Michail MorozCalifornia, USA760-583-6594 M45897@hotmail.comhttp://www.linkedin.com/pub/michail-moroz/42/3a6/734

SUMMARY

Research Scientist / EngineerMotivated professional with over 30 years of combined experience in research, development, formulating, and high volume production of various thick film cermet inks, their compo-nents, and hybrid circuits. Sincere commitment to professional growth, dedicated to the principle of continuous improvement. Strong track record of taking ideas to profitable products. Well organized, conscientious and thorough with details. Able to complete complex assignments on tight deadlines and in fast paced environment. Confident in making independent decisions and achieving set goals. Effective in multitasking situations keeping proper balance between planning ahead and taking new sudden challenges.Committed to producing results above and beyond what’s expected. Capable to work independently and also coordinate with others. Successful in training both R&D and production teams and building new capabilities in the team.Strength in analyzing, researching, organizing, and problem solving targeting the highest yield and cost effectiveness. Capable to find effective off-the-beaten-track technical solutions.25+ scientific publications concerning thick film technology https://www.researchgate.net/profile/Michail_Moroz2

SKILLS & EXPERTISE

Electronic materials and components: Thick film material systems for alumina, aluminum nitride, aluminum, copper, LTCC, stainless steel, and crystallized glass substrates Resistive, conductive and dielectric pastes Ruthenium based powders for thick film resistors with predicted characteristics Special glasses for thick film materials: conductors, dielectrics, and resistors Ruthenium-containing conductive ceramicsPowders of metals, glasses, and ceramics Organic vehicles for thick film inks with specific requirements such as fine line and thick print Co-fired buried/surface and post fired LTCC resistors and conductorsPhoto-imageable and photo-engraving high resolution conductorsThick film microwave circuits NTC low-ohmic thermistors with controlled beta Hybrid resistors, hybrid integrated circuits and resistor networks Thick film resistors for trimmers and potentiometers on alumina and AlN substrates Ultra-high value thick film resistors on alumina High value thick film resistors on AlN substratesThick film resistors for harsh environment applications: high temperature and extreme coldStandard and “thrifted’ Ag/Pd surge resistors on alumina and AlN substratesFine line Ag and Cu conductors on alumina, and AlN Thick print Ag and Cu conductors on alumina and AlN substratesCu/Ni/Cr surge and hybrid resistors on alumina and AlN substratesCu/Ni/Cr heater resistors on alumina, AlN substrates, and Direct Bond Copper (DBC) substratesPastes for dielectric coatings on stainless steel, copper, and aluminum substratesLow-temperature firing Ag-based fine line and thick print conductor inks for dielectric coated stainless steel, copper, and aluminum substratesLow-temperature firing full-range resistive inks for dielectric coated stainless steel and aluminum substratesLow-temperature heater resistive inks for dielectric coated stainless steel and aluminum substratesPaints, powders, and organic vehicles used for thick film Molybdenum-Manganese (Mo-Mn) refractory metalizing of ceramic partsProcesses: Development and manufacturing of resistive, conductor, and dielectric thick film inksSynthesis of complex ruthenium-based conductive phases and precipitation of the colloids from solutions Sintering of ceramic powders for producing conductive ceramics for ultra-high ohmic value resistorsOrganic vehicles synthesis Inks viscosity testing and interpreting of results for judicious choice of screen printing conditionsManufacturing of complex thick film hybrid microelectronic packages and chip resistorsScreen printing of various thick film inks in controlled conditions Co-firing of LTCC structuresManufacturing of thick film multilayer structures on various metal, ceramic, and crystallized glass substrates Blending, screen printing and firing of thick film inks High-temperature synthesis and grinding of special glasses and ceramicsThick film elements performance testing Photo-imageable and photo-engraving materials processing for microwave applications Lean manufacturingThick film refractory metallization of ceramic parts for microwave applicationsMo-Mn paint application methods: screen/transfer, needle/roller, brush, spray, and centrifuge Firing of metallized ceramic parts in wet hydrogen atmosphere using CAMCo furnacesHelium leak testing used for verifying the integrity of brazed jointsTesting the tensile strengths of metalized ceramic seal assembliesMetallization thickness measurement and qualitative analysis using HITACHI Fluorescent X-Ray (XRF) Coating Thickness Gauge

PROFESSIONAL EXPERIENCE

Remtec IncSenior Process Development Engineer, Norwood, MA2019 – PresentThick film ceramic metallization and packaging technologies

L3 TechnologiesEngineer IV, Los Angeles, CA2017 – 2019Metallization of ceramics - thick film materials/process development and production

Advanced SubstrateManufacturing and Process Engineer, Greensboro, NC2017 Process development and scale-up of high volume production of thick film resistor networksProcess development and production of photo-patterned (photo-engraving and photo-imageable processes) thick film circuits with line/gap resolution inherent to thin film circuits

Thick Film Paste Technology Expert Consultant, Los Angeles, CASuccessfully organized and established in-house production from scratch of thick film materials at international location (China) using original research and methods.2015 – 2017Key accomplishments:Analyzed existing thick film technology at customer’s plant.Offered efficient technical solutions for problems solving and further improvement of thick film processes and materials quality. Managed customer’s cross-functional team pursuing set targets.Significantly surpassed the prototype by both performance and cost

TT ELECTRONICS, Fullerton, CAPrincipal Engineer2005 – 2015Developed and manufactured advanced thick film material systems for Light Emission Diodes (LED) thermal management on various ceramic and metal bearing substrates.Developed and manufactured special glasses for thick film applications.Scaled-up developed thick film materials to high volume production. Procured and installed equipment for thick film processes.Analyzed and documented experimental results, formulas, procedures, and processes. Conducted patent and literature surveys to keep up with the latest thick film technology trends. Key accomplishments:In continuation to previously elaborated concepts and approaches, improved the following thick film systems:Ultra high value thick film resistorsThick film resistors for harsh environment applications: high temperature and extreme cold“Thrifted’ Ag/Pd surge resistors on alumina and AlN substratesCu/Ni/Cr surge resistors on alumina and AlN substratesHigh value thick film resistors on AlN substratesFine line Ag and Cu conductors on alumina and AlN substratesThick print Ag and Cu conductors on alumina and AlN substratesLow-ohmic NTC thermistor inksPastes for dielectric coatings on aluminum substratesLow-temperature firing Ag-based fine line and thick print inks for aluminum substratesLow-temperature full-range resistive inks for aluminum substratesLow-temperature heater resistive inks for aluminum substratesResults were described at: https://www.researchgate.net/publication/277890703_Thick_Film_Systems_for_Challenging_Applications

FERRO ELECTRONIC MATERIAL SYSTEMS, Vista, CAResearch Scientist, R&D Resistor Group Leader1999 – 2005Planned and executed laboratory research aimed at development of thick film resistive inks for such applications as LTCC co-fired/post fired, hybrid microelectronic circuits, resistive networks, surge protection, thick film heaters, and thermistors.Scaled-up developed thick film resistive inks to high volume production. Provided hands-on training of equipment usage for technicians: 3-roll milling, viscosity testing, screen printing, firing furnace profiling, resistor TCR and surge performance testing.Developed new test procedures. Solved technical problems dealing with circuit manufacturing at paste customers’ facilities.Key accomplishments:Developed original concept of precise LTCC resistors with enhanced stability.Developed, manufactured and supplied to major Ferro customers new 82-series - the most accurate LTCC post fired resistors with the widest resistivity range and set of resistor geometries: https://www.researchgate.net/publication/272092904_Performance_of_LTCC_Resistors_in_Extreme_Cold_Environment_-_PresentationDeveloped and continuously manufactured Ferro RE-88 “thrifted” surge resistor system which was chosen by Ferro major customers over similar resistor systems presented by the competitors: https://www.researchgate.net/publication/272093064_New_Low_Cost_Surge_Resistive_InksImproved and successfully manufactured variety of former EMCA-REMEX resistor materials that were transferred to Ferro Electronic Material Systems after EMCA-REMEX acquisition.Developed, manufactured and supplied to major Ferro customers DL11-194 - lead and cadmium free overglaze ink for surge resistors, obtained US Pat 7,740,899 for this material: https://www.researchgate.net/publication/272747557_Electronic_device_having_lead_and_cadmium_free_electronic_overglaze_applied_thereto

ITS ELECTRONICS, Toronto, CanadaProcess and Materials Engineer, Member of Technical Staff1998 – 1999Implemented processing technology of photosensitive materials for microwave applications.Investigated suitability of thick film photo-imageable technology for manufacturing of such microwave components like Lange couplers and filters.Implemented ISO 9001 and conducted internal audits at the plant.Handled responsibility for production safety and quality assurance of microelectronic manufacturing.

ELNA, Vilnius, Lithuania Head of Thick Film Laboratory, Technical Director1992 – 1995Implemented thick film technology processes to high-volume production.Organized high-volume manufacturing of thick film pastes and hybrids, including equipment procurement and installation.

MULTICHIP, Vilnius, LithuaniaHead of Thick Film Laboratory1990 - 1992Conducted research into the formulation, composition, properties and production of various cermet thick film materials in paste form.Produced resistive, conductive and dielectric pastes.Produced high volume thick film hybrid circuits and resistive networks. Key accomplishments:Developed and supplied post fired at 750°C on multilayer dielectrics wide-range thick film resistor inks with specific requirements to stability and accuracy for Personal Locator Beacons used in "KOSPAS – SARSAT” European Space Rescue System.

VILNIUS RADIO MEASURING EQUIPMENT COMPANY, Vilnius, Lithuania Materials Engineer, Senior Engineer1979 - 1990Department of Hybrid MicroelectronicsDeveloped and manufactured thick film resistive inks for precise voltage dividers for the oscilloscopes designed based on Tektronix models 7603, 7613, 7623, and 7844. Developed technology of metal/metal oxide complex compound powders and manufactured them.Formulated compositions of special glasses for thick film materials and manufactured them.Investigated a connection of paste component technology with final performance of electronic devices.Originated thick film resistor, conductor, and dielectric materials.Manufactured pastes and thick film hybrids/resistive networks.Conducted analytical studies and failure analysis of thick film technology processes.Designed processes to manufacture new products. Provided process engineering support for existing products including process problem-solving, yield improvement, process monitoring, and cost reduction.Handled full responsibility for hybrid circuit manufacturing yield at customers’ facilities.Key accomplishments:Provided new solution to fundamental problem of high-ohmic value thick film resistors’ anomalous conductivity loss Pioneered in the development of new series of high value resistive materials based on the previously unknown paradoxical parabolic dependence of resistivity vs. glass content;Originated new previously unknown method of precise control of TCR of thick film resistors: https://www.researchgate.net/publication/251769828_High_ohmic_value_resistive_inksObtained Certificate of Authorship on Invention # 1,167,992 (USSR) “Resistive Material”: http://publicationslist.org/data/M45897/ref-15/Resis-tive%20Material%20-%20Invention%20Certificate%201,167,992.pdf

EDUCATION & TRAININGS

Master of Science in Physical and Chemical Researches of Metallurgical Processes (Powder Metallurgy)

Kiev Polytechnic Institute, Ukraine, 1975 – 1979Dnepropetrovsk Institute of Metallurgy, Ukraine, 1973 - 1975

Main academic curriculum: Physical Chemistry; Thermal Treatment of Metals; Theory of Metallurgical Processes; Science of Metals; Physical-Chemical Fundamentals of Powder Metallurgy; Technology of Powder Metallurgy; Industrial ElectronicsEmphases: Powder Metallurgy; Composites; Electronic Materials Technology

Moscow Central Scientific-Research Technological Institute, Russia Post-Graduated course, 1986-1989Dissertation: "Ruthenium-based Thick film Resistors with Specific Requirements"

AWARDS

Diploma of the Ministry of Higher Education of SSR of Ukraine for the 1st place in final round of the Republican Olympiad (all-Ukrainian Competition) from Physics among students of technical universities, 1975

PROFESSIONAL TRAINING

ISO 9001 Quality System Internal Auditing Education and Training CourseToronto, Canada, 1998

PROFESSIONAL MEMBERSHIP

International Microelectronics and Packaging Society (IMAPS), since 1996

REFERENCES

Available upon request

LANGUAGE PROFICIENCY

English – Full professional proficiencyRussian – Native or bilingual proficiencyPolish – Professional working proficiencyCzech – Limited working proficiency

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