Index

aberration, 6astigmatism, 6, 138chromatic, 6curvature of field, 6spherical, 6

absorbance, 273absorption coefficient, 48absorption contrast, 91absorption edge, 49absorptivity, 297acceleration voltage, 81, 121achromat, 13adatom, 150adhesive mounting, 18Airy disk, 4analyzing crystal, 180anti-Stokes scattering, 259aperture diaphragm, 10apochromat, 13atomic number effect, 193atomic scattering factor, 57Auger electron, 172, 198axial-divergence error, 60

backscattered electrons, 123backscattering coefficient, 133barrier filter, 37baseline, 310beam brightness, 125beam splitter, 270Beer’s law, 297bending contours, 113bending mode, 260beryllium window, 184binding energy, 197birefringence, 30

Bragg angle, 64, 72Bragg conditions, 51Bragg’s law, 49, 72Bragg-Brentano arrangement, 60bright-field, 25, 93brightness, 5buoyancy effect, 324

Cahn microbalance, 321camera constant, 102camera length, 102capillary force, 153Cassegrain lens, 276cathode ray tube (CRT), 122cationisation, 241characteristic X-rays, 46charge neutralization, 215charged-coupled device (CCD), 283chemical shift, 210, 212cold crystallization, 309collision cascade, 226collision sputtering, 226color temperature, 9compositional contrast, 133concentric hemispherical

analyzer, 204condenser annulus, 29confocal diaphragm, 281confocal plane, 39conjugate aperture planes, 10conjugate field planes, 10conjugate focal planes, 10constant analyzer energy, 205constant current mode, 149constant height mode, 150constant retarding ratio, 205

Materials Characterization: Introduction to Microscopic and Spectroscopic Methods Yang Leng

© 2008 John Wiley & Sons (Asia) Pte Ltd. ISBN: 978-0-470-82298-2

334 Index

constructive interference, 28, 49contact mode, 156continuous X-rays, 46contrast, 5, 90

threshold, 5convergence angle of probe, 125critical angle of total reflection, 185critical-point drying, 142crossed position, 32crucible, 305crystallinity of polymer, 318crystallization temperature, 313Curie point, 324curing temperature, 319

dark-field, 25, 94dead time, 185Debye rings, 55deconvolution, 308defocus distance, 99degenerate vibration, 260dehydration, 142depth of field, 5, 134depth of focus, 6depth resolution, 246destructive interference, 28, 49detection limit, 246detection sensitivity, 246deuterated triglycine sulfate, 270deviation vector, 112devitrification, 313diamond knife, 89diatomic model, 255dichroic mirror, 37differential interference contrast,

13, 34diffraction contrast, 92diffraction grating, 280, 282diffuse reflectance, 275diffusion pump, 139, 201dimple grinder, 88dipole moment, 262dislocations, 115double-tilt, 85DSC

heat flux, 306power-compensated, 306temperature modulated, 308

d-spacing, 67, 72duoplasmatron source, 232

dwell time of probe, 127dynamic mode, 155dynamic range, 246

effective magnification, 5elastic scattering, 123electric discharge machine, 15electrolytic polishing, 21electrolytic thinning, 87electromagnetic lens, 79, 83electron sourcebombardment source, 231electron channeling, 134electron energy analyzer, 204electron flood gun, 215, 238electron gun

field emission, 82thermionic emission, 82

electron number effect, 130electron retardation, 205electronic gate, 250electrostatic force, 152elliptically polarized light, 31emission volume, 187energy dispersive spectroscopy, 171, 176, 183enthalpy change, 302epi-illumination, 11equatorial plane, 72etchants, 22etching, 22eutectic temperature, 317Everhart-Thornley detector, 124Ewald sphere, 53excited filter, 37external standard method, 70

Fano factor, 184Faraday cage, 124far-field interaction, 145fast Fourier transform, 269field diaphragm, 10field emission, 82filament current, 82flat-specimen error, 60fluorchromes, 37fluorescent labeling, 37fluorescent yield, 175focal length, 2force modulation, 159, 161force sensor, 154Fourier transform, 98

Index 335

frame time, 128freeze-drying, 142friction force microscopy, 158FTIR microscope, 276FT-Raman, 284full width at half-maximum, 63fundamental parameter method, 193fusion enthalpy, 319

glass knife, 89glass transition, 301goniometer circle, 61grinding, 19grinding jig, 86group theory, 262

Hamaker constant, 152harmonic vibration, 255heat capacity, 308, 316heat event, non-reversing, 309heat event, reversing, 309heat tinting, 25hemispherical sector analyzer, 204high resolution transmission electron

microscopy, 95high resolution X-ray diffractometry, 61holographic filter, 280hysteretic behavior, 167

inelastic scattering, 123infrared absorption, 257infrared active, 261infrared light source, 269

Globar, 269Nernst Glower, 269

instrument baseline, 310instrument factor, 191interferogram, 268intermittent contact mode, 155internal standard method, 70, 192,

299interpretable structure image, 99intrared detector, 270ion gun, 204ion milling, 87Ionization probability, 227

jet-polishing, 87jump-off-contact, 157jump-to-contact, 156

Kα doublet, 47Kikuchi line, 108Kohler system, 10

lanthanum hexaboride, 82latent heat, 315lateral force microscopy, 158lattice vibration, 256layered synthetic microstructure,

180lens

collector, 10condenser, 10eyepiece, 1, 13intermediate, 83objective, 1, 13, 83projector, 1, 83relay, 11

lifetime of surface, 230light disperson, 6light filter, 11

colored, 11heat, 11interference, 11neutral, 11

light guide, 124linear absorption coefficient,

48, 69liquid metal ion source, 232local density of states, 149

magnetic sector analyzer, 234manipulation mode, 150mass absorption coefficient, 48,

194mass resolution, 235mass-density contrast, 90mass-to-charge ratio, 235matrix effect, 193matrix factor, 191mechanical clamping, 18mercury cadmium telluride (MCT),

271meridional plane, 72Michelson interferometer, 267microbalance, 320micro-Raman, 279microtomy, 16Miller index, 50monochromatic filter, 59

336 Index

Moseley’s law, 172mounting, 16mull, 274multiplet splitting, 208

near-field force, 152near-field interaction, 145n-mer, 241Nomarski contrast, 25, 34non-contact mode, 156normal mode vibration, 259numerical aperture, 4

object function, 96oligomer, 241optical path difference, 267

parafocusing, 60pass energy, 204phase contrast, 25, 28phase imaging, 160phase plate, 29phase shift, 99phase transition, 302photodiode, 154photoelectron, 197photomultiplier tube, 124piezoelectric materials, 147pinhole spatial filter, 281Planck’s constant, 254plane polarized light, 30plasma ion source, 231plasmon loss, 208pleochroism, 32polarizability, 264polarizability ellipsoid, 265polarization factor, 56polarized light, 25, 30polarizer, 30polishing, 20

cloth, 21position vector, 96potassium bromide (KBr), 270powder diffraction file, 66prefilter, 281primary absorption, 192primary ion, 225probe current, 125probe size, 126probe tip, 149

quadrupole analyzer, 235quantum number, 173

Raman active, 262Raman scattering, 257Raman shift, 259raster, 40Rayleigh scattering, 257real image, 1receiving slit, 59reciprocal lattice, 51reciprocal unit vector, 51reflectance, 274remote aperture, 278residual stress, 64Rose visibility criterion, 127

sample baseline, 310scanner, 147scintillator, 124secondary absorption, 192secondary electrons, 123secondary fluorescence, 192secondary ion, 225secondary mode, 185sectioning, 15selected-area diffraction, 93, 101selection rules, 173sensitivity factor, 219shake-up satellites, 206short-range force, 152Si(Li) detector, 183Siegbahn notation, 174single beam spectrum, 271Soller slits, 59specimen-transparency error, 60spectroscopic mode, 150specular reflectance, 275spherical aberration coefficient, 99sputter depth profiling, 220sputter ion pump, 201sputter yield, 221, 228sputtering, 141

plasma-magnetron, 141stacking fault, 113staining, 142standardless quantitative analysis, 195static mode, 155step width for scanning, 63stigmator, 138

Index 337

Stokes scattering, 259stopping factor, 194stretching mode, 260structure extinction, 57structure factor, 58sub-monomer, 241surface charging, 139surface ionization source, 232

take-off angle, 186tapping mode, 155, 159Taylor cone, 232temperature calibration, 324temperature factor, 70thallium acid phthalate, 180thermal decomposition, 302thermal drift, 167thermal event, 301thermal event, endothermic, 306thermal event, exothermic, 306thermal lag, 304thermal null state, 307thermal shielding, 324thermal sputtering, 226thermionic emission, 82thermobalance, 320thermocouple, 304thermogravimetry, 301thin film X-ray diffractometry,

60time-of-flight, 233, 236

analyzer, 236tint etching, 25topographic contrast, 130total reflection, 185trajectory effect, 130tranmission, 228transfer function, 98

transmittance, 272tungsten filament gun, 82tunneling current, 147, 148turbomolecular pump, 201two-beam condition, 118

ultra-microtomy, 88unit cell volume, 70

vacuum impregnation, 18van der Waals force, 152vibrational frequency, 256vibrational quantum number, 256virtual image, 1

wavelength dispersive spectroscopy, 171,176–180

wavenumber, 254wavetrain, 254weak-beam dark-field, 94wedge fringe, 111Wehnelt electrode, 81white X-rays, 46wide angle X-ray diffraction, 71wide angle X-ray scattering, 74Wien filter, 233Wollaston prisms, 34working distance, 125

X-ray absorption, 48factor, 194

X-ray fluorescence, 172X-ray photoelectron, 197X-ray powder diffractometry, 58X-ray tube, 46

ZAF method, 194zero baseline, 310