Mobile Switching Centre-SDX MSC-II

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    SDX-MSC IISDX-MSC IIHardware Architecture

    By

    Syed Muhammad Munavvar

    Hussain

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    MSC Specifications

    Capacity

    Telephony Specifications

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    Hardware Architecture

    The SDX-MSC II consists of followingsubsystems:

    Access Switching Subsystem (ASS)Centralized Control Subsystem (CCS)

    Interconnection Network Subsystem (INS)

    Location Registration Subsystem (LRS)

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    Access Switching Subsystem(ASS)

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    Access Switching Subsystem(ASS)

    The ASS consists of following functionblocks:Digital Trunk Interface (DTI)

    Time Switch & Link (TSL)Digital Service Circuit (DSC)

    Signaling system No.7 protocol Handler (S7H)

    Mobile Voice Quality Test (MVQT)

    Access Switching Processor/Access SwitchPeripheralProcessor (ASP/ASPP)

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    DTI & TSL Cards

    The DTI block consists of:

    Digital Trunk Back Panel Assembly (DTBPA)

    CEPT Digital Trunk Interface board Assembly (CDTIA)

    The TSL block consists of:

    Time Switch Back Panel Assembly (TSBPA)

    Sub-highway Multiplex & De-multiplex Assembly(SMDXA)

    Time Switch Control & Maintenance Assembly (TSCMA)

    Local optic Transceiver Interface Assembly (LTRIA)

    Optic Transceiver Module Assembly (OTRMA)

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    DSC & S7H Cards

    The DSC block consists of: Digital Service circuit Back Panel Assembly (DSBPA) Digital Service circuit for Voice Message Assembly

    (DSVMA)

    Digital Service circuit for Call Mixer Assembly (DSCMA) Digital Service circuit for Multi-frequency Signaling

    Assembly (DSMSA)

    S7H Block consists of: The S7H block consists of: SS7 Protocol Handler Back Panel Assembly (SPBPA) Signaling System No.7 Handler Assembly (SSPHA)

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    MVQT & ASSP Cards

    The MVQT block consists of: Digital Service circuit Back Panel (DSBPA) Mobile Voice Quality Test Assembly (MVQTA)

    ASS Processor block consists of: Main Processor Back Panel Assembly (MPBPA) Main Processor Duplication Manager Assembly

    (MPDMA)

    Telephony Device Control Master Assembly (TDCMA)

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    Interconnection Network Subsystem

    (INS)

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    Interconnection Network Subsystem

    (INS)

    The INS consists of:Space Switch & Link (SSL)

    Communication Inter-working Network (CIN)

    Network Synchronization (NES)

    Interconnection Network Processor (INP)

    Inter Network Peripheral Processor (INPP)

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    SSL & CIN Cards

    The SSL block consists of: Space Switch Back Panel Assembly (SSBPA) Central Optic Transfer & Receiver Interface Assembly

    (CTRIA)

    Clock Distribution & Processor Interface Assembly(CDPIA) Space Switch Matrix Assembly (SSMXA) Optic Transceiver Module Assembly (OTRMA)

    The CIN block consists of: CI Back Panel Assembly (CIBPA) CI Node Interface Assembly (CINIA) CI Node Maintenance Assembly (CINMA)

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    NES & INP Cards

    NES block consists of:

    Network Synchronization Back Panel Assembly (NSBPA)

    Network Synchronization Clock Generation Assembly(NSCGA)

    Network Synchronization Clock Maintenance Assembly(NSCMA)

    INP consists of:

    Main Processor Back Panel Assembly (MPBPA) Main Processor Duplication Manager Assembly

    (MPDMA)

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    Centralized Control Subsystem(CCS)

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    Centralized Control Subsystem(CCS)

    The CCS consists of the followingblocks :

    Alarm Panel Control (APC)Operation & Maintenance Processor

    (OMP)

    Central Control Peripheral Processor(CCPP)

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    APC & OMP Cards

    APC Block consists of:

    Remote Control Back Panel Assembly (RCBPA)

    Alarm Panel Control Interface Assembly (APCIA)

    OMP consists of:

    Operation & Maintenance processor Back Panel(OMBPA)

    Main Processor SCSI-bus Interface (MSBIA) Main Processor Duplication Manager (MPDMA)

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    CCPP Cards

    CCPP consists of following boards:

    Telephony Device Control Master Back Panel(TMBPA)

    Telephony Device Control Master (TDCMA)

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    Location Registration Subsystem(LRS)

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    Location Registration Subsystem(LRS)

    performs the VLR functions

    &

    consists of following function block:Location Register Processor (LRP)

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    LRP Cards

    LRP block consists of following:

    Main Processor Back Panel (MPBPA)

    Main Processor Duplication Manager(MPDMA)

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    Processor Structure

    The SDX-MSC II Processors are

    classified as follows depending uponthe functions :

    Main Processor (MP)

    Peripheral Processor (PP)

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    Thank You..!