Mems tecnology
-
Upload
mrashish-suryavanshi -
Category
Engineering
-
view
456 -
download
4
Transcript of Mems tecnology
![Page 1: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/1.jpg)
Welcome to
Paper Presentation on
MEMS TECHNOLOGYBy
Chavan Mayuri Sanjay
Department of Electronics and Telecommunication EngineeringAnnasaheb Dange College of Engineering and Technology, Ashta
![Page 2: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/2.jpg)
OUTLINE• MEMS Introduction• Sensor• Fabrication• MEMS manufacturing technology• Packaging• Advantages• Disadvantages• Application• Conclusion• Reference
![Page 3: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/3.jpg)
INTRODUCTION
• MEMS is a acronym for micro-electro-mechanical system
• It is used to create tiny integrated devices
• Ability to scence, control and actuate
• MEMS is the promising technology in 21th century
![Page 4: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/4.jpg)
WHY MEMS SENSOR?
• It measures physical quantity and convert into it into electronic signal
• Used to scence changing parameter
• Small in size
• Have lower power consumption
• More sensitivity to input variation
• Less invasive due to mass production
![Page 5: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/5.jpg)
FABRICATION
Material used are: • Silicon
• Polymer • Metal
• Ceramic
Basic Process
Deposition Patterning Etching
![Page 6: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/6.jpg)
MEMS MANUFACTURING TECHNOLOGY
• Bulk Micromachining
• Surface Micromachining
• LIGA
![Page 7: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/7.jpg)
BULK MICROMACHINING• This technique involves removal of substrate material
• Bulk micromachining techniques are:
Wet etching
Dry etching
![Page 8: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/8.jpg)
SURFACE MICROMACHINING• It enables fabrication of complex integrated structure
• Widely used technique is Polysilicon surface micromachining
• Structure thickness is smaller than 10 μm
![Page 9: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/9.jpg)
LIGA• LIGA is a German acronym standing for lithographie,
galvanoformung (plating), and abformung (molding).
![Page 10: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/10.jpg)
PACKAGING • Protect the sensor from external influences and
environmental effect
• Protect the environment from presence of the sensor
• Provide controlled interface between sensors
• Standard IC Packages: Ceramic Packages, Plastic Package, Metal Packages
![Page 11: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/11.jpg)
ADVANTAGES
• Smaller package size
• Less power consumption
• Easy to integrate into system or modify
• Lighter weight
• Higher output signal
![Page 12: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/12.jpg)
LIMITATIONS
• It is very small to trace out
• Expensive and Complex Packaging
![Page 13: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/13.jpg)
APPLICATIONS
In medical science
• Pressure sensor
• Inertial sensor
• Sight for the blind
In marine science
![Page 14: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/14.jpg)
CONTINUE….
Applications in marine military operation
Industrial Market
Communication
![Page 15: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/15.jpg)
FUTURE SCOPE• Access to Foundries
• Design, Simulation and Modeling
• Packaging and Testing
• Standardization
• Education and Training
![Page 16: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/16.jpg)
CONCLUSION• MEMS promises to be an effective technique of
producing sensors of high quality, at lower costs.
• Thus I can conclude that the MEMS can create a proactive computing world, connected computing nodes automatically, acquire and act on real-time data about a physical environment, helping to improve lives, promoting a better understanding of the world and enabling people to become more productive.
![Page 17: Mems tecnology](https://reader036.fdocuments.in/reader036/viewer/2022062412/5875d3df1a28ab8f438b5c0b/html5/thumbnails/17.jpg)
REFERENCE1. Microsensors , Muller, R.S., Howe, R.T., Senturia , S.D., Smith, R.L., and White, R.M. [Eds.], IEEE Press, New York, NY, 1991.
2. Micromechanics and MEMS: Classic and Seminal Paper to 1990, Trimmer, W.S., IEEE Press, New York, NY, 1997.
3. Journal of Micro-electro-mechanical-Systems(http://www.ieee.org/pub_preview/mems_toc.html)
4. Journal of Micromechanics and Microengineering(http://www.iop.org/Journals/jm)