MEMS Based Reconfigurable RF Systems for SoftwareRadio, Wireless Sensors, and MMID Technology, Jussi...

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MEMS Based Reconfigurable RF Systems for Software Radio, Wireless Sensors, and MMID Technology (MOSART) Jussi Varis VTT Technical Research Centre of Finland Sweden, FOI: R. Malmqvist, C. Samuelsson Sweden, Uppsala University: A. Rydberg, X. Hu Finland, VTT: J. Varis, P. Rantakari, J. Säily, M. Lahti, M. Kaunisto, J. Saijets, and T. Vähä- Heikkilä NORDITE Conference 2011 Quality Hotel 33, Oslo June 14th, 2011

Transcript of MEMS Based Reconfigurable RF Systems for SoftwareRadio, Wireless Sensors, and MMID Technology, Jussi...

MEMS Based Reconfigurable RF Systems for Software

Radio, Wireless Sensors, and MMID Technology

(MOSART)

Jussi Varis

VTT Technical Research Centre of Finland

Sweden, FOI: R. Malmqvist, C. Samuelsson

Sweden, Uppsala University: A. Rydberg, X. Hu

Finland, VTT: J. Varis, P. Rantakari, J. Säily, M. Lahti, M. Kaunisto, J. Saijets, and T. Vähä-

Heikkilä

NORDITE Conference 2011

Quality Hotel 33, Oslo

June 14th, 2011

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Outline

1. Project overview

2. Motivation and applications

3. Produced devices and modules

• RF MEMS Devices

• Antennas on LTCC

• LTCC packaged RF MEMS devices

• Sub-system modules

4. Related on-going efforts

5. Benefits from MOSART

6. Summary

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Project overview

• 36 month VINNOVA, Tekes, and VTT funded project.

• Main goal: Successful integration of MEMS components, active RF circuits, and sub-systems into a LTCC packaged re-configurable RF front-end demonstrators at 10-40 GHz.

• Research partners: FOI, Uppsala University (SWE), VTT (FIN)

• Industry partners: Nera Networks (NOR), Ericsson Research (SWE), Saab Microwave Systems (SWE), Silex Microsystems (SWE), Syncore Technologies (SWE), Elektrobit Wireless Communications (FIN), Selmic (FIN).

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Motivation

• RF MEMS

wireless RF systems with better performance

(compared with a use of today’s of the shelf technologies)

• RF MEMS in point-to-point communication and RF sensing (5-40 GHz),

reconfigurable electronic multi-band (frequency-agile) front-ends

Lowers component count, reduces complexity and cost

• RF MEMS switch technology

High linearity

Low insertion loss and DC power consumption candidate for re-configurable front-

ends and beam steering

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Applications

• 35 GHz low loss electrically steerable antennas (low power radars)

• 10-30 GHz re-configurable/tunable amplifiers (for Pt-to-Pt communications)

mm wave sensors

radio links

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MOSART RF MEMS devices

VTT 30-40 GHz

wideband matching

network

(1.0 mm x 0.9 mm). FOI RF MEMS

switch (0.7 mm x

1.0 mm).

VTT 35 GHz analog phase

shifter.

FOI 20-30 GHz SPDT with

places for LNAs (4.5 mm x

3.0 mm).

VTT 20-30 GHz SPDT (5.0

mm x 3.0 mm).

FOI 35 GHz 3-bit switched delay

phase shifter (9.3 mm x 3.0 mm).

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MOSART antennas on LTCC

Uppsala 35 GHz 4x1 slot-coupled

antenna array (21.0 mm x 12.5 mm).

Uppsala 20-30 GHz microstrip

bow tie antenna array

(8.0 mm x 18 mm).

VTT 20-30 GHz end-fire dipole antenna

(8.5 mm x 8.0 mm). VTT 20-30 GHz Vivaldi antenna

(5.7 mm x 17 mm).

VTT 35 GHz co-planar 4x1 antenna

array with EBG structure

(20 mm x 12 mm).

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MOSART LTCC packaged RF MEMS devices

LTCC packaged wideband RF MEMS

impedance tuner (9.0 mm x 9.5 mm).

LTCC packaged 20-30 GHz RF MEMS SPDT

switch(12 mm x 9.0 mm).

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MOSART sub-system modules

20-30 GHz switchable LNA/driver

module (16 mm x 15 mm).

25/35 GHz switchable LNA

module(20 mm x 11 mm).

35 GHz narrowband digital phased array

Rx module (45 mm x 29 mm).

35 GHz narrowband analog phased

array Rx module (71 mm x 25 mm).

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Main remaining challenges

• RF MEMS reliability Process quality (residuals, layer thicknesses).

Design parameter stability (MEMS switch gap height, capacitance ratio, pull-in

voltage)

Environmental susceptibility (temperature, mechanical, charging, etc.)

• Integration Flip-chip bonding vs. ribbon bonding

Alignment accuracy on LTCC

MEMS temperature tolerance in various integration and post integration

phases.

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Related on-going efforts

• Rx modules on Taclam.

• Tunable LNAs and drivers on quartz. wire bond

or

flip-chip

Quartz substrate with RF MEMS

impedance matching networks.

LNA/PA

MMIC

RX1

RX2 Rx modules on

Taclam substrates.

Antenna arrays.

RF MEMS

phase shifters.

MMIC

LNAs.

Benefits from MOSART

• Nordic countries and Europe have in place technologies to produce

packaged re-configurable radio modules.

RF MEMS

LTCC

MMICs

• Benefits to industry partners in MOSART

Saab: electrically steerable phased array front-ends for sensor applications

Nera, Ericsson, Elektrobit: re-configurable/tunable radio sub-systems for Pt-to-Pt

applications

Syncore: novel integated sub-systems

Selmic: micro and mm wave frequency LTCC module processing

Silex: micro and mm wave RF MEMS processing

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Benefits from MOSART

• Expanding European frontiers in RF MEMS and LTCC related

development

MEMS-4-MMIC (EU FP7, 2008-2011, on-chip integration of MMIC and RF

MEMS): OMMIC and CNRS-IEMN (FRA), FOI and Saab (SWE), IMST (GER),

IMT (ROM), VTT (FIN)

SATURNE (EU FP7, 2010-2013, GaN and RF MEMS for space applications):

UU (SWE), Thales and CNRS-IEMN (FRA), EADS (GER), Thales Alenia

Space (ITA), TopGAN (POL)

MiniMEMS (EU FP7, 2010-2013, miniaturised RF MEMS for airport and

weather radar systems): ÅAC Microtec and UU (SWE), Thales and CNRS-

IEMN (FRA), Vaisala (FIN)

MEMSMOD (ESA and participants, 2010-2012, LTCC packaged RF MEMS

switch reliability and environmental testing and assessment): EADS (GER),

Selmic and VTT (FIN)

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Towards commercial systems

• RF MEMS switches and sub-systems

(circuits & antennas) have been

demonstrated with state-of-the-art

performance from DC-100 GHz and beyond

• Enabling technology for miniaturized, low-

power high performance re-configurable RF

systems (e.g. for wireless comm., space,

security & defense)

• High reliability (switch cycles) and

fabrication yields needed for a higher market

penetration

• Today, just a few commercial vendors

offering RF MEMS as packaged (discrete)

components: RadantMEMS (US), OMRON

(JPN), DELFMEMS (FR)

• A few MMIC foundries developing RF-

MEMS: OMMIC (FR) – GaAs, IHP (GE) –

SiGe, Selex (IT) – GaN

• RF-MEMS technology in the US (e.g.

Radant) has demonstrated a much higher

TRL than what is currently available in

Europe.

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Summary

• MOSART has demonstrated

RF MEMS matching networks, phase shifters and SPDT switches

Antenna arrays and wideband antennas on LTCC

Module concepts for electronically steerable or re-configurable radio systems

Processing technologies for manufacturing RF MEMS devices and LTCC modules.

• MOSART has

Brought together a large number of Nordic companies and research institutes.

Utilised synergy (for example MMIC design and manufacturing) from other related on-

going projects and networks.

Expanded RF MEMS and LTCC related development to include more Nordic and

European companies and institutes in Nordic, EU, and ESA related projects.

• Challenges remain

RF MEMS reliability and stability

Integration related issues.

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Contact information

• Project manager and national contact in Finland:

Dr. Jussi Varis, VTT, [email protected], tel: +358-40-569 4089, fax: +358-20-722 7013

• National contact in Sweden:

Prof. Anders Rydberg, Uppsala University, [email protected], tel: +46-18-471 3228, fax: +46-18-555096

• Chairman of the Steering Group:

Dr. Robert Malmqvist, FOI Swedish Defense Research Agency, [email protected], tel: +46-13-378 353, fax: +46-13-378 519