / Ticino.

IPI International Packaging InstituteNeustadt 51CH-8200 SchaffhausenTel. +41 52 675 51 51 info@ipi.eu

www.ipi.eu

DetailsDate: Thursday, September 7th 2017

Time: 08:30 – 17:00 h

Location: IPI International Packaging Institute, Schaffhausen, Switzerland (Morning speeches) MEDIPACK AG (Plant tour and afternoon speeches) Language: English

Fee: CHF 680.00* incl. 8 % VAT, lunch and electronic documentation (*or Euro equivalent at actual exchange rate)

Registration: www.ipi.eu/ipi-events/registration

IPI International Packaging InstituteNeustadt 51

MEDIPACK AG Mühlentalstrasse 184-188

P1 > Parkhaus HerrenackerFrauengasse 24Access via Frauengasse

P2 > Parkhaus BahnhofMühlentalstrasse 5Access via Mühlentalstrasse

Schaffhausen main station

P 1

P 2

P 1

P 2

Winterthur

Thayngen

Plant tour