mm-wave telecom and datacom background · telecom and datacom infrastructure market Confidential...

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mm-wave telecom and datacom background Confidential under NDA 1

Transcript of mm-wave telecom and datacom background · telecom and datacom infrastructure market Confidential...

mm-wavetelecom and datacom

background

Confidential under NDA 1

Sivers IMA 60-80 GHz time line

20132012

E and V-band Backhaul & Fronthaul

2015

V-band Backhaul Handheld spectrum analyzers

E-band

2014 2016

ExampleCustomer products:

Products:

2011

E and V-bandConverters

Gen 0.5

E and V-bandConverters

Gen 1.0

FirstSiGe MMIC

E-band Backhaul

E and V-bandConverters

Gen 2.0

70 Ghz “5G”access

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E and V-bandchip

Gen 3.0

2017

Smartphones keeps on driving data

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Mobile infrastructure gets further developed

• Need for speed & low latency• More advanced networks• Lack of spectrum is driving new

technology (mm-wave)• Backhaul need increase• IoT and 5G is coming• Reduce cost need -> C-RAN

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Growth 2022: Mobile infrastructure LTE and 5G

• +2.7 billion LTE• +0.5 billion 5G

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How will mm-wave support this growth?

Federal Communications Commission (FCC) in the US open up for mm-wave

• 27.5-28.35GHz• 37-38.6GHz• 38.6-40GHz• 57-71GHz (14 GHz)• 71-76 and 81-86 GHz (10 GHz)

USA market = first moverEarly markets Japan, China and Korea

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Wi-Fi and Cellular evolution

802.11ad, 802.11ay and 5G

key RF features • mm-wave• Beam steering/

Beam forming• Phased array

antennas

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Why beam steering/forming

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• mm-wave has higher free space path loss• Compensated by using phased array and BF• Phased array and BF increased gain• BF increase directivity (even NLOS) • BF reduces interference and crosstalk

Omni-directional

Phased array with BF

Technology choice for RF mm-wave applications

Technology + - Comments

RF CMOS(65-28 nm)

• Mainstream CMOS• Low wafer cost/mm2 • SOC integration with RF+BB• 65nm = lowest wafer cost• 28nm = highest integration

• Low breakdown voltage• Low Tx power / efficiency at

mmWave• Poor Device isolation• mmWave performance

decreases at 28nm• High mask cost

• Good choice for consumer electronics -> short rangeapplications

• RF TRX integration is difficult at mmWave

• Okay for 60 GHz (V-band, not suitable > 70 GHz.

SiGe BiCMOS(130nm)

• Optimized for mmWave• Great f-T / f-Max and phase noise• Good Tx output power and

efficiency per element• Lower mask cost• Great integration level for mixed

and digital signals

• Higher wafer cost/mm2• Not suitable to baseband SoC –

However single SMD eWLB-capsule integration possible if desired.

• Great choice for high performance and high Txpower (longer range)mmWave applications

• Support fMax of 300 Ghz -> application from 60-120 Ghz. (V-band, E-band, W-Band etc)

GaAs • Good for mmWave• Best Tx output power and

efficiency per element• Lower mask cost

• Very high wafer cost/mm2• Not suitable to baseband SoC• No digital integration possible • Low integration level

• Best choice for high performance and high Txpower (longer range)

• Expensive and has very low integration level

Sivers IMA choice SiGe => Best technology for mmWave infrastructure products

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mm-wave use cases fortelecom and datacom

infrastructuremarket

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The future is millimeter wave, Sivers IMA is the future!

Macro cell Backhaul Point to Point

• 28, 60-80 GHz backhaul solutions• Cheaper than fiber (low cost and fast installation)• Traditional point to point or 802.11ad/ay

2 GHz bandwidth, 256 QAM and up to 10 Gbps

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Sivers IMA products for Macro cell Backhaul

2nd Gen Converters57-66, 71-76, 81-86 GHz

2015-2016

3nd Gen RFICs57-71, 71-86 GHz

2017->

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C-RAN Fronthaul Point to Point

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• 60-80 GHz fronthaul solutions• Cheaper than fiber (low cost and fast installation)• Low latency • Traditional point to point or 802.11ad/ay• Beam steering and beam forming will be key

0.5-2 GHz bandwidth, up to 10 Gbps

Mesh network - Point to Multipoint

28 GHz, 39, 60GHz solution (WiGig/802.11ad) with: • Easy installation: beam steering and beam forming

3 sectors are needed to cover the full 270° degrees

Point to Multipoint

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Fixed Wireless broadband access

28 GHz (5G), 39 GHz (5G) or 60GHz (WiGig/802.11ad)

• Easy installation: beam steering and beam forming• Large bandwidth and speed > 1 Gbps• Cheaper than fiber (low cost and fast installation)

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Google Fiber -> FWA

Outdoor and Indoor: Carrier grade Wi-Fi access point at 60 GHz

• High output power to cover large cell• 60 GHz give high free space path loss –> requires beam steering and beam forming• Support for tri-band required

4 sectors are needed to cover the full 360° azimuth

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Indoor: High-end Tri-band Wi-Fi access point

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• High output power to cover longer distance in rooms• 60 GHz give high free space path loss –> requires beam steering and beam forming• Sivers IMA solution only for high-end access points due to cost• Support for tri-band required

5G cellular access

• 28, 39, 60-80 GHz “5G” with phased array and beam steering

Backhaul and end-user access in one box!

*Cellular 5G to be set by ->2019

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Test and measurement Equipment

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Spin-off from other business

• Shows that Sivers IMA has high quality• Converters and RFICs• Mostly handheld

PRODUCTS AND PARTNERSHIPS

#mm-waveandphotonics

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From Concept to mm-Wave converters

Sivers IMA’s value chain

Concept Wafer RFIC/MMIC Sub-System

Thresholds:

• Instruments

• Technology

• Manufacturing

18-24 months!!

Evaluation Board Introduction

Traffic Unit TRU

Power Supply, Surveillance

Modem

BUS DC

Control & Interface Board

Bas

eban

d In

terf

ace

Diplexer

I

Q

I

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Strategic partners product area

An

ten

na

Sivers IMA Converters

Sivers IMA Evaluation Kit

Converter Evaluation Board

FC2xxxUp and Downconverters

forE- and V-band

Point to Point mm-waveTRX 1608-LT6275

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• Support FDD and TDD

• Frequency band: 57 up to 71 GHz

• Modulation schemes: QPSK up to 64QAM

• Speed up to 4.5 Gbps

• Universal analog I/Q base band interface

• IF bandwidth up to 1000MHz

• RF Bandwidth up to 2000 MHz

• Analog RF and IF gain control

• Integrated Voltage Controller Oscillator (VCO)

• Support external local oscillator (LO)

• Digital Interfaces: SPI, GPIO

• Integrated power detection function

• On-chip temperature sensor

EVK 06001/00

• Includes GUI, RF board, power board and Rasberry Pi

• TX/RX LO frequency control • RX baseband I/Q differential

outputs • TX baseband I/Q differential inputs • WR12 interface at input/output • Ethernet interface and GUI for

controlling the transceiver • Possibility to use external reference

clock • Possibility to use external LO source • 64QAM with internal VCO

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• Until product is in “General Availability”/Mass Production all market activities and engagements will be controlled and managed from Sivers IMA

• Agreement with Integrated Device Technology (IDT) as reseller in the bundled offering of RFIC and BBIC (full WiGig node)

Focus on telecom/datacom Tier 1 customersIDT resellers will offer bundled offer to the market

• Agreement with RF Module partner that will sell full RF Modules including antennas.

• Decision how to manage RFIC sales to “non-IDT” customers when product is in mass production status

• Opportunity for resellers to explore potential market in industrial applications

E.g Intracompany datacom networksApplicable when in mass production (planned Q2 2018)

WiGig clarification

THANK YOU!

Sivers IMA ABBox 127416429 KistaSweden

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