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A

PROJECT REPORT ON

AIRCRAFT COLISSION AVOIDANCE SYSTEM

Submitted for the award of the degree of

Bachelor of Engineering

(Applied Electronics & Instrumentation)

SESSION: 2008-2012

Guided By: Submitted By:

Er.Gaurav Kumar Shravani(1208850)Assistant Professor Sitakshi(1208852)Deptt. of A.E.I. Urvi(1208854)JMIT, Radaur JMIT, Radaur

Departmentof

Applied Electronics & Instrumentation Engineering

Seth Jai Parkash Mukand Lal Institute ofEngineering & Technology, Radaur

Kurukshetra University, Kurukshetra


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PREFACE

This report presents the research, findings and recommendations resulting from theproject AIRCRAFT COLLISION AVOIDANCE SYSTEM, developed by our team

under the guidance of experienced teachers and seniors.

The objective of this project is to develop an economical and practically efficientcollision avoidance system which can be easily implemented in the planes and is reliableas well. This system works on the data transmission between the plane and the groundstation. Along with all other communication parameters the ATC sends the warningsignal in terms of data of other planes. The data send from the ATC comprises of all theparameters corresponding to the flight of other planes in the same area.

This system is an under development project with greater prospects in future. Thescientific parameters associated with system can be further enhanced and modified for

future research.


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Acknowledgement

The successful completion of any task would be incomplete without accomplishing thepeople who made it possible and whose constant guidance and encouragement secured usthe success.

It provided me opportunity to me to upgrade my skills as well as sharpen my professionalknowledge and understanding in an environment that was intellectually stimulating.

I express my sincere gratitude to Mr. Gaurav kumar for his valuable suggestions,guidance and encouragement to allow me to go out to the practical world and explore myknowledge to the maximum.

I would also like to express my sincere gratitude Mr. Rajat Kapila, HOD Appliedelectronics and instrumentation, JMIT Radaur (K.U) for helping me at every stage and

for allowing me to avail all available amenities in the college. I am indeed indebted tohim for providing me with invaluable guidance for the successful completion of theproject.


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ABSTRACT

A collision between aircraft is one of the most sudden and catastrophic transportationaccidents imaginable. These tragic events are rarely survivablehundreds of people maydie as the two aircraft are destroyed. In response to this threat this project is basically a

collision avoidance system implemented in the aircrafts and which works on the dataobtain from ATC (Air Traffic Control). ATC is the ground station which calculates theparameters and gives details to the planes regarding their flight and the path they shouldbe following. The transmission of data between ATC and plane follows below explainedtransmission basis.

Figure 1


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TABLE OF CONTENTS

CHAPTER NO. TITLE PAGE NO.

ABSTRACT ivLIST OF TABLE xvi

LIST OF FIGURES xviiiLIST OF SYMBOL xxvii

1 INTRODUCTION

1.1 History of such systems 091.2 Introduction 101.2.1 Objective of project 111.2.2 Project description 11

2

2.1 PCB Layout 122.1.1 Layout information 12

2.1.2 DC Power Supply 122.1.3 PCB Layout 132.2 PCB Modeling Process 142.2.1 PCB Etching 142.2.2 Component Mounting 152.2.3 Soldering 152.2.4 Flux 162.2.5 Process 172.3 Block Diagrams 182.3.1 Transmission Circuit 182.3.2 Reception circuit 192.4 Components used 202.4.1 Step down Transformer 202.4.2 Regulator 212.4.3 Capacitor 212.4.4 Rectifier 222.4.5 Transistor 232.4.6 Potentiometer 23


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2.4.7 Resistor 242.4.8 Diode 242.4.9 PIC Controller 252.4.10 Encoder 262.4.11 Transmitter 27

2.4.12 Receiver 282.4.13 Decoders 292.4.14 AT89S52 Controller 302.5 Compilers 322.5.1 MPLAB Compiler 322.5.2 KEIL Compiler 32

2.6 Working and Theory of Project 332.7 Logic involved 34

CHAPTER 3

3.1 Conclusion 353.2 References 35


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List of Tables

Table 3.1 30

List of FiguresCHAPTER 1

Fig. 1 Theme Idea 05Fig. 2 TCAS 09Fig. 3 Collision avoiding system 11Fig. 4 Circuit diagram 12Fig. 5 Layout of DC Power Supply 13Fig. 6 PCB Layout 14Fig. 7 PCB 18Fig. 8 Transmission side circuit 19

Fig. 9 Reception side circuit 20Fig. 10 Regulator 21Fig. 11 Capacitor 21Fig. 12 Bridge Rectifier 22Fig. 13 Potentiometer 23Fig. 14 Resistor 24Fig. 15 PIC Controller 25Fig. 16 Encoder 26Fig. 17 Transmitter 27Fig. 18 Receiver 28

Fig. 19 Decoder 29Fig. 20 40 Lead PDIP 31


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CHAPTER 1

1.1 HISTORY OF SUCH SYSTEM

The Traffic Alert and Collision Avoidance System (TCAS) have had extraordinarysuccess in reducing the risk of mid-air collisions. Now mandated on all large transportaircraft, TCAS has been in operation for more than a decade and has prevented severalcatastrophic accidents. TCAS is a unique decision support system in the sense that it hasbeen widely deployed (on more than 25,000 aircraft worldwide) and is continuouslyexposed to a high-tempo, complex air traffic system. TCAS is the product of carefullybalancing and integrating sensor characteristics, tracker and aircraft dynamics, maneuvercoordination, operational constraints, and human factors in time-critical situations.Missed or late threat detections can lead to collisions, and false alarms may cause pilotsto lose trust in the system and ignore alerts, underscoring the need for a robust system

design. Building on prior experience, Lincoln Laboratory recently examined potentialimprovements to the TCAS algorithms and monitored TCAS activity in the Boston area.Now the Laboratory is pursuing new collision avoidance technologies for unmannedaircraft. This above system is the basis of all the collision systems being implemented.

Figure 2


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1.2 INTRODUCTION

Safety is a key part of mission readiness; that is, systems must be safe to operate intheir intended environment and not cause preventable accidents or illnesses that erode ordegrade mission capability and readiness. Because of the strong correlation betweenreadiness and safety, the Secretary of Defense has established goals for accidentreduction and continues to challenge the Department of Defense (DOD) to eliminate theloss of resources incurred as a result of preventable accidents. In todays crowded airspace, mid-air collisions pose a growing threat to safety. Developed for military fastjets, the Collision Warning System (CWS) technology demonstrator is a highly advancedairborne system, which provides timely warning of potential collisions. The system is

now ready to proceed to full-scale development. The CWS will be instrumental inreducing the number of mid-air incidents and accidents by improving the aircrewssituational awareness. It is complemented by a model which can be used to assessdetection effectiveness in a wide range of scenarios. The system also has potentialbenefits for the civil aircrafts. The CWS uses Secondary Surveillance Radar (SSR)techniques. The host aircraft carries an interrogator which sends out an interrogationsignal (Modes A & C) and, when nearby aircraft respond, the delay time is used todeduce their range. The bearing is derived - using monopoles techniquesby Measuringeither the phase or amplitude differential at spatially separate receiving antenna elements.From knowledge of bearing and range or - more particularly - range rate, effective

warnings can be produced.This report recommends specific technologies that could eliminate militaryAircraft losses. In the past five years (FY 2004 - FY 2008), the Department of Defensesaircraft operations sustained 276 military deaths and destroyed 247 military aircraft (notincluding unmanned aircraft systems). Although many of the deaths are attributed to"human error," inserting hardware and software safety technologies could greatly reducethese actual losses during the next five through twenty years. Preventing these crasheswill increase readiness, reduce the need for replacement aircraft, and save the lives of ourSoldiers, Sailors, Marines, and Airmen. These technologies assist the pilots when they aretask-saturated. SeveralOf these technologies already exist in commercial aircraft, in foreign military aircraft, orhave been previously tested in Department of Defense military aircraft -- but notpreviously funded.


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1.2.1 OBJECTIVE OF PROJECT

The objective of this project is to design a simple, easy to install and cheapmicrocontroller based circuit to transmit data regarding height and bearing of planes fromATC to planes in the region, and to provide a collision avoidance system in the aircrafts.

So that on air collisions can be avoided and a safe flight can be assured up to a goodextend.

1.2.2 PROJECT DESCRIPTION

Figure 3

Where -:a= height of aircraft &

b= bearing of aircraft

This system is a combination of RT (radio telephoning) system used for transmission ofdata from aircraft to ground station based on which ATC obtain the altitude and bearingof the aircraft. A reception system for getting data on ground as well as on the aircraft.Then a micro controller based evaluation system for comparing the parameters and thenat the end an alarm system comprising of audio n visual alarm for dangerous conditions


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CHAPTER 2

2.1 PCB LAYOUT

2.1.1 Layout formationFor layout formation first we studied well the circuit diagram.Here we have shown an example of layout.

Figure 4 Circuit diagram of collision avoidance system

2.1.2 DC Power Supply

An AC powered unregulated power supply usually uses a transformer to convert thevoltage from the wall outlet (mains) to a different, nowadays usually lower, voltage. If itis used to produce DC, a rectifier is used to convert alternating voltage to a pulsatingdirect voltage, followed by a filter, comprising one or more capacitors, resistors, and

sometimes inductors, to filter out (smooth) most of the pulsation. A small remainingunwanted alternating voltage component at mains or twice mains powerfrequency (depending upon whether half- or full-wave rectification is used)rippleisunavoidably superimposed on the direct output voltage.

A regulated power supply is one that controls the output voltage or current to a specificvalue; the controlled value is held nearly constant despite variations in either load current
http://en.wikipedia.org/wiki/Alternating_currenthttp://en.wikipedia.org/wiki/Transformerhttp://en.wikipedia.org/wiki/Direct_currenthttp://en.wikipedia.org/wiki/Rectifierhttp://en.wikipedia.org/wiki/Electronic_filterhttp://en.wikipedia.org/wiki/Capacitorhttp://en.wikipedia.org/wiki/Resistorhttp://en.wikipedia.org/wiki/Inductorhttp://en.wikipedia.org/wiki/Utility_frequencyhttp://en.wikipedia.org/wiki/Utility_frequencyhttp://en.wikipedia.org/wiki/Ripple_(electrical)http://en.wikipedia.org/wiki/Regulated_power_supplyhttp://en.wikipedia.org/wiki/Regulated_power_supplyhttp://en.wikipedia.org/wiki/Ripple_(electrical)http://en.wikipedia.org/wiki/Utility_frequencyhttp://en.wikipedia.org/wiki/Utility_frequencyhttp://en.wikipedia.org/wiki/Inductorhttp://en.wikipedia.org/wiki/Resistorhttp://en.wikipedia.org/wiki/Capacitorhttp://en.wikipedia.org/wiki/Electronic_filterhttp://en.wikipedia.org/wiki/Rectifierhttp://en.wikipedia.org/wiki/Direct_currenthttp://en.wikipedia.org/wiki/Transformerhttp://en.wikipedia.org/wiki/Alternating_current


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or the voltage supplied by the power supply's energy source. For this project 220/12V DCregulated power supply is used. The layout for 12V DC power supply is as:-

Figure 5 Layout of dc power supply

2.1.3 PCB Layout


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Figure 6

2.2 PCB MODELING PROCESS

2.2.1 PCB Etching

A printed circuit board, or PCB, is used to mechanically support and electrically

connect electronic components using conductive pathways, tracks or signaltraces etched from copper sheets laminated onto a non-conductive substrate. It is alsoreferred to as printed wiring board (PWB) or etched wiring board. A PCB populated withelectronic components is a printed circuit assembly (PCA), also known as a printedcircuit board assembly (PCBA). Printed circuit boards are used in virtually all but thesimplest commercially produced electronic devices.

Chemical etching

Chemical etching is done with ferric chloride, ammonium per sulfate, or sometimeshydrochloric acid. For PTH (plated-through holes), additional steps of electrolessdeposition are done after the holes are drilled, then copper is electroplated to build up thethickness, the boards are screened, and plated with tin/lead. The tin/lead becomes theresist leaving the bare copper to be etched away.
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The simplest method, used for small scale production and often by hobbyists, isimmersion etching, in which the board is submerged in etching solution such as ferricchloride. Compared with methods used for mass production, the etching time is long.Heat and agitation can be applied to the bath to speed the etching rate. In bubble etching,

air is passed through the etchant bath to agitate the solution and speed up etching. Splashetching uses a motor-driven paddle to splash boards with etchant; the process has becomecommercially obsolete since it is not as fast as spray etching. In spray etching, the etchantsolution is distributed over the boards by nozzles, and recirculated by pumps.

As more copper is consumed from the boards, the etchant becomes saturated and lesseffective; different etchants have different capacities for copper, with some as high as 150grams of copper per liter of solution. In commercial use, etchants can be regenerated torestore their activity, and the dissolved copper recovered and sold. Small-scale etching

requires attention to disposal of used etchant, which is corrosive and toxic due to its metalcontent.

The etchant removes copper on all surfaces exposed by the resist. "Undercut" occurswhen etchant attacks the thin edge of copper under the resist; this can reduce conductorwidths and cause open-circuits. Careful control of etch time is required to preventundercut. Where metallic plating is used as a resist, it can "overhang" which can causeshort-circuits between adjacent traces when closely spaced. Overhang can be removed bywire-brushing the board after etching.

2.2.2 Component Mounting

After etching, components are mounted on the PCB by using soldering process.

2.2.3 Soldering

Soldering is a process in which two or more metal items are joined together by meltingand flowing a filler metal (solder) into the joint, the filler metal having a lower meltingpoint than the work piece. Soldering differs from welding in that soldering does notinvolve melting the work pieces.

There are three forms of soldering, each requiring higher temperatures and each

producing an increasingly stronger joint strength:

1. soft soldering, which originally used a tin-lead alloy as the filler metal,2. silver soldering, which uses an alloy containing silver,3. Brazing which uses a brass alloy for the filler.
http://en.wikipedia.org/wiki/Metalhttp://en.wikipedia.org/wiki/Solderhttp://en.wikipedia.org/wiki/Melting_pointhttp://en.wikipedia.org/wiki/Melting_pointhttp://en.wikipedia.org/wiki/Weldinghttp://en.wikipedia.org/wiki/Alloyhttp://en.wikipedia.org/wiki/Silverhttp://en.wikipedia.org/wiki/Brazinghttp://en.wikipedia.org/wiki/Brasshttp://en.wikipedia.org/wiki/Brasshttp://en.wikipedia.org/wiki/Brazinghttp://en.wikipedia.org/wiki/Silverhttp://en.wikipedia.org/wiki/Alloyhttp://en.wikipedia.org/wiki/Weldinghttp://en.wikipedia.org/wiki/Melting_pointhttp://en.wikipedia.org/wiki/Melting_pointhttp://en.wikipedia.org/wiki/Solderhttp://en.wikipedia.org/wiki/Metal


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In the soldering process, heat is applied to the parts to be joined, causing the solder tomelt and to bond to the work pieces in an alloying process called wetting.

2.2.4 Flux

The purpose offlux is to facilitate the soldering process. The obstacle to a successfulsolder joint is an impurity at the site of the union, e.g. dirt, oils or oxidation. Theimpurities can be removed by mechanical cleaning or by chemical means, but theelevated temperatures required to melt the filler metal (the solder) encourages the workpiece (and the solder) to re-oxidize. This effect is accelerated as the solderingtemperatures increase and can completely prevent the solder from joining to the workpiece. One of the earliest forms of flux was charcoal, which acts as a reducing agent andhelps prevent oxidation during the soldering process. Some fluxes go beyond the simpleprevention of oxidation and also provide some form of chemical cleaning (corrosion).

For many years, the most common type of flux used in electronics (soft soldering)was rosin-based, using the rosin from selected pine trees. It was ideal in that it was non-corrosive and non-conductive at normal temperatures but became mildly reactive(corrosive) at the elevated soldering temperatures. Plumbing and automotive applications,among others, typically use an acid-based (muriatic acid) flux which provides cleaning ofthe joint. These fluxes cannot be used in electronics because they are conductive andbecause they will eventually dissolve the small diameter wires. Many fluxes also act asa wetting agent in the soldering process,[5]reducing the surface tension of the molten

solder and causing it to flow and wet the workpieces more easily.Fluxes for soft solder are currently available in three basic formulations:

1. Water-soluble fluxes (no VOC's required for removal) are higher activity fluxesdesigned to be removed with water after soldering.

2. No-clean fluxes which are mild enough to not "require" removal due to the non-conductive and non-corrosive residue.[1]Performance of the flux needs to becarefully evaluated; a very mild 'no-clean' flux might be perfectly acceptable for

production equipment, but not give adequate performance for a poorly controlledhand-soldering operation. They are so-called "no-clean" because the residue leftafter the solder operation is non-conductive and won't cause electrical shorts;nevertheless these fluxes leave a white-color residue like dilute bird-droppings.which is plainly visible. Since the presence of foreign matter, detritus, even lint,on circuit boards is adefectfor all three classes of electronic circuit boards
http://en.wikipedia.org/wiki/Wettinghttp://en.wikipedia.org/wiki/Flux_(metallurgy)http://en.wikipedia.org/wiki/Oxidationhttp://en.wikipedia.org/wiki/Charcoalhttp://en.wikipedia.org/wiki/Reducing_agenthttp://en.wikipedia.org/wiki/Rosinhttp://en.wikipedia.org/wiki/Pine_treehttp://en.wikipedia.org/wiki/Muriatic_acidhttp://en.wikipedia.org/wiki/Wetting_agenthttp://en.wikipedia.org/wiki/Soldering#cite_note-4http://en.wikipedia.org/wiki/Soldering#cite_note-4http://en.wikipedia.org/wiki/Soldering#cite_note-4http://en.wikipedia.org/wiki/Surface_tensionhttp://en.wikipedia.org/wiki/Volatile_organic_compoundhttp://en.wikipedia.org/wiki/Soldering#cite_note-indiumcorporation-0http://en.wikipedia.org/wiki/Soldering#cite_note-indiumcorporation-0http://en.wikipedia.org/wiki/Soldering#cite_note-indiumcorporation-0http://en.wikipedia.org/wiki/Soldering#cite_note-indiumcorporation-0http://en.wikipedia.org/wiki/Volatile_organic_compoundhttp://en.wikipedia.org/wiki/Surface_tensionhttp://en.wikipedia.org/wiki/Soldering#cite_note-4http://en.wikipedia.org/wiki/Wetting_agenthttp://en.wikipedia.org/wiki/Muriatic_acidhttp://en.wikipedia.org/wiki/Pine_treehttp://en.wikipedia.org/wiki/Rosinhttp://en.wikipedia.org/wiki/Reducing_agenthttp://en.wikipedia.org/wiki/Charcoalhttp://en.wikipedia.org/wiki/Oxidationhttp://en.wikipedia.org/wiki/Flux_(metallurgy)http://en.wikipedia.org/wiki/Wetting


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(ranging from cheap consumer electronics to high-reliability, mission criticalapplications), these sorts of fluxes must still be cleaned as with all hand solderwork, typically brushing with 99% isopropyl alcohol as the solvent and lint-freenon-synthetic (eg cotton) wipes.

2.2.5 Process

Soldering operations can be performed with hand tools, one joint at a time, or enmasse on a production line. Hand soldering is typically performed with a soldering iron,soldering gun, or a torch, or occasionally a hot-air pencil. Sheet metal work wastraditionally done with "soldering coppers" directly heated by a flame, with sufficientstored heat in the mass of the soldering copper to complete a joint; torches or electrically-heated soldering irons are more convenient. All soldered joints require the same elements

of cleaning of the metal parts to be joined, fitting up the joint, heating the parts, applyingflux, applying the filler, removing heat and holding the assembly still until the filler metalhas completely solidified. Depending on the nature of flux material used, cleaning of thejoints may be required after they have cooled.

The distinction between soldering and brazing is arbitrary and often misunderstood, withsome choosing to make each type a separate category, though the only distinction is thealloy of the filler metal (the solder) and the temperature at which it melts. Soft solderingcan be done with a heated iron whereas the other methods require a higher temperature to

melt the solder than can be achieved with a heated iron. Soldering, by definition, is theuse of a filler metal to join work pieces and, as such, encompasses soft soldering, "hard"soldering (silver soldering) and brazing. The word brazing comes from the type of solderthat is used for that soldering processa brass alloy. The term silver solder likewisedenotes the type of solder that is used. Soft solder comes from the fact that lead was aprimary ingredient and is a soft metal.


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Figure 7

2.3. BLOCK DIAGRAMS

2.3.1. TRANSMISSION CIRCUIT-

It consists of four potentiometers at the input corresponding to 2 differentparameters from two different planes one of which is our mother plane.

Then comes the PIC 16F877A controller. PIC is followed by the eight bit encoder HT640/S. Encoder is at the end connected to the Rf transmitter TLP434A.


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Figure 8

2.3.2 RECEPTION CIRCUIT-

The Rf receiver receives the transmitted information and the pass the serial data tothe next stage.

The next stage of this part consists of an eight bit decoder HT-648L. This decoderdecodes the serial data into parallel form and then passes it on.

Moving ahead comes the microcontroller AT89S52; here the main programming isdone.

The comparative o/p of controller is displayed through a 16*2 LCD display. And a buzzer is connected to give the final warning.


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Figure 9

2.4. COMPONENT USED

2.4.1. STEP DOWN TRANSFORMER


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Devices that are used to step down electrical current at input power sources, which allowvoltage to be compatible with equipment.

Transformers are electrical devices that transform voltage through magnetic couplings,and they have no moving parts. There is a magnetic core with one winding of wireplaced close to one or more windings, which can couple two or more alternating-currentcircuits together by employing the induction between the windings. The primary windingis connected to the power source and the other windings are known as secondarywindings. If the secondary voltage wire is less than the primary wire, the transformer iscalled a step down transformer. If the secondary wiring is of higher voltage, thetransformer is a step-up transformer, which increases voltage input.

2.4.2. REGULATOR

Figure 10

A voltage regulator is an electrical regulator designed to automatically maintain a

constant voltage level. A voltage regulator may be a simple "feed-forward" design or mayinclude negative feedback control loops. It may use an electromechanical mechanism, orelectronic components. Depending on the design, it may be used to regulate one ormore AC or DC voltages.

2.4.3. CAPACITOR
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2.4.5. TRANSISTOR

A transistor is a semiconductor device used to amplify and switch electronic signals andpower. It is composed of a semiconductor material with at least three terminals forconnection to an external circuit. A voltage or current applied to one pair of thetransistor's terminals changes the current flowing through another pair of terminals.Because the controlled (output) power can be much more than the controlling (input)power, a transistor can amplify a signal. Today, some transistors are packagedindividually, but many more are found embedded in integrated circuits.

2.4.6 POTENTIOMETER

Figure 13

A potentiometer, informally, a pot, is a three-terminal resistor with a sliding contact thatforms an adjustable voltage divider. If only two terminals are used (one side and the

wiper), it acts as a variable resistoror rheostat. Potentiometers are commonly used tocontrol electrical devices such as volume controls on audio equipment. Potentiometersoperated by a mechanism can be used as position transducers, for example, in a joystick.
http://en.wikipedia.org/wiki/Semiconductorhttp://en.wikipedia.org/wiki/Semiconductor_devicehttp://en.wikipedia.org/wiki/Electronic_amplifierhttp://en.wikipedia.org/wiki/Electronicshttp://en.wikipedia.org/wiki/Electric_powerhttp://en.wikipedia.org/wiki/Gainhttp://en.wikipedia.org/wiki/Integrated_circuithttp://en.wikipedia.org/wiki/Terminal_(electronics)http://en.wikipedia.org/wiki/Resistorhttp://en.wikipedia.org/wiki/Voltage_dividerhttp://en.wikipedia.org/wiki/Transducerhttp://en.wikipedia.org/wiki/Joystickhttp://en.wikipedia.org/wiki/File:Potentiometer.jpghttp://en.wikipedia.org/wiki/Joystickhttp://en.wikipedia.org/wiki/Transducerhttp://en.wikipedia.org/wiki/Voltage_dividerhttp://en.wikipedia.org/wiki/Resistorhttp://en.wikipedia.org/wiki/Terminal_(electronics)http://en.wikipedia.org/wiki/Integrated_circuithttp://en.wikipedia.org/wiki/Gainhttp://en.wikipedia.org/wiki/Electric_powerhttp://en.wikipedia.org/wiki/Electronicshttp://en.wikipedia.org/wiki/Electronic_amplifierhttp://en.wikipedia.org/wiki/Semiconductor_devicehttp://en.wikipedia.org/wiki/Semiconductor


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2.4.7. RESISTOR

Figure 14

A linear resistor is a linear, passive two-terminal electrical component thatimplements electrical resistance as a circuit element. The current through a resistor isin direct proportion to the voltage across the resistor's terminals. Thus, the ratio of thevoltage applied across a resistor's terminals to the intensity of current through the circuitis called resistance. This relation is represented by Ohm's law:

2.4.8. DIODE

In electronics, a diode is a type of two-terminal electronic component with anonlinear currentvoltage characteristic. A semiconductor diode, the most common typetoday, is a crystalline piece ofsemiconductor material connected to two electricalterminals.[1]A vacuum tube diode (now rarely used except in some high-powertechnologies) is a vacuum tube with two electrodes: a plate and a cathode.
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2.4.9 PIC CONTROLLER

28-Pin PDIP, SOIC, SSOP

Figure 15

PIC16F873A/876A devices are available only in 28-pin packages, whilePIC16F874A/877A devices are available in 40-pin and 44-pin packages. All devices inthe PIC16F87XA family share common architecture with the following differences:

The PIC16F873A and PIC16F874A have one-half of the total on-chip memory of thePIC16F876A and PIC16F877A

The 28-pin devices have three I/O ports, while the 40/44-pin devices have five

The 28-pin devices have fourteen interrupts, while the 40/44-pin devices have fifteen

The 28-pin devices have five A/D input channels, while the 40/44-pin devices haveeight


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The Parallel Slave Port is implemented only on the 40/44-pin devices.

Block diagrams of the PIC16F873A/876A and the pin outs for these a device family isshown above. Some pins for these I/O ports are multiplexed with an alternate function forthe peripheral features on the device. In general, when a peripheral is enabled, that Pin

may not be used as a general purpose I/O pin. Programming of PIC family is done usingMP LAB compiler kit available on net.

2.4.10 ENCODER

PIN DIAGRAM

Figure 16

FEATURES

Operating voltage: 2.4V~12V Low power and high noise immunity CMOS technology Low standby current Capable of decoding 18 bits of information Pairs with HOLTEKs HT640 encoder 10 address pins 8 data pins Trinary address setting Two times of receiving check Built-in oscillator needs only a 5% resistor Valid transmission indictor


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Easily interface with an RF or an infrared transmission medium Minimal external components

2.4.11. TRANSMITTER

Figure 17TLP 434-A ULTRA SMALL TRANSMITTER FREQUENCY- 433.92

MHz

Specification: Frequency Range: 433.92MHz Modulate Mode: ASK Circuit Shape: S/F Data Rate: 8Kbps Supply Voltage: 3~12 V Voltage: 3v; Current: 4.9mA Voltage:5v ;Current: 8.4Ma Power Supply & All Input/output pins: -0.3 to 12.0 V Non-Operating Case Temperature: -10 to +85 centigrade Soldering Temperature: 230 centigrade (10 seconds) Simple to Apply with Low External Count High Sensitivity Passive Design.


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2.4.12. RECEIVER

Figure 18

Table 3.1


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2.4.13 DECODERS

Pin description

Figure 19General description

The 318 decoders are a series of CMOS LSIs for remote control system applications.They are paired with the 318 series of encoders. For proper operation a pair ofencoder/decoder pair with the same number of address and data format should be selected(refer to the encoder/ decoder cross reference tables). The 318 series of decoders receivesserial address and data from that series of encoders that are transmitted by a carrier usingan RF or an IR transmission medium. It then compares the serial input data twicecontinuously with its local address. If no errors or unmatched codes are encountered, theinput data codes are decoded and then transferred to the output pins. The VT pin alsogoes high to indicate a valid transmission. The 318 decoders are capable of decoding 18bits of information that consists of N bits of address and 18N bits of data. To meetvarious applications they are arranged to provide a number ofdata pins whose range is from 0 to 8 and an address pin whose range is from 8 to 18. Inaddition, the 318 decoders provide various combinations of address/data number indifferent packages.


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Features

Operating voltage: 2.4V~12V Low power and high noise immunity CMOS technology

Low standby current Capable of decoding 18 bits of information Pairs with HOLTEKs 318 series of encoders 8~18 address pins 0~8 data pins Trinary address setting Two times of receiving check Built-in oscillator needs only a 5% resistor Valid transmission indictor Easily interface with an RF or an infrared transmission medium

Minimal external components.

2.4.14 AT89S52 CONTROLLER

Description- The AT89S52 is a low-power, high-performance CMOS 8-bitmicrocontroller with 8K bytes of in-system programmable Flash memory. The device ismanufactured using Atmels high-density nonvolatile memory technology and iscompatible with the industry standard 80C51 instruction set and pin out. The on-chipFlash allows the program memory to be reprogrammed in-system or by a conventionalnonvolatile memory programmer. By combining a versatile 8-bit CPU with in-system

programmable Flash on a monolithic chip, the Atmel AT89S52 is a powerfulmicrocontroller which provides a highly-flexible and cost-effective solution to manyembedded control applications. The AT89S52 provides the following standard features:8K bytes of Flash, 256 bytes of RAM, 32 I/O lines, Watchdog timer, two data pointers,three 16-bit timer/counters, a six-vector two-level interrupt architecture, a full duplexserial port, on-chip oscillator, and clock circuitry. In addition, the AT89S52 is designedwith static logic for operation down to zero frequency and supports two softwareselectable power saving modes. The Idle Mode stops the CPU while allowing the RAM,timer/counters, serial port, and interrupt system to continue functioning. The Power-downmode saves the RAM con-tents but freezes the oscillator, disabling all other chipfunctions until the next interrupt or hardware reset.

Features

Compatible with MCS-51 Products 8K Bytes of In-System Programmable (ISP) Flash Memory Endurance: 10,000Write/Erase Cycles


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4.0V to 5.5V Operating Range Fully Static Operation: 0 Hz to 33 MHz Three-level Program Memory Lock 256 x 8-bit Internal RAM 32 Programmable I/O Lines

Three 16-bit Timer/Counters Eight Interrupt Sources Full Duplex UART Serial Channel Low-power Idle and Power-down Modes Interrupt Recovery from Power-down Mode Watchdog Timer Dual Data Pointer Power-off Flag Fast Programming Time Flexible ISP Programming (Byte and Page Mode)

Pin configurations

40-Lead PDIP

Figure 20


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2.5 COMPILERS

2.5.1 MPLAB COMPILER-

In order to develop your software and organize your files you will have to use an

integrated development environment. The number one IDE used with PICmicrocontrollers is MPLab IDE by Microchip Technology. PIC microcontrollers can beprogrammed in Assembly, C or a combination of the two. Other high level programminglanguages can be used but embedded systems software is primarily written in C. Onceyou have downloaded and installed MPLab IDE and chosen a programming language youwill have to select a compiler. The compiler, assembler, and linker are usually combinedin a single package. For basic C operations and delays the files stdlib.h and delay.h areneeded. The file pic.h is required for access to the PIC microcontrollers I/O pins, memorylocations, and other components.

2.5.2 KEIL COMPILER-

The Intel 8x931 USB microcontroller uses the MCS8051 core. The Keil C51 compilercomes with an additional header to accommodate the 8x931 USB peripherals. This file is

Reg931.h and is located in the c:\c51\inc directory. The Keil tool chain consists of thefollowing executables located in the c:\c51eval\bin directory:

mVision uvw51e.exeC Compiler c51.exe

Assembler a51.exeLinker bL51.exedScope dsw51.exemVision IDEmVision is a Windows based front end for the C Compiler and Assembler. It wasdeveloped in the USA as was the printed manual set. Compiler, Assembler and Linkeroptions are set with simple mouse clicks. mVision runs on Windows 3.1, 95 and NT.

C51 C Compiler for the 8051, 8x931Hx and 8x931Ax [USB]

The C51 ANSI compiler along with the A51 assembler is designed specifically for theIntel MCS8051 microcontroller family, including the 8x931 USB. The C51 is 100%compatible with existing 8051 programs.

A51 Macro Assembler

This Macro Assembler is included with each Compiler package or is available separately.All utilities needed to complete your project are included for all members of the 8051


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family. This Assembler is DOS based or can be run from mVision which is included withevery Assembler and Compiler package.

BL51 Linker - Banked Linker

The BL51 Linker/Locator is used to join reloadable object modules and library files

together. The object files are created with the C51 compiler or the A51 Assembler usingthe Keil library files. The linking process results in absolute object modules.

dScope Simulator

dScope is a software simulator. Your code can be debugged either in software on your PCor in your target hardware. When operated in conjunction with the Keil monitor installedin your target hardware, dScope becomes tScope.

2.6 WORKING AND THEORY OF THE PROJECT:-

The aircraft collision avoiding system so developed is based on the ATC (air trafficcontrol) communication with the plane. The ATC is the master control unit the groundstation which controls all the on air routes and process based on RADAR navigationsystem. The ATC calculate the speed, height and other parameters of the plane throughthe RADAR technology. This collision avoidance system which can be easilyimplemented in the planes and is reliable as well. This system works on the datatransmission between the plane and the ground station. Along with all othercommunication parameters the ATC sends the warning signal in terms of data of other

planes. The data send from the ATC comprises of all the parameters corresponding to theflight of other planes in the same area. These parameters are then received bi the planeand the matched wrt to its own parameters and resulting upon the calculation the o/p isgenerated.

Transmission side description

This circuit consists of all the input parameters being transmitted from ATC tothe planes which includes all the data from different planes and received and stored atATC. It consists of four I/Ps given to a PIC microcontroller. This performs the task ofconversion of analog data in digital form and then its transmission through an encoder,which convert the parallel o/p of microcontroller into serial to be given to Rf transmitterto be transmitted to the plane.


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Reception side description

On this side the transmitted signal is being received by the Rf receiver. Thisreceived data is in serial form so is again feed to a decoder which decodes the serial datainto parallel form. This parallel data is then feed to the microcontroller AT89S52 whichbelongs to 8051 family. Here the required programming is done for checking ofparameters and developing of a system which can effectively avoid mid air collisions andaccordingly a display and alarm is generated.

2.7 LOGIC INVOLVED

Programming is done in embedded C on the following basis. For PIC the MPLABcompiler is used while for AT89S52 the Keil compiler is used. For reception side theprogramming is only for transmission of data but on reception side its for comparisonand display of result.

Transmission side:-

Programming is done in PIC controller for transmission of 4 i/p data through rftransmitter. Simple A/D conversion is involved from 1st port of PIC then these data aretransmitted.

Reception side:-

If (A =! B & C =! D)Display SAFE FLYING;

If (A=B & C=! D)Display ALERT HEIGHT SAME;

If (A=! B & C=D)Display ALERT BEARING SAME;

If (A=B & C=D)Display DANGER,And blow the buzzer;


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CHAPTER 3

3.1 CONCLUSION

The system implemented for transmission of parameters from ground station to the

aircraft can be effectively used for transmission of parameters which can be used by theaircrafts alarm system for comparison of parameters to avoid a dangerous conditionwhich could arise due to neglectance or any failure.

This system is a quite inexpensive system and can be implemented in railways as wellwhich can be helpful for avoiding increasing such kind of accidents in our country.

This system is a relatively low power system as involved the implementation of microcontrollers and various micro chips most of which run near or at 5 volts.So such systems can be effectively implemented and do have a very large scope in R&D

as well.

3.2 REFRENCES-

www.google.com www.wikipedia.org www.datasheetcatalog.com www.matrixtelesol.com Electronics For You Projects Vol. 25 MAX232 data sheet from Texas Instruments Modern Digital Electronics- R.P. Jain
http://www.google.com/http://www.wikipedia.org/http://www.datasheetcatalog.com/http://www.matrixtelesol.com/http://www.matrixtelesol.com/http://www.datasheetcatalog.com/http://www.wikipedia.org/http://www.google.com/


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APPENDICES

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