Micro ABOUr 1HE COVER - IEEE Computer Society · ABOUr1HE COVER IEEEMicro Inlate...

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IEEE Micro ABOUr 1HE COVER In late 1975 a small group was formed at Intel to develop a high-end microcom- puter system. That group's early focus was the long-term relationship between computer architecture and VLSI semi- conductor technology. Recognizing that the functional densities of MOS inte- grated circuits are increasing by a factor of two to three every two years, the group perceived that they could design a VLSI computer system that would gracefully absorb rapid improvements in semicon- ductor technology without requiring con- tinual changes in its basic architecture. The result of this perception is three VLSI chips-one with 110,000 transistors and a die size of 320 mil2, one with 49,000 tran- sistors and a die size of 338 mil2, and one with 60,000 transistors and a die size of 341 mil2 (pictured on this month's cover). These chips are designed for a multiple processor system that can achieve a perfor- mance equal to a midrange mainframe computer. Figure 1, showing the number of MOS devices on a microcomputer chip in rela- tionship to the year of introduction, dem- onstrates the rapid increase in functional densities in the last few years. This in- crease is caused by three forces working simultaneously: * general improvements in semicon- ductor manufacturing technology, * the use of regular structures and mi- crocode in the design of micropro- cessor chips, and * the recognition that an architecture can grow to take advantage of rapid improvements in functional densities. These forces give new generations of mi- croprocessors larger die sizes, higher clock rates, and more architectural fea- tures than ever before, as the iAPX 432 shows (Table 1). Since this microproces- cont'd on page 6 Figure 1. Transistors per CPU vs. year of introduction. Table 1. A 32-bit microcomputer provides greater functionality than a 16-bit system. iAPX 432 FUNCTIONALITY ADDRESS SPACE INSTANTANEOUS VIRTUAL DATA TYPES INSTRUCTION SET 1/0 PROTECTION 232 240 8, 16, 32, 64 AND 80-BIT BOOLEAN, CHARACTER ORDINAL, INTEGER, REAL LONG ORDINAL, INTEGER, REAL HIGH LEVEL (e.g., A=B+C) MULTIOPERAND (0-3) VECTOR, RECORD INDEPENDENT PARALLEL FINELY GRAINED PER DATA STRUCTURE TYPICAL 16-BIT FUNCTIONALITY 216 - 218 NO SUPPORT 8, 16-BIT BOOLEAN, CHARACTER ORDINAL, INTEGER ASSEMBLY LEVEL TWO-OPERAND REGISTER-BASED DEPENDENT SLAVED COARSE SUPERVISOR/USER Senior Editor Richard C. Jaeger Editorial Board Andrew Allison Tuvia Apelewicz Walter R. Beam J. Thomas Cain Alvin Despain Patrick P. Fasang Donald Feinberg Publisher True Seaborn Associate Publisher Ginger Conrad Managing Editor Joe Schallan Editorial Assistant Noel Deeley Contributing Editor Ware Myers Associate Senior Editor Peter R. Rony John L. Hennessy Gerald Kane Fred Liguori Richard Markowitz Jean-Daniel Nicoud Deene Ogden Art Director Larry Bauer Production Larry Bauer Advertising Director Dawn Peck Advertising Production Barbara Cunningham IEEE Computer Society Publications Committee Oscar N. Garcia (chairman), D. Agrawal, B. Berra, T. Estrin, S. P. Kartashev, G. J. Lipovski, J. F. Meyer, E. A. Parrish, C. V. Ramamoorthy, T. R. N. Rao, S. Rosenbaum, R. L. Russo, J. N. Snyder, R. G. Stewart, C. L. Wu Ex officio: L. Belady, T. Booth, N. Prywes, K. S. Fu, P. Isaacson, R. C. Jaeger, R. Rice, P. R. Rony, H. T. Seaborn, M. Smith, M. J. Wozny CIRCULATION: IEEE Micro (ISSN 0272-1732) is published in February, May, August, and November by the IEEE Computer Society, 10662 Los Vaqueros Circle, Los Alamitos, CA 90720; (714) 821-8380. Annual sub- ,scription:$8.00 in addition to society metnber dues; non- members $23.00. Single-copy prices: members $6.00; nonmembers $12.00. This journal is also available in microfiche form. UNDELIVERED COPIES. CHANGE OF ADDRESS: Address all correspondence to IEEE Service Center, 445 Hoes Lane, Piscataway, NJ 08854. POSTMASTER: Send form 3579 to IEEE Micro, IEEE Service Center, 445 Hoes Lane, Piscataway, NJ 08854. Application to mail at second class postage rates is pend- ing at New York, NY and at additional mailing offices. COPYRIGHT AND REPRINT PERMISSIONS: Ab- stracting is permitted with credit to the source. Libraries are permitted to photocopy beyond the limits of US Copyright law for private useof patrons: those post- 1977 articles that carry a code at the bottom of the first page. provided the per-copy fee indicated in the code is paid through the Copyright Clearance Center, PO Box 765, Schenectady, NY 12301. Instructors are permitted to photocopy isolated articles for noncommercial class- room use without fee. For other copying, reprint, or re- publication permission, write to Editor. IEEE Micro, 10662 Los VaquerosCircle, Los Alamitos, CA 90720. All rights reserved. Copyright © 1981 by The Institute of Electrical and Electronics Engineers, Inc. EDITORIAL: Unless otherwise stated, bylined articles, as well as products and services offered in New Products, Notes on Application and Design, and the Product Sum- mary, reflect the author's or firm's opinion; inclusion in the publication does not necessarily constitute endorse- ment by the IEEE or the IEEE Computer Society. 0272-1732/81/0500-0003500.75 1981 IEEE May 1981 3

Transcript of Micro ABOUr 1HE COVER - IEEE Computer Society · ABOUr1HE COVER IEEEMicro Inlate...

Page 1: Micro ABOUr 1HE COVER - IEEE Computer Society · ABOUr1HE COVER IEEEMicro Inlate 1975asmallgroupwasformed atIntel todevelopahigh-endmicrocom-puter system. That group's early focus

IEEE Micro

ABOUr 1HE COVERIn late 1975 a small group was formed

at Intel to develop a high-end microcom-puter system. That group's early focuswas the long-term relationship betweencomputer architecture and VLSI semi-conductor technology. Recognizing thatthe functional densities of MOS inte-grated circuits are increasing by a factorof two to three every two years, the groupperceived that they could design a VLSIcomputer system that would gracefullyabsorb rapid improvements in semicon-ductor technology without requiring con-tinual changes in its basic architecture.The result of this perception is three VLSIchips-one with 110,000 transistors and adie size of 320 mil2, one with 49,000 tran-sistors and a die size of 338 mil2, and onewith 60,000 transistors and a die size of341 mil2 (pictured on this month's cover).These chips are designed for a multipleprocessor system that can achieve a perfor-mance equal to a midrange mainframecomputer.

Figure 1, showing the number ofMOSdevices on a microcomputer chip in rela-tionship to the year of introduction, dem-onstrates the rapid increase in functionaldensities in the last few years. This in-crease is caused by three forces workingsimultaneously:

* general improvements in semicon-ductor manufacturing technology,

* the use of regular structures and mi-crocode in the design of micropro-

cessor chips, and* the recognition that an architecture

can grow to take advantage of rapidimprovements in functional densities.

These forces give new generations of mi-croprocessors larger die sizes, higherclock rates, and more architectural fea-tures than ever before, as the iAPX 432shows (Table 1). Since this microproces-

cont'd on page 6

Figure 1. Transistors per CPU vs. year ofintroduction.

Table 1.A 32-bit microcomputer provides greater functionality than a 16-bit system.

iAPX 432FUNCTIONALITY

ADDRESS SPACEINSTANTANEOUSVIRTUAL

DATA TYPES

INSTRUCTIONSET

1/0

PROTECTION

2322408, 16, 32, 64 AND 80-BITBOOLEAN, CHARACTERORDINAL, INTEGER, REALLONG ORDINAL, INTEGER, REALHIGH LEVEL (e.g., A=B+C)MULTIOPERAND (0-3)VECTOR, RECORDINDEPENDENTPARALLELFINELY GRAINEDPER DATA STRUCTURE

TYPICAL 16-BITFUNCTIONALITY

216 - 218NO SUPPORT8, 16-BITBOOLEAN, CHARACTERORDINAL, INTEGER

ASSEMBLY LEVELTWO-OPERANDREGISTER-BASEDDEPENDENTSLAVEDCOARSESUPERVISOR/USER

Senior EditorRichard C. Jaeger

Editorial BoardAndrew AllisonTuvia ApelewiczWalter R. BeamJ. Thomas CainAlvin DespainPatrick P. FasangDonald Feinberg

PublisherTrue Seaborn

Associate PublisherGinger Conrad

Managing EditorJoe Schallan

Editorial AssistantNoel Deeley

Contributing EditorWare Myers

Associate Senior EditorPeter R. Rony

John L. HennessyGerald KaneFred LiguoriRichard MarkowitzJean-Daniel NicoudDeene Ogden

Art DirectorLarry Bauer

ProductionLarry Bauer

Advertising DirectorDawn Peck

Advertising ProductionBarbara Cunningham

IEEE Computer SocietyPublications Committee

Oscar N. Garcia (chairman), D. Agrawal,B. Berra, T. Estrin, S. P. Kartashev,G. J. Lipovski, J. F. Meyer, E. A. Parrish,C. V. Ramamoorthy, T. R. N. Rao,S. Rosenbaum, R. L. Russo, J. N. Snyder,R. G. Stewart, C. L. Wu

Ex officio:L. Belady, T. Booth, N. Prywes, K. S. Fu,P. Isaacson, R. C. Jaeger, R. Rice,P. R. Rony, H. T. Seaborn, M. Smith,M. J. Wozny

CIRCULATION: IEEE Micro (ISSN 0272-1732) ispublished in February, May, August, and November bythe IEEE Computer Society, 10662 Los Vaqueros Circle,Los Alamitos, CA 90720; (714) 821-8380. Annual sub-,scription:$8.00 in addition to society metnber dues; non-members $23.00. Single-copy prices: members $6.00;nonmembers $12.00. This journal is also available inmicrofiche form.

UNDELIVERED COPIES. CHANGE OF ADDRESS:Address all correspondence to IEEE Service Center, 445Hoes Lane, Piscataway, NJ 08854.

POSTMASTER: Send form 3579 to IEEEMicro, IEEEService Center, 445 Hoes Lane, Piscataway, NJ 08854.Application to mail at second class postage rates is pend-ing at New York, NY and at additional mailing offices.

COPYRIGHT AND REPRINT PERMISSIONS: Ab-stracting is permitted with credit to the source. Librariesare permitted to photocopy beyond the limits of USCopyright law for private useofpatrons: those post- 1977articles that carry a code at the bottom of the first page.provided the per-copy fee indicated in the code is paidthrough the Copyright Clearance Center, PO Box 765,Schenectady, NY 12301. Instructors are permitted tophotocopy isolated articles for noncommercial class-room use without fee. For other copying, reprint, or re-publication permission, write to Editor. IEEE Micro,10662 Los VaquerosCircle, Los Alamitos, CA 90720. Allrights reserved. Copyright © 1981 by The Institute ofElectrical and Electronics Engineers, Inc.

EDITORIAL: Unless otherwise stated, bylined articles,as well as products and services offered in New Products,Notes on Application and Design, and the Product Sum-mary, reflect the author's or firm's opinion; inclusion inthe publication does not necessarily constitute endorse-ment by the IEEE or the IEEE Computer Society.

0272-1732/81/0500-0003500.75 (© 1981 IEEEMay 1981 3

Page 2: Micro ABOUr 1HE COVER - IEEE Computer Society · ABOUr1HE COVER IEEEMicro Inlate 1975asmallgroupwasformed atIntel todevelopahigh-endmicrocom-puter system. That group's early focus

sor provides a level of functionalitypreviously associated only with main-frame computers, the developers coined anew term for it-"micromainframe."

The three-chip set comprises approx-imately 225,000 MOS devices and repre-sents over 100 man-years of design andlayout effort. A two-chip general dataprocessor performs instruction decoding,address generation, and data manipula-tion. It provides a virtual address space of240 bytes and a physical address space of224 bytes. The third chip (pictured on thecover) is an interface processor that pro-vides a bridge from an 1/0 subsystem tothe protected access environment of thecentral system. An 1/0 subsystem uses an8- or 16-bit microprocessor as an attachedprocessor, thus making 1/0 completely in-dependent of the central system (Figure 2).

Design methods. The iAPX 432 repre-sents one of the largest single programsever undertaken by Intel. To accomplishit, the company developed a new ap-proach to chip design called "large chipmethodology."

A large project like the iAPX 432 pro-gram requires special documentation, newdesign practices, and new CAD tools. Themajor problem with implementing suchcomplex systems on silicon is that describ-ing, understanding, analyzing, and de-signing complex VLSI circuits involve atleast five conceptual levels. Each level ischaracterized by a distinct language forrepresenting its elements (Table 2) andeach level has its own data base and its ownprimary CAD tool. In the iAPX 432 pro-gram, the CAD tools were focused at two

areas-reducing errors within a descrip-tion level and reducing errors when trans-lating between description levels. The fol-lowing tools were developed and used ateach level:

* macrosimulator-to simulate thebasic architecture;

* microsimulator-to simulate themicroarchitecture of the machine;

* logic simulator-to simulate themachine at the logic level;

* circuit-level simulator-to simulatethe circuits; and

* mask-level description-to describethe basic devices generated at theabove levels.

Each level has programs to check forerrors within that level. The development

Table 2.The five conceptual levels fordescribing, understanding, andanalyzing complex VLSI circuits.

LEVEL

ARCHITECTURAL

JiARCH ITECTU RAL

LOGICAL

PHYSICAL

MASK

DATA BASETEXT AND PICTURES

REGISTER TRANSFERDESCRIPTION

UNSIZED SCHEMATICDESCRIPTION

SIZED SCHEMATICDESCRIPTION

DIGITIZED MASKDESCRIPTION

Figure 2. Microarchitecture of a 32-bit iAPX 432-based "micromainframe" system.

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Page 3: Micro ABOUr 1HE COVER - IEEE Computer Society · ABOUr1HE COVER IEEEMicro Inlate 1975asmallgroupwasformed atIntel todevelopahigh-endmicrocom-puter system. That group's early focus

group also devised programs to check be-tween levels.

Table 3 outlines the group's experiencewith the large chip methodology. Eachsuccessive design became more regular,had higher layout productivity, and fewererrors. -

This is an edited version ofapaperpre-sented on February 18, 1981, at the Inter-national Solid-State Circuits Conference;a shorter version appeared in the ISSCCDigest of Technical Papers. The presenterwas William W. Lattin of Intel Corpora-tion; members of the iAPX 432 develop-ment group included Lattin, John A. Bay-liss, David L. Budde, Stephen R. Collev,George W. Cox, Allan L. Goodman, Jus-tin R. Rattner, William S. Richardson,and Roger C. Swanson.

Cover photo is courtesy ofJim Jarrett,Intel Corporation.

Table 3.Intel's experience with large chip methodology, as demonstrated by the

design of the three chips for the iAPX 432.

432/01 432/02 432/03DIE SIZE (MILS) 318x323 366x313 358x326TOTAL DEVICEPLACEMENTS llOK 49K 60KTOTAL ACTUALDEVICES

DRAWN DEVICES

NO OF SCHEMATICS

LAYOUT PRODUCTIVITY(DRAWN DEVICES)

(MAN-DAY)FATAL LAYOUT ERRORS

ON FIRST LINE CHECK

FATAL LAYOUT ERRORSON SECOND LINE CHECK

FATAL LAYOUT ERRORSON THIRD LINE CHECK

LAYOUT ERRORSON FIRST STEPPING

LAYOUT ERRORSON SECOND STEPPING

60K

5591

39

2 79

274

133

10

10

37K

9500

64

3.97

49K

5700

52

5.10

170 CVS*

29

CVS *

2 0

5

'CVS indicates the use of a CAD tool to compare the mask descriptionagainst the logic description (i e. the schematic)

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