Memory Scaling and Its Potential Impact on Computing and...

September 22, 2011Components, Packaging and Manufacturing Technology Society, SCV Chapter

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©2010 Micron Technology, Inc. All rights reserved. Products are warranted only to meet Micron’s production data sheet specifications. Information, products, and/or specifications are subject to change without notice. All information is provided on an “AS IS” basis without warranties of any kind. Dates are estimates only. Drawings are not to scale. Micron and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of their respective owners.

Micron Confidential | ©2010 Micron Technology, Inc. | 1

Edward DollerV.P. & Chief Memory Systems Architecture

IEEE SVC – September 2011

Memory Scaling and Its Potential Impact on Computing and Storage

October 11

2Micron Confidential | ©2010 Micron Technology, Inc. |

1. Environment

2. Technologies Scaling

3. Potential Impact on Computing & Storage

Agenda


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1. Environment



Agenda

Environmental TrendsRipe for Change

Cellular(Phones)

Mobile(Laptops / Tablets)

Compute(Desktop / Laptops)

Enterprise(Servers / Storage)

• Threatened by Smart Phone • Multiple names for different screen sizes• Processing battle ground

• Power, performance, reliability is the name of the game• SSD’s providing breakthrough performance improvement• Creates a battle ground for HDD providers

• H/W feature slow down Differentiation via S/W & FF• H/W & market consolidation beginning• Smart Phone challenging “mobile”

• Threatened by cloud computing• Processors throttled by storage • Promise of “instant on” has not emerged

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Characteristics Challenges are different

Cellular(Phones)

Mobile(Laptops / Tablets)

Compute(Desktops / Laptops)

Enterprise(Servers / Storage)

Consumption

Content• Performance driven (generally not CPU limited)

• “Green” focus bringing power into foreground

• Reliability vs. cost is the trade off

• Ease of use

• Instant On / Off

• Power vs. “good enough” performance trade off

Consumption TrendsConsumers are Memory Aware

When’s the last time consumers really cared about GHz?


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Exponential Information Growth

10-10

10-5

10

105

1010

1015

1020

1025

1030

1035

1040

1045

1050

1055

1900 1920 1940 1960 1980 2000 2020 2040 2060

2009: 1.5 EB’s per year

2009: 50GB’s per second

2020: 500GB’s per u-second

Source: http://www.kurzweilai.net/articles/art0134.html?printable=1

Byt

es “if three of the major US networks were broadcasting 24 hours a day, 7 days a week, 365

days a year for the last 60 years, they still wouldn’t have broadcast as much content as is uploaded to

YouTube every 30 days.”

Content TrendsPower & Performance

CPU RAM DISK TAPE

ns / GB ms / TB s / PB

CPU RAM DISK TAPE


SSD

us / GB

Bandwidth Improvement

Latency Improvement or


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Content TrendsPower & TCO

Source: Sun

3X Reduction in Cost and Power

PerformanceRelatively Speaking

HDD Then… latency = 6 months

SSD Then… latency = 1 days

SSD’s can perform >193 database searches in the time it takes an HDD to do 1


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Content TrendsPerformance

Get low latency media onto low latency busses

PCIe SATA

What Else is Going on?


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Server vs. NAS & SANPCIe is Just the start…


1. Environment



Agenda


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NAND Scaling Challenges

Reducing Cell Capacitance Results in Fewer Stored

Electrons with Scaling – Effect Magnified with MLC

Degrading Reliability Results in Increased Usage of Error Correction – More System

Management Required

NAND Electron Scaling

20122011

20102009

2008

2007

2006

2004

10

100

1000

10000

20406080100

Litho Node

# E

lec

tro

ns

SLC Erase

MLC Erase

SLC ECC

MLC ECC

©2010 Micron Technology, Inc. | 16

How Small is Small?

October 12, 2011

US One Dollar bill cross section (2.8 Billion Physical Bits)

2.61”(1.3Mc)

0.0043”(2.2Kc)


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How Small is Small?

October 12, 2011

Every Led Zeppelin song & Beatles song ever produced…(and still have room left over)


DRAM Scaling Challenges

Major Changes Required

New Periphery Transistor Every Gen

Frequent Capacitor Structure and Material Changes with Highest “known” HiK Material at ~32nm Generation

New Cell Transistor Every Generation


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What’s are Others Saying? Change is Coming… Source: ITRS 2010


EM Areas of Research – A Better View

Kryder, IEEE Tran. Mag. Oct’09


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1. Environment



Agenda

Memory CharacteristicsPCM Offers Attributes of RAM & NAND

Bit

Alt

erab

le

Wri

te

En

du

ran

ce

Rea

dL

aten

cy

Wri

teL

aten

cy

No

n-

Vo

lati

lity

Th

eo

reti

cal

Co

st

Not

Good

Good

DRAM

PCM

NAND


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Bit AlterabilityRidiculously Simple

1. Read 4KB from NAND w/ECC

2. Write to RAM

3. Modify RAM

4. Locate new NAND page

5. Write new NAND page

6. Calculate & Write ECC

7. Mark old NAND page “dirty”

8. Eventually erase NAND block

1. Write 1 bit in PCM

“I have a new mobile number:(555) 555-5554”

Much less bus traffic

“Hidden” Power

Ridiculously Simple

NAND PCM

CPU RAM DISK TAPE


SSD

us / GB

PCM

ns / GB

LatencyValue goes up with information growth

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Source: http://highscalability.com

Source: http://royal.pingdom.com

Source: http://highscalability.com


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PerformanceRelatively Speaking

SCM PCM

PCM

SSD

HDD

Then… latency = 30 min

Then… latency = 9 years

If Random Latency = 1 day

Then… latency = 17 days

Storage Class PCM can perform >800 database searches in the time it takes an SSD to do 1


Alternative Interconnects

JC64.1

5-8 Die Products60-75um Die

System In PackageNOR+RAM+Apps uC

NAND+ECC uC

Developing High Die Count Solutions

2 Die Products150um Die



Die Thinness vs.Wire Bond Die Overhang

Wafer Dicing vs.Moisture/Temp Reliability

Wafer Thinning vs. Memory Data Retention

Package Stress vs.MLC Bit Error Rate

Package Stress vs.Frequency Performance

Ultra-Thin Die Handling vs. Die Cracking

2nd Gen Wafer Dicing vs.Moisture/Temp Reliability

2nd Gen Materials vs.Package Stress

Ultra-Thin Substrates vs.Product Warpage & Frequency

Laser Dicing vs.Moisture/Temp Reliability

3rd Gen Materials vs.Package Stress

Interconnect Technology vs.XYZ and Cost

8+ Die Products≤50um Die Thinning

It’s More than Just Thinning Wafers…

TSV

10/12/2011


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10/12/2011

Memory Scaling and Its Potential Impact on Computing and...

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