MC9S12G128 Controller Board User Guide · — Back-EMF signal sensing using an MCU ADC module —...

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MC9S12G128 Controller Board User Guide Document Number: MC9S12G128MCBUG 1.0 08/2012

Transcript of MC9S12G128 Controller Board User Guide · — Back-EMF signal sensing using an MCU ADC module —...

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MC9S12G128 Controller Board UserGuide

Document Number: MC9S12G128MCBUG1.0

08/2012

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Freescale Semiconductor

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Chapter 1 Introduction1.1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .81.2 Board Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .91.3 Board Jumper Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 111.4 Board LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13

Chapter 2 Interface Description2.1 Power Supply J1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .152.2 UNI3 Interface J31 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .152.3 MC33937A Interface J34 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .172.4 Hall Sensor Interface JP1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .182.5 LIN Connector J9 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .182.6 CAN Connector J5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .182.7 USB Connector J36 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .192.8 Header JP2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .192.9 Header J30 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .192.10 Headers J14, J15, J16, J17 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

Chapter 3 Design Consideration3.1 MC9S12G128 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .213.2 PWM /HS and LS Signal Split and Phase Dead Time Generation . . . . . . . . . . . . . . . . .233.3 Board Fault Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .243.4 Hall Sensor Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

Chapter 4 Electrical Characteristics

Chapter 5 Board Set-up Guide

Chapter 6 References

Chapter 7 Acronyms

Chapter 8 MC9S12G128 Controller Board Schematic

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About This Book

This document describes the MC9S12G128 Controller Board design, which is targeted for development of motor control applications.

To locate any published updates for this document, refer to the world-wide web at: http://www.freescale.com/.

Revision History

Documentation

The MC9S12G128 documentation is available at the web site, http://www.freescale.com. as follows:

• Reference manuals — MC9S12G128 modules in detail

• Data sheets — information mainly on the device’s AC, DC, thermal characteristics and packages pin-out

• Product briefs — device overview

• Application notes — address specific design issues

Table i. Revision History Table

DateRevision

levelDescription

August 2012 1.0 Initial release

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Introduction

Chapter 1 IntroductionThe MC9S12G128 Controller Board is designed to a drive 3-phase BLDC motor, enabling implementation of motor control techniques:

• Sensorless:

— Back-EMF signal sensing using an MCU ADC module

— Back-EMF zero-cross signal monitoring

• Sensor based:

— Hall sensor signal monitoring

On-board UNI-3 interface enables control of the BLDC motor power stage.

The LIN and CAN communication interfaces connect the board to the other automotive network nodes.

The USB interface is targeted at FreeMASTER PC-based application control.

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Introduction

1.1 Features

The MC9S12G128 Controller Board features follows:

• MC9S12G128 microcontroller, 100 LQFP package

• BDM interface for MCU code download and debugging

• MC33905 System-basis chip (power supply, connectivity)

• Motor control interface:

— UNI-3

— MC33937A predriver

— Hall sensors

• Connectivity interface:

— LIN (MC33905)

— CAN (MC33905)

— USB interface

• LEDs:

— Power-on indicators

— Phase A, B, C PWM control signals

— Phase A, B, C zero-cross

— Hall sensor outputs

— Fault monitoring

— SBC safe mode

— User application

• Rotary encoder switch for an application control

• On-board PWM dead time generation

• MCU pins accessible via pin headers

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Introduction

1.2 Board Architecture

The MC9S12G128 Controller Board basic building blocks are depicted in Figure 1-1. The block color differentiates a block function:

• Blue - MCU and application software download and the debug interface

• Green - Motor control related hardware

• Red - Board power supply and connectivity

• Violet - Application control

Figure 1-1. MC9S12G128 Controller Board Block Diagram

The board is supplied by VBAT voltage in the range of 8 V to 18 V. The MCZ33905 provides 5 V to Hall interface. The MCU and on-board logic are supplied by either 3.3 V or 5 V, depending on the assembled SBC version. The board is populated with the 3.3 V SBC version by default.

The MCU generates one PWM signal for each phase. An additional on-board logic is used to split the PWM signals to control power stage top and bottom switches separately. A PWM dead time is inserted by additional hardware, if required.

The Fault logic triggers the DC bus undervoltage and DC bus overcurrent faults, and turns OFF the power stage top and bottom switches. The circuitry behaviour depends on the selected configuration. For more info, see Chapter 3.3, “Board Fault Management".

MC9S12G128

USBInterface

BDMInterface

RotaryEncoder

MCZ33905

+5V / +3V3Regulator

LINInterface

CANInterface

PWM /HS and LS Signal Split

&PWM Dead Time

Insertion FaultLogic

HallInterface

UNI-3Interface

MCZ33937Interface

VBAT

+5V

+3V3 / +5V

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Introduction

The user can control the application using the rotary switch, USB interface (RS232), CAN and LIN buses.

The BDM interface is present on-board to enable the download and debugging of the MCU code.

For the on-board block location, see Figure 1-2.

Figure 1-2. MC9S12G128 Controller Board Block Location

MCZ33905SBC

USBInterface

PWM Dead TimeCircuitry

Fault Logic

BDM

RotaryEncoderSwitch

UNI 3Interface

MCZ33937Interface

CAN LIN PowerSupply

PWM LEDs

Faultand

Hall/ZC LEDsHall

Interface

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Introduction

1.3 Board Jumper Configuration

See Table 1-1 and Figure 1-3 for proper jumper configuration.

Table 1-1. MC9S12G128 Board Configuration

Jumper Selector Function Connection

J3 SBCDebug Mode

SBC Debug mode (J4 not placed):- ON, placed- OFF, unplaced

Placed

J4 SBCFail-Safe Mode

SBC Normal mode (J3 not placed):- ON, placed- OFF, unplaced

Unplaced

J6, J7 CANTermination

CAN bus termination:- 120R, placed- without termination, unplaced

Placed

J8 LINMaster/Slave

LIN mode:- Master, placed- Slave, unplaced

Placed

J18 /RESET SBC and MCU /RESET pins connected:- connected, placed- unconnected, unplaced

Unplaced

J20, J22 PHASE A Dead Time Dead time ~2s generated by on-board HW:- ON, placed pins 1-2- OFF, placed pins 2-3

Placed, pins 1-2

J21, J23 PHASE C Dead Time Dead time ~2s generated by on-board HW:- ON, placed pins 1-2- OFF, placed pins 2-3

Placed, pins 1-2

J24, J25 PHASE B Dead Time Dead time ~2s generated by on-board HW:- ON, placed pins 1-2- OFF, placed pins 2-3

Placed, pins 1-2

J26 FAULTS Fault is processed by:- on-board HW, placed pins 1-2- MCU software (/IRQ), placed pins 2-3

Placed, pins 1-2

J27, J28 FAULTS In case of Fault, the power stage switched turned OFF by:- on-board HW, placed pins 1-2- power stage HW (EN pin), placed pins 2-3

Placed, pins 1-2

J29 FAULTS Overcurrent diagnostic input:- on-board comparator, placed pins 1-2- power stage MC33972 comparator, placed pins 2-3

Placed, pins 1-2

J32 HALL/ZC PHASE A BLDC sensor control based on:- Hall sensors, placed pins 1-2- Zero-cross, placed pins 2-3

Placed, pins 1-2

J33 HALL/ZC PHASE B BLDC sensor control based on:- Hall sensors, placed pins 1-2- Zero-cross, placed pins 2-3

Placed, pins 1-2

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Introduction

Figure 1-3. MC9S12G128 Controller Board Jumper Position and Default Setting

J35 HALL/ZC PHASE C BLDC sensor control based on:- Hall sensors, placed pins 1-2- Zero-cross, placed pins 2-3

Placed, pins 1-2

Table 1-1. MC9S12G128 Board Configuration (continued)

Jumper Selector Function Connection

J3, J4MCZ33905

SBC

J20, J22Ph A DT

J18/RESET

J24, J25Ph B DT

J21, J23Ph C DT

J32, J33, J35Hall / Zero Cross

J26, J27, J28, J29Faults

Configuration

J6, J7CAN Termination

J8LIN Master/Slave

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Introduction

1.4 Board LEDs

The Table 1-2 displays the on-board LEDs. For on-board LED locations, see Figure 1-2.

Table 1-2. on-board LEDs

LED Signal Name Description

D3 +5V 5 V Hall power supply

D6 /SAFE MCZ33905 safe-pin state (ON - SBC in safe mode)

D7 +3V3 3.3 V board power supply

D11 - User LED1

D12 - User LED2

D21 AT Phase A top switch signal (ON - High Level)

D22 UV DC bus undervoltage fault (ON - Fault)

D23 BT Phase B top switch signal (ON - High Level)

D24 OC DC bus overcurrent fault (ON - Fault)

D25 CT Phase C top switch signal (ON - High Level)

D26 H0 / ZA Hall 0 / Zero-cross Phase A signal (ON - High Level)

D27 AB Phase A bottom switch signal (ON - High Level)

D28 H1 / ZB Hall 1 / Zero-cross Phase B signal (ON - High Level)

D29 BB Phase B bottom switch signal (ON - High Level)

D30 H2 / ZC Hall 2 / Zero-cross Phase C signal (ON - High Level)

D31 CB Phase C bottom switch signal (ON - High Level)

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Interface Description

Chapter 2 Interface DescriptionThe following chapters summarize the on-board connectors and header pin-outs, signal meanings and MCU pins assignments.

2.1 Power Supply J1

The MC9S12G128 Controller Board can be supplied either by using the 2.1 mm DC power plug J1 or the UNI-3 connector (J31, pin 19).

The controller board provides 5 V for a Hall interface and 3.3 V for on-board logic. Both voltages are generated by the MC33905 SBC. Proper operation is monitored by LEDs D3 for the 5V line and D7 for the 3.3V line (see Table 1-2).

The board is designed to operate in the voltage range from 8 V to 18 V. The board is protected against a reverse battery.

2.2 UNI3 Interface J31

The Unified Interface Version 3 (UNI-3) defines the interface between the MC9S12G128 Controller Board and the BLDC motor power stage.

The list of UNI-3 signal is as follows:

• Control signals:

— PWM phase A, B, C top and bottom switches control

— Brake signal control

— Power Factor Correction (PFC)

• Monitor signals

— DC-bus voltage

— DC-bus current

— Phase A, B, C current

— Zero-cross signals

— Back-EMF phase A, B, C

— Temperature monitoring

• Power Supply +12V

• Serial line - a bidirectional communication line between the Controller Board and Power Stage

The Table 2-1 defines the UNI-3 pin-out and pin assignment to the MCU.

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Interface Description

Table 2-1. UNI-3 Signal Description

Interface Pin Signal Name MCU Signal Description Direction

1 PWM_AT PWM3 Phase A top switch control (H -> Turn OFF) Digital output

3 PWM_AB PWM3 & PA0 Phase A bottom switch control (H -> Turn ON) Digital output

5 PWM_BT PWM5 Phase B top switch control (H -> Turn OFF) Digital output

7 PWM_BB PWM5 & PA1 Phase B bottom switch control (H -> Turn ON) Digital output

9 PWM_CT PWM7 Phase C top switch control (H -> Turn OFF) Digital output

11 PWM_CB PWM7 & PA2 Phase C bottom switch control (H -> Turn ON) Digital output

2, 4, 6, 8, 10 Shield- PWM signals shield

(grounded on the power stage side only)-

12,13 GND_D - Digital power supply ground -

14, 15 +5V DC - +5V digital power supply -

17, 18 AGND - Analog power supply ground -

19 +12/+15V DC - Analog power supply -

16,20, 23,24,25, 27, 28,37

NC-

Not connected-

21 VDCBUS PAD6 DC-bus voltage sensing, 0V – 3.3V Analog input

22 IDCBUS PAD1PAD3PAD5

DC-bus current sensing, 0V – 3.3V Analog input

26 TEMP PAD7 Analog temperature 0V – 3.3V Analog input

29 BRAKE_CONT PA5 DC-bus brake control Digital output

30 SERIAL - Serial interface Dig. bidirectional

31 PFC - Power factor correction PWM Digital output

32 PFCEN - Power factor correction enable Digital output

33 PFCZC - Power factor correction Zero-cross Digital input

34 ZCA KWP2 Phase A Back-EMF zero crossing Digital input

35 ZCB KWP4 Phase B Back-EMF zero crossing Digital input

36 ZCC KWP6 Phase C Back-EMF zero crossing Digital input

38 Back-EMF_A PAD0 Phase A Back-EMF voltage sensing Analog input

39 Back-EMF_B PAD2 Phase B Back-EMF voltage sensing Analog input

40 Back-EMF_C PAD4 Phase C Back-EMF voltage sensing Analog input

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Interface Description

2.3 MC33937A Interface J34

When using a Freescale 3-phase low voltage power stage [1.], the phase top and bottom switches are controlled by the MC33937A pre-driver. The device is configured by the SPI, see Table 2-2.

Table 2-2. MC33937 Signal Description

Interface Pin Signal Name MCU Signal Description Direction

1 NC - Not connected. -

2 NC - Not connected -

3 MC33937_EN PA4 Device enable Digital output

4 MC33937_OC - Over-current Digital input

5 MC33937_/RST PC4 Reset Digital output

6 MC33937_INT PC5 Interrupt Digital input

7 MC33937_SOUT MISO0 SPI Input data Digital input

8 MC33937_SCK SCK0 SPI clock Digital output

9 MC33937_CS /SS0 Chip-select Digital output

10 MC33937_SIN MOSI0 SPI output data Digital output

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Interface Description

2.4 Hall Sensor Interface JP1

When developing the sensor based BLDC application, the Hall sensors are used to determine the actual motor rotor sector.

Connect the motor Hall sensors outputs to JP1 following the instructions in Table 2-3. and watch the signal levels by on-board LEDs (Table 1-2, Table 1-1).

2.5 LIN Connector J9

The MC33905 LIN transceiver is used as an on-board LIN interface hardware. The LIN node can be configured to either the Master or Slave mode, see Table 1-1.

A Table 2-4 shows the LIN connector pin-out and pin assignment to the MCU.

2.6 CAN Connector J5

The system basis chip on the MC33905 CAN transceiver is used as the CAN hardware interface. The on-board jumpers J6, J7 enable node termination, impedance of 120R, see Table 1-1.

Table 2-5 shows the CAN connector pin-out and pin assignment to the MCU.

Table 2-3. HALL Signal Description

Interface Pin Signal Name MCU Signal Description Direction

1 +5Vdc - +5 V sensor supply voltage -

2 GND - Ground -

3 HALL0 KWP2 HALL0 sensor output Digital input

4 HALL1 KWP4 HALL1 sensor output Digital input

5 HALL2 KWP6 HALL 2 sensor output Digital input

6 NC - Not connected -

Table 2-4. LIN Signal Description

Interface Pin Signal Name MCU Signal Description Direction

1 GND - Ground -

2 GND - Ground -

3 VSUP - Power Supply -

4 LIN RXD1/TXD1 LIN bus Dig. bidirectional

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Interface Description

2.7 USB Connector J36

The USB line is used for board communication with the PC, when using e.g. the Freescale FreeMASTER tool to control the user application.

The interface uses a B type connector and is isolated from the board environment. See Table 2-6 for the pin description and pin assignment to the MCU.

2.8 Header JP2

Monitoring the PWM signal is possible using JP2. The Table 2-7 summarizes header pin-out.

Table 2-7. JP2 Signal Description

2.9 Header J30

Header J30 allows monitoring the MC33937A EN and OC pins, see Table 2-8.

Table 2-5. CAN Signal Description

Interface Pin Signal Name MCU Signal Description Direction

1 CANH RXCAN/TXCAN CAN bus H Diff. bidirectional

2 CANL RXCAN/TXCAN CAN bus L Diff. bidirectional

3 GND - Ground -

4 NC - Not connected -

Table 2-6. USB Signal Description

Interface Pin Signal Name MCU Signal Description Direction

1 VBUS - USB Power Supply -

2 D- RXD0/TXD0 Data – Dig. bidirectional

3 D+ RXD0/TXD0 Data + Dig. bidirectional

4 GNDB - USB Ground -

Interface Pin Signal Name MCU Signal Description Direction

1 PWM_AT PWM3 Phase A top switch control Digital output

2 PWM_AB PWM3 & PA0 Phase A bottom switch control Digital output

3 PWM_BT PWM5 Phase B top switch control Digital output

4 PWM_BB PWM5 & PA1 Phase B bottom switch control Digital output

5 PWM_CT PWM7 Phase C top switch control Digital output

6 PWM_CB PWM7 & PA2 Phase C bottom switch control Digital output

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Interface Description

Table 2-8. J30 Signal Description

2.10 Headers J14, J15, J16, J17

The MC9S12G128 MCU signals can be monitored using headers J14, J15, J16, J17, see board schematic.

Interface Pin Signal Name MCU Signal Description Direction

1 MC33937_OC - Over-current Digital input

2 MC33937_EN PA4 Device enable Digital output

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Design Consideration

Chapter 3 Design ConsiderationThis chapter provides an additional information on functional blocks of the MC9S12G128 controller board.

3.1 MC9S12G128 Features

The MC9S12G-Family is an automotive 16-bit microcontroller product line focused onlow-cost, high-performance and low pin-count [2.]. This family is intended to bridge between high-end 8-bit microcontrollers and high-performance 16-bit microcontrollers, such as the MC9S12XS-Family. The MC9S12G-Family is targeted at generic automotive applications requiring CAN or LIN/J2602 communication.The MC9S12G128 MCU 100 LQFP features follows (see Figure 3-1):

• CPU12V1 core

• Memory

— 128 KB of Flash memory

— 4096 bytes of EEPROM

— 8192 bytes of RAM

• Clock modules:

— External oscillator

— Internal 1MHz RC oscillator

— PLL

• Connectivity:

— MSCAN, 1 module

— SCI, 3modules

— SPI, 3modules

• 16-bit timer, 8 channels

• 8-bit PWM, that can be configured as either 8 channel 8-bit PWM or 4 channel 16-bit PWM.

• 10-bit ADC, 16 channels

• MCU Supply voltage from 3.13 V to 5.5 V

• Execution speed 50MHz

The MC9S12G128 Controller Board is designed to use MCU PWM3, PWM5, PWM7 channels as power stage phase A, phase B and phase C signals. The PWM1 channel is used primarily for proper timing of the power stage DC-bus current and BLDC motor Back-EMF ADC conversion.

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Design Consideration

Figure 3-1. S12G Family Block Diagram

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Design Consideration

3.2 PWM /HS and LS Signal Split and Phase Dead Time Generation

The MC9S12G128 MCU PWM module generates one PWM signal per each phase. The power stage requires separate PWM signals for each phase top and bottom switch.

The Figure 3-2 shows how the PWM signals are generated for motor phase A. The other motor phases are controlled using the same logic circuitry.

The PWMA signal is split using the dual AND gate U3 into:

• PWMA_/HS signal:

— turn ON the power stage top switch, when reaches a low level

— turn OFF the power stage top switch, when reaches a high level

• PWMA_LS signal:

— turn ON the power stage bottom switch, when reaches a high level

— turn OFF the power stage bottom switch, when reaches a low level

In case of need to turn OFF the top and bottom switch simultaneously, the CTRLA signal is driven by MCU low level and PWMA signal is driven high level.

The RC cell and diode are present on-board to insert a dead time approximately 2 micro seconds into the phase PWM signal. Optionally this can be disabled using on-board jumpers, see Section 1.3, “Board Jumper Configuration.”

Figure 3-2. PWM Signal Split and Phase Dead Time Generation

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Design Consideration

3.3 Board Fault Management

The Faults can be processed either by MCU software or by an on-board hardware. The action depends on jumper configuration, see Figure 3-3. and Table 1-1 J26, J27, J28, J29.

There are two sources of Fault condition (U6 comparator output high level):

• /FLT_DET0 - fault is triggered whenever the signal level is below limit set by R57

• FLT_DET1 - fault is triggered whenever the signal level is above limit set by R69

The /FLT_DET0 can be used for the DC bus undervoltage fault detection. The FLT_DET1 is designed for the DC bus overcurrent detection.

The jumper J29 selects the source of overcurrent fault. Either the on-board comparator or the power stage overcurrent fault signal, e.g. when using the MC33937A, determine the fault condition.

In fact, there are three options of fault processing, i.e. turning OFF power stage the top and bottom switches:

1. MCU using the /IRQ pin - MCU software is responsible for the power stage switches turn OFF

2. Power Stage Enable pin - when the fault is captured by U8 the RS Flip-Flop, the EN signal goes low. The power stage is responsible for turning OFF the switches.

3. on-board hardware - when the fault is captured by the U8 RS Flip-Flop, the U7 and U9 turn OFF the power stage top and bottom switches.

For configuration, see Table 3-1.

Table 3-1. Fault Jumper Configuration

Fault Action Responsibility

Fault Action Signals J26 J27 J28

Software MCU /IRQ pin, low level Placed, pins 2-3 Unplaced Unplaced

Power Stage J34 EN pin, low level Placed, pins 1-2 Placed, pins 2-3 Unplaced

Controller Board HW RS Flip-Flop signals Placed, pins 1-2 Placed, pins 1-2 Placed, pins 1-2

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Design Consideration

Figure 3-3. Fault Management Hardware

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Design Consideration

3.4 Hall Sensor Interface

The Hall sensor interface is used for BLDC sensor based motor control applications. The Hall sensors are used to determine the actual motor rotor sector.

The on-board interface provides the 5V power supply voltage to supply the sensors. The Hall interface inputs are designed to support an open collector as well as push-pull Hall sensors outputs (see Figure 3-4). A single pole RC low pass filter is present to reduce a signal noise.

For a detailed JP1 connector signal description, see Table 2-3.

Figure 3-4. Hall Sensor Interface

The Figure 3-5 shows the Hall sensor signal alignment to BLDC motor Back-EMF signal. The Hall sensors detect the rotor flux, so their actual state is not influenced by stator current. The Hall effect outputs in BLDC motors divide the electrical revolution into three equal sections of 120°. In this so-called 120° configuration, the Hall states 111 and 000 never occur.

Based on the Hall sensor signal, the BLDC motor commutation table is developed. An example is shown in Figure 3-6. The right-hand side of the table shows the Hall sensors signal, while the left side applied phase voltage.

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Design Consideration

Figure 3-5. BLDC Motor Back-EMF and Hall Sensor Signal Alignment

Figure 3-6. BLDC Motor Commutation Table

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Design Consideration

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Electrical Characteristics

Chapter 4 Electrical CharacteristicsThe electrical characteristics in Table 4-1 apply to an operation at 25 °C.

1—12V power supply, MCU without software

Table 4-1. Electrical Characteristics

Characteristic Symbol Min Typ Max Units

Power supply Voltage VDC 8 12 18 V

Current consumption(1) ICC 30 mA

Input Voltage Range VIN 0 – 3.3 V

Input Voltage Range Hall and MC33937 interface VIN 0 – 5 V

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Electrical Characteristics

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Board Set-up Guide

Chapter 5 Board Set-up GuideThe board is designed to be supplied either by the UNI-3 interface or by using the on-board J1 connector, power supply voltage from 8 V to 18 V. When using board as a standalone EVB, connect the power supply to J1. In case of board operation with the power stage, it is recommended to supply board using UNI-3 interface.

The MC9S12G128 Controller Board (blue board) is designed for operation with the FSL MC33937A based 3-Phase low voltage power stage (green board), see Figure 5-1. The complete 3-phase BLDC Sensor/Sensorless Development Kit can be ordered at http://www.freescale.com/AutoMCDevKits.

Figure 5-1. 3-Phase BLDC Sensor/Sensorless Development Kit

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Board Set-up Guide

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References

Chapter 6 References1. 3-phase Low Voltage Power Stage User Manual, Rev. 0, 31 March 2009,

http://www.freescale.com/AutoMCDevKits.

2. MC9S12G Family Reference Manual, MC9S12GRMV1 Rev. 1.06, 8 November 2011

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References

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Acronyms

Chapter 7 AcronymsADC Analog to Digital Converter

BEMF Back Electromotive Force

BLDC Brushless DC Motor

CAN Controller Area Network

DT Dead Time

LIN Local Interconnect Network

MCU Microcontroller Unit

PC Personal Computer

PWM Pulse Width Modulation

USB Universal Serial Bus

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Acronyms

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MC9S12G128 Controller Board Schematic

Chapter 8 MC9S12G128 Controller Board Schematic

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Notes:

----------

Sheet 4: Configure BLDC motor BEMF and current sensing.

Sheet 5: Insert Dead time ~2us.

Sheet 6: Configure Fault logic.

Sheet 7: Select either Hall sensor or Zero Cross based sensing.

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SCHEMATIC REVISIONS

Zone Date RevisedDescription0.1 Initial version 11.01.2012 PChAll

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SCHEMATIC REVISIONS

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____X____

08_USB_RS232_Interface

08_USB_RS232_Interface

RS232_TXRS232_RX

06_Fault_Logic

06_Fault_Logic

FLT1_DET

PWMA_/HS_IN PWMA_/HS_OUTPWMA_LS_IN PWMA_LS_OUT

PWMB_/HS_IN

PWMC_/HS_INPWMC_LS_IN

PWMB_LS_IN PWMB_LS_OUT

PWMC_LS_OUTPWMC_/HS_OUT

PWMB_/HS_OUT

FLT0_OUTFLT1_OUT

FLT_OUT

FLT_RSTEN_IN EN_OUT

FLT1_DET_ALT

/FLT0_DET

09_LEDs_&_Ctrl

09_LEDs_&_Ctrl

LED1_YLED2_YLED3_Y

LED4_GLED5_GLED6_G

LED7_RLED8_R

LED9_GLED10_GLED11_G

ROTAROTBROTSW

07_UNI3_HALL_Interface

07_UNI3_HALL_Interface

BRAKE

DCBVDCBI

TEMP

PWM_CBPWM_CT

PWM_BBPWM_BT

PWM_ABPWM_AT

MC33937_SOUT

MC33937_INT

MC33937_OC

MC33937_/CS

MC33937_/RST

MC33937_SINMC33937_SCK

MC33937_EN

BEMF_A

BEMF_B

BEMF_C

UNI3_+12V/+15V_PWR_OUT

HALL0/ZCAHALL1/ZCBHALL2/ZCC

05_PWM_and_Dead_Time_Unit

05_PWM_and_Dead_Time_Unit

PWMA PWMA_/HSPWMA_LSCTRLA

PWMBCTRLB

CTRLCPWMC

PWMB_/HS

PWMC_/HSPWMC_LS

PWMB_LS

03_Power_Supply_LIN_CAN

03_Power_Supply_LIN_CAN

CAN_TXCAN_RX

LIN_TXLIN_RX

MC33905_/CS

MC33905_/INT

MC33905_SCLK

MC33905_MUX_OUT

MC33905_/RST

MC33905_MOSIMC33905_MISO

+VSUP_PWR_IN

04_MCU

04_MCU

PWM3

PWM7

PWM5

TXD0RXD0

MISO0MOSI0SCK0/SS0

KWJ4KWJ5KWJ6

AN0AN1AN2AN3AN4AN5AN6AN7

TXD1RXD1

RXCANTXCAN

/RESET

KWJ7

KWP2KWP4KWP6

/IRQ

PA0

PA1

PA2

PA3PA4PA5

PC3PC4PC5PC6PC7

AN8

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D D

C C

B B

A A

TERMINATE

CAN

LIN

VSUP <+8V, +28V>

CANHCANL

MC33905_/INTMC33905_/RST

MC33905_MISO

MC33905_MOSI

MC33905_MUX_OUT

MC33905_SCLK

MC33905_/CS

+VSUP_PWR_IN

CAN_TX

LIN_TXLIN_RX

CAN_RX

GND

GND

GND

GND

GND

GND

VSUP

VSUP

GND

VSUP

GND

GND

+3.3VD_MCU

+3.3VD_MCU

+5V

+3.3VA_MCU

GNDA GNDAGNDGND

GND

GND

GNDDGND GNDD

GNDD GNDD

GND GND

GND

GNDD GNDD

GNDD

GNDD

GND

GND GNDA

GNDA

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____X____

R94.7KR94.7K

J2J2

1

D6

HSMS-C170

D6

HSMS-C170

AC

J12J12

1

C17

220PF

C17

220PF

C1347PFC1347PF

C110.1UF

C110.1UF

D7

HSMG-C170

D7

HSMG-C170

A C

R18

1.0K

R18

1.0K

D1

ES1JL

D1

ES1JL

A C

TP2TP2

R5

0

R5

0

+ C1

10UF

+ C1

10UF

J6J6

12

J4J4

1 2

R13

10.0K

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10.0K

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ES1JL

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ES1JL

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C164700PFC164700PF

J5

CON_1x4

J5

CON_1x4

1234M1

M2

R14 10.0KR14 10.0K

+ C4

10UF

+ C4

10UF

R1760.4R1760.4

C100.1UFC100.1UF

R12 0R12 0

+ C14

10UF

+ C14

10UF

EB

CQ1

BCP52-16

EB

CQ1

BCP52-16

1

32 4

+ C5330UF

+ C5330UF

J7J7

12

L1

1000 OHM

L1

1000 OHM

C20.1UFC20.1UF

R10 0R10 0

J8J8

1 2

D4

ES1JL

D4

ES1JL

A C

J13J13

1

SW1B3S-1002SW1B3S-1002

1234

J10J10

1

C80.1UFC80.1UF

D5

ES1JL

D5

ES1JL

A C

TP3TP3

R4

1.0K

R4

1.0K

R61.0KR61.0K

R8

1.0K

R8

1.0K

+ C6330UF

+ C6330UF

C7

0.1UF

C7

0.1UF

J11J11

1

R2

0

R2

0

C1247PFC1247PF

R7

4.7K

R7

4.7K

D9NUP2105LD9NUP2105L

2

3

1

R11 0R11 0

U1MCZ33905BS3EKU1MCZ33905BS3EK

VB

AU

X11

VC

AU

X12

VSUP22 V

AU

X13

VE

31

VB

32

VSUP11

SAFE5

DBG16

VSENSE20

I/O_015

I/O_121

CANH7

SPLIT10

CANL8

LIN_T4

LIN17

VDD28

RST22

INT23

MOSI26

SCLK25

MISO27

CS24

MUX_OUT14

5V_CAN6

TXD29

RXD30

TXD_L18

RXD_L19

GN

D_C

AN

9

EX

_P

AD

33

I/O_33

L2B82789C0513N002L2B82789C0513N002

13

24

C30.1UFC30.1UF

D3

HSMG-C170

D3

HSMG-C170

AC

TP1TP1

D8

MMSZ8V2T1G

D8

MMSZ8V2T1G

AC

C150.1UFC150.1UF

R1660.4R1660.4

D10

MMSD914T1

D10

MMSD914T1

AC

R3

10.0K

R3

10.0K

+ C9

10UF

+ C9

10UF

J9

CON PLUG 4

J9

CON PLUG 4

4321

J1

CON_1_PWR

J1

CON_1_PWR

1

23

R1

1.0K

R1

1.0K

J3J31 2

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B B

A A

Configure ADC signals used for BEMF and BLDC motor current sensing:

-------------------------------------------------------------------

- AN0, AN1 populate R21, R24

- AN2, AN3 populate R29, R30

- AN4, AN5 populate R35, R36

/RST

PA0PA1PA2PA3PA4PA5

PB4

PC3PC4PC5PC6PC7

PP2PP3PP4PP5PP6PP7

PT0PT1PT2PT3PT4PT5PT6PT7

PAD9PAD10PAD11PAD12PAD13PAD14PAD15

PS0PS1PS2PS3PS4PS5PS6PS7

PJ4PJ5PJ6PJ7

PM0PM1PM2PM3

PA6PA7

PB0PB1PB2PB3

PB5PB6PB7

PC0PC1PC2

PD0PD1PD2PD3PD4PD5PD6PD7

PJ0PJ1PJ2PJ3

PP0

PAD0PAD1PAD2PAD3PAD4PAD5PAD6PAD7

PAD8

PAD0

PAD1

PAD2

PAD3

PAD4

PAD5

PAD6

PAD7

PAD8

PP0 PP1PP2 PP3PP4 PP5PP6 PP7

PC0PC2PC4PC6

PC1PC3PC5PC7

PAD0 PAD1PAD2PAD4PAD6PAD8PAD10PAD12PAD14

PAD3PAD5PAD7PAD9PAD11PAD13PAD15

PS0PS2PS4PS6

PS1PS3PS5PS7

PM0PM2

PM1PM3

PC0

PC1

PC2

BKGD

VDDA

VRH

VDDX1

VDDX2

VDDX3

VDDA

VRH

VDDX1

VDDX2

VDDX3

/RSTBKGD

PP1

PD1 PD0PD3 PD2PD5 PD4PD7 PD6

PT6PT7PT5 PT4

PT2PT0

PT3PT1

PB0PB1PB3 PB2PB5 PB4PB7 PB6

PA1 PA0PA3 PA2PA5 PA4PA7 PA6

PJ0 PJ1PJ2 PJ3

PJ5PJ4PJ6 PJ7

PWM5

PWM3

PWM7

TXD0RXD0

KWJ4KWJ5KWJ6

AN0

AN1

AN2

AN3

AN4

AN5

AN6

AN7

TXD1RXD1

RXCANTXCAN

/RESET

KWJ7

KWP2

KWP4

KWP6

/IRQ

MISO0MOSI0SCK0/SS0

PA0PA1PA2PA3PA4PA5

PC3PC4

PC5PC6PC7

AN8

+3.3VD_MCU

GNDD

+3.3VD_MCU

GNDD GNDD

+3.3VD_MCU

GNDD

GNDDGNDD

GNDD

GNDA

GNDD

GNDD

GNDD

GNDAGNDD

GNDAGNDAGNDA

+3.3VA_MCU

GNDD

GNDD

GNDD

+3.3VD_MCU

GNDD

GNDD

+3.3VD_MCU

GNDD

GNDD

GNDD

GNDD

GNDA

GNDA

GNDA

GNDA

GNDA

GNDA

GNDA

GNDA

GNDA

Drawing Title:

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<DrawnBy>

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____X____Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

Designer:

Drawn by:

Approved:

Freescale Semiconductor RCSC

1. maje 1009765 61 Roznov p. R. Czech republic, Europe

This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

ICAP Classification: FCP: FIUO: PUBI:

SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

C

Monday, March 12, 2012

MCU

<Designer>

<Approver>

<DrawnBy>

4 9

____X____Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

Designer:

Drawn by:

Approved:

Freescale Semiconductor RCSC

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This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

ICAP Classification: FCP: FIUO: PUBI:

SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

C

Monday, March 12, 2012

MCU

<Designer>

<Approver>

<DrawnBy>

4 9

____X____

R37 0

DNP

R37 0

DNP

SW3B3S-1002

SW3B3S-1002

1234

R34 100R34 100

R41 100R41 100

C360.1UFC360.1UF

J17

HDR_2X13

J17

HDR_2X13

1 23 4

657 89 10

11 1213 1415 1617 1819 2021 2223 2425 26

C25

22pF

C25

22pF

R33 0DNPR33 0DNP

R19 0DNPR19 0DNP

D12

HSMG-C170

D12

HSMG-C170

AC

C18100 PFC18100 PF

+ C33

10UF

+ C33

10UF

R24 0R24 0

R26

0

R26

0

C26100 PFC26100 PF

Y1

8MHz

Y1

8MHz

12

R250R250

C350.1UFC350.1UF

J16

HDR_2X13

J16

HDR_2X13

1 23 4

657 89 10

11 1213 1415 1617 1819 2021 2223 2425 26

R431.0KR431.0K

1

2526 50

51

75

76100

U2

MC9S12G128

1

2526 50

51

75

76100

U2

MC9S12G128

PB0/ECLK25

PB1/API_EXTCLK26

PB2/ECLKX227

PB328

PJ6/KWJ6/SCK21

VDDX19

PB4/IRQ47

PB5/XIRQ48

PB649

PB750

PD078

PD179

PD280

PD381

PD494

PD595

PD696

PD797

PM0/RXCAN92

PM1/TXCAN93

PM2/RXD298

PM3/TXD299

PP0/KWP0/ETRIG0/PWM029

PP1/KWP1/ETRIG1/PWM130

PP2/KWP2/ETRIG2/PWM231

PP3/KWP3/ETRIG3/PWM332

PP4/KWP4/PWM433

PP5/KWP5/PWM534

PP6/KWP6/PWM635

PP7/KWP7/PWM736

PT0/IOC046

PT1/IOC145

PT2/IOC244

PT3/IOC343

PJ0/KWJ0/MISO120

PT4/IOC442

PT5/IOC541

PT6/IOC640

PT7/IOC739

PAD0/KWAD0/AN055

PAD1/KWAD1/AN157

PAD2/KWAD2/AN259

PAD3/KWAD3/AN361

PAD4/KWAD4/AN463

VSSX338

VSSX111

PAD5/KWAD5/AN565

PAD6/KWAD6/AN667

PAD7/KWAD7/AN769

PAD8/KWAD8/AN856

PAD9/KWAD9/AN958

VDDR10

VDDX337

PE0/EXTAL12

PE1/XTAL14

PAD10/KWAD10/AN1060

PAD11/KWAD11/AN1162

PAD12/KWAD1264

PAD13/KWAD1366

PAD14/KWAD1468

PAD15/KWAD1570

PS0/RXD082

PS1/TXD083

PS2/RXD184

PS3/TXD185

PS4/MISO086

PS5/MOSI087

PS6/SCK088

VSS13

PJ1/KWJ1/MOSI121

PJ4/KWJ4/MISO23 PJ3/KWJ3/SS1

23

PC051

PC152

PC253

PC354

PC471

PC572

PC673

PC774

PJ2/KWJ2/SCK122

VDDX291

PA04

PA15

PA26

PA37

PJ5/KWJ5/MOSI22

PJ7/KWJ7/SS2100

PA416

PA517

PA618

PA719

VSSA77 VDDA76

VSSX290

PS7/API_EXTCLK/SS089

TEST15

VRH75

RESET8

BKGD/MODC24

C29100 PFC29100 PF

C24100 PFC24100 PF

J18J18

1 2

J19

CON 2X3 PLUG TH 100MIL

J19

CON 2X3 PLUG TH 100MIL

1 23 4

65

R44

10.0K

R44

10.0K

C370.1UFC370.1UF

R421.0KR421.0K

R40 100R40 100

C21100 PFC21100 PF

C300.1UFC300.1UF

J15

HDR_2X13

J15

HDR_2X13

1 23 4

657 89 10

11 1213 1415 1617 1819 2021 2223 2425 26

R32 100R32 100

D11

HSMG-C170

D11

HSMG-C170

AC

R39 100R39 100

L4 1000 OHML4 1000 OHM

SW2B3S-1002

SW2B3S-1002

1234

R29 0R29 0

L31000 OHML31000 OHM

R22 0

DNP

R22 0

DNP

R21 0R21 0

C19100 PFC19100 PF

R30 0R30 0

C28100 PFC28100 PF

R28 100R28 100

C22100 PFC22100 PF

J14

HDR_2X13

J14

HDR_2X13

1 23 4

657 89 10

11 1213 1415 1617 1819 2021 2223 2425 26

R31 0

DNP

R31 0

DNP

R27 0DNPR27 0DNP

R38 100R38 100

C23

22pF

C23

22pF

R20 100R20 100

C274700PFC274700PF

R35 0R35 0

+ C31

10UF

+ C31

10UF

C320.1UFC320.1UF

R36 0R36 0

C340.1UFC340.1UF

R23 100R23 100

C20100 PFC20100 PF

Page 42: MC9S12G128 Controller Board User Guide · — Back-EMF signal sensing using an MCU ADC module — Back-EMF zero-cross signal monitoring • Sensor based: — Hall sensor signal monitoring

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

Insert Dead time ~2us:

-----------------------

Yes - Place jumper on J2x headers, pins 2,3

No - Place jumper on J2x headers, pins 1,2

PWMAPWMA_/HS

CTRLA

PWMB

CTRLB

PWMB_LS

PWMB_/HS

PWMC

CTRLC

PWMC_/HS

PWMC_LSPWMA_LS

+3.3VD_MCU

GNDDGNDD

GNDD

GNDD

+3.3VD_MCU

GNDDGNDD

GNDD

GNDD

+3.3VD_MCU

GNDDGNDD

GNDD

GNDD

Drawing Title:

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Date: Sheet of

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ICAP Classification: FCP: FIUO: PUBI:

SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

B

Monday, February 06, 2012

PWM and Dead Time Unit

<Designer>

<Approver>

<DrawnBy>

5 9

____X____Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

Designer:

Drawn by:

Approved:

Freescale Semiconductor RCSC

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This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

ICAP Classification: FCP: FIUO: PUBI:

SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

B

Monday, February 06, 2012

PWM and Dead Time Unit

<Designer>

<Approver>

<DrawnBy>

5 9

____X____Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

Designer:

Drawn by:

Approved:

Freescale Semiconductor RCSC

1. maje 1009765 61 Roznov p. R. Czech republic, Europe

This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

ICAP Classification: FCP: FIUO: PUBI:

SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

B

Monday, February 06, 2012

PWM and Dead Time Unit

<Designer>

<Approver>

<DrawnBy>

5 9

____X____

D13BAT54T1G

D13BAT54T1G

A C

D14BAT54T1G

D14BAT54T1G

A C

C44

0.1UF

C44

0.1UF

U3B

SN74LVC2G08DCT

U3B

SN74LVC2G08DCT

5

63

VCC

GND

U4A

SN74LVC2G08DCT

VCC

GND

U4A

SN74LVC2G08DCT

1

27

84

C39

0.1UF

C39

0.1UF

R53 1.0KR53 1.0K

R51 22.0KR51 22.0K

R47 1.0KR47 1.0K

C38

0.1UF

C38

0.1UF

J24J24

1 2 3

R54 15.0KR54 15.0K

J21J21

1 2 3

R48 15.0KR48 15.0K

U4B

SN74LVC2G08DCT

U4B

SN74LVC2G08DCT

5

63

VCC

GND

U5A

SN74LVC2G08DCT

VCC

GND

U5A

SN74LVC2G08DCT

1

27

84

R49 620R49 620

R56 22.0KR56 22.0K

R52 22.0KR52 22.0K

D15BAT54T1G

D15BAT54T1G

AC

J20J20

1 2 3

R55 620R55 620

J22J22

1 2 3

R45 1.0KR45 1.0K

U5B

SN74LVC2G08DCT

U5B

SN74LVC2G08DCT

5

63R50 620R50 620

D18BAT54T1G

D18BAT54T1G

AC

C40100 PFC40100 PF

D16BAT54T1G

D16BAT54T1G

AC

C45100 PFC45100 PF

C41100 PFC41100 PF

J25J25

1 2 3

C46100 PFC46100 PF

VCC

GND

U3A

SN74LVC2G08DCT

VCC

GND

U3A

SN74LVC2G08DCT

1

27

84

J23J23

1 2 3

C43100 PFC43100 PF

C42100 PFC42100 PF

R46 15.0KR46 15.0K

D17BAT54T1G

D17BAT54T1G

A C

Page 43: MC9S12G128 Controller Board User Guide · — Back-EMF signal sensing using an MCU ADC module — Back-EMF zero-cross signal monitoring • Sensor based: — Hall sensor signal monitoring

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

Q

/QS

R

Configure on board Fault logic:

-------------------------------

1. Select source of OC protection, J29

2. MCU /IRQ based (software based) Fault logic:

- jumper on J26, pins 2, 3

- jumper on J27, open

- jumper on J28, open

3. HW based Fault logic using gate driver

MC33972_EN signal to turn OFF MOSFETs:

- jumper on J26, pins 1, 2

- jumper on J27, pins 2, 3

- jumper on J28, open

4. HW based Fault logic using on board logic to turn OFF

MOSFETs (/HS = H, LS = L):

- jumper on J26, pins 1, 2

- jumper on J27, pins 1, 2

- jumper on J28, pins 1, 2

FLT_/Q

FLT_Q

FLT_/QFLT_Q

PWMA_/HS_INPWMA_/HS_OUT

PWMA_LS_INPWMA_LS_OUT

PWMB_/HS_IN

PWMC_/HS_IN PWMC_LS_IN

PWMB_LS_INPWMB_LS_OUT

PWMC_LS_OUTPWMC_/HS_OUT

PWMB_/HS_OUT

FLT_RST

/FLT0_DET

FLT1_DET

FLT0_OUT

FLT1_OUT

FLT_OUT

EN_IN

EN_OUT

FLT1_DET_ALT

+3.3VD_MCU

GNDD

GNDD

GNDD

GNDD

+3.3VD_MCU

GNDD

GNDD

GNDD GNDD

+3.3VD_MCU

+3.3VD_MCU

GNDDGNDD

GNDD

GNDD

+3.3VD_MCU

+3.3VD_MCU

+3.3VD_MCU

GNDD

+3.3VD_MCU

GNDD

GNDD

+3.3VD_MCU

GNDD

GNDD

GNDD

+3.3VD_MCU

Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

Designer:

Drawn by:

Approved:

Freescale Semiconductor RCSC

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This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

ICAP Classification: FCP: FIUO: PUBI:

SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

B

Thursday, March 01, 2012

Fault Logic

<Designer>

<Approver>

<DrawnBy>

6 9

____X____Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

Designer:

Drawn by:

Approved:

Freescale Semiconductor RCSC

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This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

ICAP Classification: FCP: FIUO: PUBI:

SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

B

Thursday, March 01, 2012

Fault Logic

<Designer>

<Approver>

<DrawnBy>

6 9

____X____Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

Designer:

Drawn by:

Approved:

Freescale Semiconductor RCSC

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This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

ICAP Classification: FCP: FIUO: PUBI:

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S12G BLDC Development Kit

B

Thursday, March 01, 2012

Fault Logic

<Designer>

<Approver>

<DrawnBy>

6 9

____X____

U7C

MC74AC32DG

U7C

MC74AC32DG

9

108

-

+

U6BLM393M_NL

-

+

U6BLM393M_NL

5

67

84

R65 10.0KR65 10.0K R66 1.0MR66 1.0M

R59 1.0MR59 1.0M

U10

NC7SZ14

U10

NC7SZ14

Y4

GND3

A2

VCC5

NC1

R67

10.0K

R67

10.0K

R6910KR6910K

13

2

-

+

U6ALM393M_NL

-

+

U6ALM393M_NL

3

21

84

R63 10.0KR63 10.0K

GND

VCCU7A

MC74AC32DG

GND

VCCU7A

MC74AC32DG

1

23

14

7

U7D

MC74AC32DG

U7D

MC74AC32DG

12

1311

U8BSN74LVC2G02DCTR

U8BSN74LVC2G02DCTR

5

63

VCC

GNDU8A

SN74LVC2G02DCTR

VCC

GNDU8A

SN74LVC2G02DCTR

1

27

84

C50

0.1UF

C50

0.1UF

R68

10.0K

R68

10.0K

R60

10.0K

R60

10.0K

R58 10.0KR58 10.0K

C49

0.1UF

C49

0.1UF

J29J29

1 2 3

C544700PFC544700PF

R62

10.0K

R62

10.0K

J27J27

1 2 3

U9BMC74AC08DGU9BMC74AC08DG

4

56

U7B

MC74AC32DG

U7B

MC74AC32DG

4

56

VCC

GNDU9AMC74AC08DG

VCC

GNDU9AMC74AC08DG

1

23

14

7

R61

10.0K

R61

10.0K

C530.1UFC530.1UF

C51

0.1UF

C51

0.1UF

C470.1UFC470.1UF

R64 10.0KR64 10.0K

U9CMC74AC08DGU9CMC74AC08DG

9

108

C550.1UFC550.1UF

J26J26

1 2 3

C524700PFC524700PF

C480.1UFC480.1UF

J28J28

1 2 3

R57

10K

R57

10K

13

2

U9DMC74AC08DGU9DMC74AC08DG

12

1311

Page 44: MC9S12G128 Controller Board User Guide · — Back-EMF signal sensing using an MCU ADC module — Back-EMF zero-cross signal monitoring • Sensor based: — Hall sensor signal monitoring

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

HALL SENSORS

ZCB ZCC

PWM_ABPWM_BTPWM_BBPWM_CTPWM_CB

EN

SOUT

OCINT

ZCA

PWM_AT

TP

ZCB

ZCA

ZCC

OC

INT

SOUT TP

PWM_ATPWM_ABPWM_BTPWM_BBPWM_CTPWM_CB

OC

EN

PWM_ATPWM_ABPWM_BTPWM_BBPWM_CTPWM_CB

UNI3_+12V/+15V_PWR_OUT

MC33937_/RST

MC33937_SIN

MC33937_EN

BRAKE

MC33937_/CSMC33937_SCK

MC33937_OC

MC33937_INT

MC33937_SOUT

BEMF_CBEMF_A

BEMF_B

HALL0/ZCA

HALL1/ZCB

HALL2/ZCC

TEMP

DCBIDCBV

GNDA GNDA

+5V

+5V

+5V

+5V

GNDD

GNDD

GNDD

GNDD

GNDD

GNDD

GNDD

GNDD

GNDD

GNDD

GNDD

GNDA

Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

Designer:

Drawn by:

Approved:

Freescale Semiconductor RCSC

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This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

ICAP Classification: FCP: FIUO: PUBI:

SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

B

Monday, February 06, 2012

UNI 3 Interface

<Designer>

<Approver>

<DrawnBy>

7 9

____X____Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

Designer:

Drawn by:

Approved:

Freescale Semiconductor RCSC

1. maje 1009765 61 Roznov p. R. Czech republic, Europe

This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

ICAP Classification: FCP: FIUO: PUBI:

SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

B

Monday, February 06, 2012

UNI 3 Interface

<Designer>

<Approver>

<DrawnBy>

7 9

____X____Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

Designer:

Drawn by:

Approved:

Freescale Semiconductor RCSC

1. maje 1009765 61 Roznov p. R. Czech republic, Europe

This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

ICAP Classification: FCP: FIUO: PUBI:

SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

B

Monday, February 06, 2012

UNI 3 Interface

<Designer>

<Approver>

<DrawnBy>

7 9

____X____

R81

3.3K

R81

3.3K

J34

HDR_2X5

J34

HDR_2X5

1 23 4

657 89 10

JP2

HDR 1X6

JP2

HDR 1X6

123456

R751.0KR751.0K

R82

3.3K

R82

3.3K

R896.2KR896.2K

R701.0KR701.0K

JP1JP1123456

R786.2KR786.2K

R85

3.3K

R85

3.3K

J33J33

1 2 3

J30J30

12

J31

CON_2X20

J31

CON_2X20

1 23 4

657 89 10

11 1213 1415 1617 1819 2021 2223 2425 2627 2829 3031 3233 3435 3637 3839 40

C5647PFC5647PF

R836.2KR836.2K

C5747PFC5747PF

R866.2KR866.2K

R746.2KR746.2K

R906.2KR906.2K

R7627R7627

R8027R8027

R87

3.3K

R87

3.3K

R73

470

R73

470

R791.0KR791.0K

J35J35

1 2 3

R88

3.3K

R88

3.3K

R77

3.3K

R77

3.3K

R72

3.3K

R72

3.3K

R846.2KR846.2K

R7127R7127

J32J32

1 2 3

C5847PFC5847PF

Page 45: MC9S12G128 Controller Board User Guide · — Back-EMF signal sensing using an MCU ADC module — Back-EMF zero-cross signal monitoring • Sensor based: — Hall sensor signal monitoring

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

Isolation Barrier

RS232_TX

RS232_RX

VDD_USB

VDD_USB

GND_USB

GND_USB

GND_USB

GND_USB

VDD_USB

GNDD

GNDD

+3.3VD_MCU

GND_USB

Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

Designer:

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Freescale Semiconductor RCSC

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This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

ICAP Classification: FCP: FIUO: PUBI:

SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

B

Monday, February 06, 2012

USB to RS232 Interface

<Designer>

<Approver>

<DrawnBy>

8 9

____X____Drawing Title:

Size Document Number Rev

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Page Title:

Designer:

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Approved:

Freescale Semiconductor RCSC

1. maje 1009765 61 Roznov p. R. Czech republic, Europe

This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

ICAP Classification: FCP: FIUO: PUBI:

SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

B

Monday, February 06, 2012

USB to RS232 Interface

<Designer>

<Approver>

<DrawnBy>

8 9

____X____Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

Designer:

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Approved:

Freescale Semiconductor RCSC

1. maje 1009765 61 Roznov p. R. Czech republic, Europe

This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

ICAP Classification: FCP: FIUO: PUBI:

SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

B

Monday, February 06, 2012

USB to RS232 Interface

<Designer>

<Approver>

<DrawnBy>

8 9

____X____

C600.1UFC600.1UF

C610.1UFC610.1UF

U11

ADUM1201

U11

ADUM1201

VD

D1

1

VD

D2

8

VIA7

VIB3

VOA2

VOB6

GN

D1

4

GN

D2

5

U12

FT232RL

U12

FT232RL

VCCIO4

VCC20

USBDM16

USBDP15

NC_88

RESET19

NC_2424

OSCI27

OSCO28

3V3OUT17

AG

ND

25

GN

D1

7G

ND

21

8G

ND

32

1

TE

ST

26

TXD1

RXD5

RTS3

CTS11

DTR2

DSR9

DCD10

RI6

CBUS023

CBUS122

CBUS213

CBUS314

CBUS412

R92

1.0K

R92

1.0K

D20

HSMY-C170

D20

HSMY-C170

AC

C590.1UFC590.1UF

123

4

+D

-D

G

V

J36

USB_TYPE_B

123

4

+D

-D

G

V

J36

USB_TYPE_B

1

234

S1

S2R91

1.0K

R91

1.0K

R93 27R93 27

L51000 OHML51000 OHM C63

0.01UFC630.01UF

C640.1UFC640.1UF

R94 27R94 27

C62

4.7uF

C62

4.7uF

D19

HSMY-C170

D19

HSMY-C170

AC

Page 46: MC9S12G128 Controller Board User Guide · — Back-EMF signal sensing using an MCU ADC module — Back-EMF zero-cross signal monitoring • Sensor based: — Hall sensor signal monitoring

5

5

4

4

3

3

2

2

1

1

D D

C C

B B

A A

ROTA

ROTB

LED1_Y

LED2_Y

LED3_Y

LED4_G

LED5_G

LED6_G

LED7_R

LED8_R

LED10_G

ROTSWLED9_G

LED11_G

+3.3VD_MCU

GNDD

GNDD

+3.3VD_MCU

GNDD

+3.3VD_MCU

GNDD

+3.3VD_MCU

+3.3VD_MCU

GNDD

GNDD

Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

Designer:

Drawn by:

Approved:

Freescale Semiconductor RCSC

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This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

ICAP Classification: FCP: FIUO: PUBI:

SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

B

Monday, February 06, 2012

LEDs and Control

<Designer>

<Approver>

<DrawnBy>

9 9

____X____Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

Designer:

Drawn by:

Approved:

Freescale Semiconductor RCSC

1. maje 1009765 61 Roznov p. R. Czech republic, Europe

This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

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SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

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Monday, February 06, 2012

LEDs and Control

<Designer>

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<DrawnBy>

9 9

____X____Drawing Title:

Size Document Number Rev

Date: Sheet of

Page Title:

Designer:

Drawn by:

Approved:

Freescale Semiconductor RCSC

1. maje 1009765 61 Roznov p. R. Czech republic, Europe

This document contains information proprietary to Freescale Semiconductor and shall not be used forengineering design, procurement or manufacture in whole or in part without the express written permissionof Freescale Semiconductor.

ICAP Classification: FCP: FIUO: PUBI:

SCH-27496 PDF: SPF-27496 X

S12G BLDC Development Kit

B

Monday, February 06, 2012

LEDs and Control

<Designer>

<Approver>

<DrawnBy>

9 9

____X____

U13B

MC74HC04ADG

U13B

MC74HC04ADG

3 4

R981.0KR981.0K

R994.7KR994.7K

VCC

GND

U14A

MC74HC04ADG

VCC

GND

U14A

MC74HC04ADG

1 2

14

7

SW4EC11J1524802SW4EC11J1524802

COMMONC

AA

BB

DD

EE

GN

D1

S1

GN

D2

S2

GN

D3

S3

GN

D4

S4

GN

D5

S5

GN

D6

S6

D24

HSMS-C170

D24

HSMS-C170

AC

D22

HSMS-C170

D22

HSMS-C170

AC

D25

HSMY-C170

D25

HSMY-C170

AC

R1051.0KR1051.0K

R951.0KR951.0K

U13F

MC74HC04ADG

U13F

MC74HC04ADG

13 12

VCC

GND

U13A

MC74HC04ADG

VCC

GND

U13A

MC74HC04ADG

1 2

14

7

C650.1UFC650.1UF

U14C

MC74HC04ADG

U14C

MC74HC04ADG

5 6

R971.0KR971.0K

R1081.0KR1081.0K

D30

HSMG-C170

D30

HSMG-C170

AC

R1061.0KR1061.0K

C660.1UFC660.1UF

R961.0KR961.0K

U13E

MC74HC04ADG

U13E

MC74HC04ADG

11 10

R1041.0KR1041.0K

U14B

MC74HC04ADG

U14B

MC74HC04ADG

3 4

U14E

MC74HC04ADG

U14E

MC74HC04ADG

11 10

U13D

MC74HC04ADG

U13D

MC74HC04ADG

9 8

D23

HSMY-C170

D23

HSMY-C170

AC

R1071.0KR1071.0K

D31

HSMG-C170

D31

HSMG-C170

AC

R1021.0KR1021.0K

R1031.0KR1031.0K

R1004.7KR1004.7K

D27

HSMG-C170

D27

HSMG-C170

AC

D29

HSMG-C170

D29

HSMG-C170

AC

U14F

MC74HC04ADG

U14F

MC74HC04ADG

13 12

D28

HSMG-C170

D28

HSMG-C170

AC

U14D

MC74HC04ADG

U14D

MC74HC04ADG

9 8

R1014.7KR1014.7K

U13C

MC74HC04ADG

U13C

MC74HC04ADG

5 6D26

HSMG-C170

D26

HSMG-C170

AC

D21

HSMY-C170

D21

HSMY-C170

AC

Page 47: MC9S12G128 Controller Board User Guide · — Back-EMF signal sensing using an MCU ADC module — Back-EMF zero-cross signal monitoring • Sensor based: — Hall sensor signal monitoring

MC9S12G128 Controller Board Schematic

MC9S12G128 Controller Board User Guide, Rev. 1.0

38 Freescale Semiconductor

Page 48: MC9S12G128 Controller Board User Guide · — Back-EMF signal sensing using an MCU ADC module — Back-EMF zero-cross signal monitoring • Sensor based: — Hall sensor signal monitoring

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MC9S12G128MCBUGRev. 1.008/2012