Microsoft Outlook - Memo Style - Future Electronics

1

Shareen Mehta

From: [email protected]

Sent: Tuesday, October 24, 2017 3:39 AM

Subject: PCN- 56282- Quality Notification2017090001

Attachments: file_20171024145057.pdf; Product List_FPCN_2017090001.xlsx; Final Qualification Report.pdf

Importance: High

Final Product Change Notification PCN number 2017090001

Issue Date:2017-10-24Effective Date:

Dear Customer,Here's your quality information concerning products our customers and partners purchased from WeEn.

Management Summary

Release JCET (Jiangsu Changjiang Electronics Technology Co.,Ltd) as the new Assembly Centre to assemble the products in packages SOT223. The production of all SOT223 products will be moved to JCET from the Assembly Center of ATGD.

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Release JCET as the Assembly Centre for WeEn Products in SOT223

Information Notification

The final PCN is to notify to release JCET as the new Assembly Centre to assemble the products in packages SOT223. The production of all SOT223 products will be moved to JCET from the Assembly Centre of ATGD. The qualification report is for your reference.

Why do we issue this Information Notification

The new assembly center is top supplier worldwide who can increase our assembly capacity, and effectively plan internal resources to improve the feasibility of capacity. The adopted equipments are advanced and mature, which will ensure the high product quality.

Identification of Affected Products

The assembly code on the device marking or on the label will be changed from "W" to "L". The affected Product List attached.

ImpactData Sheet Revision

No impact to the product functionality anticipated. No change on the data sheet.

Disposition of Old Products

Existing inventory will be shipped until depleted.

Production

The assembly line is ready.

Additional information

Affected products and sales history information: see attached file of Product List.See attached file of Self-qualification Report.

Remarks

Should you not be able to obtain these documents, please contact your WeEn sales representative or the e-mail address mentioned below under Contact and Support.

Contact and Support

For all Quality Notification content inquiries, please contact your local WeEn Sales Support team.

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For specific questions on this notice or the products affected please contact our specialist directly.

Name:Shawn LinPosition:Quality Manager QSe-mail address:[email protected]

At WeEn Semiconductors we are constantly striving to improve our product and processes to ensure they reach the highest possible Quality Standards.

You have received this email because you are a designated contact or subscribed to WeEn Quallity Notifications. WeEn shall not be held liable if this Notification is not correctly distributed within your organization.

This message has been automatically distributed. Please do not reply.

WeEn Semiconductorswww.ween-semi.com

PCN: FPCN 2017090001

Qual Plan: QP70101

Final Qualification Report:

SOT223 Package Qualification at Assembly&Testing

Subcontractor JCET

Date: 20171012 Author: HuaxingHuang Page: 1 Revision: 01

Final Qualification Report

SOT223 Package Qualification at Assembly & Testing Subcontractor JCET

PCN: FPCN 2017090001

Qual Plan: QP70101



Subcontractor JCET


Table of Contents

1. Introduction ..................................................................................................................................................... 3

2. Affected Types ................................................................................................................................................ 3

3. Purposed Material ........................................................................................................................................... 3

4. Current Technology, Platform or Material Used ............................................................................................ 3

5. Test Vehicles ................................................................................................................................................... 3

6. Package Structure ............................................................................................................................................ 3

6.1 Package Outline Review .......................................................................................................................... 4

6.2 Package Dimension/Drawing Review ..................................................................................................... 4

7. Self-Qualification Result ................................................................................................................................. 7

7.1 Key Process Control ................................................................................................................................ 7

7.2 Reliability Test Result ……………………………………………………………………………..…7

7.3 Solderability …………………………………………………………………………………….…….7

7.3 Packing…………………………………………………………………………………………….…….8

8. Marking ........................................................................................................................................................ .10

9. Conclusions .................................................................................................................................................. .10

10. Document Revision Sheet ............................................................................................................................ .10

PCN: FPCN 2017090001

Qual Plan: QP70101



Subcontractor JCET


1. Introduction

The qualification is to qualify packages of SOT223 at JCET (CHANGJIANG ELEC.TECH.). JCET

is one of the 1st tier Assembly&Testing centers worldwide, who has been certificated the ISO/TS16949.

2. Affected Types

Please see detailed product list .

3. Purposed Material

BOM as the below.

4. Technology, Platform or Material Used

Material ATGD JCET

Wafer No Change

Leadframe Copper with Ag plated Copper with Ag plated

Glue Sumitomo CRM-1061S Henkel 84-1MISR4

Wire Heraeus with Cu 1.3 mil, 2mil

Heraeus with Cu 1.3mil,2mil

Molding Compound

Henkel Halogen Free Henkel Halogen Free

Plating Matte Tin Matte Tin

5. Test vehicles

At least 3 devices were chosen for qualification vehicle, which cover all wafer technology platform,

biggest die size , highest voltage and key variation.

6. Package Structure

The comparison of package outline between JCET’s and ATGD’s, please see the details as below:

PCN: FPCN 2017090001

Qual Plan: QP70101



Subcontractor JCET


6.1 Package Outline Review

SOT223 View

ATGD’s Top JCET’s Top

6.2 Package dimension/drawing review

Remark : The POD is from datasheet and keeps no change for all key dimension.

ATGD JCET

Max. Min. Max. Min.

A TTL Height 1.80 1.50 1.80 1.61 1.56 FitA1 Stand off 0.10 0.01 0.10 0.02 0.02 0.05 Fitbp Lead Width 0.80 0.60 0.80 0.66 0.74 0.72 Fitb1 Big lead width 3.10 2.90 3.10 2.90 3.00 2.95 Fitc Lead Thickness 0.32 0.22 0.35 0.23 0.26 0.28 FitD Body Length 6.70 6.30 6.70 6.30 6.47 6.45 FitE Body Width 3.70 3.30 3.70 3.30 3.48 3.55 Fite 1-3 Lead Pitch 4.60 4.60 Fite1 Lead Pitch 2.30 2.30 FitHe TTL Length 7.30 6.70 7.30 6.70 6.99 6.95 FitLp Seat Plate 1.10 0.70 0.75 0.94 0.99 Fitv Symmetry of body side 0.20 0.20 Fitw Position of body side 0.10 0.10 Fity Flatness of lead 0.10 0.10 Fit

POD Summary

Symb. ItemATGD SPECJCET SPEC

RemarkActual Dimension

4.60

0.10 0.10

0.20 0.20

0.10 0.10

2.30 2.30

4.60

PCN: FPCN 2017090001

Qual Plan: QP70101



Subcontractor JCET


6.2.1 Package Outline Drawing

PCN: FPCN 2017090001

Qual Plan: QP70101



Subcontractor JCET


6.2.2 Soldering

Remark : The footprint is from Datasheet and keeps no change.

PCN: FPCN 2017090001

Qual Plan: QP70101



Subcontractor JCET


7. Self-Qualification Results

7.1 Key Process Control

7.2 Reliability Test Condition and Result

Test Items Test Condition Sample Size Result

Pre-condition MSL 1 4 lots x 320pcs Pass

Temperature Cycle (TMCL) 200 cycles at -65C to 150C. 4 lots x 80pcs Pass

Unbiased Highly Accelerated

Stress Test (UHST) 96 hours at Ta = 130C, RH = 85% 4 lots x 80pcs Pass

High Temperature, Humidity

& Reverse Bias (THBS) 1000 hours at Tj = 85C, RH = 85%,

Reverse Bias =80V

4 lots x 80pcs Pass

Thermal Fatigue (TFAT) 10000 cycles, Tj = 25ºC to 125ºC, Tj

≥ 80ºC,

4 lots x 80pcs Pass

Static High Temperature Life

(SHTL)

1000 hours ; Tj = max operating temp,

Reverse Bias = 80% rated voltage.

4 lots x 80pcs Pass

High Temperature Storage

(HTSL)

1000 hours at Ta = 150°C 4 lots x 80pcs Pass

7.3 Solderability

Process Station Wafer Saw Die Attach

Items Kerf Width Epoxy Thickness Wire Pull Test Ball Shear Test

Unit um um gf gf

Lower limit 24 5 20 58

Upper limit 36 25 135

Min 27 13 42.8 93.1

Max 30 19 51.4 117.5

Stdev 0.85 1.68 2.15 6.43

Ave 28.97 15.87 48.36 106.72

Cpk 1.95 1.82 4.39 2.53

Wire Bonding

PCN: FPCN 2017090001

Qual Plan: QP70101



Subcontractor JCET


7.4 Packing

7.4.1 Packing method

The packing method is the same as the original tape&reel, please see the below:

Packing Quantity,-135: 4000 units per reel.

Packing Quantity,-115: 1000 units per reel.

7.4.2 Packing material/Carrier Tape comparison

Remark : There is no major change at key dimensions.

JCET

ATGD

PCN: FPCN 2017090001

Qual Plan: QP70101



Subcontractor JCET


7.4.3 Label on Pizza box

Label from ATGD Label from JCET

Remark : The code of factory location shows on Label with L instead of W which marked in red.

PCN: FPCN 2017090001

Qual Plan: QP70101



Subcontractor JCET


8. Marking Appearance

Assembly Lot Code with 3 vertical digits from “001 to 999” denotes assembly lot number in manufacture

size for better traceability. And factory location code at left top side denotes Fab site of WeEn Jilin

inhouse and Assembly & testing subcontractor of JCET . Others keep no change as below.

Factory Location Code and Assembly Lot Code

9. Conclusions

Base on the qualification data, Package of SOT223 at JCET meets WeEn’s quality & reliability

requirement, thus it can be released for mass production.

10. Document Revision Sheet

R E V I S I O N S H E E T

DATE REV

.

DESCRIPTION AUTHOR

01 Initial release Huaxing Huang

AFFECTED MPNBT134W-600,115

BT134W-600,135

BT134W-800,115

BT148W-600R,115

BT134W-600D,115

BT134W-600E,115

BT168GW,115

BYV40E-150,115

BT131W-600,135

BTA204W-600B,135

BTA204W-600C,135

BTA204W-600D,135

BTA204W-600E,135

BTA204W-600F,135

BTA204W-800E,135

MCR08BT1,115

Z0103MN,135

Z0103NN,135

Z0107MN,135

Z0107NN,135

Z0109MN,135

Z0109NN,135

BTA204W-800C,135

OT393,115

BTA201W-600E,115

BTA201W-800E,115

BT1308W-600D,115

BT1308W-600D,135

BT1308W-400D,115

BT1308W-400D,135

OT406,135

OT408,135

OT409,135

ACT108W-600E,135

OT412,115

ACT108W-600D,135

BT168GWF,115

Z0103MN0,135

Z0103NN0,135

Z0107NN0,135

Z0107MN0,135

Z0109MN0,135

Z0109NN0,135

BTA2008W-600D

BTA2008W-800D

EC103D1W,115

OT418,115

ACTT2W-800ETN,135 ACT108W-800E,135

NCR100W-10L,115

NCR100W-12M,115

NCR100W-10M,115

NCR100W-12L,115

Microsoft Outlook - Memo Style - Future Electronics

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