Mems Microphone - Spm0408he5h
Transcript of Mems Microphone - Spm0408he5h
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Amplified "Mini" SiSonicTM Microphone
Specification With Enhanced RF Protection-Halogen Free
SPM0408HE5H
Sheet 1 of 10
Knowles Acoustics, a division of Knowles Electronics, LLC.Release Level: ACTIVERevision: B
Knowles Acoustics1151 Maplewood Drive
Itasca, IL 60143
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Amplified "Mini" Surface Mount Silicon Microphone withEnhanced RF Protection.
Hand held telecomunication devices.
SPM0408HE5H
Sheet 2 of 10
Knowles Acoustics, a division of Knowles Electronics, LLC.Release Level: ACTIVERevision: B
1. DESCRIPTION AND APPLICATION
1.1 DESCRIPTION
1.2 APPLICATION
2. PART MARKING
Identification Number Convention
S 1 2 3
4 5 6 7
S: Manufacturing Location"S" - Knowles Electronics Suzhou
Suzhou, China
"No Alpha Character" - Knowles ElectronicsItasca, IL USA
"E" - Engineering Samples
Digits 1-7: Job Identification Number
3. TEMPERATURE RANGE
3.1 Operating Temperature Range: -40 C to +100 C
3.2 Storage Temperature Range: -40 C to +100 C
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SPM0408HE5H
Sheet 3 of 10
Knowles Acoustics, a division of Knowles Electronics, LLC.Release Level: ACTIVERevision: B
4. ACOUSTIC & ELECTRICAL SPECIFICATIONSTEST CONDITIONS: +20 C, 60-70% R.H.
5. FREQUENCY RESPONSE CURVE
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"W"
"L"
1.319
1.880
"AP"
1
"H" 1.245
0.153
1.448
0.158
1.524
0.965
1
23
4
SPM0408HE5H
Sheet 4 of 10
Knowles Acoustics, a division of Knowles Electronics, LLC.Release Level: ACTIVERevision: B
6. MECHANICAL SPECIFICATIONS
Note:
Dimensions are in milimeters unless otherwise specified.
Tolerance 0.15mm unless otherwise specified.
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1.448
1.245
2.210
2.972
N/A
SPM0408HE5H
Sheet 5 of 10
Knowles Acoustics, a division of Knowles Electronics, LLC.Release Level: ACTIVERevision: B
7. RECOMMENDED CUSTOMER LAND PATTERN
8. RECOMMENDED SOLDER STENCIL PATTERN
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SPM0408HE5H
Sheet 6 of 10
Knowles Acoustics, a division of Knowles Electronics, LLC.Release Level: ACTIVERevision: B
9. RECOMMENDED INTERFACE CIRCUIT
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1.50.0
+0.1
1.50.0
+0.1
12.00.3
1.750.10
5.500.05
4.00
2.000.05 8.000.10
R0.3 TYP.5.120.10
4.160.10
A
A
1.300.10
0.300.05
COMPONENTORIENTATION
PIN #1
SPM0408HE5H
Sheet 7 of 10
Knowles Acoustics, a division of Knowles Electronics, LLC.Release Level: ACTIVERevision: B
10. PACKAGING DETAIL
Note:
Dimensions are in milimetersunless otherwise specified.
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SPM0408HE5H
Sheet 8 of 10
Knowles Acoustics, a division of Knowles Electronics, LLC.Release Level: ACTIVERevision: B
12. ADDITIONAL NOTESShelf life: Twelve (12) months when devices are to be stored in factory supplied,(A)unopened ESD moisture sensitive bag under maximum environmental conditions of30C, 70% R.H. MSL (moisture sensitivity level) Class 2a.Do not pull a vacuum over port hole of the microphone. Pulling a vacum over the(B)port hole can damage the device.Do not board wash after the reflow process. Board washing and cleaning agents(C)can damage the device. Do not expose to ultrasonic processing or cleaning.Do not brush board after the reflow process. Brushing the board with/without(D)solvents can damage the device.Do not insert any object in port hole of device at any time as this can damage the(E)device.Number of reflow - Recommend no more than 3 cycles.(F)
11. SOLDER FLOW PROFILE
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SPM0408HE5H
Sheet 9 of 10
Knowles Acoustics, a division of Knowles Electronics, LLC.Release Level: ACTIVERevision: B
Note: After test conditions are performed, the sensitivity of the microphone shall
not deviate more than 3dB from its initial value.
13. RELIABILITY SPECIFICATIONS
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Revision Detailed Specification Changes Date
A Specification Release (DMS) 8/14/2009
B Update sensitivity spec (section 4). (DMS, C10110154) 9/1/2009
SPM0408HE5H
Sheet 10 of 10
Knowles Acoustics, a division of Knowles Electronics, LLC.Release Level: ACTIVERevision: B
14. SPECIFICATION REVISIONS
The information contained in this literature is based on our experience to date and is believed to be reliable and it issubject to change without notice. It is intended as a guide for use by persons having technical skill at their owndiscretion and risk. We do not guarantee favorable results or assume any liability in connection with its use.Dimensions contained herein are for reference purposes only. For specific dimensional requirements consult factory.This publication is not to be taken as a license to operate under, or recommendation to infringe any existingpatents. This supersedes and voids all previous literature.