memsfab GmbHMEMSFABCHEMNITZCHEMNITZ

mems seminar Moscow, March 17th, 2010

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz

memsfab‘s history and philosophy

• memsfab GmbH started its operation in January 2004, the model is “fabless”memsfab GmbH started its operation in January 2004, the model is fabless

• memsfab has very close and active connections to the Chemnitz University of Technology (Center for Microtechnologies) and to the Fraunhofer Research Institution for Electronic Nano Systems (ENAS) in Chemnitz

• memsfab is member of “Silicon Saxony” and “Automotive Supplier Network Saxony”y

• based on our wide experience in design and production of sensors we can offer extended knowledge and potential for creating sensor solutions in a fast, flexible and efficient manner according to our customer needs

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz

Ch it

Foundry

Chemnitz University

of Technology

memsfab GmbH

MEMSFABCHEMNITZ

memsfab GmbH

CHEMNITZ

Customer

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz

Fraunhofer Research Institution for Electronic Nano Systems

Director Prof Thomas Gessner

Fraunhofer Research Institution for Electronic Nano Systems

Director: Prof. Thomas Gessner

• MEMS/NEMS DesignMEMS/NEMS Design

• Development of MEMS/NEMS

• MEMS/NEMS Test

• System Packaging / Wafer Bonding

• Back‐End‐of‐Line Technologies for Micro Fraunhofer ENAS in Chemnitz

and Nanoelectronics

• Process and Equipment SimulationInternational Offices:

Since 2001 / 2005   Tokyo/Sendai‐Japan

• Micro and Nano Reliability

• Printed Functionalities

Ad an ed S stem En ineerin

Since 2002              Shanghai‐China 

Since 2007 Manaus‐Brazil

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz

• Advanced System Engineering

Center for MicrotechnologiesCenter for Microtechnologies

• ZfM facilities include 1000 m2 of clean rooms• ZfM facilities include 1000 m2 of clean rooms

• 300 m2 clean room class 10 (ISO 4) 

• processing of 100 mm, 150 mm and 200 mm 

wafers

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz

products

■ sensors and systems

products

■ sensors and systems

acceleration sensor angular rate sensorangular rate sensor fabry-perot filter frequency selective vibration sensor inclination sensor micro scanner and mirror strip array vacuum sensorvacuum sensor

■ service in research and development

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz

Information about the mems marketInformation about the mems market..…

….

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz

Smart Systems  Integration &Packaging

MEMS /NEMS

Electronic

Commu-nicationUnit

P

Electronic Components

Processor&

MemoryCMOSRadio

Power

MicrosystemtechnologiesSensor

&H t tActuator Hetero systemintegration

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz

A smart integrated system comprises several componentsA smart integrated system  comprises several components

1. sensor, actuator2. electronic data processing‐ and transport unit3. package

Further more the test of the system is significant!

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz

1. Dr. Torsten Thieme, memsfab GmbH, Chemnitz, managing director“Micro Electro Mechanical Systems – a very complex topic and market” (introduction)(introduction)

2. Dr. Detlef Billep, Fraunhofer ENAS, Chemnitz, senior scientist“MEMS sensor elements and their technologies”“MEMS‐sensor‐elements and their technologies” (sensor)

ff3. Dr. Steffen Heinz, Electronic Design Chemnitz GmbH, managing director“MEMS‐data‐processing – a real challenge” (ASIC)

4. Dr. Gregor Zwinge, Micro Packaging Dresden GmbH, managing director“MEMS‐packaging  – a mostly underestimated problem” p g g y p(package)

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz

Characteristics of Smart Systems Integration

MULTIFUNCTIONALITYM lti De ice IntegrationMulti Device Integration

MULTITECHNOLOGYCombination of different  • Improved functionality and technology approaches

MULTIMATERIALSCombination and integration

performance

Combination and integrationof advanced materials

New approaches required concerning:• System / Component design• Reliability aspects

f h ff h l• Usage of huge effective technologies

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz

AIM Dual Axis low g Sensorg

sensor with glass cover plate (glass frit bonding) AIM7E sensor with M777.04 ASIC (ELMOS)

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz

AIM low g Sensor System Prototypes FabricatedAIM7 sensor withAIM7 sensor with IMD 9801 ASIC

CLCC44

AIM7E sensor with M777.04 ASIC (ELMOS)

CLCC44

PLCC44AIM5 sensor with AD7746 (24 Bit)> evaluation by HL Planar

AIM5I sensor with CVC ASIC (GEMAC)

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz

MEMS possible applications in at

ion

atio

ncarsA

pplic

aA

pplic

a

Stability sensor

otiv

e A

otiv

e A

utom

out

omo

Active wheel

Accelerometer (Vehicle security system)

Au

Au

speed sensor (part of ABS)

Accelerometer (Air bag system)

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz

(Air bag system)

tion

pplic

atla

ne A

p

High Precision

Airp

g

Inclination & Acceleration

SensorsSensors

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz

contact us

memsfab GmbH Technologie-Campus 109126 Chemnitzphone: +49 (0) 371 5347 680fax: +49 (0) 371 5347 681fax: +49 (0) 371 5347 681web: http://www.memsfab.de

managing director: Dr. Torsten Thiemeemail: torsten.thieme@memsfab.de

memsfab GmbH – Technologie-Campus 1 – 09126 Chemnitz