Manufacturing Advantage Service: Mobile System Integration Intel® Centrino® Duo Mobile...

Manufacturing Advantage Service: Mobile System Integration Intel Centrino Duo Mobile Technology-based Notebooks September 2006

Disclaimer All Intel boxed products are intended to be professionally installed. This product integration training and the guidance contained herein is provided to Intel customers as a convenience. Intel assumes no responsibility for any errors contained in this training and has no liabilities or obligations for any damages arising from or in connection with the use of this training and the guidance contained herein. Intel is not obligated to provide any support or assistance with regard to the information provided in this training. Consult all product manufacturers documentation before attempting to install or remove Intel boxed products. INFORMATION IN THIS PRODUCT INTEGRATION TRAINING IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. EXCEPT AS PROVIDED IN INTELS TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS. INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND/OR USE OF INTEL PRODUCTS, INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERY RIGHT. All products, dates, and figures are preliminary and subject to change without notice. Intel may make changes to this training and product descriptions at any time, without notice. Intel, Pentium, Intel Inside, NetBurst, Centrino, Celeron, the Intel Inside logo and the Intel logo are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. The hardware vendors of the barebone notebooks and the interchangeable components remain solely responsible for the design, sale and functionality of their respective products, including any liability arising from product infringement and product warranty. Intel is not warranting the products of the hardware vendors *Other names and brands may be claimed as the property of others. 2006 Intel Corporation

Objectives Introduce mobile basics to new notebook resellers Provide tips and hints for quality mobile integration

Agenda What is Different about Mobile Design Building a Notebook Material Handling and Operation Top Tips for Verified by Intel Notebooks

What is Different about Mobile Design Most new notebooks are designed for high-volume manufacturing Easily accessible components Limited number of required tools Notebooks have fewer components to integrate than desktop or server systems Desktop/Server PSU, multiple HDD, multiple ODD, motherboard, cpu+heatsink, memory, add-in cards Mobile 1 HDD, 1 ODD, cpu+heatsink, memory, WLAN Notebook components are smaller than server/desktop components Typically more sensitive to shock & vibration Requires more precise and careful handling methods Intel Centrino Duo-based notebooks are Easy to Build

Mobile Integration Flow

Notebook SKU management Pre-2006 customer feedback Mobile integration is complex with high sku maintenance Inflexible supply choice Inventory management difficulties New features introduced with Barebone Notebooks that are Verified By Intel Designs from selected ODMs tested by Intel for interchangeability across Common Building Blocks 7 CBBs in 2006 - hard disk drive, optical disk drive, keyboard, battery pack, LCD panel, customizable notebook panel (CNP) & AC adapter CBB defines the mechanical form and fit and basic electrical connections

Verified certain barebones notebook designs of ODMs for interchangeability 24x7 support via web/phone/email Warranty fulfillment by Intel on behalf of ODM Warranty support for resellers only Intel Customer Support & Post Sales Support Interchangeability Vision Verified By Intel

Verified By Intel & Interchangeability Optical Drive Hard Disk LCD Keyboard Custom Panel AC Adapter Battery Pack Channel Value Multiple suppliers Flexibility Improved availability Customizable Notebooks Vision: Accelerate Adoption of Interchangeable Ingredients New for 2006

Participating Vendor Detail Barebone Notebooks that are Verified By Intel Asus* Compal* Quanta* * Other names and brands may be claimed as the property of others. Interchangeable Ingredients Tested & verified for compliance to industry or Intel specifications Hard Disk Battery Optical Drive Keyboard AC/DC CNP LCD Hitachi*, Fujitsu*, Seagate* Panasonic*, QSI*, Lite-On* CMO*, AUO*, CPT*, QDI* Simplo*, Dynapack*, Celxpert* Sunrex* Delta* Bradys*, FedEx Kinkos*, Worldmark* Channel Value Multiple suppliers Flexibility Improved availability Customizable Notebooks

Common component locations Most components are accessible via the bottom of the notebook Some components may be located top-side, underneath the keyboard Battery CPU, memory, WLAN HDD CPU, memory, WLAN Battery HDD, WLAN CPUMemoryHDD

General Tips for Mobile System Integration Remove power cable and battery before any work Option to order notebook without the battery installed could reduce installation time Minimize ESD and physical shock Assemble one component at a time; keep screws together Recommend to have a bin of extra screws, as it is usually not cost effective to search for a dropped screw Follow System Torque requirements; do not over-tighten screws Loosen all screws before removing component/screw panels; loosely tighten all screws before securing component/screw panel

CPU Insertion and Attributes Intel Mobile ProcessorIntel Desktop Processor Retention MechanismRetention ScrewRetention Lever SocketMicro-FCPGA 478-pinLGA775 CPU Pin A1 markingYes

CPU Insertion Tips (1 of 2) 1. Remove CPU Fan Cable 2. Loosen all screws first before removing thermal mounting plate

CPU Insertion Tips (2 of 2) 3. Align CPU Pin 1 with socket; turn retention screw to secure CPU in socket 4. Loosely tighten all screws first before securing thermal mounting plate

Wireless LAN Card Tips 1. When not in use - Recommend to use a non-conductive material around the antennae connector leads 2. Insert WLAN card at an angle, and gently push down 3A. Do not swap the two WLAN connector leads Main and Aux 3B. To ensure tight connection, firmly press on the leads until a click is felt

Keyboard/LCD Tips The ribbon cable connector that attaches to the LCD screen, keyboard and mouse pad connector could be easily ripped. These cables can create intricate assembly procedure, manufacturing aids that hold components in place can help with this process. The panel that holds the keyboard in place is fragile. Breakage from the assembly / disassembly process can be minimized with careful handling.

Memory & HDD Tips 2. HDD may have mounting brackets, handle with care to avoid physical shock 1. Insert Memory at an angle and then gently press down until locking in place

Recommended Materials

Screw Torque Requirements The screw torque is an important factor when assembling systems Too much torque will strip the threads of screws or screw holes, causing damage to the component If there is not enough torque applied to a screw, then components can shake loose during shipping, often causing extensive damage to the computer system Never use screw after multiple insertion or after any striping. Torque requirements should be available from barebones system supplier

ESD Overview Electrostatic Discharge, or ESD, is an event which occurs when two dissimilarly charged materials move to the same electrical potential ESD is one of the most common causes of semiconductor failure ESD normally causes latent failures, where the circuit works for a short time, but fails prematurely Latent failures usually make it into customers hands before they fail Survey source: Intel, 1998

ESD Basic Checklist Keep your work area clean. Eliminate all non-conductors from assembly and test area or neutralize static charges with ion systems Work surfaces and conveyors are grounded Floors and work surfaces are kept free of dust Charge generators are kept out of the work area Employees wear ESD protective equipment Handle electronic devices and assemblies only if you are properly grounded Employees wear ESD shoes or heel straps and ESD smocks If an ESD floor is not available, employees need to wear wrist straps, this includes Receiving, Storage, Repair and the Reject area Employees test twice daily for ESD compliance Store and transport ESD sensitive items in static shielding containers or faraday cages Assume all electronic devices and equipment are susceptible to ESD damage or failure

Material Storage In the case of ESD sensitive components, they should be stored in their ESD package, and preferable in a grounded storage location (i.e. Grounded shelves) In the case of humidity sensitive, components should be kept in their sealed containers. No damage due to humidity should be observed in the container. If the material is suspect, follow the quarantine/rebake procedures In the case of temperature sensitive components, they should be store in a temperature controlled area, with temperature monitors

Material Handling Circuit Boards Broken caps Bent pins Cracked connecters Cracked solder joints Cracked circuit boards CPUs/ICs Bent pins Broken capacitors & resistors Drives Head slap Chipped sectors on disc Head misalignment Exterior surfaces Scratches Dents Broken components Types of damage that can be caused by physical shocks

Material Handling Do not stack devices, and do not place other objects on top of the devices Keep material in its original packaging until it is ready to be used Place devices flat on an ESD padded surface Do not place devices on top of ESD bag Handle all devices by the edge The following guidelines can greatly reduce the risk of damaging components from physical shocks and ESD

Processor Handling/Insertion Overview Before installing the processor, inspect the package for Physical damage such as scratches, die chips, or cracks Bent or misaligned pins Debris on the die or within the pins which cannot be blown off Ensure the socket is properly mounted on the motherboard in the correct orientation Ensure the socket is free of debris and the socket holes are clear of any contamination Ensure the socket is in the OPEN position Do not force the package into the socket

Processor Handling (1 of 3) Care must be exercised when attaching the thermal solution to the processor Avoid edge loading or concentrated forces on the die Processors are ESD-sensitive Same as current processors Follow safe ESD practices (clothing, grounding, work areas) Processors should only be unpacked from boxes at ESD workstations Transfer material using ESD-safe trays, not by hand (note: shipping trays are static dissipative) Example: During assembly, a tilted thermal solution may apply undesired instantaneous edge loading to the bare die during assembly which could cause damage to the die

Processor Handling (2 of 3) Avoid touching or pressing on the silicon die Avoid smashing the balls, dont coin-stack units Avoid putting excessive force on the die Avoid scratching die Avoid introducing foreign material onto die surface > 100 psi

Processor Handling (3 of 3) Care must be exercised when disassembling the thermal solution from the processor Some thermal interface materials have high viscosity High-viscosity materials may induce high stress on die during disassembly High viscosity materials may need heating to soften prior to disassembly In general, a torsional (twisting) removal force is better than peeling as former tends to shear the thermal interface materials rather than transferring a tensile load to the silicon die

Tips - Customizable Notebook Panel (CNP) What is the Customisable Notebook Panel? It is a piece of material (typically Polycarbonate or Vinyl) that has been customized for the insertion into the top cover of notebook barebones supporting interchangeability It is designed for thin & light notebook computer platforms to allow an integrator to differentiate the design of their notebooks with a high quality, cost effective, customized design Barebones that are Verified By Intel will ship with ~0.3mm recess on the A Cover to accommodate the panel CNP is not designed to be reusable Before installation of the CNP, clean the A-cover surface with isoprophyl alcohol Remove air bubbles before completing installation Use a roller or ruler 2 Types of adhesive available: Permanent type Pressure Sensitive Adhesive (PSA) ~15 minutes to set Removal of CNP after the PSA has set and cured is not recommended (leaves residue & can damage A Cover) Replaceable type Pressure Sensitive Adhesive (PSA) Adjust and verify CNP alignment before the PSA has set and cured (~15minutes)

Tips Verified by Intel Warranty Policy Eligible warranty components L4, ODD (include bezel), keyboard (include keyboard cover strip), thermal module, battery, AC/DC power adapter HDD, Wireless, CPU & memory excluded from warranty L4 definition - Chassis, motherboard, LCD Reseller should remove the following components when returning the L4 barebone/chassis (if not, they will not be returned to the reseller by Intel) ODD (w/bezel), keyboard (w/keyboard strip), battery, HDD (w/HDD brackets), wireless card, processor, thermal module, memory, CNP, AC/DC power adapter Defective components will be replaced by Intel Components determined to be CID/NTF/NDF will be returned to the reseller For any warranty questions, please contact Intel Customer Support

Tips Verified by Intel Warranty Policy (Contd) L4 Returns & Customizable Notebook Panels (CNP) The CNP will not be returned The reseller will be required to replace the CNP L4 Returns and Stickers The Microsoft* Certificate of Authenticity sticker placed on the chassis will not be replaced along with a L4 barebone return Recommend placing OS license sticker on a removable part (i.e. the hard drive cover) and remove part before sending in the L4 It will be the resellers responsibility to replace any OS logo stickers for the A Cover Country of Assembly (COA) stickers placed on the chassis will not be replaced for an L4 return Recommend placing COA sticker on a removable part (i.e. the hard drive cover) and remove part before sending in the L4 It will be the resellers responsibility to replace any CPU or Intel Centrino Mobile Technology stickers after appropriately re-certifying the system For any warranty questions, please contact Intel Customer Support

Tips LCD Panel LCD Handling Recommendations Do not push or scratch LCD panel surface with any objects Do not touch the LCD panel surface with bare hands Wipe off LCD panel surface with an absorbent cotton or soft cloth E.g. dust, dirt, fingerprints, smudges Immediately wipe off drops of liquids (e.g. adhesives, saliva, water) on the LCD panel surface Liquids may cause panel surface variation and color change Use screen savers to lessen the chance of permanent patterns from being imprinted on the screen

Tips Interchangeable Battery Pack Notebook Barebones that are Verified By Intel may or may not require a cover that is attached to the battery pack The cover need not be the same as the reference design but it must fit to the attachment mechanism of the battery pack For example, to swap the battery pack from one Verified By Intel Barebone to another you may need to either remove or add a battery cover depending on the make and model of the barebone Each cover is designed to have five rear catch pins and four front catch pins To remove the cover use a flat wedge tool For visual examples refer to 4-figures in following slide

Tips Interchangeable Battery Pack (Contd)

Tips Updating to Intel Core TM 2 Duo Processor All Verified By Intel SKUs support: Intel Core Duo Processor (65nm Intel codename Yonah) Intel Core 2 Duo Processor (65nm Intel codename Merom) BIOS Update Required Intel Core Solo Processor (65nm Intel codename Yonah) Intel Celeron M processor (65nm Intel codename Yonah or Merom only) Updating to Intel Core 2 Duo Processor (Merom) No H/W or product code changes required except ASmobile* S62x series 2 new part codes S62FM and S62JM that are Merom-ready BIOS update required on most SKUs Most SKUs require Intel Core Processor during BIOS upgrade Requesting ODMs to externally ID Merom Ready systems Not all SKUs will support Microsoft* Windows* XP-64 32-bit OS support confirmed on all SKUs Quanta* Thermal Solution New larger Thermal Interface Material (TIM) should be used Larger surface area due to increase in processor die size of the Intel Core TM 2 Duo processor Ensure that thermal throttle feature is enabled in BIOS No product code change for TIM modification * Intel internal codename

Tips - Thermals and Wireless Notebooks typically use low-profile heat spreader thermal solutions for the processor Fan may not be attached directly to thermal solution Screw locations also may be located away from the processor area Wireless antennae connector leads When not in use, it is recommend to use a non-conductive material around the antennae connector leads

Mobile Platform Integration Resources via the Intel Reseller website (login required) Intel Channel Knowledge Builder website: http://intel.seminars.net/etraining http://intel.seminars.net/etraining Interactive Hardware Integration Training for VBI-based notebooks Mobile Platform Integration Guides 1 ODD Installation Guide CNP Installation Guide HDD Installation Guide Keyboard Installation Guide Battery Pack Installation Guide Verified by Intel Warranty Guide Assembly and Disassembly Guides 2 Users Manuals 2 Service Manuals 2 1 Provided by Intel 2 Provided by notebook manufacturer

Summary Intel Centrino Duo-based notebooks are easy to build Use proper tools, handling, and assembly processes to build a quality notebook Work in a clean and ESD safe assembly environment Additional platform integration resources can be found Intel Reseller website Intel Channel Knowledge Builder website Verified By Intel Information www.intel.com/reseller/eng/VerifiedByIntel

Backup

Acronym List CNP = Customizable Notebook Panel ODD = Optical Drive device HDD = Hard Drive device LCD = Liquid Crystal Display NDF = No Defect Found NTF = No Trouble Found CID = Customer Induced Damage VBI = Verified by Intel CBB = Common Building Block ESD = electrostatic discharge PSU = power supply unit WLAN = Wireless LAN PSA = Pressure Sensitive Adhesive TIM = Thermal Interface Material ODM = Original Design Manufacturer

LCD Defects Measurements SPWG 3.5 lists 18 elements in two categories used to evaluate LCD defects Cosmetic Visual Defects Screen Functional Defects Individual defects may be graded as Major or Minor, based on expected customer acceptance Minor defects of sufficient quantity and scope may also cause an LCD panel to be rejected See SPWG V3.5 (March 2005) www.spwg.orgwww.spwg.org

LCD Major Defect Examples Physical Cracked glass substrate LC leakage Warped/bent frame Polarizer scratches Functional White-Screen Line/Row/Block patterns Image Color uniformity Light leakage Light flicker or flashing Safety Exposed backlight wiring Damaged CCFL wire insulation

LCD Minor Cosmetic Defects Cosmetic Smaller scratches, dents, bubbles on polarizer Foreign material presence Bad Pixels (Bright, Dark) Mounting hole offset Frame distortion Display Visibility Tiger Mura Brightness Uniformity Contrast ratio

LCD RGB Pixel Control Every pixel contains three separate R-G-B sub- pixels; each sub-pixel employs one transistor switch Defective transistor at any sub-pixel location can cause that pixel to be bright or dark Objectives SPWG V3.5 (March 2005)

LCD Transistor Density Total LCD transistor count is based on panel resolution Panel size and LC technology (a-Si, LTPS) will determine the aperture size of individual sub-pixels Aperture size affects the users ability to detect defective pixels

Bad Pixels Bright and/or Dark Pixels may be acceptable if they Are small in number Non-adjacent Outside screen center Do not exceed overall Minor Defect thresholds Bad Pixel Defects across a full row, a full column, or over any block constitutes a Major Defect

Example: LCD Defect Rates Major Defects Minor Defects Bad Pixels Grade A None 15 mm Dark Pair > 5 mm Grade B None>8> 3-3-5 Bright Pair < 15 mm Dark Pair > < mm

What is Intel Channel Knowledge Builder? Online training available 24/7 to all Intel Channel Program Members at no additional cost Provides simple to highly interactive knowledge and skills training Training that is available any time and accessible to all employees Training typically covers Product, Technical, Sales and Marketing topics around every major platform launch Available in 12 languages Web Based, Downloadable, and CD versions available

Training available to all Intel Reseller employees no extra travel expense required Provides in-depth Intel Platform training on Desktop, Mobile, and Server solutions Soft Skills training recently added that covers: Integration Techniques Sales Skills Business Development Course completion certificates available Most courses provide a training certificate that can be printed Completion incentives offered on some major course launches The Primary contact at the Intel Reseller can assign training courses to any of their employees What benefit does Intel Channel Knowledge Builder Provide?

Processor Insertion Orient the Micro-FCPGA package so that the pin A1 corner matches with the socket marking Align pins and holes and lightly press the package into the socket until fully seated. There should be very little resistance Dont force the package into the socket; damage could result Actuate the socket to engage the processor, lightly press on the package to ensure it is completely seated on the socket surface Do NOT try to force the package into the socket NOTE PIN A1 CORNER REFERENCE MARKINGS

Manufacturing Advantage Service: Mobile System Integration Intel® Centrino® Duo Mobile...

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