March 5 - 8, 2017 Mesa, Arizona Archive Session 6 · 2017. 3. 30. · BiTS 2017 Making Contact -...

Making Contact - Contact Technology - 1 of 2 BiTS 2017 Session 6 Presentation 4

March 5-8, 2017 Burn-in & Test Strategies Workshop www.bitsworkshop.org

Archive – Session 6

March 5 - 8, 2017

Hilton Phoenix / Mesa Hotel

Mesa, Arizona

© 2017 BiTS Workshop – Image: tonda / iStock

BiTS 2017


Copyright Notice

The presentation(s)/poster(s) in this publication comprise the Proceedings of the 2017 BiTS Workshop. The content reflects the opinion of the authors and their respective companies. They are reproduced here as they were presented at the 2017 BiTS Workshop. This version of the presentation or poster may differ from the version that was distributed in hardcopy & softcopy form at the 2017 BiTS Workshop. The inclusion of the presentations/posters in this publication does not constitute an endorsement by BiTS Workshop or the workshop’s sponsors. There is NO copyright protection claimed on the presentation/poster content by BiTS Workshop. However, each presentation/poster is the work of the authors and their respective companies: as such, it is strongly encouraged that any use reflect proper acknowledgement to the appropriate source. Any questions regarding the use of any materials presented should be directed to the author(s) or their companies. The BiTS logo and ‘Burn-in & Test Strategies Workshop’ are trademarks of BiTS Workshop. All rights reserved.



BiTS Workshop 2017 Schedule

Session

Session Chair

Frontier Day Tuesday March 7 - 1:30 pm

Making Contact

"High Current Final Test Contactor Development"

Thiha Shwe, Hisashi Ata – Texas Instruments

Kenichi Sato – Yokowo

"Customers Are the New Team Member for Board to Board Connectors"

Derek Biggs – Plastronics

"WLCSP Contacting Technologies for 0.2 mm Pitch and Below"

Valts Treibergs - Xcerra Corporation

"Coming to terms with Burn-In sockets"

James Tong - Texas Instruments

6 Jason Mroczkowski



Coming to Terms with

Burn-In Sockets

James Tong

Texas Instruments

BiTS Workshop

March 5 - 8, 2017

Conference Ready

mm/dd/2014



Contents

• Background

• Root cause review

• Solution selection

• Qualification process

• Result and data review

• Lesson learned

• Standardization

• Future plan

Coming to Terms with Burn-In Sockets 5



Background

• Custom solution per device per supplier

• Solution selected base on

– good faith and experience from last project

– pricing is the main driver

• Engineering hardware for device

checkout/qualification gets propagated to

production burn in




Root cause review

• Historically used solution was

inferred to be the best solution

• Ball damaged due to stuck pin

• Plastic socket housing around the

pin melted with Tj >200°C

– High current

– Contact resistance failure

– Housing material

– Defective device

• 5Ws => Ball deformation stuck

pin melted housing heated

spring current flows thru the

spring




Solution selection – pick the right

pin structure

• Considering the possible root causes of

failure

• Plan checkout DOEs

Your Paper Title Here: BiTS Presentation Guide & Template 1.0 8



Solution selection – decision matrix

• Pick supplier matrix

• Specify pin worst case test

requirement

• Qualify selected solution

qualification plan to define

roadmap solutions


Supplier Weightage Vendor A Vendor B Vendor C Vendor D

Cost 3 4 5 3 4

Design Robustness 5 4 2 3 4

Responsiveness 3 2 4 3 4

A/T site Support 3 3 2 4 4

Dallas Dev. Support 3 4 3 4 4

Pin Design 5 3 4 3 4

Engineeering Support 4 4 3 3 4

Quality 3 2 3 3 4

Delivery 4 3 4 2 4

3.22 3.33 3.11 4.00

102 100 92 120

Selection Matrix

Unweigthed Average

Total



Qualification process

• 3 steps process

• Best of the Cheapest vs. Cheapest of the Best


“Qualification

Process”

RTP

RELEASE

TO PROD

“BURN IN OPERATION”

“NEW SOLUTION”

Oven platform



Qualification process – Step1

• Max 2 pins designs to support all pitch in package family

(BGA, QFN, QFP)

• CCC of 2 A or greater, Pin force of 15g/pin or less

• Vendor factory data on proposed pin solution

• Engineering data to support design robustness

11 Coming to Terms with Burn-In Sockets




• Small sample functionality engineering

checkout

Electrical performance

Mechanical performance

Operation friendliness





• Production correlation

• High volume production qualification of

solution

• Expose to typical production variables




Yield Trend

Result and data review

• Significant burn in test cost saving

14

First Pass to Final

Yield Gap

improved

Final Yield

improved

Mechanical

Yield loss

drops (less

scraps)

More functional socket per

BIB

Better utilization / thru’ put

Performance

Coming to Terms with Burn-In Sockets



Lesson learned – Device surface

marring


Bottom BGA substrate surface marring Top side BGA

substrate marring

=> illegible symbols

Boss

(aka: pusher)

Thermal

Module

Surface

roughness Boss

Clam-shell

type Burn-In

socket



Lesson learned – Pin structure

• Through hole pinch contact pin is problematic for BGA

• Impossible to replace worn off or damage socket


Reproduced from BiTS workshop 2003 (Prasanth

Ambady, James Forster & Jason Cullen – Texas

Instruments)



Standardization

• Adopt proven qualification process

• Socket base sizes Burn In Board (BIB)

density

• Use compression mount technology (CMT)

pins only

• Lock in socket mechanical design

• Minimize pin type/geometry for all device

pitch

• Lower cost with best solution and volume




Future plan

• Use only roadmap CMT pin

solution

• Open top sockets design

• Use rack style solution for

active temperature control

requirement

• Ability to use multiple socket

suppliers on same device


Rack with pusher assembly

BIB PCB

Open Top

sockets

Clam-shell

socket

style

• Collaboration to define

industry standard



Acknowledgement

• TI operations team

• TI management team

• Suppliers

• BiTS2017 committee and attendees


March 5 - 8, 2017 Mesa, Arizona Archive Session 6 · 2017. 3. 30. · BiTS 2017 Making Contact -...

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