Metal Soldering Connectors
10
Metal Soldering Connectors nectors 6mm diameter with a small pin to enter in the hole Developed for NA62 project 3µm
description
Metal Soldering Connectors. Developed for NA62 project. Kovar connectors 6mm diameter with a small pin to enter in the hole. 3 µm. Soldering Test with 10x10mm chips. Temperature Profile. Vacuum oven (10 -6 – 10 -7 ). 200°C for 2min. 100°C/h. 50°C/h. 160-165°C for 1h. - PowerPoint PPT Presentation
Transcript of Metal Soldering Connectors
Metal Soldering Connectors
Kovar connectors 6mm diameter with a small pin to enter in the hole
Developed for NA62 project
3µm
Soldering Test with 10x10mm chips
200°C for 2min
160-165°C for 1h
100°C/h
100°C/h
50°C/h
Temperature Profile
Vacuum oven (10-6 – 10-7)
6 mmLimitation of the test set-up read-out at 600
barsLimitation of the pump 700 barsNo failure of the soder joint
Inner diameter 1.6 mm
Silicon thickness 525 µm
preliminary prototypes size reduction and different
geometries under study
Common development with LHCb VeLo Upgrade
Solder joint withstands 700 bar ! Si thickness = 500 umExposed Si surface is 2mm hole
Pressure test
SMD lab
3µm
Vapor phase oven: Liquid (fluides liquides perfluorocarbonés inertes) in vapour-phase form is used to transfer the heat to the components and solder.230°C
RT___Ti-Ni-Au_unif 20-50-200 nm 49-139-161 s Pyrex #64RT___Ti-Ni-Au_unif 200-350-100 nm 488-972-81 s Pyrex #65
Metal on Pyrex:
Comparison
Oven chez Tino SMD lab
20 nmTi50 nm Ni200 nm Au
Future soldering TEST for NA62
